FIG. 1 is a front elevational view of a semiconductor wafer delivery apparatus, showing my design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a cross-sectional view taken along line 7—7 in FIG. 1;

FIG. 8 is a top and right front perspective view thereof; and,

FIG. 9 is a top and right rear perspective view thereof.

The broken line showing and the indicia shown in the Figures are shown for illustrative purposes only and form no part of the claimed design.