USD761744S1 - Heat spreader with fins and top bar on a memory module - Google Patents
Heat spreader with fins and top bar on a memory module Download PDFInfo
- Publication number
- USD761744S1 USD761744S1 US29/507,394 US201429507394F USD761744S US D761744 S1 USD761744 S1 US D761744S1 US 201429507394 F US201429507394 F US 201429507394F US D761744 S USD761744 S US D761744S
- Authority
- US
- United States
- Prior art keywords
- fins
- memory module
- heat spreader
- top bar
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The sole FIGURE is a front, right side perspective view of a heat spreader on a memory module showing our new design.
The shade lines in the FIGURES show contour and not surface ornamentation.
Claims (1)
- The ornamental design for a heat spreader with fins and top bar on a memory module, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/507,394 USD761744S1 (en) | 2012-07-18 | 2014-10-27 | Heat spreader with fins and top bar on a memory module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/427,486 USD717251S1 (en) | 2012-07-18 | 2012-07-18 | Heat spreader with fins and top bar on a memory module |
US29/507,394 USD761744S1 (en) | 2012-07-18 | 2014-10-27 | Heat spreader with fins and top bar on a memory module |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/427,486 Division USD717251S1 (en) | 2012-07-18 | 2012-07-18 | Heat spreader with fins and top bar on a memory module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD761744S1 true USD761744S1 (en) | 2016-07-19 |
Family
ID=51846178
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/427,486 Active USD717251S1 (en) | 2012-07-18 | 2012-07-18 | Heat spreader with fins and top bar on a memory module |
US29/507,394 Active USD761744S1 (en) | 2012-07-18 | 2014-10-27 | Heat spreader with fins and top bar on a memory module |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/427,486 Active USD717251S1 (en) | 2012-07-18 | 2012-07-18 | Heat spreader with fins and top bar on a memory module |
Country Status (1)
Country | Link |
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US (2) | USD717251S1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD795807S1 (en) * | 2015-09-16 | 2017-08-29 | Mitsubishi Electric Corporation | Cover of AC generator for vehicle |
USD820785S1 (en) * | 2015-09-16 | 2018-06-19 | Mitsubishi Electric Corporation | Rectifier of AC generator for vehicle |
USD823252S1 (en) * | 2015-09-16 | 2018-07-17 | Mitsubishi Electric Corporation | Rectifier of AC generator for vehicle |
USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
USD862402S1 (en) * | 2017-12-18 | 2019-10-08 | Kingston Digital, Inc. | Memory heat dissipation sink |
USD863311S1 (en) * | 2018-06-26 | 2019-10-15 | Corsair Memory, Inc. | Memory module |
USD868069S1 (en) * | 2017-06-29 | 2019-11-26 | V-Color Technology Inc. | Memory device |
USD897345S1 (en) * | 2018-12-07 | 2020-09-29 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD954061S1 (en) * | 2018-12-07 | 2022-06-07 | Sung-Yu Chen | Double-data-rate SDRAM card |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD717251S1 (en) * | 2012-07-18 | 2014-11-11 | Corsair Memory, Inc. | Heat spreader with fins and top bar on a memory module |
USD733145S1 (en) * | 2014-03-14 | 2015-06-30 | Kingston Digital, Inc. | Memory module |
USD735201S1 (en) * | 2014-07-30 | 2015-07-28 | Kingston Digital, Inc. | Memory module |
US10053338B1 (en) | 2016-05-10 | 2018-08-21 | Versabar, Inc. | Adjustable spreader bar |
US10633223B1 (en) | 2018-11-27 | 2020-04-28 | Versabar, Inc. | Adjustable spreader bar |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297966B1 (en) | 1998-12-24 | 2001-10-02 | Foxconn Precision Components Co., Ltd. | Memory module having improved heat dissipation and shielding |
US20020039282A1 (en) | 2000-09-29 | 2002-04-04 | Samsung Electronics Co., Ltd. | Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof |
US20030076657A1 (en) | 2001-06-28 | 2003-04-24 | Intel Corporation | Heat transfer apparatus |
US20050264998A1 (en) | 2004-05-25 | 2005-12-01 | 3M Innovative Properties Company | Heat sink assembly |
US20070070607A1 (en) | 2005-09-23 | 2007-03-29 | Staktek Group, L.P. | Applied heat spreader with cooling fin |
US20070263360A1 (en) | 2006-05-15 | 2007-11-15 | Foxconn Technology Co., Ltd. | Memory module assembly including a clip for mounting a heat sink thereon |
US7365985B1 (en) | 2004-09-29 | 2008-04-29 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
US7382617B2 (en) | 2006-01-16 | 2008-06-03 | Nanya Technology Corporation | Heat sink assembly |
US7391613B2 (en) | 2006-05-12 | 2008-06-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US20090168356A1 (en) | 2007-12-27 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly with heat dissipation device |
USD597966S1 (en) | 2008-10-09 | 2009-08-11 | Asustek Computer Inc. | Memory heat sink |
US7606035B2 (en) | 2006-09-22 | 2009-10-20 | Samsung Electronics Co., Ltd. | Heat sink and memory module using the same |
US20100038054A1 (en) | 2008-08-18 | 2010-02-18 | Comptake Technology Inc. | Heat dispensing unit for memory chip |
USD610557S1 (en) | 2009-06-16 | 2010-02-23 | Comptake Technology Inc. | Heat sink for read only memory device |
US20100175852A1 (en) | 2009-01-13 | 2010-07-15 | Peterson Eric C | Cooling Manifold Assembly |
US7768785B2 (en) * | 2004-09-29 | 2010-08-03 | Super Talent Electronics, Inc. | Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive |
USD626521S1 (en) | 2010-03-23 | 2010-11-02 | Comptake Technology Inc. | Heat-dissipating device for memory |
USD626520S1 (en) | 2010-03-23 | 2010-11-02 | Comptake Technology Inc. | Heat-dissipating device for memory |
US8018723B1 (en) * | 2008-04-30 | 2011-09-13 | Netlist, Inc. | Heat dissipation for electronic modules |
US8081474B1 (en) | 2007-12-18 | 2011-12-20 | Google Inc. | Embossed heat spreader |
USD657756S1 (en) | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
USD660810S1 (en) | 2011-10-17 | 2012-05-29 | Corsair Memory, Inc. | Heat spreader with fins for a computer memory module |
USD717251S1 (en) * | 2012-07-18 | 2014-11-11 | Corsair Memory, Inc. | Heat spreader with fins and top bar on a memory module |
USD717744S1 (en) * | 2013-08-30 | 2014-11-18 | Corsair Memory, Inc. | Heat spreader on a memory module |
-
2012
- 2012-07-18 US US29/427,486 patent/USD717251S1/en active Active
-
2014
- 2014-10-27 US US29/507,394 patent/USD761744S1/en active Active
Patent Citations (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297966B1 (en) | 1998-12-24 | 2001-10-02 | Foxconn Precision Components Co., Ltd. | Memory module having improved heat dissipation and shielding |
US20020039282A1 (en) | 2000-09-29 | 2002-04-04 | Samsung Electronics Co., Ltd. | Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof |
US20030076657A1 (en) | 2001-06-28 | 2003-04-24 | Intel Corporation | Heat transfer apparatus |
US20050264998A1 (en) | 2004-05-25 | 2005-12-01 | 3M Innovative Properties Company | Heat sink assembly |
US7365985B1 (en) | 2004-09-29 | 2008-04-29 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
US7768785B2 (en) * | 2004-09-29 | 2010-08-03 | Super Talent Electronics, Inc. | Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive |
US20070070607A1 (en) | 2005-09-23 | 2007-03-29 | Staktek Group, L.P. | Applied heat spreader with cooling fin |
US7382617B2 (en) | 2006-01-16 | 2008-06-03 | Nanya Technology Corporation | Heat sink assembly |
US7391613B2 (en) | 2006-05-12 | 2008-06-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US20070263360A1 (en) | 2006-05-15 | 2007-11-15 | Foxconn Technology Co., Ltd. | Memory module assembly including a clip for mounting a heat sink thereon |
US7606035B2 (en) | 2006-09-22 | 2009-10-20 | Samsung Electronics Co., Ltd. | Heat sink and memory module using the same |
US8081474B1 (en) | 2007-12-18 | 2011-12-20 | Google Inc. | Embossed heat spreader |
US20090168356A1 (en) | 2007-12-27 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly with heat dissipation device |
US7755897B2 (en) * | 2007-12-27 | 2010-07-13 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly with heat dissipation device |
US8018723B1 (en) * | 2008-04-30 | 2011-09-13 | Netlist, Inc. | Heat dissipation for electronic modules |
US20100038054A1 (en) | 2008-08-18 | 2010-02-18 | Comptake Technology Inc. | Heat dispensing unit for memory chip |
USD597966S1 (en) | 2008-10-09 | 2009-08-11 | Asustek Computer Inc. | Memory heat sink |
US20100175852A1 (en) | 2009-01-13 | 2010-07-15 | Peterson Eric C | Cooling Manifold Assembly |
USD610557S1 (en) | 2009-06-16 | 2010-02-23 | Comptake Technology Inc. | Heat sink for read only memory device |
USD626521S1 (en) | 2010-03-23 | 2010-11-02 | Comptake Technology Inc. | Heat-dissipating device for memory |
USD626520S1 (en) | 2010-03-23 | 2010-11-02 | Comptake Technology Inc. | Heat-dissipating device for memory |
USD657756S1 (en) | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
USD660810S1 (en) | 2011-10-17 | 2012-05-29 | Corsair Memory, Inc. | Heat spreader with fins for a computer memory module |
USD717251S1 (en) * | 2012-07-18 | 2014-11-11 | Corsair Memory, Inc. | Heat spreader with fins and top bar on a memory module |
USD717744S1 (en) * | 2013-08-30 | 2014-11-18 | Corsair Memory, Inc. | Heat spreader on a memory module |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD795807S1 (en) * | 2015-09-16 | 2017-08-29 | Mitsubishi Electric Corporation | Cover of AC generator for vehicle |
USD820785S1 (en) * | 2015-09-16 | 2018-06-19 | Mitsubishi Electric Corporation | Rectifier of AC generator for vehicle |
USD823252S1 (en) * | 2015-09-16 | 2018-07-17 | Mitsubishi Electric Corporation | Rectifier of AC generator for vehicle |
USD868069S1 (en) * | 2017-06-29 | 2019-11-26 | V-Color Technology Inc. | Memory device |
USD862402S1 (en) * | 2017-12-18 | 2019-10-08 | Kingston Digital, Inc. | Memory heat dissipation sink |
USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
USD863311S1 (en) * | 2018-06-26 | 2019-10-15 | Corsair Memory, Inc. | Memory module |
USD897345S1 (en) * | 2018-12-07 | 2020-09-29 | Sung-Yu Chen | Double-data-rate SDRAM card |
USD954061S1 (en) * | 2018-12-07 | 2022-06-07 | Sung-Yu Chen | Double-data-rate SDRAM card |
Also Published As
Publication number | Publication date |
---|---|
USD717251S1 (en) | 2014-11-11 |
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