USRE41924E1 - Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system - Google Patents
Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system Download PDFInfo
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- USRE41924E1 USRE41924E1 US11/948,425 US94842507A USRE41924E US RE41924 E1 USRE41924 E1 US RE41924E1 US 94842507 A US94842507 A US 94842507A US RE41924 E USRE41924 E US RE41924E
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- 238000000034 method Methods 0.000 title claims abstract description 81
- 238000001514 detection method Methods 0.000 title description 15
- 238000012795 verification Methods 0.000 title description 5
- 238000003384 imaging method Methods 0.000 claims abstract description 25
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 description 270
- 238000007689 inspection Methods 0.000 description 41
- 230000003287 optical effect Effects 0.000 description 26
- 239000000758 substrate Substances 0.000 description 25
- 238000010330 laser marking Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 21
- 230000033001 locomotion Effects 0.000 description 20
- 238000012545 processing Methods 0.000 description 19
- 210000003128 head Anatomy 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 17
- 238000012937 correction Methods 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 238000013461 design Methods 0.000 description 13
- 239000003550 marker Substances 0.000 description 13
- 238000005259 measurement Methods 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 13
- 239000010703 silicon Substances 0.000 description 13
- 238000005286 illumination Methods 0.000 description 10
- 238000013519 translation Methods 0.000 description 9
- 238000012549 training Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000003909 pattern recognition Methods 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 7
- 238000005336 cracking Methods 0.000 description 6
- 239000012636 effector Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000035515 penetration Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- YLJREFDVOIBQDA-UHFFFAOYSA-N tacrine Chemical compound C1=CC=C2C(N)=C(CCCC3)C3=NC2=C1 YLJREFDVOIBQDA-UHFFFAOYSA-N 0.000 description 4
- 229960001685 tacrine Drugs 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000003252 repetitive effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 241000180579 Arca Species 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 235000002595 Solanum tuberosum Nutrition 0.000 description 1
- 244000061456 Solanum tuberosum Species 0.000 description 1
- 238000003070 Statistical process control Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012804 iterative process Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
- G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
- G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/007—Marks, e.g. trade marks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Laser Beam Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
- 1. Robot moves the wafer to the pre-aligner and establishes a notch-die positional relation.
- 2. The wafer ID is read by an OCR reader.
- 3. Mark information is obtained from a network.
- 4. The robot moves the pre-aligned wafer to a precision X-Y stage.
- 5. Fine X-Y-Theta alignment of the wafer to a least correct residual pre-aligner errors.
- 6. The wafer is marked using a “mark-index field-mark-index field” repeating sequence.
- 7. The wafer is inspected.
- 8. The wafer is returned to the FOUP.
PARAMETER | TOLERANCE |
Encoder Resolution | .1 microns |
Z-stage Travel | 10 mm |
Z-stage Perpendicularity | .1 mRad |
Z-stage Accuracy | +/−5 microns |
Fine Alignment Repeatability | 1-2 microns |
Spot Size | ≦60 microns nominal, |
25-40 μm preferred | |
Galvo (calibrated field) | +/−30-50 micron accuracy |
Marking Lens Option (due to sag) | telecentric, +/−3 micron, 300 micron |
wafer thickness, 300 mm wafer | |
Marking Lens Option | flat field, +/−10 micron, 775 micron |
wafer thickness, 300 mm wafer | |
- 1. Calibrating camera pixels for each camera in system.
- 2. Calibrating coordinates of a first camera to a second camera.
- 3. Calibrating stage coordinates to camera coordinates
- 4. Calibrating the scan head to the wafer nest.
# | Generated Output Data for Each |
1 | Row and column number of the associated die at that point. |
2 | The die corner used; upper-left, upper-right, lower-left, or lower- |
right. | |
3 | A vision model of the area around the taught point. |
4 | Coordinates of the point in the “primary” coordinate system. |
# | Input Data for Each |
1 | The number of rows and columns of actual dies on the wafer. |
2 | The X and Y pitch of the dies on the wafer. |
3 | The X and Y die size. |
4 | The size of the wafer. |
- a. The
coordinates 610 of a point (x1,y1) in the primary system on the left edge of the diepattern bounding box 606; - b. The
coordinates 611 of a point (x2,y2) in the primary system on the top edge of the die pattern bounding box; and - c. The rotation of the die pattern coordinate
system 605 relative to the primary coordinatesystem 607.
Rep. | ||||
Laser Power | Rate | Mark Speed | Average Mark | Average Mark |
(% max. rating) | (KHz) | (mm/sec) | Height (μm) | Depth (μm) |
80 | 20 | 120 | 4.36 | −4.75 |
80 | 20 | 200 | 4.53 | −4.43 |
80 | 20 | 300 | 4.65 | −5.61 |
100 | 10 | 120 | 3.58 | −5.40 |
100 | 10 | 200 | 3.41 | −4.33 |
100 | 10 | 300 | 3.64 | −2.90 |
100 | 20 | 120 | 4.08 | −9.91 |
100 | 20 | 200 | 3.58 | −6.45 |
100 | 20 | 300 | 3.55 | −4.53 |
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/948,425 USRE41924E1 (en) | 2002-05-17 | 2007-11-30 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38160202P | 2002-05-17 | 2002-05-17 | |
US10/439,069 US7119351B2 (en) | 2002-05-17 | 2003-05-15 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US11/948,425 USRE41924E1 (en) | 2002-05-17 | 2007-11-30 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/439,069 Reissue US7119351B2 (en) | 2002-05-17 | 2003-05-15 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE41924E1 true USRE41924E1 (en) | 2010-11-16 |
Family
ID=29550148
Family Applications (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/438,500 Abandoned US20040144760A1 (en) | 2002-05-17 | 2003-05-15 | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
US10/438,533 Expired - Lifetime US7015418B2 (en) | 2002-05-17 | 2003-05-15 | Method and system for calibrating a laser processing system and laser marking system utilizing same |
US10/439,069 Ceased US7119351B2 (en) | 2002-05-17 | 2003-05-15 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US10/438,501 Expired - Lifetime US7067763B2 (en) | 2002-05-17 | 2003-05-15 | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
US11/266,844 Abandoned US20060054608A1 (en) | 2002-05-17 | 2005-11-04 | Method and system for calibrating a laser processing system and laser marking system utilizing same |
US11/406,191 Abandoned US20060180580A1 (en) | 2002-05-17 | 2006-04-18 | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
US11/405,780 Abandoned US20060186096A1 (en) | 2002-05-17 | 2006-04-18 | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
US11/544,898 Abandoned US20070031993A1 (en) | 2002-05-17 | 2006-10-09 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US11/544,426 Abandoned US20080316504A1 (en) | 2002-05-17 | 2006-10-09 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US11/948,425 Expired - Lifetime USRE41924E1 (en) | 2002-05-17 | 2007-11-30 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
Family Applications Before (9)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/438,500 Abandoned US20040144760A1 (en) | 2002-05-17 | 2003-05-15 | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
US10/438,533 Expired - Lifetime US7015418B2 (en) | 2002-05-17 | 2003-05-15 | Method and system for calibrating a laser processing system and laser marking system utilizing same |
US10/439,069 Ceased US7119351B2 (en) | 2002-05-17 | 2003-05-15 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US10/438,501 Expired - Lifetime US7067763B2 (en) | 2002-05-17 | 2003-05-15 | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
US11/266,844 Abandoned US20060054608A1 (en) | 2002-05-17 | 2005-11-04 | Method and system for calibrating a laser processing system and laser marking system utilizing same |
US11/406,191 Abandoned US20060180580A1 (en) | 2002-05-17 | 2006-04-18 | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
US11/405,780 Abandoned US20060186096A1 (en) | 2002-05-17 | 2006-04-18 | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
US11/544,898 Abandoned US20070031993A1 (en) | 2002-05-17 | 2006-10-09 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US11/544,426 Abandoned US20080316504A1 (en) | 2002-05-17 | 2006-10-09 | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
Country Status (6)
Country | Link |
---|---|
US (10) | US20040144760A1 (en) |
JP (1) | JP2005526386A (en) |
KR (1) | KR100914053B1 (en) |
AU (1) | AU2003239502A1 (en) |
TW (1) | TWI290363B (en) |
WO (1) | WO2003097290A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080250625A1 (en) * | 2005-09-13 | 2008-10-16 | Gudmunn Slettemoen | Opto-Mechanical Postion Finder |
US20110132885A1 (en) * | 2009-12-07 | 2011-06-09 | J.P. Sercel Associates, Inc. | Laser machining and scribing systems and methods |
US20120265344A1 (en) * | 2011-04-15 | 2012-10-18 | Kabushiki Kaisha Yaskawa Denki | Robot system and method for operating robot system |
US20140061173A1 (en) * | 2012-09-04 | 2014-03-06 | United Technologies Corporation | Visual alignment system and method for workpiece marking |
US20140076976A1 (en) * | 2006-12-29 | 2014-03-20 | Sergei Voronov | Substrate markings |
US9099481B2 (en) | 2013-03-15 | 2015-08-04 | Semiconductor Components Industries, Llc | Methods of laser marking semiconductor substrates |
US20160098837A1 (en) * | 2014-10-07 | 2016-04-07 | Tokyo Electron Limited | Substrate Inspection Apparatus and Control Method Thereof |
US9766473B1 (en) * | 2014-02-03 | 2017-09-19 | Automation Engineering, Inc. | Automated UV calibration, motorized optical target and automatic surface finder for optical alignment and assembly robot |
TWI708041B (en) * | 2018-10-17 | 2020-10-21 | 所羅門股份有限公司 | Method of detecting and marking defect |
Families Citing this family (299)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4052498B2 (en) | 1999-10-29 | 2008-02-27 | 株式会社リコー | Coordinate input apparatus and method |
JP2001184161A (en) | 1999-12-27 | 2001-07-06 | Ricoh Co Ltd | Method and device for inputting information, writing input device, method for managing written data, method for controlling display, portable electronic writing device, and recording medium |
US7838794B2 (en) | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
US6483071B1 (en) * | 2000-05-16 | 2002-11-19 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
ATE345525T1 (en) | 2000-07-05 | 2006-12-15 | Smart Technologies Inc | CAMERA BASED TOUCH SYSTEM |
US6803906B1 (en) * | 2000-07-05 | 2004-10-12 | Smart Technologies, Inc. | Passive touch system and method of detecting user input |
US6972268B2 (en) * | 2001-03-29 | 2005-12-06 | Gsi Lumonics Corporation | Methods and systems for processing a device, methods and systems for modeling same and the device |
US7396441B2 (en) | 2002-02-22 | 2008-07-08 | Aqua Innovations, Inc. | Flow-through oxygenator |
USRE47092E1 (en) | 2002-02-22 | 2018-10-23 | Oxygenator Water Technologies, Inc. | Flow-through oxygenator |
US6951995B2 (en) | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
US7563695B2 (en) * | 2002-03-27 | 2009-07-21 | Gsi Group Corporation | Method and system for high-speed precise laser trimming and scan lens for use therein |
US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
US20040144760A1 (en) * | 2002-05-17 | 2004-07-29 | Cahill Steven P. | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
US7170075B2 (en) * | 2002-07-18 | 2007-01-30 | Rudolph Technologies, Inc. | Inspection tool with a 3D point sensor to develop a focus map |
DE10234943B4 (en) * | 2002-07-31 | 2004-08-26 | Infineon Technologies Ag | Processing device for wafers and method for processing them |
US7738693B2 (en) * | 2002-12-24 | 2010-06-15 | Lam Research Corporation | User interface for wafer data analysis and visualization |
US6954197B2 (en) * | 2002-11-15 | 2005-10-11 | Smart Technologies Inc. | Size/scale and orientation determination of a pointer in a camera-based touch system |
JP2004200221A (en) * | 2002-12-16 | 2004-07-15 | Toray Eng Co Ltd | Laser marking method and device thereof |
US7217579B2 (en) * | 2002-12-19 | 2007-05-15 | Applied Materials, Israel, Ltd. | Voltage contrast test structure |
KR100628455B1 (en) * | 2002-12-21 | 2006-09-28 | 주식회사 이오테크닉스 | Chip-scale marker and marking method |
US8456447B2 (en) | 2003-02-14 | 2013-06-04 | Next Holdings Limited | Touch screen signal processing |
US8508508B2 (en) | 2003-02-14 | 2013-08-13 | Next Holdings Limited | Touch screen signal processing with single-point calibration |
US7629967B2 (en) | 2003-02-14 | 2009-12-08 | Next Holdings Limited | Touch screen signal processing |
US7532206B2 (en) | 2003-03-11 | 2009-05-12 | Smart Technologies Ulc | System and method for differentiating between pointers used to contact touch surface |
TWI242848B (en) * | 2003-03-26 | 2005-11-01 | Advanced Semiconductor Eng | Chip scale package and method for marking the same |
JP2005028423A (en) * | 2003-07-09 | 2005-02-03 | Disco Abrasive Syst Ltd | Laser beam machining method and device |
US7196300B2 (en) * | 2003-07-18 | 2007-03-27 | Rudolph Technologies, Inc. | Dynamic focusing method and apparatus |
EP1510282B1 (en) * | 2003-08-29 | 2008-07-09 | Trumpf Laser- und Systemtechnik GmbH | Device for remote machining workpieces with a laser machining beam |
US7274356B2 (en) | 2003-10-09 | 2007-09-25 | Smart Technologies Inc. | Apparatus for determining the location of a pointer within a region of interest |
US7355593B2 (en) * | 2004-01-02 | 2008-04-08 | Smart Technologies, Inc. | Pointer tracking across multiple overlapping coordinate input sub-regions defining a generally contiguous input region |
WO2005073783A1 (en) * | 2004-01-23 | 2005-08-11 | Gsi Lumonics Corporation | System and method for optimizing character marking performance |
US7486705B2 (en) | 2004-03-31 | 2009-02-03 | Imra America, Inc. | Femtosecond laser processing system with process parameters, controls and feedback |
US7460110B2 (en) * | 2004-04-29 | 2008-12-02 | Smart Technologies Ulc | Dual mode touch system |
US7492357B2 (en) * | 2004-05-05 | 2009-02-17 | Smart Technologies Ulc | Apparatus and method for detecting a pointer relative to a touch surface |
US7538759B2 (en) | 2004-05-07 | 2009-05-26 | Next Holdings Limited | Touch panel display system with illumination and detection provided from a single edge |
US8120596B2 (en) | 2004-05-21 | 2012-02-21 | Smart Technologies Ulc | Tiled touch system |
US7885311B2 (en) | 2007-03-27 | 2011-02-08 | Imra America, Inc. | Beam stabilized fiber laser |
US8049135B2 (en) * | 2004-06-18 | 2011-11-01 | Electro Scientific Industries, Inc. | Systems and methods for alignment of laser beam(s) for semiconductor link processing |
US7366321B2 (en) * | 2004-06-18 | 2008-04-29 | Agilent Technologies, Inc. | System and method for performing automated optical inspection of objects |
GB0414201D0 (en) * | 2004-06-24 | 2004-07-28 | Fujifilm Electronic Imaging | Method and apparatus for forming a multiple focus stack image |
US20060000814A1 (en) * | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
US7586059B2 (en) * | 2004-08-27 | 2009-09-08 | Infineon Technologies Ag | Lithography mask substrate labeling system |
US7283256B2 (en) * | 2004-09-21 | 2007-10-16 | Chapman Instruments, Inc. | Method and apparatus for measuring wafer thickness |
US7280232B2 (en) * | 2004-09-21 | 2007-10-09 | Chapman Instruments, Inc. | Method and apparatus for measuring wafer thickness |
US20060189091A1 (en) * | 2004-11-11 | 2006-08-24 | Bo Gu | Method and system for laser hard marking |
US7705268B2 (en) * | 2004-11-11 | 2010-04-27 | Gsi Group Corporation | Method and system for laser soft marking |
US7731798B2 (en) * | 2004-12-01 | 2010-06-08 | Ultratech, Inc. | Heated chuck for laser thermal processing |
US7526357B2 (en) * | 2004-12-13 | 2009-04-28 | The Aerospace Corporation | Pulse modulation laser writing system |
KR100674950B1 (en) * | 2005-01-22 | 2007-01-26 | 삼성전자주식회사 | Semiconductor wafer including reference semiconductor chip and method of semiconductor chip assembly using the same |
GB0503032D0 (en) * | 2005-02-14 | 2005-03-23 | Fujifilm Electronic Imaging | Blip focus |
US7363180B2 (en) * | 2005-02-15 | 2008-04-22 | Electro Scientific Industries, Inc. | Method for correcting systematic errors in a laser processing system |
DE102005013045B4 (en) * | 2005-03-18 | 2013-03-14 | Siemens Aktiengesellschaft | Fluorescence scanner for molecular signatures |
KR100672830B1 (en) * | 2005-03-21 | 2007-01-22 | 삼성전자주식회사 | Method for marking a label and apparatus for marking a label using the same |
GB0507465D0 (en) * | 2005-04-13 | 2005-05-18 | Renishaw Plc | Method of scale manufacture |
US20060235564A1 (en) * | 2005-04-18 | 2006-10-19 | Igor Troitski | Method and multifunctional system for producing laser-induced images on the surfaces of various materials and inside transparent materials |
JP4972289B2 (en) * | 2005-04-19 | 2012-07-11 | 芝浦メカトロニクス株式会社 | Laser marking device |
US7315361B2 (en) * | 2005-04-29 | 2008-01-01 | Gsi Group Corporation | System and method for inspecting wafers in a laser marking system |
US20060243711A1 (en) * | 2005-04-29 | 2006-11-02 | Robert Paradis | System and method for aligning a wafer processing system in a laser marking system |
US7200257B2 (en) * | 2005-05-05 | 2007-04-03 | International Business Machines Corporation | Structure and methodology for fabrication and inspection of photomasks |
US7466466B2 (en) * | 2005-05-11 | 2008-12-16 | Gsi Group Corporation | Optical scanning method and system and method for correcting optical aberrations introduced into the system by a beam deflector |
US20090272806A1 (en) * | 2005-05-25 | 2009-11-05 | Romeena Pty Limited As Trustee For Kemp Family Trust | Instrument tracking |
US7265567B2 (en) * | 2005-05-31 | 2007-09-04 | Delphi Technologies, Inc. | First die indicator for integrated circuit wafer |
US20060289411A1 (en) * | 2005-06-24 | 2006-12-28 | New Wave Research | Laser system with multiple operating modes and work station using same |
JP2007021528A (en) * | 2005-07-15 | 2007-02-01 | Matsushita Electric Ind Co Ltd | Laser beam machining apparatus, and method for controlling the same |
TWI278910B (en) * | 2005-08-09 | 2007-04-11 | Powerchip Semiconductor Corp | System and method for wafer visual inspection |
AT502410B1 (en) * | 2005-08-16 | 2007-03-15 | Eiser & Partner Oeg | DEVICE FOR TESTING WORKPIECES |
US20090195790A1 (en) * | 2005-09-02 | 2009-08-06 | Neptec | Imaging system and method |
US7625679B2 (en) * | 2005-09-23 | 2009-12-01 | Applied Materials, Inc. | Method of aligning a particle-beam-generated pattern to a pattern on a pre-patterned substrate |
EP1770443B1 (en) * | 2005-09-28 | 2016-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing apparatus and exposure method |
KR100652435B1 (en) * | 2005-10-07 | 2006-12-01 | 삼성전자주식회사 | Wafer having the indicator which finds first die and die attach method of wafer |
US8290239B2 (en) * | 2005-10-21 | 2012-10-16 | Orbotech Ltd. | Automatic repair of electric circuits |
US8311311B2 (en) * | 2005-10-31 | 2012-11-13 | Mitutoyo Corporation | Optical aberration correction for machine vision inspection systems |
US7899634B1 (en) * | 2005-11-07 | 2011-03-01 | Advanced Micro Devices, Inc. | Method and apparatus for analysis of continuous data using binary parsing |
US20070117227A1 (en) * | 2005-11-23 | 2007-05-24 | Gsi Group Corporation | Method And System for Iteratively, Selectively Tuning A Parameter Of A Doped Workpiece Using A Pulsed Laser |
US20070152064A1 (en) * | 2005-12-30 | 2007-07-05 | Laurens Nunnink | Diffuse light ring for reading encoded symbols |
DE602006006964D1 (en) * | 2006-02-09 | 2009-07-09 | Infineon Technologies Ag | Delay control loop with asynchronous decision element |
US20070224768A1 (en) * | 2006-02-24 | 2007-09-27 | Uvtech Systems, Inc. | Method and apparatus for delivery of pulsed laser radiation |
US20070205994A1 (en) * | 2006-03-02 | 2007-09-06 | Taco Van Ieperen | Touch system and method for interacting with the same |
US7589869B2 (en) * | 2006-04-28 | 2009-09-15 | Electro Scientific Industries, Inc. | Adjusting image quality using multi-wavelength light |
US20070106416A1 (en) * | 2006-06-05 | 2007-05-10 | Griffiths Joseph J | Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same |
US20080013823A1 (en) * | 2006-06-30 | 2008-01-17 | Behnke Merlin E | Overhead traveling camera inspection system |
WO2008063249A2 (en) * | 2006-07-11 | 2008-05-29 | Duke University | Real-time 3-d ultrasound guidance of surgical robotics |
DE602006009248D1 (en) * | 2006-07-13 | 2009-10-29 | Montres Breguet Sa | Laser marking method |
US7732731B2 (en) * | 2006-09-15 | 2010-06-08 | Gsi Group Corporation | Method and system for laser processing targets of different types on a workpiece |
US7751612B2 (en) * | 2006-10-10 | 2010-07-06 | Usnr/Kockums Cancar Company | Occlusionless scanner for workpieces |
US9442607B2 (en) | 2006-12-04 | 2016-09-13 | Smart Technologies Inc. | Interactive input system and method |
US20080237353A1 (en) * | 2007-03-29 | 2008-10-02 | Joy Lau | Unique identifier on integrated circuit device |
US20080243416A1 (en) * | 2007-03-30 | 2008-10-02 | Mitutoyo Corporation | Global calibration for stereo vision probe |
US8055466B2 (en) * | 2007-03-30 | 2011-11-08 | Mitutoyo Corporation | Global calibration for stereo vision probe |
EP2135155B1 (en) * | 2007-04-11 | 2013-09-18 | Next Holdings, Inc. | Touch screen system with hover and click input methods |
US7642929B1 (en) | 2007-04-19 | 2010-01-05 | The United States Of America As Represented By The Secretary Of The Air Force | Helicopter brown-out landing |
DE102007030051B4 (en) * | 2007-06-29 | 2018-05-30 | Globalfoundries Inc. | Wafer layout optimization process and system |
CN100459034C (en) * | 2007-07-12 | 2009-02-04 | 格兰达技术(深圳)有限公司 | Full-automatic wafer rear marking machine |
US8094137B2 (en) | 2007-07-23 | 2012-01-10 | Smart Technologies Ulc | System and method of detecting contact on a display |
EP2022601B1 (en) * | 2007-08-03 | 2013-03-20 | TRUMPF Werkzeugmaschinen GmbH + Co. KG | Laser processing machine for machining workpieces and machine method for machining workpieces using a laser beam |
TWI478272B (en) * | 2007-08-15 | 2015-03-21 | 尼康股份有限公司 | A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method |
EP2030797A1 (en) * | 2007-08-25 | 2009-03-04 | Mondi Business Paper Services AG | Optically and thermally writeable nano coating |
US8432377B2 (en) * | 2007-08-30 | 2013-04-30 | Next Holdings Limited | Optical touchscreen with improved illumination |
WO2009029764A1 (en) | 2007-08-30 | 2009-03-05 | Next Holdings, Inc. | Low profile touch panel systems |
US9302345B2 (en) * | 2007-08-31 | 2016-04-05 | Caterpillar Inc. | Laser machining calibration method |
US7800766B2 (en) * | 2007-09-21 | 2010-09-21 | Northrop Grumman Space & Mission Systems Corp. | Method and apparatus for detecting and adjusting substrate height |
US8233696B2 (en) * | 2007-09-22 | 2012-07-31 | Dynamic Micro System Semiconductor Equipment GmbH | Simultaneous wafer ID reading |
SG152090A1 (en) * | 2007-10-23 | 2009-05-29 | Hypertronics Pte Ltd | Scan head calibration system and method |
US8315457B2 (en) * | 2007-12-21 | 2012-11-20 | Cognex Corporation | System and method for performing multi-image training for pattern recognition and registration |
US9305235B1 (en) | 2007-12-21 | 2016-04-05 | Cognex Corporation | System and method for identifying and locating instances of a shape under large variations in linear degrees of freedom and/or stroke widths |
US8405636B2 (en) * | 2008-01-07 | 2013-03-26 | Next Holdings Limited | Optical position sensing system and optical position sensor assembly |
US20090207144A1 (en) * | 2008-01-07 | 2009-08-20 | Next Holdings Limited | Position Sensing System With Edge Positioning Enhancement |
US20090213093A1 (en) * | 2008-01-07 | 2009-08-27 | Next Holdings Limited | Optical position sensor using retroreflection |
US8411270B2 (en) * | 2008-01-17 | 2013-04-02 | International Business Machines Corporation | Monitoring stage alignment and related stage and calibration target |
US7706632B2 (en) * | 2008-01-17 | 2010-04-27 | Ffei Limited | Method and apparatus for forming a multiple focus stack image |
US7645971B2 (en) * | 2008-01-18 | 2010-01-12 | Ffei Limited | Image scanning apparatus and method |
US7996096B2 (en) * | 2008-02-29 | 2011-08-09 | Fisher Controls International Llc | Estimation of process control parameters over predefined travel segments |
CN102067172B (en) * | 2008-03-21 | 2013-05-22 | 欧泰克应用激光科技有限责任公司 | Multi model registration (MMR) for a galvanometer and laser system |
US20090278794A1 (en) * | 2008-05-09 | 2009-11-12 | Smart Technologies Ulc | Interactive Input System With Controlled Lighting |
US20090277697A1 (en) * | 2008-05-09 | 2009-11-12 | Smart Technologies Ulc | Interactive Input System And Pen Tool Therefor |
US8902193B2 (en) * | 2008-05-09 | 2014-12-02 | Smart Technologies Ulc | Interactive input system and bezel therefor |
US8922853B2 (en) * | 2008-05-12 | 2014-12-30 | Wilopen Products Lc | Printer calibration system and associated methods |
US8217302B2 (en) * | 2008-06-17 | 2012-07-10 | Electro Scientific Industries, Inc | Reducing back-reflections in laser processing systems |
DE102008059813A1 (en) * | 2008-07-17 | 2010-01-21 | Lss Laser Scribing Systems Ag | Laser-scribing system for structuring substrates for thin-film solar modules |
US20100079385A1 (en) * | 2008-09-29 | 2010-04-01 | Smart Technologies Ulc | Method for calibrating an interactive input system and interactive input system executing the calibration method |
KR20110066198A (en) * | 2008-10-02 | 2011-06-16 | 넥스트 홀딩즈 리미티드 | Stereo optical sensors for resolving multi-touch in a touch detection system |
CN102245339B (en) | 2008-10-10 | 2015-08-26 | Ipg微系统有限公司 | There is laser-processing system and the method for multiple narrow laser beam transmission system |
US8339378B2 (en) * | 2008-11-05 | 2012-12-25 | Smart Technologies Ulc | Interactive input system with multi-angle reflector |
DE102008060293B4 (en) * | 2008-12-03 | 2015-07-30 | Carl Zeiss Sms Gmbh | Method and device for measuring the relative local positional error of one of the sections of a section-wise exposed object |
US20100157086A1 (en) | 2008-12-15 | 2010-06-24 | Illumina, Inc | Dynamic autofocus method and system for assay imager |
JP5402284B2 (en) * | 2008-12-18 | 2014-01-29 | 株式会社安川電機 | Substrate transport robot, substrate transport apparatus, semiconductor manufacturing apparatus, and interference avoidance method for substrate transport robot |
EP2202027B1 (en) * | 2008-12-29 | 2016-07-13 | Continental Automotive GmbH | Method, device and system for positioning a first body and a part fixed to a second body with respect to each other |
KR101513602B1 (en) * | 2009-02-11 | 2015-04-22 | 삼성전자주식회사 | Method of scanning biochip |
US20100229090A1 (en) * | 2009-03-05 | 2010-09-09 | Next Holdings Limited | Systems and Methods for Interacting With Touch Displays Using Single-Touch and Multi-Touch Gestures |
US8129203B2 (en) * | 2009-03-18 | 2012-03-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Auto feedback apparatus for laser marking |
JP2010274328A (en) * | 2009-04-30 | 2010-12-09 | Mitsuboshi Diamond Industrial Co Ltd | Laser beam machining method and laser beam machining device |
JP5340806B2 (en) * | 2009-05-21 | 2013-11-13 | 株式会社ディスコ | Laser processing method of semiconductor wafer |
JP5340807B2 (en) * | 2009-05-21 | 2013-11-13 | 株式会社ディスコ | Processing method of semiconductor wafer |
WO2010136600A1 (en) * | 2009-05-29 | 2010-12-02 | Datacard Corporation | System for the calibration of operating parameters of a laser engraver |
DE102009023297A1 (en) * | 2009-05-29 | 2010-12-02 | Kuka Roboter Gmbh | Method and device for operating an additional tool axis of a tool guided by a manipulator |
WO2010144778A2 (en) * | 2009-06-12 | 2010-12-16 | Applied Materials, Inc. | Methods and systems for laser-scribed line alignment |
US8692768B2 (en) | 2009-07-10 | 2014-04-08 | Smart Technologies Ulc | Interactive input system |
US9691650B2 (en) * | 2009-09-29 | 2017-06-27 | Applied Materials, Inc. | Substrate transfer robot with chamber and substrate monitoring capability |
US20110095977A1 (en) * | 2009-10-23 | 2011-04-28 | Smart Technologies Ulc | Interactive input system incorporating multi-angle reflecting structure |
WO2011066343A2 (en) * | 2009-11-24 | 2011-06-03 | Next Holdings Limited | Methods and apparatus for gesture recognition mode control |
US20110199387A1 (en) * | 2009-11-24 | 2011-08-18 | John David Newton | Activating Features on an Imaging Device Based on Manipulations |
EP2507692A2 (en) * | 2009-12-04 | 2012-10-10 | Next Holdings Limited | Imaging methods and systems for position detection |
US20130256286A1 (en) * | 2009-12-07 | 2013-10-03 | Ipg Microsystems Llc | Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths |
FR2954199B1 (en) | 2009-12-22 | 2013-07-26 | Commissariat Energie Atomique | METHOD FOR ABLATION OF A THREE-DIMENSIONAL SURFACE USING A LASER ABLATION DEVICE, AND DEVICE FOR CARRYING OUT THE METHOD |
US8461479B2 (en) * | 2009-12-23 | 2013-06-11 | Electro Scientific Industries, Inc. | Adaptive processing constraints for memory repair |
US20110156033A1 (en) * | 2009-12-31 | 2011-06-30 | Stmicroelectronics Asia Pacific Pte. Ltd. | Method and system for tracing die at unit level |
WO2011096562A1 (en) * | 2010-02-08 | 2011-08-11 | 三菱電機株式会社 | Control device and laser beam machine |
JP5795777B2 (en) * | 2010-02-26 | 2015-10-14 | マイクロニック エービー | Method and apparatus for performing pattern alignment |
US20110234542A1 (en) * | 2010-03-26 | 2011-09-29 | Paul Marson | Methods and Systems Utilizing Multiple Wavelengths for Position Detection |
WO2011127601A1 (en) * | 2010-04-13 | 2011-10-20 | National Research Council Of Canada | Laser processing control method |
US9110457B2 (en) * | 2010-06-22 | 2015-08-18 | Siemens Healthcare Diagnostics Inc. | Methods, systems, and apparatus for calibration of a positional offset between an end effector and a position sensor |
US8389895B2 (en) | 2010-06-25 | 2013-03-05 | Electro Scientifix Industries, Inc. | Method and apparatus for reliably laser marking articles |
US20120097833A1 (en) * | 2010-10-22 | 2012-04-26 | Industrial Technology Research Institute | Laser scanning device |
US8669507B2 (en) * | 2010-10-22 | 2014-03-11 | Industrial Technology Research Institute | Laser scanning device |
US8878095B2 (en) | 2010-12-17 | 2014-11-04 | Electro Scientific Industries, Inc. | Reducing back-reflection in laser micromachining systems |
JP5637532B2 (en) * | 2010-12-27 | 2014-12-10 | 株式会社ブイ・テクノロジー | Laser processing equipment |
TW201228786A (en) * | 2011-01-13 | 2012-07-16 | Hon Hai Prec Ind Co Ltd | Mechanical arm movement controlling system and method |
US9474156B2 (en) * | 2011-02-10 | 2016-10-18 | Apple Inc. | Interposer connectors with alignment features |
US20120206892A1 (en) * | 2011-02-10 | 2012-08-16 | Apple Inc. | Circular interposers |
US8924002B2 (en) * | 2011-04-22 | 2014-12-30 | I-Cut, Inc. | Adaptive registration during precision graphics cutting from multiple sheets |
US9033740B2 (en) | 2011-04-25 | 2015-05-19 | Apple Inc. | Interposer connectors |
US20130266228A1 (en) * | 2012-04-10 | 2013-10-10 | Siemens Industry, Inc. | Automatic part identification and workflow generation |
JP5743958B2 (en) * | 2012-05-30 | 2015-07-01 | キヤノン株式会社 | Measuring method, exposure method and apparatus |
US9772183B2 (en) * | 2012-06-29 | 2017-09-26 | Rudolph Technologies Inc. | Flying sensor head |
DE102012106156B4 (en) * | 2012-07-09 | 2019-09-12 | Acsys Lasertechnik Gmbh | Method for controlling a tool |
GB2505691B (en) * | 2012-09-07 | 2018-02-21 | Ffei Ltd | Method and apparatus for image scanning |
CN102867765B (en) * | 2012-09-27 | 2015-04-15 | 盛美半导体设备(上海)有限公司 | Detector and detection method for wafer position |
US9355444B2 (en) * | 2012-09-28 | 2016-05-31 | Skyworks Solutions, Inc. | Systems and methods for processing packaged radio-frequency modules identified as being potentially defective |
US9430593B2 (en) * | 2012-10-11 | 2016-08-30 | Kla-Tencor Corporation | System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking |
TW201417195A (en) * | 2012-10-23 | 2014-05-01 | Wecon Automation Corp | Circular type die placing method |
US20140115886A1 (en) * | 2012-10-26 | 2014-05-01 | Volex Plc | Method and system for marking substrate and placing components for high accuracy |
US9239147B2 (en) * | 2012-11-07 | 2016-01-19 | Omnivision Technologies, Inc. | Apparatus and method for obtaining uniform light source |
US9494617B2 (en) | 2012-11-07 | 2016-11-15 | Omnivision Technologies, Inc. | Image sensor testing probe card |
US9513230B2 (en) * | 2012-12-14 | 2016-12-06 | Kla-Tencor Corporation | Apparatus and method for optical inspection, magnetic field and height mapping |
JP2014130962A (en) * | 2012-12-28 | 2014-07-10 | Ibiden Co Ltd | Formation method for cavity, formation device for cavity, program, manufacturing method for wiring board, and wiring board |
US10838406B2 (en) * | 2013-02-11 | 2020-11-17 | The Aerospace Corporation | Systems and methods for the patterning of material substrates |
US10613513B2 (en) * | 2013-02-11 | 2020-04-07 | The Aerospace Corporation | Systems and methods for modifying material substrates |
US10464172B2 (en) * | 2013-02-21 | 2019-11-05 | Nlight, Inc. | Patterning conductive films using variable focal plane to control feature size |
KR102020912B1 (en) | 2013-02-21 | 2019-09-11 | 엔라이트 인크. | Laser patterning multi-layer structures |
WO2014144012A1 (en) * | 2013-03-15 | 2014-09-18 | Electro Scientific Industries, Inc. | Image recognition base ablation pattern position recall |
TWI543830B (en) | 2013-05-10 | 2016-08-01 | 財團法人工業技術研究院 | Visual error correction method |
US9842757B2 (en) * | 2013-06-05 | 2017-12-12 | Persimmon Technologies Corporation | Robot and adaptive placement system and method |
US9679224B2 (en) | 2013-06-28 | 2017-06-13 | Cognex Corporation | Semi-supervised method for training multiple pattern recognition and registration tool models |
KR102225200B1 (en) * | 2013-10-04 | 2021-03-11 | 시크파 홀딩 에스에이 | Method and system for marking an object having a surface of a conductive material |
US9796045B2 (en) * | 2013-12-19 | 2017-10-24 | Sunpower Corporation | Wafer alignment with restricted visual access |
US9689804B2 (en) | 2013-12-23 | 2017-06-27 | Kla-Tencor Corporation | Multi-channel backside wafer inspection |
CA2937354C (en) | 2014-01-20 | 2020-04-14 | Smart Wave Technologies Corp. | Methods of laser trace post processing and depaneling of assembled printed circuit boards |
US11176655B2 (en) | 2014-01-27 | 2021-11-16 | Cognex Corporation | System and method for determining 3D surface features and irregularities on an object |
CN104979227B (en) * | 2014-04-02 | 2018-03-30 | 中芯国际集成电路制造(上海)有限公司 | Semiconductors data collection method and system |
US10618131B2 (en) | 2014-06-05 | 2020-04-14 | Nlight, Inc. | Laser patterning skew correction |
KR101537044B1 (en) * | 2014-07-10 | 2015-07-16 | (주)티에스이 | Inspection device for led package |
JP6367048B2 (en) * | 2014-08-28 | 2018-08-01 | 株式会社ディスコ | Laser processing equipment |
EP3185747A1 (en) | 2014-08-31 | 2017-07-05 | Berestka, John | Systems and methods for analyzing the eye |
US9950389B1 (en) | 2014-09-19 | 2018-04-24 | EMC IP Holding Company LLC | Laser calibration |
US9719943B2 (en) * | 2014-09-30 | 2017-08-01 | Kla-Tencor Corporation | Wafer edge inspection with trajectory following edge profile |
TWI577484B (en) * | 2014-11-20 | 2017-04-11 | 財團法人工業技術研究院 | Three-dimension laser processing apparatus and positioning error correction method |
TWI577493B (en) | 2014-12-26 | 2017-04-11 | 財團法人工業技術研究院 | Calibration method and automatic apparatus using the same |
WO2016118962A1 (en) * | 2015-01-24 | 2016-07-28 | Ten Media, Llc Dba Ten Ag Tech Co. | Method and system for optimizing laser marking on a food product |
US9837783B2 (en) | 2015-01-26 | 2017-12-05 | Nlight, Inc. | High-power, single-mode fiber sources |
CN107438800A (en) | 2015-02-12 | 2017-12-05 | 格罗弗治公司 | The mobile material in laser processing procedure |
US10509390B2 (en) | 2015-02-12 | 2019-12-17 | Glowforge Inc. | Safety and reliability guarantees for laser fabrication |
JP2018507782A (en) * | 2015-02-23 | 2018-03-22 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | Laser system and method for extensive modification |
US10050404B2 (en) | 2015-03-26 | 2018-08-14 | Nlight, Inc. | Fiber source with cascaded gain stages and/or multimode delivery fiber with low splice loss |
USD793972S1 (en) * | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 31-pocket configuration |
USD793971S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
US10724947B2 (en) | 2015-04-14 | 2020-07-28 | Cognex Corporation | System and method for acquiring images of surface texture |
USD778247S1 (en) | 2015-04-16 | 2017-02-07 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
CN106158715B (en) * | 2015-04-24 | 2021-04-02 | 上海微电子装备(集团)股份有限公司 | Pre-alignment device and method for wafer |
US9864048B2 (en) | 2015-05-17 | 2018-01-09 | Microsoft Technology Licensing, Llc. | Gated time of flight camera |
US10044988B2 (en) | 2015-05-19 | 2018-08-07 | Conduent Business Services, Llc | Multi-stage vehicle detection in side-by-side drive-thru configurations |
CN104816559B (en) * | 2015-05-29 | 2017-04-12 | 中国电子科技集团公司第四十六研究所 | Laser marking method of semiconductor material |
CN107924023B (en) | 2015-07-08 | 2020-12-01 | 恩耐公司 | Fibers having suppressed center refractive index for increased beam parameter product |
US10295342B2 (en) | 2015-08-14 | 2019-05-21 | Kla-Tencor Corporation | System, method and computer program product for calibration of metrology tools |
US9698093B2 (en) * | 2015-08-24 | 2017-07-04 | Nxp Usa,Inc. | Universal BGA substrate |
TWI607817B (en) * | 2015-09-02 | 2017-12-11 | E&R Eng Corp | Laser printing apparatus and method |
CN108450016A (en) * | 2015-09-15 | 2018-08-24 | 首尔半导体株式会社 | Light-emitting device, the chromaticity coordinates measuring device of light-emitting device and chromaticity coordinates correction method |
TWI607814B (en) * | 2015-10-28 | 2017-12-11 | 新代科技股份有限公司 | Flying Laser Marking System with Real-time 3D Modeling and Method Thereof |
CN106652014A (en) * | 2015-10-28 | 2017-05-10 | 新代科技股份有限公司 | Instant three-dimensional modeling laser flight marking system and method thereof |
US11179807B2 (en) | 2015-11-23 | 2021-11-23 | Nlight, Inc. | Fine-scale temporal control for laser material processing |
WO2017091505A1 (en) | 2015-11-23 | 2017-06-01 | Nlight, Inc. | Fine-scale temporal control for laser material processing |
WO2017127573A1 (en) | 2016-01-19 | 2017-07-27 | Nlight, Inc. | Method of processing calibration data in 3d laser scanner systems |
KR102521372B1 (en) | 2016-02-12 | 2023-04-14 | 삼성전자주식회사 | Method for predicting location of a mark |
KR101812210B1 (en) * | 2016-02-15 | 2017-12-26 | 주식회사 이오테크닉스 | Apparatus and method for calibrating a marking position |
KR101812209B1 (en) * | 2016-02-16 | 2017-12-26 | 주식회사 이오테크닉스 | Laser marking apparatus and laser marking method |
KR101857414B1 (en) * | 2016-02-25 | 2018-05-15 | 주식회사 이오테크닉스 | Apparatus and method for calibrating a marking position |
US20170323708A1 (en) * | 2016-05-03 | 2017-11-09 | Texas Instruments Incorporated | Component sheet and method of singulating |
KR101867390B1 (en) * | 2016-08-01 | 2018-06-15 | 주식회사 이오테크닉스 | Laser processing apparatus and laser processing method |
EP3507768B1 (en) * | 2016-08-31 | 2020-09-30 | Molecular Devices, LLC | System and method for template-based image analysis |
JP7164289B2 (en) * | 2016-09-05 | 2022-11-01 | 東京エレクトロン株式会社 | Position-Specific Tuning of Bow-Controlling Stress to Control Overlay During Semiconductor Processing |
US10673197B2 (en) | 2016-09-29 | 2020-06-02 | Nlight, Inc. | Fiber-based optical modulator |
US10730785B2 (en) | 2016-09-29 | 2020-08-04 | Nlight, Inc. | Optical fiber bending mechanisms |
US10673198B2 (en) | 2016-09-29 | 2020-06-02 | Nlight, Inc. | Fiber-coupled laser with time varying beam characteristics |
US10673199B2 (en) | 2016-09-29 | 2020-06-02 | Nlight, Inc. | Fiber-based saturable absorber |
CN109791252B (en) | 2016-09-29 | 2021-06-29 | 恩耐公司 | Adjustable beam characteristics |
KR102620433B1 (en) * | 2016-09-30 | 2024-01-03 | 세메스 주식회사 | Method of forming a wafer map |
CN106247959B (en) * | 2016-09-30 | 2018-08-07 | 国网山东省电力公司商河县供电公司 | A kind of automatic checkout system and automatic testing method of cable antenna height |
CN108020164B (en) * | 2016-10-31 | 2020-10-13 | 泰科电子(上海)有限公司 | Thickness detection experiment platform |
WO2018098397A1 (en) | 2016-11-25 | 2018-05-31 | Glowforge Inc. | Calibration of computer-numerically-controlled machine |
WO2018098398A1 (en) | 2016-11-25 | 2018-05-31 | Glowforge Inc. | Preset optical components in a computer numerically controlled machine |
WO2018098399A1 (en) | 2016-11-25 | 2018-05-31 | Glowforge Inc. | Controlled deceleration of moveable components in a computer numerically controlled machine |
US10664714B2 (en) * | 2016-12-21 | 2020-05-26 | Rudolph Technologies, Inc. | Substrate handling and identification mechanism |
CN110268521B (en) * | 2017-02-03 | 2023-06-23 | 黑塞有限公司 | Method for fixing an engaged product in a working area of an adapter |
EP3607389B1 (en) | 2017-04-04 | 2023-06-07 | Nlight, Inc. | Optical fiducial generation for galvanometric scanner calibration |
US11389896B2 (en) | 2017-04-04 | 2022-07-19 | Nlight, Inc. | Calibration test piece for galvanometric laser calibration |
KR101892576B1 (en) | 2017-04-04 | 2018-08-30 | 주식회사 이오테크닉스 | Calibration method for a plurality of 3 dimensional laser scanners and laser processing apparatus |
JP6923344B2 (en) | 2017-04-13 | 2021-08-18 | 株式会社Screenホールディングス | Peripheral processing equipment and peripheral processing method |
US11073487B2 (en) | 2017-05-11 | 2021-07-27 | Kla-Tencor Corporation | Methods and systems for characterization of an x-ray beam with high spatial resolution |
CN107225882B (en) * | 2017-06-06 | 2019-07-09 | 广东正业科技股份有限公司 | A kind of laser marking method based on CCD navigator fix |
DE102017210994A1 (en) * | 2017-06-28 | 2019-01-03 | Eos Gmbh Electro Optical Systems | Measuring system for a device for the generative production of a three-dimensional object |
CN107248375A (en) * | 2017-07-20 | 2017-10-13 | 武汉华星光电半导体显示技术有限公司 | Identifier benefit value method and system for quarter machine |
JP7021877B2 (en) * | 2017-08-08 | 2022-02-17 | 株式会社Screenホールディングス | Board processing equipment, alignment equipment and alignment method |
US10861723B2 (en) * | 2017-08-08 | 2020-12-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | EFEM robot auto teaching methodology |
JP6777604B2 (en) * | 2017-08-28 | 2020-10-28 | ファナック株式会社 | Inspection system and inspection method |
US10962790B2 (en) * | 2017-09-05 | 2021-03-30 | Facebook Technologies, Llc | Depth measurement using a pulsed structured light projector |
JP6616368B2 (en) * | 2017-09-14 | 2019-12-04 | ファナック株式会社 | Laser processing device that corrects processing conditions according to the contamination level of the optical system before laser processing |
US10118250B1 (en) | 2017-09-15 | 2018-11-06 | International Business Machines Corporation | In-situ laser beam position and spot size sensor and high speed scanner calibration, wafer debonding method |
US10365211B2 (en) | 2017-09-26 | 2019-07-30 | Kla-Tencor Corporation | Systems and methods for metrology beam stabilization |
CN111316412A (en) * | 2017-11-03 | 2020-06-19 | 东京毅力科创株式会社 | Yield enhancement of functional microelectronic devices |
US10984524B2 (en) * | 2017-12-21 | 2021-04-20 | Advanced Ion Beam Technology, Inc. | Calibration system with at least one camera and method thereof |
BR112020013260A2 (en) * | 2017-12-28 | 2020-12-01 | Avery Dennison Retail Information Services, Llc | apparatus and method of adaptive control of laser cutting based on optical inspection |
KR102203579B1 (en) * | 2017-12-31 | 2021-01-15 | 주식회사 에이티앤씨 | A laser marking apparatus using tray |
DE102018113913A1 (en) * | 2018-06-11 | 2019-12-12 | Mühlbauer Gmbh & Co. Kg | A card marking system and method for automatically determining an optimized setting of a card marking system |
JP7084227B2 (en) * | 2018-06-22 | 2022-06-14 | 株式会社Screenホールディングス | Mark position detection device, drawing device and mark position detection method |
TWI698953B (en) * | 2018-07-13 | 2020-07-11 | 鈦昇科技股份有限公司 | Calibration laser printing method |
US11251096B2 (en) * | 2018-09-05 | 2022-02-15 | Micron Technology, Inc. | Wafer registration and overlay measurement systems and related methods |
JP2022503883A (en) * | 2018-09-28 | 2022-01-12 | コーニング インコーポレイテッド | Rotary light source used to modify the board |
CN109108480B (en) * | 2018-10-08 | 2020-08-28 | 南京溧水高新创业投资管理有限公司 | Clamp for laser printing of integrated circuit chip |
KR102175286B1 (en) * | 2018-10-11 | 2020-11-06 | 라온피플 주식회사 | Apparatus and method for inspecting for defects |
CN109175716B (en) * | 2018-10-12 | 2021-04-13 | 常州英诺激光科技有限公司 | Laser marking control method and device, computer equipment and storage medium |
DE102018127221B4 (en) * | 2018-10-31 | 2021-05-06 | Carl Zeiss Industrielle Messtechnik Gmbh | Coordinate measuring system |
TWI678744B (en) * | 2018-11-16 | 2019-12-01 | 皓琪科技股份有限公司 | Picture recording system equipped with online evaluation and operation method |
WO2020153995A1 (en) * | 2019-01-23 | 2020-07-30 | Nlight, Inc. | A galvanometric laser system with a calibration test piece |
WO2020163657A1 (en) | 2019-02-08 | 2020-08-13 | Yaskawa America, Inc. | Through-beam auto teaching |
US11579440B2 (en) | 2019-03-14 | 2023-02-14 | Nlight, Inc. | Focus assessment in dynamically focused laser system |
US11525968B2 (en) | 2019-03-14 | 2022-12-13 | Nlight, Inc. | Calibration validation using geometric features in galvanometric scanning systems |
US10399227B1 (en) * | 2019-03-29 | 2019-09-03 | Mujin, Inc. | Method and control system for verifying and updating camera calibration for robot control |
US10906184B2 (en) | 2019-03-29 | 2021-02-02 | Mujin, Inc. | Method and control system for verifying and updating camera calibration for robot control |
JP7307001B2 (en) * | 2019-06-17 | 2023-07-11 | 東レエンジニアリング株式会社 | LASER PROCESSING APPARATUS AND METHOD, CHIP TRANSFER APPARATUS AND METHOD |
US11626305B2 (en) * | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
JP7303053B2 (en) * | 2019-07-17 | 2023-07-04 | ファナック株式会社 | Adjustment aid and laser welding equipment |
US20210016394A1 (en) * | 2019-07-18 | 2021-01-21 | General Electric Company | System and methods for compensating for calibration plate irregularities in additive manufacturing systems |
JP2022552053A (en) * | 2019-08-23 | 2022-12-15 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | Method and apparatus for aligning substrates |
US11084123B2 (en) * | 2019-09-05 | 2021-08-10 | The Boeing Company | Laser-etching and machine-vision positioning system |
DK4065378T3 (en) * | 2019-11-25 | 2023-11-27 | Weidmueller Interface Gmbh & Co Kg | METHOD AND DEVICE FOR MARKING ELECTRICAL APPLIANCES PLACED IN ROW |
CN111156896B (en) * | 2020-01-02 | 2022-06-10 | 浙江大学台州研究院 | Laser auxiliary calibration device used in measurement of sizes of parts with different heights |
US11435391B2 (en) * | 2020-01-22 | 2022-09-06 | Nanya Technology Corporation | Dual-sided wafer imaging apparatus and methods thereof |
CN111735487B (en) * | 2020-05-18 | 2023-01-10 | 清华大学深圳国际研究生院 | Sensor, sensor calibration method and device, and storage medium |
CN111856252B (en) * | 2020-08-24 | 2022-05-27 | 珠海市精实测控技术有限公司 | Single-datum positioning full-floating PCB function test structure |
CN112070133B (en) * | 2020-08-27 | 2023-02-03 | 武汉华工激光工程有限责任公司 | Three-dimensional space point positioning method based on distance measuring instrument and machine vision |
EP3970899B1 (en) * | 2020-09-18 | 2023-11-22 | Laser Systems & Solutions of Europe | Method of and system for uniformly irradiating a frame of a processed substrate having a plurality of frames |
CN112710662A (en) * | 2020-12-25 | 2021-04-27 | 深圳中科飞测科技股份有限公司 | Generation method and device, generation system and storage medium |
TWI762182B (en) * | 2021-02-05 | 2022-04-21 | 德制國際有限公司 | Automatic processing method and automatic processing system |
CN113210853B (en) * | 2021-04-13 | 2023-02-28 | 广东原点智能技术有限公司 | Optical path correction system and correction method thereof |
TWI781696B (en) * | 2021-07-23 | 2022-10-21 | 致茂電子股份有限公司 | Position alignment system and method |
CN114226289A (en) * | 2021-12-23 | 2022-03-25 | 南光高科(厦门)激光科技有限公司 | Automatic laser marking system based on machine vision, marking method and application |
CN114295056A (en) * | 2021-12-31 | 2022-04-08 | 普聚智能系统(苏州)有限公司 | Rapid correction method and application of visual positioning system of laser processing equipment |
CN114577064B (en) * | 2021-12-31 | 2023-06-23 | 哈瓦国际航空技术(深圳)有限公司 | Sighting device calibration method and unmanned aerial vehicle |
US20230288472A1 (en) * | 2022-03-11 | 2023-09-14 | Mellanox Technologies, Ltd. | Substrate testing with three-dimensional scanning |
CN116921854B (en) * | 2023-07-07 | 2024-03-29 | 上海君屹工业自动化股份有限公司 | Method for setting defocusing amount of BUSBAR welding |
Citations (148)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4156124A (en) * | 1977-04-14 | 1979-05-22 | Optical Engineering, Inc. | Image transfer laser engraving |
US4220842A (en) * | 1976-10-07 | 1980-09-02 | Lasag Ag | Method of removing material from a workpiece |
US4323755A (en) * | 1979-09-24 | 1982-04-06 | Rca Corporation | Method of making a machine-readable marking in a workpiece |
US4362942A (en) | 1979-12-10 | 1982-12-07 | Fujitsu Limited | Electron beam exposure system and an apparatus for carrying out the same |
US4468551A (en) | 1982-07-30 | 1984-08-28 | Armco Inc. | Laser treatment of electrical steel and optical scanning assembly therefor |
US4504144A (en) * | 1982-07-06 | 1985-03-12 | The Perkin-Elmer Corporation | Simple electromechanical tilt and focus device |
US4522656A (en) * | 1983-07-07 | 1985-06-11 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Method of making reference surface markings on semiconductor wafers by laser beam |
US4685775A (en) | 1985-11-15 | 1987-08-11 | Teradyne, Inc. | Light beam positioning apparatus |
US4702134A (en) * | 1986-04-10 | 1987-10-27 | Corley Manufacturing Company | Edging apparatus |
US4710908A (en) * | 1983-09-20 | 1987-12-01 | Olympus Optical Company Limited | Servo apparatus for compensating for warp and deflection deviations on optical discs |
US4734558A (en) * | 1983-05-16 | 1988-03-29 | Nec Corporation | Laser machining apparatus with controllable mask |
US4752668A (en) | 1986-04-28 | 1988-06-21 | Rosenfield Michael G | System for laser removal of excess material from a semiconductor wafer |
US4758848A (en) * | 1985-11-28 | 1988-07-19 | Nec Corporation | Method and apparatus for marking a pattern on an article with a laser including partial feedback of the laser output for generating the marking beam |
US4797749A (en) | 1986-11-18 | 1989-01-10 | General Scanning, Inc. | Scanning system with tunable resonant actuator |
US4820055A (en) * | 1985-08-26 | 1989-04-11 | Siemens Aktiengesellschaft | Apparatus for adjusting a mask with at least one adjustment mark relative to a semi-conductor wafer provided with at least one lattice structure |
US4823394A (en) | 1986-04-24 | 1989-04-18 | Kulicke & Soffa Industries, Inc. | Pattern recognition system |
US4856053A (en) * | 1987-05-06 | 1989-08-08 | Hashimoto Corporation | Telephone terminal equipment having means for preventing malicious and nuisance transmission |
US4872177A (en) | 1985-05-01 | 1989-10-03 | Spectra-Physics | Laser diode pumped solid state laser |
US4886958A (en) | 1988-03-25 | 1989-12-12 | Texas Instruments Incorporated | Autofocus system for scanning laser inspector or writer |
US4900940A (en) * | 1987-05-21 | 1990-02-13 | Anritsu Corporation | Optical system for measuring a surface profile of an object using a converged, inclined light beam and movable converging lens |
US4910725A (en) * | 1986-04-23 | 1990-03-20 | Drexler Technology Corporation | Optical recording method for data cards |
US4918284A (en) * | 1988-10-14 | 1990-04-17 | Teradyne Laser Systems, Inc. | Calibrating laser trimming apparatus |
US4922077A (en) * | 1989-01-31 | 1990-05-01 | Raytheon Company | Method of laser marking metal packages |
US4945204A (en) * | 1988-11-10 | 1990-07-31 | Mitsubishi Denki Kabushiki Kaisha | Method of laser-marking semiconductor devices |
US4952858A (en) * | 1988-05-18 | 1990-08-28 | Galburt Daniel N | Microlithographic apparatus |
US4958082A (en) | 1987-08-31 | 1990-09-18 | Nikon Corporation | Position measuring apparatus |
US4962318A (en) | 1988-08-19 | 1990-10-09 | Nikon Corporation | Alignment system for exposure apparatus |
US4985780A (en) * | 1989-04-04 | 1991-01-15 | Melco Industries, Inc. | Portable electronically controlled laser engraving machine |
US5048968A (en) | 1982-10-20 | 1991-09-17 | Canon Kabushiki Kaisha | Alignment mark detecting optical system |
US5235408A (en) * | 1988-09-05 | 1993-08-10 | Canon Kabushiki Kaisha | Position detecting method and apparatus |
US5243195A (en) | 1991-04-25 | 1993-09-07 | Nikon Corporation | Projection exposure apparatus having an off-axis alignment system and method of alignment therefor |
US5256578A (en) | 1991-12-23 | 1993-10-26 | Motorola, Inc. | Integral semiconductor wafer map recording |
US5265170A (en) * | 1990-01-11 | 1993-11-23 | Hine Design, Inc. | Devices and methods for reading identification marks on semiconductor wafers |
US5329090A (en) * | 1993-04-09 | 1994-07-12 | A B Lasers, Inc. | Writing on silicon wafers |
US5357077A (en) * | 1993-01-20 | 1994-10-18 | Nec Corporation | Apparatus for marking semiconductor devices |
US5365342A (en) | 1984-10-18 | 1994-11-15 | Canon Kabushiki Kaisha | Alignment and exposure apparatus and method for manufacture of integrated circuits |
US5383118A (en) | 1992-09-23 | 1995-01-17 | At&T Corp. | Device alignment methods |
US5386294A (en) * | 1990-07-05 | 1995-01-31 | Nikon Corporation | Pattern position measuring apparatus |
US5406132A (en) * | 1992-01-21 | 1995-04-11 | Advantest Corporation | Waveform shaper for semiconductor testing devices |
US5502311A (en) * | 1992-01-17 | 1996-03-26 | Nikon Corporation | Method of and apparatus for detecting plane position |
US5521628A (en) * | 1993-08-30 | 1996-05-28 | Lumonics Corporation | Laser system for simultaneously marking multiple parts |
WO1996016767A1 (en) * | 1994-11-28 | 1996-06-06 | Komatsu Ltd. | Laser marking apparatus |
US5548326A (en) * | 1993-10-06 | 1996-08-20 | Cognex Corporation | Efficient image registration |
US5585019A (en) * | 1995-03-10 | 1996-12-17 | Lumonics Inc. | Laser machining of a workpiece through adjacent mask by optical elements creating parallel beams |
US5600478A (en) * | 1990-02-13 | 1997-02-04 | Imaje Sa | Laser marking arrangements |
US5614115A (en) * | 1993-04-08 | 1997-03-25 | Cadcam Technology Limited | Computer-controlled laser cutter with optical sensor |
US5629484A (en) * | 1995-05-19 | 1997-05-13 | Micron Technology, Inc. | Method and apparatus for monitoring a laser ablation operation involving multiple ablation sites on a workpiece |
US5635976A (en) * | 1991-07-17 | 1997-06-03 | Micronic Laser Systems Ab | Method and apparatus for the production of a structure by focused laser radiation on a photosensitively coated substrate |
US5682243A (en) * | 1994-08-22 | 1997-10-28 | Nikon Corporation | Method of aligning a substrate |
US5690846A (en) * | 1994-12-22 | 1997-11-25 | Matsushita Electric Industrial Co., Ltd. | Laser processing method |
US5698120A (en) * | 1995-01-17 | 1997-12-16 | Mitsubishi Denki Kabushiki Kaisha | Laser machining system with control based on machining state recognition |
US5716876A (en) | 1995-10-31 | 1998-02-10 | Nec Corporation | Method for manufacturing completely circular semiconductor wafers |
US5719372A (en) * | 1994-11-17 | 1998-02-17 | Nec Corporation | Laser marking system and method using controlled pulse width of Q-switch |
US5721605A (en) | 1994-03-29 | 1998-02-24 | Nikon Corporation | Alignment device and method with focus detection system |
US5737122A (en) * | 1992-05-01 | 1998-04-07 | Electro Scientific Industries, Inc. | Illumination system for OCR of indicia on a substrate |
US5757756A (en) * | 1996-10-15 | 1998-05-26 | Eastman Kodak Company | Reducing mark length variations in recording data in wobbled groove storage media |
US5778548A (en) | 1995-05-16 | 1998-07-14 | Dea-Brown & Sharpe S.P.A. | Viewing device and method for three-dimensional noncontacting measurements |
US5812569A (en) * | 1997-03-21 | 1998-09-22 | Lumonics, Inc. | Stabilization of the output energy of a pulsed solid state laser |
US5843626A (en) | 1995-04-19 | 1998-12-01 | Pioneer Video Corporation | Method for manufacturing a master disc for optical discs |
WO1998053949A1 (en) * | 1997-05-27 | 1998-12-03 | Sdl, Inc. | Laser marking system and method of energy control |
US5854805A (en) | 1997-03-21 | 1998-12-29 | Lumonics Inc. | Laser machining of a workpiece |
US5854604A (en) | 1997-05-12 | 1998-12-29 | Northrop Grumman Corporation | High-power waveform generator |
US5877800A (en) | 1993-09-10 | 1999-03-02 | Imperial Chemical Industries Plc | Optical data recording apparatus and method |
US5894530A (en) * | 1996-09-05 | 1999-04-13 | Electro Scientific Industries, Inc. | Optical viewing system for simultaneously viewing indicia located on top and bottom surfaces of a substrate |
US5895588A (en) * | 1995-03-07 | 1999-04-20 | Komatsu Ltd. | Controller of laser marking machine |
JPH11135390A (en) * | 1997-10-27 | 1999-05-21 | Sony Corp | Wafer on which id is printed, manufacture of semiconductor device and manufacture equipment therefor |
US5929997A (en) * | 1997-07-02 | 1999-07-27 | Winbond Electronics Corp. | Alignment-mark measurements on the backside of a wafer for synchronous wafer alignment |
US5932119A (en) * | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
US5942137A (en) * | 1997-08-29 | 1999-08-24 | Scitex Corporation Ltd. | Method and apparatus for laser scribing grooves on hard crystals |
US5946537A (en) * | 1997-11-28 | 1999-08-31 | Fujitsu Limited | Printing apparatus with positional offset detection and correction |
US5965042A (en) * | 1996-07-24 | 1999-10-12 | Miyachi Technos Corporation | Method and apparatus for laser marking with laser cleaning |
US5969877A (en) | 1997-11-26 | 1999-10-19 | Xerox Corporation | Dual wavelength F-theta scan lens |
US5978081A (en) * | 1995-12-19 | 1999-11-02 | Cognex Corporation | Multiple field of view calibration plate for use in semiconductor manufacturing |
US5981116A (en) | 1996-12-12 | 1999-11-09 | Nikon Corporation | Alignment in a projection exposure method |
US5986753A (en) * | 1998-03-09 | 1999-11-16 | Chapman Instruments Inc. | Wafer holding and orienting fixture for optical profilometry |
US5986235A (en) | 1996-01-24 | 1999-11-16 | Micron Electronics, Inc. | Method of efficiently laser marking singulated semiconductor devices |
US5999252A (en) * | 1998-07-22 | 1999-12-07 | Seh America, Inc. | Method for marking workpieces |
US5998759A (en) * | 1996-12-24 | 1999-12-07 | General Scanning, Inc. | Laser processing |
US6066829A (en) | 1996-07-02 | 2000-05-23 | Miyachi Technos Corporation | Apparatus for entering, formatting, and storing a variety of characters, symbols, and figures for use in a laser marking system |
US6137303A (en) | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
WO2000064622A1 (en) * | 1999-04-27 | 2000-11-02 | Gsi Lumonics Inc. | Laser calibration apparatus and method |
US6144118A (en) * | 1998-09-18 | 2000-11-07 | General Scanning, Inc. | High-speed precision positioning apparatus |
US6177648B1 (en) * | 1999-03-30 | 2001-01-23 | Laser Machining, Inc. | Steered laser beam system with laser power control |
US6231196B1 (en) | 1997-03-27 | 2001-05-15 | Precision Laser Marking, Inc. | Laser marking process and products |
US6248973B1 (en) | 1998-03-11 | 2001-06-19 | Komatsu Limited | Laser marking method for semiconductor wafer |
US6261919B1 (en) | 1998-10-09 | 2001-07-17 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
US6262388B1 (en) * | 1998-12-21 | 2001-07-17 | Micron Electronics, Inc. | Laser marking station with enclosure and method of operation |
WO2001054854A1 (en) * | 2000-01-28 | 2001-08-02 | Gsi Lumonics, Inc. | Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
US6275250B1 (en) | 1998-05-26 | 2001-08-14 | Sdl, Inc. | Fiber gain medium marking system pumped or seeded by a modulated laser diode source and method of energy control |
US20010016293A1 (en) | 1994-02-22 | 2001-08-23 | Nikon Corporation | Method for positioning substrate |
WO2001061275A1 (en) * | 2000-02-17 | 2001-08-23 | Gsi Lumonics, Inc. | Method and system for automatically generating reference height data for use in a three-dimensional inspection system |
US6281471B1 (en) | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
US6300590B1 (en) | 1998-12-16 | 2001-10-09 | General Scanning, Inc. | Laser processing |
US6309943B1 (en) * | 2000-04-25 | 2001-10-30 | Amkor Technology, Inc. | Precision marking and singulation method |
JP2001308154A (en) | 2000-04-24 | 2001-11-02 | Nikon Corp | Electron beam inspection device, electron beam inspecting method and method for manufacturing device |
US20010038153A1 (en) | 2000-01-07 | 2001-11-08 | Kiyofumi Sakaguchi | Semiconductor substrate and process for its production |
US20010043321A1 (en) | 1997-04-18 | 2001-11-22 | Nikon Corporation | Exposure apparatus, exposure method using the same, and method of manufacture of circuit device |
US6337122B1 (en) | 2000-01-11 | 2002-01-08 | Micron Technology, Inc. | Stereolithographically marked semiconductors devices and methods |
US6339604B1 (en) * | 1998-06-12 | 2002-01-15 | General Scanning, Inc. | Pulse control in laser systems |
US6340806B1 (en) | 1999-12-28 | 2002-01-22 | General Scanning Inc. | Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train |
US6342705B1 (en) | 1999-09-10 | 2002-01-29 | Chapman Instruments | System for locating and measuring an index mark on an edge of a wafer |
US6356091B1 (en) | 1998-11-19 | 2002-03-12 | Speedfam-Ipec Corporation | Automatic wafer mapping in a wet environment on a wafer cleaner |
US20020033558A1 (en) | 2000-09-20 | 2002-03-21 | Fahey Kevin P. | UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses |
US20020038794A1 (en) * | 1998-12-21 | 2002-04-04 | Canella Robert L. | Laser marking system for dice carried in trays and method of operation |
US6396640B2 (en) * | 2000-03-30 | 2002-05-28 | Fuji Photo Optical Co., Ltd. | Collimator lens and optical scanning apparatus using the same |
US6432796B1 (en) * | 2000-06-28 | 2002-08-13 | Micron Technology, Inc. | Method and apparatus for marking microelectronic dies and microelectronic devices |
US6437454B1 (en) | 1999-10-20 | 2002-08-20 | Komatsu Limited | Semiconductor base material having fine dot mark |
US6437287B1 (en) | 1997-09-18 | 2002-08-20 | Nederlandse Centrum Voor Laser Research B.V. | Laser processing device |
US20020167581A1 (en) | 2001-03-29 | 2002-11-14 | Cordingley James J. | Methods and systems for thermal-based laser processing a multi-material device |
US6483071B1 (en) * | 2000-05-16 | 2002-11-19 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
US6495791B2 (en) | 2000-05-16 | 2002-12-17 | General Scanning, Inc. | Method and subsystem for generating a trajectory to be followed by a motor-driven stage when processing microstructures at a laser-processing site |
US20030024913A1 (en) * | 2002-04-15 | 2003-02-06 | Downes Joseph P. | Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
US6528760B1 (en) * | 2000-07-14 | 2003-03-04 | Micron Technology, Inc. | Apparatus and method using rotational indexing for laser marking IC packages carried in trays |
US20030102292A1 (en) * | 2001-12-01 | 2003-06-05 | Eo Technics Co., Ltd. | Method and apparatus for calibrating marking position in chip scale marker |
US6589801B1 (en) | 1998-08-31 | 2003-07-08 | Amkor Technology, Inc. | Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques |
US20030142313A1 (en) * | 1998-07-03 | 2003-07-31 | Shoshi Katayama | Position detection apparatus and exposure apparatus |
US20030192866A1 (en) * | 2002-04-15 | 2003-10-16 | Eo Technics Co., Ltd. | Chip scale marker and making method |
WO2003092069A1 (en) * | 2002-04-26 | 2003-11-06 | Eo Technics Co., Ltd. | Method of calibrating marking in laser marking system |
US6662063B2 (en) | 2000-05-16 | 2003-12-09 | Gsi Lumonics Corporation | Method and subsystem for determining a sequence in which microstructures are to be processed at a laser-processing site |
US6671049B1 (en) * | 1999-10-29 | 2003-12-30 | Cognex Corporation | Article of manufacture bearing a universal alignment target |
US6678061B2 (en) * | 2001-06-29 | 2004-01-13 | Siemens Aktiengesellschaft | Method of calibrating the optical system of a laser machine for processing electrical circuit substrates |
US6684172B1 (en) | 2001-12-27 | 2004-01-27 | Advanced Micro Devices, Inc. | Sensor to predict void free films using various grating structures and characterize fill performance |
US6710847B1 (en) | 1998-11-06 | 2004-03-23 | Nikon Corporation | Exposure method and exposure apparatus |
US6710284B1 (en) * | 1999-02-26 | 2004-03-23 | Micron Technology, Inc. | Laser marking techniques for bare semiconductor die |
US20040101000A1 (en) * | 2002-11-27 | 2004-05-27 | Eo Technics Co., Ltd. | Laser system for dual wavelength and chip scale marker having the same |
US20040121493A1 (en) * | 2002-12-24 | 2004-06-24 | Eo Technics Co., Ltd. | Chip scale marker and method of calibrating marking position |
US20040118821A1 (en) * | 2002-12-21 | 2004-06-24 | Eo Technics Co., Ltd. | Chip scale marker and marking method |
US20040134896A1 (en) | 1999-12-28 | 2004-07-15 | Bo Gu | Laser-based method and system for memory link processing with picosecond lasers |
US20040144760A1 (en) | 2002-05-17 | 2004-07-29 | Cahill Steven P. | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
US6774340B1 (en) | 1998-11-25 | 2004-08-10 | Komatsu Limited | Shape of microdot mark formed by laser beam and microdot marking method |
US20050120840A1 (en) * | 1999-10-13 | 2005-06-09 | Koskovich Jerome E. | Automated board processing apparatus |
US6951995B2 (en) | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
US20060000814A1 (en) | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
US20060108337A1 (en) | 2004-11-11 | 2006-05-25 | Bo Gu | Method and system for laser soft marking |
US7064807B2 (en) | 2001-01-15 | 2006-06-20 | Asml Netherlands B.V. | Lithographic apparatus |
US20060151704A1 (en) | 2004-12-30 | 2006-07-13 | Cordingley James J | Laser-based material processing methods, system and subsystem for use therein for precision energy control |
US20060189091A1 (en) | 2004-11-11 | 2006-08-24 | Bo Gu | Method and system for laser hard marking |
US20060191884A1 (en) | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
US20060199354A1 (en) | 2002-03-27 | 2006-09-07 | Bo Gu | Method and system for high-speed precise laser trimming and electrical device produced thereby |
US20060256181A1 (en) | 2005-05-11 | 2006-11-16 | Ehrmann Jonathan S | Optical scanning method and system and method for correcting optical aberrations introduced into the system by a beam deflector |
US20070106416A1 (en) | 2006-06-05 | 2007-05-10 | Griffiths Joseph J | Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same |
US20070117227A1 (en) | 2005-11-23 | 2007-05-24 | Gsi Group Corporation | Method And System for Iteratively, Selectively Tuning A Parameter Of A Doped Workpiece Using A Pulsed Laser |
US20070173075A1 (en) | 2001-03-29 | 2007-07-26 | Joohan Lee | Laser-based method and system for processing a multi-material device having conductive link structures |
US20070178714A1 (en) | 2002-03-27 | 2007-08-02 | Bo Gu | Method and system for high-speed precise laser trimming and scan lens for use therein |
US20070199927A1 (en) | 1999-12-28 | 2007-08-30 | Bo Gu | Laser-based method and system for removing one or more target link structures |
US7280232B2 (en) | 2004-09-21 | 2007-10-09 | Chapman Instruments, Inc. | Method and apparatus for measuring wafer thickness |
US20080067155A1 (en) | 2006-09-15 | 2008-03-20 | Bo Gu | Method and system for laser processing targets of different types on a workpiece |
US7358157B2 (en) | 2002-03-27 | 2008-04-15 | Gsi Group Corporation | Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US495204A (en) * | 1893-04-11 | Fabriken | ||
US102292A (en) * | 1870-04-26 | Improvement in trunks | ||
US4170908A (en) * | 1978-05-01 | 1979-10-16 | Joy Manufacturing Company | Indexing mechanism for an open-head power tong |
CH678846A5 (en) * | 1989-02-22 | 1991-11-15 | Tetra Pak Romont | |
US5896753A (en) * | 1996-10-18 | 1999-04-27 | Lg Electronics Inc. | Freezing cycle apparatus having quick freezing and thawing functions |
JP2001223145A (en) * | 2000-02-07 | 2001-08-17 | Komatsu Ltd | Semiconductor wafer carrying dot mark having special shape and method for forming dot mark |
JP4614502B2 (en) * | 2000-06-08 | 2011-01-19 | 株式会社東芝 | Method for forming concave hole type dot mark and semiconductor wafer having the same dot mark |
JP4518719B2 (en) * | 2001-12-10 | 2010-08-04 | ソニー株式会社 | Data processing system, information processing apparatus and method, and computer program |
US20070215575A1 (en) * | 2006-03-15 | 2007-09-20 | Bo Gu | Method and system for high-speed, precise, laser-based modification of one or more electrical elements |
-
2003
- 2003-05-15 US US10/438,500 patent/US20040144760A1/en not_active Abandoned
- 2003-05-15 US US10/438,533 patent/US7015418B2/en not_active Expired - Lifetime
- 2003-05-15 US US10/439,069 patent/US7119351B2/en not_active Ceased
- 2003-05-15 US US10/438,501 patent/US7067763B2/en not_active Expired - Lifetime
- 2003-05-16 AU AU2003239502A patent/AU2003239502A1/en not_active Abandoned
- 2003-05-16 JP JP2004504672A patent/JP2005526386A/en active Pending
- 2003-05-16 WO PCT/US2003/015698 patent/WO2003097290A1/en active Application Filing
- 2003-05-19 TW TW092113464A patent/TWI290363B/en not_active IP Right Cessation
-
2004
- 2004-11-17 KR KR1020047018604A patent/KR100914053B1/en active IP Right Grant
-
2005
- 2005-11-04 US US11/266,844 patent/US20060054608A1/en not_active Abandoned
-
2006
- 2006-04-18 US US11/406,191 patent/US20060180580A1/en not_active Abandoned
- 2006-04-18 US US11/405,780 patent/US20060186096A1/en not_active Abandoned
- 2006-10-09 US US11/544,898 patent/US20070031993A1/en not_active Abandoned
- 2006-10-09 US US11/544,426 patent/US20080316504A1/en not_active Abandoned
-
2007
- 2007-11-30 US US11/948,425 patent/USRE41924E1/en not_active Expired - Lifetime
Patent Citations (186)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4220842A (en) * | 1976-10-07 | 1980-09-02 | Lasag Ag | Method of removing material from a workpiece |
US4156124A (en) * | 1977-04-14 | 1979-05-22 | Optical Engineering, Inc. | Image transfer laser engraving |
US4323755A (en) * | 1979-09-24 | 1982-04-06 | Rca Corporation | Method of making a machine-readable marking in a workpiece |
US4362942A (en) | 1979-12-10 | 1982-12-07 | Fujitsu Limited | Electron beam exposure system and an apparatus for carrying out the same |
US4504144A (en) * | 1982-07-06 | 1985-03-12 | The Perkin-Elmer Corporation | Simple electromechanical tilt and focus device |
US4468551A (en) | 1982-07-30 | 1984-08-28 | Armco Inc. | Laser treatment of electrical steel and optical scanning assembly therefor |
US5048968A (en) | 1982-10-20 | 1991-09-17 | Canon Kabushiki Kaisha | Alignment mark detecting optical system |
US4734558A (en) * | 1983-05-16 | 1988-03-29 | Nec Corporation | Laser machining apparatus with controllable mask |
US4522656A (en) * | 1983-07-07 | 1985-06-11 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Method of making reference surface markings on semiconductor wafers by laser beam |
US4710908A (en) * | 1983-09-20 | 1987-12-01 | Olympus Optical Company Limited | Servo apparatus for compensating for warp and deflection deviations on optical discs |
US5365342A (en) | 1984-10-18 | 1994-11-15 | Canon Kabushiki Kaisha | Alignment and exposure apparatus and method for manufacture of integrated circuits |
US4872177A (en) | 1985-05-01 | 1989-10-03 | Spectra-Physics | Laser diode pumped solid state laser |
US4820055A (en) * | 1985-08-26 | 1989-04-11 | Siemens Aktiengesellschaft | Apparatus for adjusting a mask with at least one adjustment mark relative to a semi-conductor wafer provided with at least one lattice structure |
US4685775A (en) | 1985-11-15 | 1987-08-11 | Teradyne, Inc. | Light beam positioning apparatus |
US4758848A (en) * | 1985-11-28 | 1988-07-19 | Nec Corporation | Method and apparatus for marking a pattern on an article with a laser including partial feedback of the laser output for generating the marking beam |
US4702134A (en) * | 1986-04-10 | 1987-10-27 | Corley Manufacturing Company | Edging apparatus |
US4910725A (en) * | 1986-04-23 | 1990-03-20 | Drexler Technology Corporation | Optical recording method for data cards |
US4823394A (en) | 1986-04-24 | 1989-04-18 | Kulicke & Soffa Industries, Inc. | Pattern recognition system |
US4752668A (en) | 1986-04-28 | 1988-06-21 | Rosenfield Michael G | System for laser removal of excess material from a semiconductor wafer |
US4797749A (en) | 1986-11-18 | 1989-01-10 | General Scanning, Inc. | Scanning system with tunable resonant actuator |
US4856053A (en) * | 1987-05-06 | 1989-08-08 | Hashimoto Corporation | Telephone terminal equipment having means for preventing malicious and nuisance transmission |
US4900940A (en) * | 1987-05-21 | 1990-02-13 | Anritsu Corporation | Optical system for measuring a surface profile of an object using a converged, inclined light beam and movable converging lens |
US4958082A (en) | 1987-08-31 | 1990-09-18 | Nikon Corporation | Position measuring apparatus |
US4886958A (en) | 1988-03-25 | 1989-12-12 | Texas Instruments Incorporated | Autofocus system for scanning laser inspector or writer |
US4952858A (en) * | 1988-05-18 | 1990-08-28 | Galburt Daniel N | Microlithographic apparatus |
US4962318A (en) | 1988-08-19 | 1990-10-09 | Nikon Corporation | Alignment system for exposure apparatus |
US5235408A (en) * | 1988-09-05 | 1993-08-10 | Canon Kabushiki Kaisha | Position detecting method and apparatus |
US4918284A (en) * | 1988-10-14 | 1990-04-17 | Teradyne Laser Systems, Inc. | Calibrating laser trimming apparatus |
US4945204A (en) * | 1988-11-10 | 1990-07-31 | Mitsubishi Denki Kabushiki Kaisha | Method of laser-marking semiconductor devices |
US4922077A (en) * | 1989-01-31 | 1990-05-01 | Raytheon Company | Method of laser marking metal packages |
US4985780A (en) * | 1989-04-04 | 1991-01-15 | Melco Industries, Inc. | Portable electronically controlled laser engraving machine |
US5265170A (en) * | 1990-01-11 | 1993-11-23 | Hine Design, Inc. | Devices and methods for reading identification marks on semiconductor wafers |
US5600478A (en) * | 1990-02-13 | 1997-02-04 | Imaje Sa | Laser marking arrangements |
US5386294A (en) * | 1990-07-05 | 1995-01-31 | Nikon Corporation | Pattern position measuring apparatus |
US5243195A (en) | 1991-04-25 | 1993-09-07 | Nikon Corporation | Projection exposure apparatus having an off-axis alignment system and method of alignment therefor |
US5635976A (en) * | 1991-07-17 | 1997-06-03 | Micronic Laser Systems Ab | Method and apparatus for the production of a structure by focused laser radiation on a photosensitively coated substrate |
US5256578A (en) | 1991-12-23 | 1993-10-26 | Motorola, Inc. | Integral semiconductor wafer map recording |
US5502311A (en) * | 1992-01-17 | 1996-03-26 | Nikon Corporation | Method of and apparatus for detecting plane position |
US5406132A (en) * | 1992-01-21 | 1995-04-11 | Advantest Corporation | Waveform shaper for semiconductor testing devices |
US5737122A (en) * | 1992-05-01 | 1998-04-07 | Electro Scientific Industries, Inc. | Illumination system for OCR of indicia on a substrate |
US5383118A (en) | 1992-09-23 | 1995-01-17 | At&T Corp. | Device alignment methods |
US5357077A (en) * | 1993-01-20 | 1994-10-18 | Nec Corporation | Apparatus for marking semiconductor devices |
US5614115A (en) * | 1993-04-08 | 1997-03-25 | Cadcam Technology Limited | Computer-controlled laser cutter with optical sensor |
US5329090A (en) * | 1993-04-09 | 1994-07-12 | A B Lasers, Inc. | Writing on silicon wafers |
US5521628A (en) * | 1993-08-30 | 1996-05-28 | Lumonics Corporation | Laser system for simultaneously marking multiple parts |
US5877800A (en) | 1993-09-10 | 1999-03-02 | Imperial Chemical Industries Plc | Optical data recording apparatus and method |
US5548326A (en) * | 1993-10-06 | 1996-08-20 | Cognex Corporation | Efficient image registration |
US20010016293A1 (en) | 1994-02-22 | 2001-08-23 | Nikon Corporation | Method for positioning substrate |
US5721605A (en) | 1994-03-29 | 1998-02-24 | Nikon Corporation | Alignment device and method with focus detection system |
US5682243A (en) * | 1994-08-22 | 1997-10-28 | Nikon Corporation | Method of aligning a substrate |
US5719372A (en) * | 1994-11-17 | 1998-02-17 | Nec Corporation | Laser marking system and method using controlled pulse width of Q-switch |
WO1996016767A1 (en) * | 1994-11-28 | 1996-06-06 | Komatsu Ltd. | Laser marking apparatus |
US5690846A (en) * | 1994-12-22 | 1997-11-25 | Matsushita Electric Industrial Co., Ltd. | Laser processing method |
US5698120A (en) * | 1995-01-17 | 1997-12-16 | Mitsubishi Denki Kabushiki Kaisha | Laser machining system with control based on machining state recognition |
US5895588A (en) * | 1995-03-07 | 1999-04-20 | Komatsu Ltd. | Controller of laser marking machine |
US5585019A (en) * | 1995-03-10 | 1996-12-17 | Lumonics Inc. | Laser machining of a workpiece through adjacent mask by optical elements creating parallel beams |
US5843626A (en) | 1995-04-19 | 1998-12-01 | Pioneer Video Corporation | Method for manufacturing a master disc for optical discs |
US5778548A (en) | 1995-05-16 | 1998-07-14 | Dea-Brown & Sharpe S.P.A. | Viewing device and method for three-dimensional noncontacting measurements |
US5629484A (en) * | 1995-05-19 | 1997-05-13 | Micron Technology, Inc. | Method and apparatus for monitoring a laser ablation operation involving multiple ablation sites on a workpiece |
US5716876A (en) | 1995-10-31 | 1998-02-10 | Nec Corporation | Method for manufacturing completely circular semiconductor wafers |
US5978081A (en) * | 1995-12-19 | 1999-11-02 | Cognex Corporation | Multiple field of view calibration plate for use in semiconductor manufacturing |
US5932119A (en) * | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
US5986235A (en) | 1996-01-24 | 1999-11-16 | Micron Electronics, Inc. | Method of efficiently laser marking singulated semiconductor devices |
US6066829A (en) | 1996-07-02 | 2000-05-23 | Miyachi Technos Corporation | Apparatus for entering, formatting, and storing a variety of characters, symbols, and figures for use in a laser marking system |
US5965042A (en) * | 1996-07-24 | 1999-10-12 | Miyachi Technos Corporation | Method and apparatus for laser marking with laser cleaning |
US5894530A (en) * | 1996-09-05 | 1999-04-13 | Electro Scientific Industries, Inc. | Optical viewing system for simultaneously viewing indicia located on top and bottom surfaces of a substrate |
US5757756A (en) * | 1996-10-15 | 1998-05-26 | Eastman Kodak Company | Reducing mark length variations in recording data in wobbled groove storage media |
US5981116A (en) | 1996-12-12 | 1999-11-09 | Nikon Corporation | Alignment in a projection exposure method |
US5998759A (en) * | 1996-12-24 | 1999-12-07 | General Scanning, Inc. | Laser processing |
US5854805A (en) | 1997-03-21 | 1998-12-29 | Lumonics Inc. | Laser machining of a workpiece |
US5812569A (en) * | 1997-03-21 | 1998-09-22 | Lumonics, Inc. | Stabilization of the output energy of a pulsed solid state laser |
US6231196B1 (en) | 1997-03-27 | 2001-05-15 | Precision Laser Marking, Inc. | Laser marking process and products |
US20010043321A1 (en) | 1997-04-18 | 2001-11-22 | Nikon Corporation | Exposure apparatus, exposure method using the same, and method of manufacture of circuit device |
US6414743B1 (en) | 1997-04-18 | 2002-07-02 | Nikon Corporation | Exposure apparatus, exposure method using the same and method of manufacture of circuit device |
US5854604A (en) | 1997-05-12 | 1998-12-29 | Northrop Grumman Corporation | High-power waveform generator |
WO1998053949A1 (en) * | 1997-05-27 | 1998-12-03 | Sdl, Inc. | Laser marking system and method of energy control |
US6160568A (en) | 1997-05-27 | 2000-12-12 | Sdl, Inc. | Laser marking system and method of energy control |
US6489985B1 (en) | 1997-05-27 | 2002-12-03 | Jds Uniphase Corporation | Laser marking system and method of energy control |
US5929997A (en) * | 1997-07-02 | 1999-07-27 | Winbond Electronics Corp. | Alignment-mark measurements on the backside of a wafer for synchronous wafer alignment |
US5942137A (en) * | 1997-08-29 | 1999-08-24 | Scitex Corporation Ltd. | Method and apparatus for laser scribing grooves on hard crystals |
US6437287B1 (en) | 1997-09-18 | 2002-08-20 | Nederlandse Centrum Voor Laser Research B.V. | Laser processing device |
JPH11135390A (en) * | 1997-10-27 | 1999-05-21 | Sony Corp | Wafer on which id is printed, manufacture of semiconductor device and manufacture equipment therefor |
US5969877A (en) | 1997-11-26 | 1999-10-19 | Xerox Corporation | Dual wavelength F-theta scan lens |
US5946537A (en) * | 1997-11-28 | 1999-08-31 | Fujitsu Limited | Printing apparatus with positional offset detection and correction |
US5986753A (en) * | 1998-03-09 | 1999-11-16 | Chapman Instruments Inc. | Wafer holding and orienting fixture for optical profilometry |
US6248973B1 (en) | 1998-03-11 | 2001-06-19 | Komatsu Limited | Laser marking method for semiconductor wafer |
US6275250B1 (en) | 1998-05-26 | 2001-08-14 | Sdl, Inc. | Fiber gain medium marking system pumped or seeded by a modulated laser diode source and method of energy control |
US6339604B1 (en) * | 1998-06-12 | 2002-01-15 | General Scanning, Inc. | Pulse control in laser systems |
US20030142313A1 (en) * | 1998-07-03 | 2003-07-31 | Shoshi Katayama | Position detection apparatus and exposure apparatus |
US5999252A (en) * | 1998-07-22 | 1999-12-07 | Seh America, Inc. | Method for marking workpieces |
US6589801B1 (en) | 1998-08-31 | 2003-07-08 | Amkor Technology, Inc. | Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques |
US6144118A (en) * | 1998-09-18 | 2000-11-07 | General Scanning, Inc. | High-speed precision positioning apparatus |
US6261919B1 (en) | 1998-10-09 | 2001-07-17 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
US6710847B1 (en) | 1998-11-06 | 2004-03-23 | Nikon Corporation | Exposure method and exposure apparatus |
US6356091B1 (en) | 1998-11-19 | 2002-03-12 | Speedfam-Ipec Corporation | Automatic wafer mapping in a wet environment on a wafer cleaner |
US6774340B1 (en) | 1998-11-25 | 2004-08-10 | Komatsu Limited | Shape of microdot mark formed by laser beam and microdot marking method |
US6137303A (en) | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
US6300590B1 (en) | 1998-12-16 | 2001-10-09 | General Scanning, Inc. | Laser processing |
US6262388B1 (en) * | 1998-12-21 | 2001-07-17 | Micron Electronics, Inc. | Laser marking station with enclosure and method of operation |
US20020038794A1 (en) * | 1998-12-21 | 2002-04-04 | Canella Robert L. | Laser marking system for dice carried in trays and method of operation |
US6710284B1 (en) * | 1999-02-26 | 2004-03-23 | Micron Technology, Inc. | Laser marking techniques for bare semiconductor die |
US6177648B1 (en) * | 1999-03-30 | 2001-01-23 | Laser Machining, Inc. | Steered laser beam system with laser power control |
US6501061B1 (en) * | 1999-04-27 | 2002-12-31 | Gsi Lumonics Inc. | Laser calibration apparatus and method |
WO2000064622A1 (en) * | 1999-04-27 | 2000-11-02 | Gsi Lumonics Inc. | Laser calibration apparatus and method |
US6342705B1 (en) | 1999-09-10 | 2002-01-29 | Chapman Instruments | System for locating and measuring an index mark on an edge of a wafer |
US20050120840A1 (en) * | 1999-10-13 | 2005-06-09 | Koskovich Jerome E. | Automated board processing apparatus |
US6437454B1 (en) | 1999-10-20 | 2002-08-20 | Komatsu Limited | Semiconductor base material having fine dot mark |
US6671049B1 (en) * | 1999-10-29 | 2003-12-30 | Cognex Corporation | Article of manufacture bearing a universal alignment target |
US6281471B1 (en) | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
US20070199927A1 (en) | 1999-12-28 | 2007-08-30 | Bo Gu | Laser-based method and system for removing one or more target link structures |
US20060086702A1 (en) | 1999-12-28 | 2006-04-27 | Gsi Group Corp | Energy-efficient, laser-based method and system for processing target material |
US20040188399A1 (en) | 1999-12-28 | 2004-09-30 | Gsi Lumonics Inc. | Energy-efficient, laser-based method and system for processing target material |
US20040134896A1 (en) | 1999-12-28 | 2004-07-15 | Bo Gu | Laser-based method and system for memory link processing with picosecond lasers |
US6727458B2 (en) | 1999-12-28 | 2004-04-27 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
US6703582B2 (en) | 1999-12-28 | 2004-03-09 | Gsi Lumonics Corporation | Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train |
US20080035614A1 (en) | 1999-12-28 | 2008-02-14 | Gsi Group Corp | Energy efficient, laser-based method and system for processing target material |
US6340806B1 (en) | 1999-12-28 | 2002-01-22 | General Scanning Inc. | Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train |
US20010038153A1 (en) | 2000-01-07 | 2001-11-08 | Kiyofumi Sakaguchi | Semiconductor substrate and process for its production |
US6337122B1 (en) | 2000-01-11 | 2002-01-08 | Micron Technology, Inc. | Stereolithographically marked semiconductors devices and methods |
WO2001054854A1 (en) * | 2000-01-28 | 2001-08-02 | Gsi Lumonics, Inc. | Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
WO2001061275A1 (en) * | 2000-02-17 | 2001-08-23 | Gsi Lumonics, Inc. | Method and system for automatically generating reference height data for use in a three-dimensional inspection system |
US6496270B1 (en) * | 2000-02-17 | 2002-12-17 | Gsi Lumonics, Inc. | Method and system for automatically generating reference height data for use in a three-dimensional inspection system |
US6396640B2 (en) * | 2000-03-30 | 2002-05-28 | Fuji Photo Optical Co., Ltd. | Collimator lens and optical scanning apparatus using the same |
JP2001308154A (en) | 2000-04-24 | 2001-11-02 | Nikon Corp | Electron beam inspection device, electron beam inspecting method and method for manufacturing device |
US6309943B1 (en) * | 2000-04-25 | 2001-10-30 | Amkor Technology, Inc. | Precision marking and singulation method |
US20050199598A1 (en) | 2000-05-16 | 2005-09-15 | Gsi Lumonics Corporation | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
US6662063B2 (en) | 2000-05-16 | 2003-12-09 | Gsi Lumonics Corporation | Method and subsystem for determining a sequence in which microstructures are to be processed at a laser-processing site |
US7176407B2 (en) | 2000-05-16 | 2007-02-13 | Gsi Group Corporation | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
US6573473B2 (en) | 2000-05-16 | 2003-06-03 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
US6495791B2 (en) | 2000-05-16 | 2002-12-17 | General Scanning, Inc. | Method and subsystem for generating a trajectory to be followed by a motor-driven stage when processing microstructures at a laser-processing site |
US6483071B1 (en) * | 2000-05-16 | 2002-11-19 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
US6432796B1 (en) * | 2000-06-28 | 2002-08-13 | Micron Technology, Inc. | Method and apparatus for marking microelectronic dies and microelectronic devices |
US6528760B1 (en) * | 2000-07-14 | 2003-03-04 | Micron Technology, Inc. | Apparatus and method using rotational indexing for laser marking IC packages carried in trays |
US20020033558A1 (en) | 2000-09-20 | 2002-03-21 | Fahey Kevin P. | UV laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses |
US7064807B2 (en) | 2001-01-15 | 2006-06-20 | Asml Netherlands B.V. | Lithographic apparatus |
US6777645B2 (en) | 2001-03-29 | 2004-08-17 | Gsi Lumonics Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
US20060216927A1 (en) | 2001-03-29 | 2006-09-28 | Gsi Lumonics Corporation | Methods and systems for processing a device, methods and systems for modeling same and the device |
US20080094640A1 (en) | 2001-03-29 | 2008-04-24 | Cordingley James J | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method for controlling energy delivered to a target structure |
US20070052791A1 (en) | 2001-03-29 | 2007-03-08 | Gsi Lumonics Corporation | Methods and systems for thermal-based laser processing a multi-material device |
US20060207975A1 (en) | 2001-03-29 | 2006-09-21 | Gsi Lumonics Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
US20070075058A1 (en) | 2001-03-29 | 2007-04-05 | Gsi Lumonics Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
US20070173075A1 (en) | 2001-03-29 | 2007-07-26 | Joohan Lee | Laser-based method and system for processing a multi-material device having conductive link structures |
US20020167581A1 (en) | 2001-03-29 | 2002-11-14 | Cordingley James J. | Methods and systems for thermal-based laser processing a multi-material device |
US20060192845A1 (en) | 2001-03-29 | 2006-08-31 | Gsi Lumonics Corporation | Methods and systems for thermal-based laser processing a multi-material device |
US6639177B2 (en) | 2001-03-29 | 2003-10-28 | Gsi Lumonics Corporation | Method and system for processing one or more microstructures of a multi-material device |
US20070215820A1 (en) | 2001-03-29 | 2007-09-20 | Cordingley James J | Methods and systems for thermal-based laser processing a multi-material device |
US7027155B2 (en) | 2001-03-29 | 2006-04-11 | Gsi Lumonics Corporation | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
US6972268B2 (en) | 2001-03-29 | 2005-12-06 | Gsi Lumonics Corporation | Methods and systems for processing a device, methods and systems for modeling same and the device |
US7148447B2 (en) | 2001-03-29 | 2006-12-12 | Gsi Group Corporation | Method and apparatus for laser marking by ablation |
US6989508B2 (en) | 2001-03-29 | 2006-01-24 | Gsi Group Corporation | High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
US20060028655A1 (en) | 2001-03-29 | 2006-02-09 | Gsil Lumonics Corporation | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
US7192846B2 (en) | 2001-03-29 | 2007-03-20 | Gsi Group Corporation | Methods and systems for processing a device, methods and systems for modeling same and the device |
US6678061B2 (en) * | 2001-06-29 | 2004-01-13 | Siemens Aktiengesellschaft | Method of calibrating the optical system of a laser machine for processing electrical circuit substrates |
US6808117B2 (en) | 2001-12-01 | 2004-10-26 | Eo Technics Co., Ltd. | Method and apparatus for calibrating marking position in chip scale marker |
US20030102292A1 (en) * | 2001-12-01 | 2003-06-05 | Eo Technics Co., Ltd. | Method and apparatus for calibrating marking position in chip scale marker |
US6684172B1 (en) | 2001-12-27 | 2004-01-27 | Advanced Micro Devices, Inc. | Sensor to predict void free films using various grating structures and characterize fill performance |
US20050233537A1 (en) | 2002-03-27 | 2005-10-20 | Gsi Lumonics Corporation | Method and system for high-speed, precise micromachining an array of devices |
US6951995B2 (en) | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
US7358157B2 (en) | 2002-03-27 | 2008-04-15 | Gsi Group Corporation | Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby |
US20060199354A1 (en) | 2002-03-27 | 2006-09-07 | Bo Gu | Method and system for high-speed precise laser trimming and electrical device produced thereby |
US20060205121A1 (en) | 2002-03-27 | 2006-09-14 | Gsi Lumonics Corporation | Method and system for high-speed, precise micromachining an array of devices |
US20070178714A1 (en) | 2002-03-27 | 2007-08-02 | Bo Gu | Method and system for high-speed precise laser trimming and scan lens for use therein |
US20030024913A1 (en) * | 2002-04-15 | 2003-02-06 | Downes Joseph P. | Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
US20030192866A1 (en) * | 2002-04-15 | 2003-10-16 | Eo Technics Co., Ltd. | Chip scale marker and making method |
US6710286B2 (en) | 2002-04-15 | 2004-03-23 | Eo Technics Co., Ltd. | Chip scale marker and making method |
WO2003092069A1 (en) * | 2002-04-26 | 2003-11-06 | Eo Technics Co., Ltd. | Method of calibrating marking in laser marking system |
US7015418B2 (en) | 2002-05-17 | 2006-03-21 | Gsi Group Corporation | Method and system for calibrating a laser processing system and laser marking system utilizing same |
US20070031993A1 (en) | 2002-05-17 | 2007-02-08 | Gsi Lumonics Corporation | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US20060186096A1 (en) | 2002-05-17 | 2006-08-24 | Gsi Lumonics Corporation | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
US20040144760A1 (en) | 2002-05-17 | 2004-07-29 | Cahill Steven P. | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
US7119351B2 (en) | 2002-05-17 | 2006-10-10 | Gsi Group Corporation | Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system |
US20040101000A1 (en) * | 2002-11-27 | 2004-05-27 | Eo Technics Co., Ltd. | Laser system for dual wavelength and chip scale marker having the same |
US20040118821A1 (en) * | 2002-12-21 | 2004-06-24 | Eo Technics Co., Ltd. | Chip scale marker and marking method |
US20040121493A1 (en) * | 2002-12-24 | 2004-06-24 | Eo Technics Co., Ltd. | Chip scale marker and method of calibrating marking position |
US20080011852A1 (en) | 2004-06-30 | 2008-01-17 | Gsi Group Corporation | Laser-based method and system for processing targeted surface material and article produced thereby |
US20080073438A1 (en) | 2004-06-30 | 2008-03-27 | Gsi Group Corporation | Laser-based method and system for processing targeted surface material and article produced thereby |
US20060000814A1 (en) | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
US7280232B2 (en) | 2004-09-21 | 2007-10-09 | Chapman Instruments, Inc. | Method and apparatus for measuring wafer thickness |
US20060108337A1 (en) | 2004-11-11 | 2006-05-25 | Bo Gu | Method and system for laser soft marking |
US20060189091A1 (en) | 2004-11-11 | 2006-08-24 | Bo Gu | Method and system for laser hard marking |
US20060151704A1 (en) | 2004-12-30 | 2006-07-13 | Cordingley James J | Laser-based material processing methods, system and subsystem for use therein for precision energy control |
US20060191884A1 (en) | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
US20060256181A1 (en) | 2005-05-11 | 2006-11-16 | Ehrmann Jonathan S | Optical scanning method and system and method for correcting optical aberrations introduced into the system by a beam deflector |
US20070117227A1 (en) | 2005-11-23 | 2007-05-24 | Gsi Group Corporation | Method And System for Iteratively, Selectively Tuning A Parameter Of A Doped Workpiece Using A Pulsed Laser |
US20070106416A1 (en) | 2006-06-05 | 2007-05-10 | Griffiths Joseph J | Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same |
US20080067155A1 (en) | 2006-09-15 | 2008-03-20 | Bo Gu | Method and system for laser processing targets of different types on a workpiece |
Non-Patent Citations (14)
Title |
---|
Hayes, Orlan, Marking Application Now Encompass Many Materials, Laser Focus World, Feb. 1997, pp. 153-160. * |
Invention Disclosure entitled "Calibration System for Fine Die Alignment", shipping date Sep. 1998 to Helett Packard. * |
Keirstead, Mark and Somerville, Paul, UV Lasers are workhorses, Optoelectronics World magazine, Jun. 2001, pp. 197-198, 200-201, www.optoelectronics-world.com. * |
Kuttner, Paul, Optics for data storage, Optische Werke G. Rodenstock, Munich, Genrmany, pp. 303-305, 331-332 and 383-390. * |
Montagu, Galvanometric and Resonant Low Inertia Scanners, Laser Beam Scanning, Marcel-Dekker, 1985, pp. 214-216.□□ * |
Motagu, Galvanometric and Resonant Low Inertia Scanners, Laser beam scanning, Marcel-Dekker, 1985, pp. 214-216. * |
Nikoonahad, Mehrdad, et al., In Situ Height Correction for Laser Scanning of Semiconductor Wafers, Optical Engineering, Oct. 1995, vol. 34, No. 10, pp. 3036-3039. * |
PCT International Preliminary Examiknation Report, dated Mar. 15, 2004, pp. 1-4. * |
PCT International Preliminary Examination Report, dated Aug. 28, 2003, pp. 1-4. * |
Rodenstock Laser Optics-F-Theta Flat Field Laser Scan Lenses, Laser Optics, www.rodenstockoptics.de/pp5.html. * |
Rossi, Brian, Commersial Fiber Lasers Take ON Industrial Markers, Laser Focus world, May 1997, pp. 143-150. * |
Scanning Lens Theory, Special Optics, Wharton, New Jersy, May 1997, pp. 36-37. * |
Special Optics Manufacture and Design catalog, Scanning Lenses, www.specialoptics.com/scanlens.html. * |
Zayhowski, John, Q-Switched Microchip lasers Find Real World Application, Laser Focus World magazine, Aug. 1999, pp. 129-132, 134, 136, www.optoelectronics-world.com. * |
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Also Published As
Publication number | Publication date |
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WO2003097290A1 (en) | 2003-11-27 |
US7119351B2 (en) | 2006-10-10 |
JP2005526386A (en) | 2005-09-02 |
KR20050024275A (en) | 2005-03-10 |
US20060180580A1 (en) | 2006-08-17 |
AU2003239502A1 (en) | 2003-12-02 |
TWI290363B (en) | 2007-11-21 |
US20060054608A1 (en) | 2006-03-16 |
TW200414488A (en) | 2004-08-01 |
US7015418B2 (en) | 2006-03-21 |
US20080316504A1 (en) | 2008-12-25 |
US20060186096A1 (en) | 2006-08-24 |
US20040060910A1 (en) | 2004-04-01 |
US20040031779A1 (en) | 2004-02-19 |
US20070031993A1 (en) | 2007-02-08 |
US20040144760A1 (en) | 2004-07-29 |
US20040152233A1 (en) | 2004-08-05 |
US7067763B2 (en) | 2006-06-27 |
KR100914053B1 (en) | 2009-08-28 |
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