US D529031 S1 Ansprüche
Beschreibung FIG. 1 is a front elevation view of the IC card type circuit module showing our new design; FIG. 2 is a left side elevation view thereof; FIG. 3 is a bottom plan view thereof; FIG. 4 is a right side elevation view thereof; FIG. 5 is a top plan view thereof; FIG. 6 is a rear elevation view thereof; FIG. 7 is a top perspective view thereof; and, FIG. 8 is a bottom perspective view thereof. | ||||||||||||||||||||||