USD667801S1 - Package for light emitting diode (LED) lighting - Google Patents

Package for light emitting diode (LED) lighting Download PDF

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Publication number
USD667801S1
USD667801S1 US29/397,017 US201129397017F USD667801S US D667801 S1 USD667801 S1 US D667801S1 US 201129397017 F US201129397017 F US 201129397017F US D667801 S USD667801 S US D667801S
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US
United States
Prior art keywords
package
led
lighting
light emitting
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/397,017
Inventor
Sung Chul Joo
Christopher P. Hussell
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Creeled Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/397,017 priority Critical patent/USD667801S1/en
Priority to US29/432,988 priority patent/USD708156S1/en
Application granted granted Critical
Publication of USD667801S1 publication Critical patent/USD667801S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Description

FIG. 1 is a top perspective view of a package for light emitting diode (LED) lighting showing our design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a first side view thereof, the opposing side being a mirror image of that shown;
FIG. 4 is a second side view thereof, the opposing side being a mirror image of that shown;
FIG. 5 is a bottom plan view thereof opposite the view of FIG. 2;
FIG. 6 is a first side view thereof, the opposing side being a mirror image of that shown;
FIG. 7 is a second side view thereof, the opposing side being a mirror image of that shown; and,
FIG. 8 is a bottom perspective view thereof.
Broken lines immediately adjacent to the shaded areas represent the boundaries of the claimed design. Other broken lines are for illustrative purpose only and form no part of the claimed design. None of the broken lines form part of the claimed design.

Claims (1)

  1. The ornamental design for a package for light emitting diode (LED) lighting, as shown and described.
US29/397,017 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting Active USD667801S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/397,017 USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting
US29/432,988 USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/365,939 USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting
US29/397,017 USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/365,939 Division USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/432,988 Division USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

Publications (1)

Publication Number Publication Date
USD667801S1 true USD667801S1 (en) 2012-09-25

Family

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Family Applications (3)

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US29/365,939 Active USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting
US29/397,017 Active USD667801S1 (en) 2010-07-16 2011-07-11 Package for light emitting diode (LED) lighting
US29/432,988 Active USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/365,939 Active USD643819S1 (en) 2010-07-16 2010-07-16 Package for light emitting diode (LED) lighting

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/432,988 Active USD708156S1 (en) 2010-07-16 2012-09-24 Package for light emitting diode (LED) lighting

Country Status (1)

Country Link
US (3) USD643819S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
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US20110031865A1 (en) * 2009-01-12 2011-02-10 Hussell Christopher P Light emitting device packages with improved heat transfer
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
USD704358S1 (en) 2011-01-03 2014-05-06 Cree, Inc. High brightness LED package
USD708156S1 (en) * 2010-07-16 2014-07-01 Cree, Inc. Package for light emitting diode (LED) lighting
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8866166B2 (en) 2009-06-05 2014-10-21 Cree, Inc. Solid state lighting device
US8878217B2 (en) 2010-06-28 2014-11-04 Cree, Inc. LED package with efficient, isolated thermal path
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US9634209B2 (en) 2011-03-02 2017-04-25 Cree, Inc. Miniature surface mount device
US9685592B2 (en) 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
US9691949B2 (en) 2014-05-30 2017-06-27 Cree, Inc. Submount based light emitter components and methods
USD796076S1 (en) 2014-12-22 2017-08-29 Lunera Lighting Inc. Horizontal LED lamp
US9859471B2 (en) 2011-01-31 2018-01-02 Cree, Inc. High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
US10957736B2 (en) 2018-03-12 2021-03-23 Cree, Inc. Light emitting diode (LED) components and methods
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting

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USD738027S1 (en) * 2013-11-18 2015-09-01 Koninklijke Philips N.V. Illuminated OLED panel
USD731214S1 (en) * 2014-01-15 2015-06-09 Winston Products Llc Merchandising containers for vehicle lights
USD731825S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
USD731826S1 (en) * 2014-01-15 2015-06-16 Winston Products Llc Merchandising containers for vehicle lights
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
USD777694S1 (en) * 2015-05-15 2017-01-31 Citizen Electronics Co., Ltd. Light-emitting diode
USD782989S1 (en) * 2015-05-15 2017-04-04 Citizen Electronics Co., Ltd. Light-emitting diode
US10576557B2 (en) 2017-11-17 2020-03-03 Greenlee Tools, Inc. Workpiece shearing apparatus

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