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Patente

VeröffentlichungsnummerUSD450070 S1
PublikationstypErteilung
Anmeldenummer29/090,618
Veröffentlichungsdatum6. Nov. 2001
Eingetragen13. Juli 1998
Prioritätsdatum
13. Juli 1998
Erfinder
Ursprünglich Bevollmächtigter
US-Klassifikation
Referenzen
Externe Links
Sputtering chamber coil
US D450070 S1
Zeichnungen(3)
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Ansprüche
  1. The design for sputtering chamber coil, as shown and described.

Beschreibung

FIG. 1 is a front elevational view;

FIG. 2 is a top view;

FIG. 3 is a right side elevational view;

FIG. 4 is a bottom view; and,

FIG. 5 is a rear elevational view of our sputtering chamber coil.

The left side elevation view (not shown) is the same as the right side elevational view (FIG. 3) because of coil symmetry.

Nichtpatentzitate
Referenz
1Applied Materials, Inc., Exhibit A, Dated Prior to Jul. 13, 1998, the filing date of the present application.(Exhibit A is a drawing of a prior art coil design which is prior to the design of the present application.).
2Search report in PCT/US98/10058 issued 4Nov98.
3U.S Patent Application Serial No. 08/559,345 filed Nov. 15, 1995 (Atty Dkt 938.X1/4479).
4U.S. Patent Application Serial No. 08/730,722 filed Oct. 8, 1996 (Atty Dkt 1207/4784).
5U.S. Patent Application Serial No. 09/049,276 Mar. 27, 1998 (Atty Dkt 938.D2/5703).
6U.S. Patent Application Serial No. 09/049,839 Mar. 27, 1998 (Atty Dkt 938.D1/5702).
7U.S. Patent Application Serial No. 29/109,870 (Atty. Dkt. 3980/PVD/DV).
8U.S. Patent Application Serial No. 29/109,892 (Atty. Dkt. 3979D/PVD/DV).
9U.S. Patent Application Serial No. 29/109,893 (Atty. Dkt. 3981/PVD/DV).
Referenziert von
Zitiert von PatentEingetragen Veröffentlichungsdatum Antragsteller Titel
US666013410. Juli 19989. Dez. 2003Applied Materials, Inc.Feedthrough overlap coil