Patent USD394844 - Temporary package for semiconductor dice

Veröffentlichungsnummer	USD394844 S
Publikationstyp	Erteilung
Anmeldenummer	29/070,050
Veröffentlichungsdatum	2. Juni 1998
Eingetragen	25. Apr. 1997
Erfinder	Salman Akram Warren M. Farnworth David R. Hembree Alan G. Wood
Ursprünglich Bevollmächtigter	Micron Technology, Inc.
US-Klassifikation	D13/182
Referenzen	Nichtpatentzitate (1) Referenziert von (62)

Externe Links	USPTO USPTO-Zuordnung Espacenet

Temporary package for semiconductor dice

US D394844 S

Ansprüche

The ornamental design for a temporary package for semiconductor dice, as shown and described.

Beschreibung

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.

Nichtpatentzitate

Referenz
1	1994 Dram Data Book, Micron Semiconductor, Inc., pp. 7-7-7-13, Apr., 1994.

Referenziert von

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