USD708156S1 - Package for light emitting diode (LED) lighting - Google Patents
Package for light emitting diode (LED) lighting Download PDFInfo
- Publication number
- USD708156S1 USD708156S1 US29/432,988 US201229432988F USD708156S US D708156 S1 USD708156 S1 US D708156S1 US 201229432988 F US201229432988 F US 201229432988F US D708156 S USD708156 S US D708156S
- Authority
- US
- United States
- Prior art keywords
- package
- led
- lighting
- light emitting
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Description
Broken lines immediately adjacent to the shaded areas represent the boundaries of the claimed design. Other broken lines are for illustrative purpose only and form no part of the claimed design. None of the broken lines form part of the claimed design.
Claims (1)
- The ornamental design for a package for light emitting diode (LED) lighting, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/432,988 USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/365,939 USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
US29/397,017 USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
US29/432,988 USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/397,017 Division USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
Publications (1)
Publication Number | Publication Date |
---|---|
USD708156S1 true USD708156S1 (en) | 2014-07-01 |
Family
ID=44455808
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/365,939 Active USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
US29/397,017 Active USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
US29/432,988 Active USD708156S1 (en) | 2010-07-16 | 2012-09-24 | Package for light emitting diode (LED) lighting |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/365,939 Active USD643819S1 (en) | 2010-07-16 | 2010-07-16 | Package for light emitting diode (LED) lighting |
US29/397,017 Active USD667801S1 (en) | 2010-07-16 | 2011-07-11 | Package for light emitting diode (LED) lighting |
Country Status (1)
Country | Link |
---|---|
US (3) | USD643819S1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
US9123874B2 (en) | 2009-01-12 | 2015-09-01 | Cree, Inc. | Light emitting device packages with improved heat transfer |
USD738027S1 (en) * | 2013-11-18 | 2015-09-01 | Koninklijke Philips N.V. | Illuminated OLED panel |
USD777694S1 (en) * | 2015-05-15 | 2017-01-31 | Citizen Electronics Co., Ltd. | Light-emitting diode |
USD778848S1 (en) * | 2015-04-07 | 2017-02-14 | Cree, Inc. | Solid state light emitter component |
USD782989S1 (en) * | 2015-05-15 | 2017-04-04 | Citizen Electronics Co., Ltd. | Light-emitting diode |
US9859471B2 (en) | 2011-01-31 | 2018-01-02 | Cree, Inc. | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
USD866623S1 (en) * | 2017-11-17 | 2019-11-12 | Greenlee Tools, Inc. | Die |
US11101408B2 (en) | 2011-02-07 | 2021-08-24 | Creeled, Inc. | Components and methods for light emitting diode (LED) lighting |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7923739B2 (en) * | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
US9685592B2 (en) | 2009-01-14 | 2017-06-20 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device with large pin pads |
US8860043B2 (en) | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
USD643819S1 (en) * | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
WO2012116470A1 (en) | 2011-03-02 | 2012-09-07 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device |
USD731825S1 (en) * | 2014-01-15 | 2015-06-16 | Winston Products Llc | Merchandising containers for vehicle lights |
USD731214S1 (en) * | 2014-01-15 | 2015-06-09 | Winston Products Llc | Merchandising containers for vehicle lights |
USD731826S1 (en) * | 2014-01-15 | 2015-06-16 | Winston Products Llc | Merchandising containers for vehicle lights |
US9691949B2 (en) | 2014-05-30 | 2017-06-27 | Cree, Inc. | Submount based light emitter components and methods |
USD796076S1 (en) | 2014-12-22 | 2017-08-29 | Lunera Lighting Inc. | Horizontal LED lamp |
US10957736B2 (en) | 2018-03-12 | 2021-03-23 | Cree, Inc. | Light emitting diode (LED) components and methods |
Citations (104)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4679118A (en) | 1984-08-07 | 1987-07-07 | Aavid Engineering, Inc. | Electronic chip-carrier heat sinks |
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
US5210051A (en) | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
USRE34861E (en) | 1987-10-26 | 1995-02-14 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
US5393993A (en) | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
US5506446A (en) | 1994-04-14 | 1996-04-09 | Olin Corporation | Electronic package having improved wire bonding capability |
US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
US20010045640A1 (en) | 1997-02-10 | 2001-11-29 | Seishi Oida | Resin-molded semiconductor device and method for manufacturing the same |
US20020004251A1 (en) | 1999-03-15 | 2002-01-10 | Roberts John K. | Method of making a semiconductor radiation emitter package |
US6498355B1 (en) | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
US6610563B1 (en) | 1997-12-15 | 2003-08-26 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface mounting optoelectronic component and method for producing same |
US20040075100A1 (en) | 2001-04-10 | 2004-04-22 | Georg Bogner | Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component |
US20040079957A1 (en) | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
US20040126913A1 (en) | 2002-12-06 | 2004-07-01 | Loh Ban P. | Composite leadframe LED package and method of making the same |
US6936855B1 (en) | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
US6943433B2 (en) | 2002-03-06 | 2005-09-13 | Nichia Corporation | Semiconductor device and manufacturing method for same |
USD514073S1 (en) * | 2003-07-09 | 2006-01-31 | Nichai Corporation | Light emitting diode |
US20060118808A1 (en) | 2003-03-14 | 2006-06-08 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
US20060157726A1 (en) | 2005-01-14 | 2006-07-20 | Loh Ban P | Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same |
US7081661B2 (en) * | 2001-03-16 | 2006-07-25 | Matsushita Electric Industrial Co., Ltd. | High-frequency module and method for manufacturing the same |
US20060175716A1 (en) | 2003-06-20 | 2006-08-10 | Shintaro Nakashima | Molded package and semiconductor device using molded package |
US20060186418A1 (en) | 2004-05-18 | 2006-08-24 | Edmond John A | External extraction light emitting diode based upon crystallographic faceted surfaces |
US20060220050A1 (en) * | 2003-08-26 | 2006-10-05 | Sumitomo Electric Industries, Ltd. | Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same |
US20070052074A1 (en) | 2005-09-08 | 2007-03-08 | Sharp Kabushiki Kaisha | Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element |
US20070057364A1 (en) | 2005-09-01 | 2007-03-15 | Wang Carl B | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
US20070075325A1 (en) * | 2005-10-04 | 2007-04-05 | Samsung Electro-Mechanics Co., Ltd. | High power light emitting diode package |
US20070114514A1 (en) | 2005-11-21 | 2007-05-24 | Sharp Kabushiki Kaisha | Light emitting device |
US7224047B2 (en) | 2004-12-18 | 2007-05-29 | Lsi Corporation | Semiconductor device package with reduced leakage |
US7249790B2 (en) | 2000-06-23 | 2007-07-31 | Breeze-Torca Products, Llc | Clamp for joining tubular bodies |
US20080006837A1 (en) | 2006-07-07 | 2008-01-10 | Lg Electronics Inc. And Lg Innotek Co., Ltd | Sub-mount for mounting light emitting device and light emitting device package |
US20080023722A1 (en) | 2006-07-28 | 2008-01-31 | Delta Electronics, Inc. | Light-emitting heat-dissipating device and packaging method thereof |
USD566055S1 (en) * | 2006-09-21 | 2008-04-08 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
US7361940B2 (en) | 2004-12-16 | 2008-04-22 | Seoul Semiconductor Co., Ltd. | Leadframe and packaged light emitting diode |
US7400049B2 (en) | 2006-02-16 | 2008-07-15 | Stats Chippac Ltd. | Integrated circuit package system with heat sink |
USD573113S1 (en) * | 2005-12-09 | 2008-07-15 | Nichia Corporation | Light emitting diode |
USD573114S1 (en) * | 2007-05-04 | 2008-07-15 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
US20080185605A1 (en) * | 2007-01-15 | 2008-08-07 | Citizen Electronics Co., Ltd. | Light-emitting diode and method for producing it |
US7432589B2 (en) | 2006-04-19 | 2008-10-07 | Nichia Corporation | Semiconductor device |
US20080258130A1 (en) | 2007-04-23 | 2008-10-23 | Bergmann Michael J | Beveled LED Chip with Transparent Substrate |
US20080258162A1 (en) * | 2007-04-17 | 2008-10-23 | Koung Chia-Yin | Package for a high-power light emitting diode |
USD580375S1 (en) | 2006-10-12 | 2008-11-11 | Semi-Photonics Co., Ltd. | Lead frame for a two-pin light emitting diode device |
US20080278941A1 (en) | 2007-05-07 | 2008-11-13 | Philips Solid-State Lighting Solutions, Inc. | Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability |
USD580891S1 (en) * | 2007-07-20 | 2008-11-18 | Alti-Electronics Co. Ltd. | Light emitting diode |
US20080283849A1 (en) | 2007-05-16 | 2008-11-20 | Ushiodenki Kabushiki Kaisha | Led device and method by which it is produced |
US7456499B2 (en) | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US20080290353A1 (en) | 2007-05-24 | 2008-11-27 | Medendorp Jr Nicholas W | Microscale optoelectronic device packages |
US20090008662A1 (en) | 2007-07-05 | 2009-01-08 | Ian Ashdown | Lighting device package |
US20090101921A1 (en) | 2007-10-17 | 2009-04-23 | Tai-Sol Electronics Co., Ltd. | LED and thermal conductivity device combination assembly |
US20090122533A1 (en) | 2007-11-08 | 2009-05-14 | Innovations In Optics, Inc. | LED backlighting system with closed loop control |
USD594827S1 (en) | 2006-12-07 | 2009-06-23 | Cree, Inc. | Lamp package |
US20090159905A1 (en) | 2007-12-24 | 2009-06-25 | Kuei-Fang Chen | Light Emitting Assembly |
USD595675S1 (en) * | 2008-09-24 | 2009-07-07 | Harvatek Corporation | Light emitting diode |
US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
US7566159B2 (en) | 2007-05-31 | 2009-07-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Side-emitting LED package with improved heat dissipation |
US20090189178A1 (en) | 2006-06-30 | 2009-07-30 | Do Hyung Kim | Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method |
USD597968S1 (en) * | 2008-03-13 | 2009-08-11 | Rohm Co., Ltd. | Light emitting diode module |
USD597971S1 (en) * | 2008-03-13 | 2009-08-11 | Rohm Co., Ltd. | Light emitting diode module |
US7592638B2 (en) | 2005-10-19 | 2009-09-22 | Lg Innotek Co., Ltd. | Light emitting diode package |
US20090267085A1 (en) | 2005-03-11 | 2009-10-29 | Seoul Semiconductor Co., Ltd. | Led package having an array of light emitting cells coupled in series |
US20090321779A1 (en) | 2005-11-25 | 2009-12-31 | Samsung Electro-Mechanics Co., Ltd. | Side view light emitting diode package |
US7659551B2 (en) | 2003-05-27 | 2010-02-09 | Cree, Inc. | Power surface mount light emitting die package |
US20100059783A1 (en) | 2008-09-08 | 2010-03-11 | Harry Chandra | Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation |
USD614592S1 (en) | 2008-08-28 | 2010-04-27 | Cree, Inc. | Light emitting diode |
US20100102345A1 (en) | 2007-04-19 | 2010-04-29 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US7719024B2 (en) * | 2006-05-10 | 2010-05-18 | Nichia Corporation | Semiconductor light emitting device and a method for producing the same |
US20100133578A1 (en) | 2009-08-04 | 2010-06-03 | Cree Led Lighting Solutions, Inc. | Solid state lighting device with improved heatsink |
US20100133554A1 (en) * | 2009-06-05 | 2010-06-03 | Cree, Inc. | Solid state lighting device |
US20100155748A1 (en) * | 2009-01-14 | 2010-06-24 | Cree Hong Kong Limited | Aligned multiple emitter package |
US20100163887A1 (en) | 2008-12-31 | 2010-07-01 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of non-polar light emitting cells and a method of fabricating the same |
US20100181582A1 (en) | 2009-01-22 | 2010-07-22 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof |
USD621799S1 (en) * | 2009-01-12 | 2010-08-17 | Cree, Inc. | Light emitting diode |
USD621798S1 (en) * | 2008-08-29 | 2010-08-17 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
USD622680S1 (en) | 2009-12-04 | 2010-08-31 | Silitek Electronic (Guangzhou) Go., Ltd. | Package of a light emitting diode |
US20100237360A1 (en) | 2009-03-19 | 2010-09-23 | Chih-Chiang Kao | Light emitting diode and back light module thereof |
USD626095S1 (en) | 2009-12-11 | 2010-10-26 | Everlight Electronics Co., Ltd. | Light emitting diode |
US20100270577A1 (en) | 2007-07-23 | 2010-10-28 | Dsm Ip Assets B.V. | Plastic component for a lighting systems |
USD627310S1 (en) | 2009-11-27 | 2010-11-16 | Lite-On Technology Corp. | Package of a light emitting diode |
USD628541S1 (en) | 2010-06-14 | 2010-12-07 | Everlight Electronics Co., Ltd. | Light emitting diode |
US7852015B1 (en) | 2006-10-11 | 2010-12-14 | SemiLEDs Optoelectronics Co., Ltd. | Solid state lighting system and maintenance method therein |
US20110006658A1 (en) | 2009-07-07 | 2011-01-13 | Cree Led Lighting Solutions, Inc. | Solid state lighting device with improved heatsink |
USD632267S1 (en) | 2010-02-12 | 2011-02-08 | Lextar Electronics Corp. | Light emitting diode packaging carrier |
US20110031865A1 (en) | 2009-01-12 | 2011-02-10 | Hussell Christopher P | Light emitting device packages with improved heat transfer |
USD632659S1 (en) * | 2009-11-11 | 2011-02-15 | Everlight Electronics Co., Ltd. | Light emitting diode lamp |
USD634286S1 (en) | 2010-02-10 | 2011-03-15 | Lextar Electronics Corporation | Lead frame |
USD634285S1 (en) | 2010-02-10 | 2011-03-15 | Lextar Electronics Corporation | Lead frame |
USD634284S1 (en) | 2010-02-10 | 2011-03-15 | Lextar Electronics Corporation | Lead frame |
USD634716S1 (en) | 2009-08-06 | 2011-03-22 | Toshiba Lighting & Technology Corporation | Light emitting diode illumination device |
US20110090711A1 (en) | 2009-10-19 | 2011-04-21 | Kim Geun Ho | Light emitting apparatus and lighting system |
USD641719S1 (en) * | 2009-06-05 | 2011-07-19 | Cree, Inc. | Light emitting diode |
US20110186873A1 (en) * | 2009-06-05 | 2011-08-04 | Emerson David T | Light emitting device packages, systems and methods |
USD643819S1 (en) * | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
USD648687S1 (en) * | 2009-06-05 | 2011-11-15 | Cree, Inc. | Light emitting device package |
USD648686S1 (en) * | 2010-04-30 | 2011-11-15 | Cree, Inc. | Light emitting diode (LED) package |
US20120069560A1 (en) | 2007-10-06 | 2012-03-22 | Lynk Labs, Inc. | Multi-voltage and multi-brightness led lighting devices and methods of using same |
USD658599S1 (en) | 2010-03-26 | 2012-05-01 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
US20120127720A1 (en) | 2010-06-28 | 2012-05-24 | Hussell Christopher P | Light emitting devices and methods |
US20120153317A1 (en) | 2009-06-05 | 2012-06-21 | Emerson David T | Light emitting diode (led) devices, systems, and methods |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
US20130003375A1 (en) | 2011-02-07 | 2013-01-03 | Hussell Christopher P | Components and methods for light emitting diode (led) lighting |
US8354992B2 (en) | 2007-07-13 | 2013-01-15 | Tte Indianapolis | Appearance improvement for zone backlit LCD displays |
USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
-
2010
- 2010-07-16 US US29/365,939 patent/USD643819S1/en active Active
-
2011
- 2011-07-11 US US29/397,017 patent/USD667801S1/en active Active
-
2012
- 2012-09-24 US US29/432,988 patent/USD708156S1/en active Active
Patent Citations (123)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4679118A (en) | 1984-08-07 | 1987-07-07 | Aavid Engineering, Inc. | Electronic chip-carrier heat sinks |
USRE34861E (en) | 1987-10-26 | 1995-02-14 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
US4946547A (en) | 1989-10-13 | 1990-08-07 | Cree Research, Inc. | Method of preparing silicon carbide surfaces for crystal growth |
US5210051A (en) | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
US5200022A (en) | 1990-10-03 | 1993-04-06 | Cree Research, Inc. | Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product |
US5393993A (en) | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
US5506446A (en) | 1994-04-14 | 1996-04-09 | Olin Corporation | Electronic package having improved wire bonding capability |
US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
US20010045640A1 (en) | 1997-02-10 | 2001-11-29 | Seishi Oida | Resin-molded semiconductor device and method for manufacturing the same |
US6610563B1 (en) | 1997-12-15 | 2003-08-26 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface mounting optoelectronic component and method for producing same |
US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
US20020004251A1 (en) | 1999-03-15 | 2002-01-10 | Roberts John K. | Method of making a semiconductor radiation emitter package |
US6828170B2 (en) | 1999-03-15 | 2004-12-07 | Gentex Corporation | Method of making a semiconductor radiation emitter package |
US7249790B2 (en) | 2000-06-23 | 2007-07-31 | Breeze-Torca Products, Llc | Clamp for joining tubular bodies |
US7081661B2 (en) * | 2001-03-16 | 2006-07-25 | Matsushita Electric Industrial Co., Ltd. | High-frequency module and method for manufacturing the same |
US20040075100A1 (en) | 2001-04-10 | 2004-04-22 | Georg Bogner | Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component |
US6498355B1 (en) | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
US6936855B1 (en) | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
US6943433B2 (en) | 2002-03-06 | 2005-09-13 | Nichia Corporation | Semiconductor device and manufacturing method for same |
US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
US20040079957A1 (en) | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
US20040126913A1 (en) | 2002-12-06 | 2004-07-01 | Loh Ban P. | Composite leadframe LED package and method of making the same |
US7692206B2 (en) | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
US20060118808A1 (en) | 2003-03-14 | 2006-06-08 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
US7659551B2 (en) | 2003-05-27 | 2010-02-09 | Cree, Inc. | Power surface mount light emitting die package |
US20060175716A1 (en) | 2003-06-20 | 2006-08-10 | Shintaro Nakashima | Molded package and semiconductor device using molded package |
US7462870B2 (en) | 2003-06-20 | 2008-12-09 | Nichia Corporation | Molded package and semiconductor device using molded package |
USD514073S1 (en) * | 2003-07-09 | 2006-01-31 | Nichai Corporation | Light emitting diode |
US20060220050A1 (en) * | 2003-08-26 | 2006-10-05 | Sumitomo Electric Industries, Ltd. | Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same |
US20060186418A1 (en) | 2004-05-18 | 2006-08-24 | Edmond John A | External extraction light emitting diode based upon crystallographic faceted surfaces |
US7791061B2 (en) | 2004-05-18 | 2010-09-07 | Cree, Inc. | External extraction light emitting diode based upon crystallographic faceted surfaces |
US7456499B2 (en) | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US7361940B2 (en) | 2004-12-16 | 2008-04-22 | Seoul Semiconductor Co., Ltd. | Leadframe and packaged light emitting diode |
US7224047B2 (en) | 2004-12-18 | 2007-05-29 | Lsi Corporation | Semiconductor device package with reduced leakage |
US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
US20060157726A1 (en) | 2005-01-14 | 2006-07-20 | Loh Ban P | Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same |
US20090267085A1 (en) | 2005-03-11 | 2009-10-29 | Seoul Semiconductor Co., Ltd. | Led package having an array of light emitting cells coupled in series |
US20070057364A1 (en) | 2005-09-01 | 2007-03-15 | Wang Carl B | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
US20070052074A1 (en) | 2005-09-08 | 2007-03-08 | Sharp Kabushiki Kaisha | Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element |
US20070075325A1 (en) * | 2005-10-04 | 2007-04-05 | Samsung Electro-Mechanics Co., Ltd. | High power light emitting diode package |
US7592638B2 (en) | 2005-10-19 | 2009-09-22 | Lg Innotek Co., Ltd. | Light emitting diode package |
US20070114514A1 (en) | 2005-11-21 | 2007-05-24 | Sharp Kabushiki Kaisha | Light emitting device |
US20090321779A1 (en) | 2005-11-25 | 2009-12-31 | Samsung Electro-Mechanics Co., Ltd. | Side view light emitting diode package |
USD598400S1 (en) | 2005-12-09 | 2009-08-18 | Nichia Corporation | Light emitting diode |
USD580381S1 (en) * | 2005-12-09 | 2008-11-11 | Nichia Corporation | Light emitting diode |
USD573113S1 (en) * | 2005-12-09 | 2008-07-15 | Nichia Corporation | Light emitting diode |
USD584699S1 (en) | 2005-12-09 | 2009-01-13 | Nichia Corporation | Light emitting diode |
US7400049B2 (en) | 2006-02-16 | 2008-07-15 | Stats Chippac Ltd. | Integrated circuit package system with heat sink |
US7432589B2 (en) | 2006-04-19 | 2008-10-07 | Nichia Corporation | Semiconductor device |
US7719024B2 (en) * | 2006-05-10 | 2010-05-18 | Nichia Corporation | Semiconductor light emitting device and a method for producing the same |
US20090189178A1 (en) | 2006-06-30 | 2009-07-30 | Do Hyung Kim | Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method |
US20080006837A1 (en) | 2006-07-07 | 2008-01-10 | Lg Electronics Inc. And Lg Innotek Co., Ltd | Sub-mount for mounting light emitting device and light emitting device package |
US20080023722A1 (en) | 2006-07-28 | 2008-01-31 | Delta Electronics, Inc. | Light-emitting heat-dissipating device and packaging method thereof |
USD566055S1 (en) * | 2006-09-21 | 2008-04-08 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
US7852015B1 (en) | 2006-10-11 | 2010-12-14 | SemiLEDs Optoelectronics Co., Ltd. | Solid state lighting system and maintenance method therein |
USD580375S1 (en) | 2006-10-12 | 2008-11-11 | Semi-Photonics Co., Ltd. | Lead frame for a two-pin light emitting diode device |
USD594827S1 (en) | 2006-12-07 | 2009-06-23 | Cree, Inc. | Lamp package |
US20080185605A1 (en) * | 2007-01-15 | 2008-08-07 | Citizen Electronics Co., Ltd. | Light-emitting diode and method for producing it |
US20080258162A1 (en) * | 2007-04-17 | 2008-10-23 | Koung Chia-Yin | Package for a high-power light emitting diode |
US20100102345A1 (en) | 2007-04-19 | 2010-04-29 | Lg Innotek Co., Ltd. | Light emitting device package and light unit having the same |
US20080258130A1 (en) | 2007-04-23 | 2008-10-23 | Bergmann Michael J | Beveled LED Chip with Transparent Substrate |
USD573114S1 (en) * | 2007-05-04 | 2008-07-15 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
US20080278941A1 (en) | 2007-05-07 | 2008-11-13 | Philips Solid-State Lighting Solutions, Inc. | Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability |
US20080283849A1 (en) | 2007-05-16 | 2008-11-20 | Ushiodenki Kabushiki Kaisha | Led device and method by which it is produced |
US20080290353A1 (en) | 2007-05-24 | 2008-11-27 | Medendorp Jr Nicholas W | Microscale optoelectronic device packages |
US7566159B2 (en) | 2007-05-31 | 2009-07-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Side-emitting LED package with improved heat dissipation |
US20090008662A1 (en) | 2007-07-05 | 2009-01-08 | Ian Ashdown | Lighting device package |
US8354992B2 (en) | 2007-07-13 | 2013-01-15 | Tte Indianapolis | Appearance improvement for zone backlit LCD displays |
USD580891S1 (en) * | 2007-07-20 | 2008-11-18 | Alti-Electronics Co. Ltd. | Light emitting diode |
US20100270577A1 (en) | 2007-07-23 | 2010-10-28 | Dsm Ip Assets B.V. | Plastic component for a lighting systems |
US20120069560A1 (en) | 2007-10-06 | 2012-03-22 | Lynk Labs, Inc. | Multi-voltage and multi-brightness led lighting devices and methods of using same |
US20090101921A1 (en) | 2007-10-17 | 2009-04-23 | Tai-Sol Electronics Co., Ltd. | LED and thermal conductivity device combination assembly |
USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US20090122533A1 (en) | 2007-11-08 | 2009-05-14 | Innovations In Optics, Inc. | LED backlighting system with closed loop control |
US20090159905A1 (en) | 2007-12-24 | 2009-06-25 | Kuei-Fang Chen | Light Emitting Assembly |
USD597971S1 (en) * | 2008-03-13 | 2009-08-11 | Rohm Co., Ltd. | Light emitting diode module |
USD597968S1 (en) * | 2008-03-13 | 2009-08-11 | Rohm Co., Ltd. | Light emitting diode module |
USD614592S1 (en) | 2008-08-28 | 2010-04-27 | Cree, Inc. | Light emitting diode |
USD621798S1 (en) * | 2008-08-29 | 2010-08-17 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
US20100059783A1 (en) | 2008-09-08 | 2010-03-11 | Harry Chandra | Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation |
USD595675S1 (en) * | 2008-09-24 | 2009-07-07 | Harvatek Corporation | Light emitting diode |
US20100163887A1 (en) | 2008-12-31 | 2010-07-01 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of non-polar light emitting cells and a method of fabricating the same |
USD621799S1 (en) * | 2009-01-12 | 2010-08-17 | Cree, Inc. | Light emitting diode |
US20110031865A1 (en) | 2009-01-12 | 2011-02-10 | Hussell Christopher P | Light emitting device packages with improved heat transfer |
USD635527S1 (en) * | 2009-01-12 | 2011-04-05 | Cree, Inc. | Light emitting diode |
US20100155748A1 (en) * | 2009-01-14 | 2010-06-24 | Cree Hong Kong Limited | Aligned multiple emitter package |
US20100181582A1 (en) | 2009-01-22 | 2010-07-22 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof |
US20100237360A1 (en) | 2009-03-19 | 2010-09-23 | Chih-Chiang Kao | Light emitting diode and back light module thereof |
US7923739B2 (en) * | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
US8497522B2 (en) | 2009-06-05 | 2013-07-30 | Cree, Inc. | Solid state lighting device |
US20120153317A1 (en) | 2009-06-05 | 2012-06-21 | Emerson David T | Light emitting diode (led) devices, systems, and methods |
USD661264S1 (en) | 2009-06-05 | 2012-06-05 | Cree, Inc. | Light emiting device package |
US20110186873A1 (en) * | 2009-06-05 | 2011-08-04 | Emerson David T | Light emitting device packages, systems and methods |
US20110180827A1 (en) | 2009-06-05 | 2011-07-28 | Hussell Christopher P | Solid state lighting device |
EP2438631A2 (en) | 2009-06-05 | 2012-04-11 | Cree, Inc. | Solid state lighting device |
US20100133554A1 (en) * | 2009-06-05 | 2010-06-03 | Cree, Inc. | Solid state lighting device |
USD648687S1 (en) * | 2009-06-05 | 2011-11-15 | Cree, Inc. | Light emitting device package |
USD641719S1 (en) * | 2009-06-05 | 2011-07-19 | Cree, Inc. | Light emitting diode |
US20110006658A1 (en) | 2009-07-07 | 2011-01-13 | Cree Led Lighting Solutions, Inc. | Solid state lighting device with improved heatsink |
US20100133578A1 (en) | 2009-08-04 | 2010-06-03 | Cree Led Lighting Solutions, Inc. | Solid state lighting device with improved heatsink |
USD634716S1 (en) | 2009-08-06 | 2011-03-22 | Toshiba Lighting & Technology Corporation | Light emitting diode illumination device |
US20110090711A1 (en) | 2009-10-19 | 2011-04-21 | Kim Geun Ho | Light emitting apparatus and lighting system |
USD632659S1 (en) * | 2009-11-11 | 2011-02-15 | Everlight Electronics Co., Ltd. | Light emitting diode lamp |
USD627310S1 (en) | 2009-11-27 | 2010-11-16 | Lite-On Technology Corp. | Package of a light emitting diode |
USD622680S1 (en) | 2009-12-04 | 2010-08-31 | Silitek Electronic (Guangzhou) Go., Ltd. | Package of a light emitting diode |
USD626095S1 (en) | 2009-12-11 | 2010-10-26 | Everlight Electronics Co., Ltd. | Light emitting diode |
USD634284S1 (en) | 2010-02-10 | 2011-03-15 | Lextar Electronics Corporation | Lead frame |
USD634285S1 (en) | 2010-02-10 | 2011-03-15 | Lextar Electronics Corporation | Lead frame |
USD634286S1 (en) | 2010-02-10 | 2011-03-15 | Lextar Electronics Corporation | Lead frame |
USD632267S1 (en) | 2010-02-12 | 2011-02-08 | Lextar Electronics Corp. | Light emitting diode packaging carrier |
USD658599S1 (en) | 2010-03-26 | 2012-05-01 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
USD648686S1 (en) * | 2010-04-30 | 2011-11-15 | Cree, Inc. | Light emitting diode (LED) package |
USD659657S1 (en) | 2010-04-30 | 2012-05-15 | Cree, Inc. | Light emitting diode (LED) package |
USD628541S1 (en) | 2010-06-14 | 2010-12-07 | Everlight Electronics Co., Ltd. | Light emitting diode |
US20120127720A1 (en) | 2010-06-28 | 2012-05-24 | Hussell Christopher P | Light emitting devices and methods |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
US20130011946A1 (en) | 2010-06-28 | 2013-01-10 | Cree, Inc. | Led package with efficient, isolated thermal path |
USD643819S1 (en) * | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
USD667801S1 (en) * | 2010-07-16 | 2012-09-25 | Cree, Inc. | Package for light emitting diode (LED) lighting |
EP2603930A1 (en) | 2010-08-10 | 2013-06-19 | Cree, Inc. | Led package with efficient, isolated thermal path |
EP2628196A2 (en) | 2010-10-13 | 2013-08-21 | Cree, Inc. | Light emitting devices and methods |
USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
US20130003375A1 (en) | 2011-02-07 | 2013-01-03 | Hussell Christopher P | Components and methods for light emitting diode (led) lighting |
Non-Patent Citations (83)
Title |
---|
Certificate of Design Patent for Application No. 2011/015199 dated Dec. 9, 2011. |
Certificate of Design Patent for Application No. 2011/015200 dated Jan. 6, 2012. |
Certificate of Design Patent for Application No. 2011/015201 dated Jan. 6, 2012. |
Certificate of Design Patent for Application No. CN ZL 201130210595 dated Jun. 11, 2012. |
Certificate of Design Patent for Application Serial No. CN ZL 201030577293 dated May 23, 2012. |
Certificate of Registration for Community Design Application Serial No. 001283600-0001-0003 dated Jan. 7, 2011. |
Communication of Europe publication number and information on the application of Article 67(3) EPC dated Mar. 14, 2012. |
Design U.S. Appl. No. 29/382,394, filed Jan. 3, 2011. |
Hyun-Ho Kim et al., Thermal Transient Characteristics of Die Attach in High Power LED PKG, Microelectronics Reliability, vol. 48, Issue 3, Mar. 2008, pp. 445-454. |
International Preliminary Report on Patentability for PCT Application Serial No. PCT/US2010/035379 dated Dec. 8, 2011. |
International Search Report and Written Opinion for Application Serial No. PCT/US2011/04560 dated May 22, 2012. |
International Search Report and Written Opinion for Application Serial No. PCT/US2012/021879 dated Sep. 21, 2012. |
International Search Report and Written Opinion for Application Serial No. PCT/US2012/024122 dated Jul. 11, 2012. |
International Search Report and Written Opinion for Application Serial No. PCT/US2012/036110 dated Oct. 4, 2012. |
International Search Report and Written Opinion for PCT Application Serial No. PCT/US2011/043539 dated Oct. 28, 2011. |
International Search Report and Written Opinion for PCT Application Serial No. PCT/US2011/41833 dated Oct. 24, 2011. |
International Search Report for Application Serial No. PCT/US2012/023285 dated Jun. 27, 2012. |
International Search Report for Application Serial No. TW 100305347 dated Mar. 5, 2012. |
International Search Report/Written Opinion dated Jan. 5, 2011 for PCT/US2010/035379. |
Japanese Notice of Allowance for Application Serial No. JP 2011-017747 dated Mar. 8, 2012. |
Japanese Office Action for JP2010-026185 dated Apr. 5, 2011. |
Korean Decision to Grant for Application No. KR 30-2010-0047048 dated Nov. 26, 2012. |
Korean Decision to Grant for Application No. KR 30-2011-0027243 dated Nov. 26, 2012. |
Korean Decision to Grant for Application No. KR 30-2011-0027244 dated Nov. 19, 2012. |
Korean Decision to Grant for Application No. KR 30-2011-0027245 dated Nov. 19, 2012. |
Korean Notice of Allowance for Application No. 30-2010-0047049 dated Apr. 4, 2013. |
Korean Office Action for Application Serial No. KR 30-2010-0047049 dated Sep. 12, 2012. |
Korean Office Action for Application Serial No. KR 30-2011-27243 dated Jul. 5, 2012. |
Korean Office Action for Application Serial No. KR 30-2011-27244 dated Jul. 5, 2012. |
Korean Office Action for Application Serial No. KR 30-2011-27245 dated Jul. 5, 2012. |
Non-Final Office Action for Design U.S. Appl. No. 13/082,699 dated Apr. 13, 2012. |
Non-Final Office Action for Korean Application Serial No. KR 30-2010-0047048 dated Dec. 15, 2011. |
Non-Final Office Action for Korean Application Serial No. KR 30-2010-0047049 dated Dec. 15, 2011. |
Non-Final Office Action for U.S. Appl. No. 12/479,318 dated Jun. 2, 2010. |
Non-final Office Action for U.S. Appl. No. 12/479,318 dated Nov. 10, 2010. |
Non-Final Office Action for U.S. Appl. No. 12/825,075 dated Feb. 1, 2013. |
Non-Final Office Action for U.S. Appl. No. 12/853,812 dated Dec. 7, 2011. |
Non-Final Office Action for U.S. Appl. No. 12/969,267 dated Mar. 29, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/011,609 dated Jun. 7, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/227,961 dated Mar. 26, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/362,683 dated Sep. 9, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/462,450 dated Jan. 15, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/616,759 dated Jul. 11, 2013. |
Non-Final Office Action for U.S. Appl. No. 13/616,759 dated Oct. 10, 2013. |
Notice of Allowance dated Apr. 16, 2010 from U.S. Appl. No. 29/338,186. |
Notice of Allowance for Chinese Application Serial No. CN 2011/30171313.0 dated Dec. 6, 2011. |
Notice of Allowance for Design U.S. Appl. No. 29/338,186 dated Mar. 10, 2011. |
Notice of Allowance for Design U.S. Appl. No. 29/360,791 dated Apr. 12, 2011. |
Notice of Allowance for Design U.S. Appl. No. 29/360,791 dated Jul. 21, 2011. |
Notice of Allowance for Design U.S. Appl. No. 29/365,939 dated Apr. 12, 2011. |
Notice of Allowance for Design U.S. Appl. No. 29/380,549 dated Jul. 28, 2011. |
Notice of Allowance for Design U.S. Appl. No. 29/382,394 dated Nov. 27, 2012. |
Notice of Allowance for Design U.S. Appl. No. 29/397,017 dated Dec. 9, 2011. |
Notice of Allowance for Design U.S. Appl. No. 29/397,017 dated May 17, 2012. |
Notice of Allowance for Design U.S. Appl. No. 29/401,692 dated Jan. 20, 2012. |
Notice of Allowance for Design U.S. Appl. No. 29/403,433 dated Feb. 2, 2012. |
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015199 dated Nov. 10, 2011. |
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015200 dated Nov. 30, 2011. |
Notice of Allowance for Japanese Application Serial No. JP-DES 2011/015201 dated Nov. 30, 2011. |
Notice of Allowance for Japanese Design Appl. No. 2010-026186 dated Mar. 29, 2011. |
Notice of Allowance for Taiwanese Application Serial No. TW 099305566 dated Dec. 5, 2011. |
Notice of Allowance for U.S. Appl. No. 12/479,318 dated Feb. 17, 2011. |
Notice of Allowance for U.S. Appl. No. 12/825,075 dated Jul. 31, 2013. |
Notice of Allowance for U.S. Appl. No. 12/853,812 dated May 21, 2012. |
Notice of Allowance for U.S. Appl. No. 12/969,267 dated Oct. 2, 2013. |
Notice of Allowance for U.S. Appl. No. 13/082,699 dated Apr. 3, 2013. |
Notice of Allowance for U.S. Appl. No. 13/082,699 dated Oct. 23, 2012. |
Notice of Allowance for U.S. Appl. No. 13/227,961 dated Oct. 2, 2013. |
Notice of Allowance for U.S. Appl. No. 13/462,450 dated Aug. 1, 2013. |
Notice of Allowance from Design U.S. Appl. No. 29/330,657 dated Sep. 25, 2009. |
Notification of Grant for Chinese Application Serial No. CN 2010-305787293.2 dated Jan. 19, 2012. |
Notification of Grant for Chinese Application Serial No. CN 2011/30210595.0 dated Jan. 17, 2012. |
Office Action for Restriction/Election Requirement for U.S. Appl. No. 12/853,812 dated Sep. 22, 2011. |
Restriction Requirement for Design U.S. Appl. No. 29/382,394 dated Jul. 17, 2012. |
Restriction Requirement for Design U.S. Appl. No. 29/451,761 dated Sep. 25, 2013. |
Supplemental Notice of Allowability for U.S. Appl. No. 12/479,318 dated Apr. 5, 2011. |
Supplemental Notice of Allowance for Design U.S. Appl. No. 29/338,186 dated May 20, 2011. |
Supplemental Notice of Allowance for Design U.S. Appl. No. 29/360,791 dated Jan. 24, 2011. |
Supplemental Notice of Allowance for Design U.S. Appl. No. 29/382,394 dated Jan. 14, 2013. |
Supplemental Notice of Allowance for Design U.S. Appl. No. 29/397,017 dated Jul. 23, 2012. |
Taiwanese Notice of Allowance for Application No. 100305347 dated Mar. 23, 2012. |
Taiwanese Office Action for U.S. Appl. No. 099305566 dated Jul. 12, 2011. |
U.S. Appl. No. 12/969,267, filed Dec. 15, 2010. |
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