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Patente

VeröffentlichungsnummerUSD572670 S1
PublikationstypErteilung
Anmeldenummer29/266,467
Veröffentlichungsdatum8. Juli 2008
Eingetragen22. Sept. 2006
Prioritätsdatum30. März 2006
Auch veröffentlicht unterUSD592159, USD615933
Veröffentlichungsnummer266467, 29266467, US D572670 S1, US D572670S1, US-S1-D572670, USD572670 S1, USD572670S1
ErfinderMasaru Kato, Hiroshi Miyairi, Masato Ono, Kazunori Watanabe
Ursprünglich BevollmächtigterNichia Corporation
Externe Links: USPTO, USPTO-Zuordnung, Espacenet
Light emitting diode
US D572670 S1
Bilder(21)
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Ansprüche
  1. The ornamental design for a light emitting diode, as shown and described.
Beschreibung

FIG. 1 is a front top side perspective view of a light emitting diode in accordance with a first embodiment of my new design;

FIG. 2 is a top plan view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 3 is a bottom plan view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 4 is a front elevational view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 5 is a rear elevational view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 6 is a left side end elevational view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 7 is a right side end elevational view of the light emitting diode in accordance with the first embodiment of my new design;

FIG. 8 is a front top side perspective view of a light emitting diode in accordance with a second embodiment of my new design;

FIG. 9 is a top plan view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 10 is a bottom plan view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 11 is a front elevational view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 12 is a rear elevational view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 13 is a left side end elevational view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 14 is a right side end elevational view of the light emitting diode in accordance with the second embodiment of my new design;

FIG. 15 is a front top side perspective view of a light emitting diode in accordance with a third embodiment of my new design;

FIG. 16 is a top plan view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 17 is a bottom plan view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 18 is a front elevational view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 19 is a rear elevational view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 20 is a left side end elevational view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 21 is a right side end elevational view of the light emitting diode in accordance with the third embodiment of my new design;

FIG. 22 is a front top side perspective view of a light emitting diode in accordance with a fourth embodiment of my new design;

FIG. 23 is a top plan view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 24 is a bottom plan view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 25 is a front elevational view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 26 is a rear elevational view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 27 is a left side end elevational view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 28 is a right side end elevational view of the light emitting diode in accordance with the fourth embodiment of my new design;

FIG. 29 is a front top side perspective view of a light emitting diode in accordance with a fifth embodiment of my new design;

FIG. 30 is a top plan view of the light emitting diode in accordance with the fifth embodiment of my new design;

FIG. 31 is a bottom plan view of the light emitting diode in accordance with the fifth embodiment of my new design;

FIG. 32 is a front elevational view of the light emitting diode in accordance with the fifth embodiment of my new design;

FIG. 33 is a rear elevational view of the light emitting diode in accordance with the fifth embodiment of my new design;

FIG. 34 is a left side end elevational view of the light emitting diode in accordance with the fifth embodiment of my new design; and,

FIG. 35 is a right side end elevational view of the light emitting diode in accordance with the fifth embodiment of my new design.

The broken line showing of environment (the remaining structure of the light emitting diode) in the Figures is for illustrative purposes only and forms no part of the claimed design.

The opaque line shading illustrates a translucent portion of the light emitting diode.

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US767514528. März 20069. März 2010Cree Hong Kong LimitedApparatus, system and method for use in mounting electronic elements
US782102323. Mai 200826. Okt. 2010Cree, Inc.Solid state lighting component
US8049230 *16. Mai 20081. Nov. 2011Cree Huizhou Opto LimitedApparatus and system for miniature surface mount devices
US821741216. Sept. 201010. Juli 2012Cree, Inc.Solid state lighting component
US835037029. Jan. 20108. Jan. 2013Cree Huizhou Opto LimitedWide angle oval light emitting diode package
US83626059. Nov. 200929. Jan. 2013Cree Huizhou Opto LimitedApparatus and method for use in mounting electronic elements
US836794516. Aug. 20065. Febr. 2013Cree Huizhou Opto LimitedApparatus, system and method for use in mounting electronic elements
US836811214. Jan. 20095. Febr. 2013Cree Huizhou Opto LimitedAligned multiple emitter package
US84156926. Juli 20099. Apr. 2013Cree, Inc.LED packages with scattering particle regions
Klassifizierungen
US-KlassifikationD13/180