USD761744S1 - Heat spreader with fins and top bar on a memory module - Google Patents

Heat spreader with fins and top bar on a memory module Download PDF

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Publication number
USD761744S1
USD761744S1 US29/507,394 US201429507394F USD761744S US D761744 S1 USD761744 S1 US D761744S1 US 201429507394 F US201429507394 F US 201429507394F US D761744 S USD761744 S US D761744S
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United States
Prior art keywords
fins
memory module
heat spreader
top bar
bar
Prior art date
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Active
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US29/507,394
Inventor
Martin Mueller
Thi La
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Corsair Memory Inc
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Corsair Memory Inc
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Priority to US29/507,394 priority Critical patent/USD761744S1/en
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Assigned to MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT reassignment MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Assignors: CORSAIR MEMORY, INC.
Assigned to MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT reassignment MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Assignors: CORSAIR MEMORY, INC.
Assigned to Corsair Memory Inc., ORIGIN PC, LLC reassignment Corsair Memory Inc. TERMINATION AND RELEASE OF SECOND LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY RECORDED AT REEL 043714, FRAME 0171 Assignors: MACQUARIE CAPITAL FUNDING LLC
Assigned to BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT reassignment BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Assignors: CORSAIR MEMORY, INC.
Assigned to CORSAIR MEMORY, INC., ORIGIN PC, LLC reassignment CORSAIR MEMORY, INC. TERMINATION AND RELEASE OF FIRST LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Assignors: MACQUARIE CAPITAL FUNDING LLC
Assigned to CORSAIR MEMORY, INC. reassignment CORSAIR MEMORY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LA, THI, MUELLER, MARTIN
Active legal-status Critical Current
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Description

The sole FIGURE is a front, right side perspective view of a heat spreader on a memory module showing our new design.
The shade lines in the FIGURES show contour and not surface ornamentation.

Claims (1)

    CLAIM
  1. The ornamental design for a heat spreader with fins and top bar on a memory module, as shown and described.
US29/507,394 2012-07-18 2014-10-27 Heat spreader with fins and top bar on a memory module Active USD761744S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/507,394 USD761744S1 (en) 2012-07-18 2014-10-27 Heat spreader with fins and top bar on a memory module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/427,486 USD717251S1 (en) 2012-07-18 2012-07-18 Heat spreader with fins and top bar on a memory module
US29/507,394 USD761744S1 (en) 2012-07-18 2014-10-27 Heat spreader with fins and top bar on a memory module

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US29/427,486 Division USD717251S1 (en) 2012-07-18 2012-07-18 Heat spreader with fins and top bar on a memory module

Publications (1)

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USD761744S1 true USD761744S1 (en) 2016-07-19

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US29/427,486 Active USD717251S1 (en) 2012-07-18 2012-07-18 Heat spreader with fins and top bar on a memory module
US29/507,394 Active USD761744S1 (en) 2012-07-18 2014-10-27 Heat spreader with fins and top bar on a memory module

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US29/427,486 Active USD717251S1 (en) 2012-07-18 2012-07-18 Heat spreader with fins and top bar on a memory module

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795807S1 (en) * 2015-09-16 2017-08-29 Mitsubishi Electric Corporation Cover of AC generator for vehicle
USD820785S1 (en) * 2015-09-16 2018-06-19 Mitsubishi Electric Corporation Rectifier of AC generator for vehicle
USD823252S1 (en) * 2015-09-16 2018-07-17 Mitsubishi Electric Corporation Rectifier of AC generator for vehicle
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
USD863311S1 (en) * 2018-06-26 2019-10-15 Corsair Memory, Inc. Memory module
USD868069S1 (en) * 2017-06-29 2019-11-26 V-Color Technology Inc. Memory device
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD717251S1 (en) * 2012-07-18 2014-11-11 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD733145S1 (en) * 2014-03-14 2015-06-30 Kingston Digital, Inc. Memory module
USD735201S1 (en) * 2014-07-30 2015-07-28 Kingston Digital, Inc. Memory module
US10053338B1 (en) 2016-05-10 2018-08-21 Versabar, Inc. Adjustable spreader bar
US10633223B1 (en) 2018-11-27 2020-04-28 Versabar, Inc. Adjustable spreader bar

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297966B1 (en) 1998-12-24 2001-10-02 Foxconn Precision Components Co., Ltd. Memory module having improved heat dissipation and shielding
US20020039282A1 (en) 2000-09-29 2002-04-04 Samsung Electronics Co., Ltd. Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof
US20030076657A1 (en) 2001-06-28 2003-04-24 Intel Corporation Heat transfer apparatus
US20050264998A1 (en) 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
US20070070607A1 (en) 2005-09-23 2007-03-29 Staktek Group, L.P. Applied heat spreader with cooling fin
US20070263360A1 (en) 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US7365985B1 (en) 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7382617B2 (en) 2006-01-16 2008-06-03 Nanya Technology Corporation Heat sink assembly
US7391613B2 (en) 2006-05-12 2008-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US20090168356A1 (en) 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly with heat dissipation device
USD597966S1 (en) 2008-10-09 2009-08-11 Asustek Computer Inc. Memory heat sink
US7606035B2 (en) 2006-09-22 2009-10-20 Samsung Electronics Co., Ltd. Heat sink and memory module using the same
US20100038054A1 (en) 2008-08-18 2010-02-18 Comptake Technology Inc. Heat dispensing unit for memory chip
USD610557S1 (en) 2009-06-16 2010-02-23 Comptake Technology Inc. Heat sink for read only memory device
US20100175852A1 (en) 2009-01-13 2010-07-15 Peterson Eric C Cooling Manifold Assembly
US7768785B2 (en) * 2004-09-29 2010-08-03 Super Talent Electronics, Inc. Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive
USD626521S1 (en) 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD626520S1 (en) 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
US8018723B1 (en) * 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
USD657756S1 (en) 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD660810S1 (en) 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module
USD717251S1 (en) * 2012-07-18 2014-11-11 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD717744S1 (en) * 2013-08-30 2014-11-18 Corsair Memory, Inc. Heat spreader on a memory module

Patent Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297966B1 (en) 1998-12-24 2001-10-02 Foxconn Precision Components Co., Ltd. Memory module having improved heat dissipation and shielding
US20020039282A1 (en) 2000-09-29 2002-04-04 Samsung Electronics Co., Ltd. Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof
US20030076657A1 (en) 2001-06-28 2003-04-24 Intel Corporation Heat transfer apparatus
US20050264998A1 (en) 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
US7365985B1 (en) 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7768785B2 (en) * 2004-09-29 2010-08-03 Super Talent Electronics, Inc. Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive
US20070070607A1 (en) 2005-09-23 2007-03-29 Staktek Group, L.P. Applied heat spreader with cooling fin
US7382617B2 (en) 2006-01-16 2008-06-03 Nanya Technology Corporation Heat sink assembly
US7391613B2 (en) 2006-05-12 2008-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US20070263360A1 (en) 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US7606035B2 (en) 2006-09-22 2009-10-20 Samsung Electronics Co., Ltd. Heat sink and memory module using the same
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US20090168356A1 (en) 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly with heat dissipation device
US7755897B2 (en) * 2007-12-27 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly with heat dissipation device
US8018723B1 (en) * 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US20100038054A1 (en) 2008-08-18 2010-02-18 Comptake Technology Inc. Heat dispensing unit for memory chip
USD597966S1 (en) 2008-10-09 2009-08-11 Asustek Computer Inc. Memory heat sink
US20100175852A1 (en) 2009-01-13 2010-07-15 Peterson Eric C Cooling Manifold Assembly
USD610557S1 (en) 2009-06-16 2010-02-23 Comptake Technology Inc. Heat sink for read only memory device
USD626521S1 (en) 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD626520S1 (en) 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD657756S1 (en) 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD660810S1 (en) 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module
USD717251S1 (en) * 2012-07-18 2014-11-11 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD717744S1 (en) * 2013-08-30 2014-11-18 Corsair Memory, Inc. Heat spreader on a memory module

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795807S1 (en) * 2015-09-16 2017-08-29 Mitsubishi Electric Corporation Cover of AC generator for vehicle
USD820785S1 (en) * 2015-09-16 2018-06-19 Mitsubishi Electric Corporation Rectifier of AC generator for vehicle
USD823252S1 (en) * 2015-09-16 2018-07-17 Mitsubishi Electric Corporation Rectifier of AC generator for vehicle
USD868069S1 (en) * 2017-06-29 2019-11-26 V-Color Technology Inc. Memory device
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module
USD863311S1 (en) * 2018-06-26 2019-10-15 Corsair Memory, Inc. Memory module
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card

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