USD588080S1 - 2021-8J matrix leadframe - Google Patents

2021-8J matrix leadframe Download PDF

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Publication number
USD588080S1
USD588080S1 US29/292,066 US29206607F USD588080S US D588080 S1 USD588080 S1 US D588080S1 US 29206607 F US29206607 F US 29206607F US D588080 S USD588080 S US D588080S
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United States
Prior art keywords
matrix
matrix leadframe
leadframe
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US29/292,066
Inventor
James Harnden
Anthony Chia
Hongbo Yang
Teng Hui
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GEM Services Inc USA
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GEM Services Inc USA
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Publication date
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Priority to US29/292,066 priority Critical patent/USD588080S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAMDEN, JAMES, CHIA, ANTHONY, TENG, Hui, YANG, HONGBO
Application granted granted Critical
Publication of USD588080S1 publication Critical patent/USD588080S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a portion of a matrix incorporating a plurality of 2021-8J matrix leadframes showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the 2021-8J matrix leadframe shown in FIG. 1 for ease of illustration; and,
FIG. 3 is a perspective view of FIG. 1.

Claims (1)

  1. The ornamental design for 2021-8J matrix leadframe, as shown and described.
US29/292,066 2007-09-26 2007-09-26 2021-8J matrix leadframe Expired - Lifetime USD588080S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/292,066 USD588080S1 (en) 2007-09-26 2007-09-26 2021-8J matrix leadframe

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Application Number Priority Date Filing Date Title
US29/292,066 USD588080S1 (en) 2007-09-26 2007-09-26 2021-8J matrix leadframe

Publications (1)

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USD588080S1 true USD588080S1 (en) 2009-03-10

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Family Applications (1)

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US29/292,066 Expired - Lifetime USD588080S1 (en) 2007-09-26 2007-09-26 2021-8J matrix leadframe

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130292811A1 (en) * 2012-05-02 2013-11-07 Texas Instruments Incorporated Leadframe having selective planishing
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803801S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803800S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9006038B2 (en) * 2012-05-02 2015-04-14 Texas Instruments Incorporated Selective leadframe planishing
US8587099B1 (en) * 2012-05-02 2013-11-19 Texas Instruments Incorporated Leadframe having selective planishing
US8963300B2 (en) 2012-05-02 2015-02-24 Texas Instruments Incorporation Semiconductor device with selective planished leadframe
US20130292811A1 (en) * 2012-05-02 2013-11-07 Texas Instruments Incorporated Leadframe having selective planishing
US20150221526A1 (en) * 2012-05-02 2015-08-06 Texas Instruments Incorporated Selective planishing method for making a semiconductor device
US9972506B2 (en) * 2012-05-02 2018-05-15 Texas Instruments Incorporated Selective planishing method for making a semiconductor device
US10438816B2 (en) 2012-05-02 2019-10-08 Texas Instruments Incorporated Selective planishing method for making a semiconductor device
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803801S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803800S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

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