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US RE39784 E1 Zusammenfassung A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on the memory module to stimulate heat exchange above the extension part of the heat sinks. The cooler module could be a fan or heat conductive tube. As a fan, it could be buckled on the memory module socket for the extension part of the heat sinks to stimulate heat exchange. As a heat conduction tube screwed or tenoned against the extension part of the heat sinks, it stimulates heat exchange and provides heat dispensation function to assure the performance of the memory module. Zeichnungen(9)            Ansprüche 1. A structure for a removable cooler on a memory module inside a PC, comprising: a heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on said memory module, stimulating heat exchange by transmitting heat generated by said memory module to space above an extension part of said heat sink; a cooler module consisting of a frame and at least a pair of fans, on both sides of said frame there are flexible frame's legs and two holes on top of said frame stretching to both sides of said frame for ventilation; one of the at least a pair of fans is placed above each of said frame's holes to enhance ventilation; thus, several memory modules are inserted separately in memory module sockets of a board and said frame's legs pushed outward are stuck with a hook, allowing a frame's top and said at least a pair of fans to be placed above said extension part of said heat sinks for ventilation, stimulating heat exchange to said extension parts, thus to provide heat dispensation for said memory module. 2. The removable cooler for a memory module of 3. The removable cooler on a memory module of 4. The removable cooler on a memory module of 5. The removable cooler on a memory module of 6. The removable cooler on a memory module of 7. The removable cooler on a memory module of 8. The removable cooler on a memory module of 9. The removable cooler on a memory module of 10. A removable cooler module for a memory module, the memory module being mounted in a memory socket that is secured to a printed circuit board such that a plane of the memory module extends perpendicular to the printed circuit board, the cooler module comprising: a frame including parallel side legs and an upper section extending perpendicular to the parallel side legs and attached to upper ends of the side legs, wherein a lower end of each of the side legs includes an engaging structure, and wherein the upper section defines at least one opening; and at least one fan mounted on the frame, wherein, when the cooler module is mounted on the memory socket over the memory module, the engagement structures engage the memory socket, and the side legs extend perpendicular to the printed circuit board and the upper section of the frame is maintained over an upper edge of the memory module and parallel to the printed circuit board, whereby the fan is positioned to generate air flow over the memory module, and wherein the lower end of each of the side legs includes a bevel, and wherein the engaging structure comprises a cavity defined in said each of the side legs adjacent an upper end of a corresponding one of said bevels. 11. The removable cooler module according to 12. The removable cooler according to a first fan mounted over said at least one opening adjacent a first end of said upper section, and a second fan mounted over said at least one opening adjacent a second end of said upper section. 13. An assembly comprising: a module socket mounted on a printed circuit board; a memory module mounted in the module socket such that a plane of the memory module extends perpendicular to the printed circuit board; and a cooler module including: a frame including a plurality of side legs and an upper section extending between upper ends of the side legs, and at least one fan mounted on the frame, wherein a lower end of each of the side legs is removably engaged with the module socket, wherein the upper section is positioned over an upper edge of the memory module, and wherein the fan is arranged on the frame such that air flow generated by the fan passes along opposing surfaces of the memory module, wherein the module socket includes a hook that is engaged with a side edge of the memory module, wherein the lower end of each of the side legs includes an bevel and defines a cavity, and wherein a portion of the hook is received in the cavity defined by at least one of the side legs of the frame. 14. The assembly according to 15. The assembly according to a first fan mounted over a first opening defined in said upper section adjacent to a first end of said memory module, and a second fan mounted over a second opening defined in said upper section adjacent to a second end of said memory module. 16. The assembly according to 17. The assembly according to 18. The assembly according to 19. The assembly according to Beschreibung The present invention relates to a cooler, especially a removable cooler on the memory of a PC. Traditionally, during the run time of a PC, the electronic components inside and memory module generate lots of heat, especially the new memory module required by high-level computers. The temperature of the memory module going up continuously affects operation performance, even causes the memory module to break down. Currently, a cooler designed for such a heat dispensation problem of the memory module is still unavailable. In view of such the unavailability, the inventor of the present invention was devoted to finding a solution and accomplished structural improvement for cooler. The main objective for the present invention is to provide a removable cooler on the memory module inside a PC, wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module combined by two pieces of heat conduction heat sinks placed oppositely is screwed or tenoned to the memory module so that the heat generated by the memory module is conducted to the extension part of the heat sink and thus stimulates heat exchange. The cooler module could be a fan or heat conduction tube. If it is a fan, it could be buckled on the memory module socket for the extension part of the two oppositely placed heat sinks to absorb the heat of the memory module and drives heat exchange. If it is a heat conductive tube screwed or tenoned against the extension of the two oppositely placed heat sinks, it absorbs the heat of the memory conducted to the extension part of the two oppositely placed heat sinks and stimulates heat exchange, thus provides heat dispensation to assure the performance of the memory module. In the following, the embodiment illustrated is used to describe the detailed structural characteristics and operation action for the present invention Please refer to FIG. 1. The present invention provides a removal cooler for the memory module inside a PC, mainly consisting of a heat sink module 1 and a cooler module 2. The heat sink module 1 covered on the memory module 3 contains two pieces of heat-conductive heat sinks 11 placed oppositely. There is a concave 111 on the inner side of each heat sink 11 that shelters and contacts against the chips 31 protruding from both sides of the memory module 3 and conducts heat (as shown in FIG. 3). Otherwise, a heat conduction interface 4 is used between the chip 31 and the concave 111 for heat conduction (as shown in FIG. 4). This heat conduction interface 4 can be heat dispensation ointment or heat dispensation tape. On the two heat sinks 11 placed oppositely there are several holes 112 corresponding to the holes 32 on the memory module 3 so that the two heat sinks 11 can be screwed (as shown in Please refer to FIG. 6. The above cooler module 2 is a fan-style frame that contains a frame 21 and at least one fan 22 (in this case two fans 22 are used). The frame 21 is a π-shaped frame with two flexible sides. On the frame's top 211 there are two holes 212 stretching to the side of the frame. There is a fan 22 placed at different angle on top of the hole, at the bottom of the hole or on one side of the hole (in this case the fan is placed on top of the hole). At the inner bottom of the frame's leg 213 on both sides of the frame 21 there is a cavity 214 and the inner bottom of the two frame's legs 213 are bevels 215. Please refer to Please refer to FIG. 9. The cooler module 2 of the present invention can be a tube combined with a heat-conduction tube 23 and a pair of fans 22. The heat-conduction tube 23 is screwed or tenoned on top of the extension part 113 of the heat sinks 11 and extends outward with heat dispensation fins 231 at the extended end. The fan 22 is placed on one side of the heat dispensation fins 231, allowing the air absorbed by the fan 22 to be transmitted to the space above the heat dispensation fins 231 for heat exchange, thus achieves heat dispensation for the memory module 3 and ensures the performance of the memory module 3. Patentzitate
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