Suche Bilder Maps Play YouTube News Gmail Drive Mehr »
Erweiterte Patentsuche | Webprotokoll | Anmelden

Patente

VeröffentlichungsnummerUSD656909 S1
PublikationstypErteilung
Anmeldenummer29/389,788
Veröffentlichungsdatum3. Apr. 2012
Eingetragen15. Apr. 2011
Prioritätsdatum
15. Okt. 2010
Erfinder
Ursprünglich Bevollmächtigter
US-Klassifikation
Referenzen
Externe Links
Adhesive tape for semiconductor manufacturing
US D656909 S1
Zeichnungen(13)
Previous page
Next page
Ansprüche
  1. The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.

Beschreibung

FIG. 1 is a top plan view of a first embodiment of our new design;

FIG. 2 is a bottom plan view of the first embodiment;

FIG. 3 is a left side view of the first embodiment;

FIG. 4 is a right side view of the first embodiment;

FIG. 5 is a rear side view of the first embodiment;

FIG. 6 is a front side view of the first embodiment;

FIG. 7 is a cross-sectional view of the first embodiment taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view of the first embodiment;

FIG. 9 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 1 for completeness of illustration.

FIG. 10 is a top plan view of a second embodiment of our new design;

FIG. 11 is a bottom plan view of the second embodiment;

FIG. 12 is a left side view of the second embodiment;

FIG. 13 is a right side view of the second embodiment;

FIG. 14 is a rear side view of the second embodiment;

FIG. 15 is a front side view of the second embodiment;

FIG. 16 is a cross-sectional view of the second embodiment taken at line 16-16 of FIG. 10;

FIG. 17 is an exploded view of the second embodiment;

FIG. 18 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 10 for completeness of illustration.

FIG. 19 is a top plan view of a third embodiment of our new design;

FIG. 20 is a bottom plan view of the third embodiment;

FIG. 21 is a left side view of the third embodiment;

FIG. 22 is a right side view of the third embodiment;

FIG. 23 is a rear side view of the third embodiment;

FIG. 24 is a front side view of the third embodiment;

FIG. 25 is a cross-sectional view of the third embodiment taken at line 25-25 of FIG. 19;

FIG. 26 is an exploded view of the third embodiment; and,

FIG. 27 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 19 for completeness of illustration.

Nichtpatentzitate
Referenz
1U.S. Appl. No. 29/389,790, filed Apr. 15, 2011, Taniguchi et al.
2U.S. Appl. No. 29/389,794, filed Apr. 15, 2011, Taniguchi et al.
3U.S. Appl. No. 29/389,797, filed Apr. 15, 2011, Taniguchi et al.