US D365092 S Ansprüche
Beschreibung FIG. 1 is a top-plan view of a chipcard module showing our new design; FIG. 2 is a bottom-plan view thereof; FIG. 3 is a right-side elevational view thereof; FIG. 4 is a left-side elevational view thereof; FIG. 5 is a front elevational view thereof; FIG. 6 is a rear elevational view thereof; FIG. 7 is a cross-sectional view thereof taken along the line VII--VII of FIGS. 1 and 2; and, FIG. 8 is a cross-sectional view thereof taken along the line VIII--VIII of FIGS. 1 and 2. | ||||||||||||||||||||||