USD651992S1 - Semiconductor substrate - Google Patents

Semiconductor substrate Download PDF

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Publication number
USD651992S1
USD651992S1 US29/379,485 US37948510F USD651992S US D651992 S1 USD651992 S1 US D651992S1 US 37948510 F US37948510 F US 37948510F US D651992 S USD651992 S US D651992S
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US
United States
Prior art keywords
semiconductor substrate
view
partially enlarged
mirror image
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/379,485
Inventor
Taro Nishiguchi
Makoto Sasaki
Shin Harada
Shinsuke Fujiwara
Yasuo Namikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAMIKAWA, YASUO, HARADA, SHIN, FUJIWARA, SHINSUKE, NISHIGUCHI, TARO, SASAKI, MAKOTO
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Publication of USD651992S1 publication Critical patent/USD651992S1/en
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FIG. 1 is a front, right, and top perspective view of a semiconductor substrate showing our new design;
FIG. 2 is a front view thereof, a rear view being a mirror image thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right-side view thereof, a left side view being a mirror image thereof;
FIG. 6 is a partially enlarged view at 6 shown in FIG. 2 thereof;
FIG. 7 is a partially enlarged view at 7 shown in FIG. 2 thereof;
FIG. 8 is an enlarged ended view at 8-8 shown in FIG. 3 thereof; and,
FIG. 9 is a partially enlarged sectional view at 9 shown in FIG. 8 thereof.
The broken line showing of the semiconductor substrate is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a semiconductor substrate, as shown and described.
US29/379,485 2010-08-17 2010-11-19 Semiconductor substrate Active USD651992S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2010-19920F JP1441120S (en) 2010-08-17 2010-08-17
JPD2010-019920 2010-08-17

Publications (1)

Publication Number Publication Date
USD651992S1 true USD651992S1 (en) 2012-01-10

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ID=45419484

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/379,485 Active USD651992S1 (en) 2010-08-17 2010-11-19 Semiconductor substrate

Country Status (3)

Country Link
US (1) USD651992S1 (en)
JP (1) JP1441120S (en)
CA (1) CA138032S (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD789311S1 (en) * 2015-12-28 2017-06-13 Hitachi Kokusai Electric Inc. Pattern wafer
USD791091S1 (en) * 2015-12-28 2017-07-04 Hitachi Kokusai Electric Inc. Pattern wafer
USD808664S1 (en) 2016-05-16 2018-01-30 Ninja Brand Incorporated Sheet with camouflage pattern
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus
USD947144S1 (en) * 2019-05-10 2022-03-29 Tdk Corporation Vibration element for a haptic actuator

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/379,460, filed Nov. 19, 2010, Taro Nishiguchi et al.
U.S. Appl. No. 29/379,471, filed Nov. 19, 2010, Taro Nishiguchi et al.
U.S. Appl. No. 29/379,488, filed Nov. 19, 2010, Taro Nishiguchi et al.
U.S. Notice of Allowance dated Aug. 30, 2011, issued in U.S. Appl. No. 29/379,471.
U.S. Notice of Allowance dated Jul. 18, 2011, issued in U.S. Appl. No. 29/379,471.
U.S. Notice of Allowance dated Jul. 25, 2011, issued in U.S. Appl. No. 29/379,460.
U.S. Office Action dated Jul. 22, 2011, issued in U.S. Appl. No. 29/379,488.

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD839220S1 (en) 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD789311S1 (en) * 2015-12-28 2017-06-13 Hitachi Kokusai Electric Inc. Pattern wafer
USD791091S1 (en) * 2015-12-28 2017-07-04 Hitachi Kokusai Electric Inc. Pattern wafer
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD808664S1 (en) 2016-05-16 2018-01-30 Ninja Brand Incorporated Sheet with camouflage pattern
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus
USD947144S1 (en) * 2019-05-10 2022-03-29 Tdk Corporation Vibration element for a haptic actuator

Also Published As

Publication number Publication date
JP1441120S (en) 2015-05-11
CA138032S (en) 2011-11-17

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