USRE42347E1 - Solid state silicon-based condenser microphone - Google Patents
Solid state silicon-based condenser microphone Download PDFInfo
- Publication number
- USRE42347E1 USRE42347E1 US11/903,207 US90320707A USRE42347E US RE42347 E1 USRE42347 E1 US RE42347E1 US 90320707 A US90320707 A US 90320707A US RE42347 E USRE42347 E US RE42347E
- Authority
- US
- United States
- Prior art keywords
- chip
- transducer
- silicon
- electronic circuit
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Definitions
- This invention related to miniature condenser microphones, and in particular to solid state silicon-based condenser microphones incorporating an integrated electronic circuit for transducer signal conditioning.
- miniature microphones are suitable for use in miniature electroacoustic devices such as hearing instruments.
- EP 561 566 discloses a solid state condenser microphone having a transducer chip and, on the same chip, an electronic circuit and a cavity forming an opening or sound inlet for the transducer.
- the techniques and processes for manufacturing such electronic circuitry are quite different from the techniques and processes used in manufacturing the transducer elements. Consequently a chip having both an electronic circuit and an opening therein requires two (or possibly more) separate stages of production, usually at different facilities.
- the invention provides a solid state silicon-based condenser microphone which is suitable for batch production. Several silicon chips are stacked, and the subsequent dicinig of the stacked chips or discs is easier than with the prior art.
- the invention makes it possible to make a very well defined sound inlet, which can optionally be covered with a sealing film or a filter preventing dust, moisture and other impurities from contaminating or obstructing the interior and the sound inlet of the microphone.
- a sound inlet can theoretically be made as an opening in any of the chip surfaces including the fractures after dicing, but in practice the fractures are irregular surfaces and therefore less suitable for supporting a sealing film or a filter, since the irregular fractures could give rise to the sealing film or a filter becoming wrinkled and having leakages at its periphery where it is secured to the die surface.
- a microphone according to the invention has an opening forming a sound inlet in the practically perfectly flat and polished faces of the wafer on which several individual microphones are arranged.
- An integrated electronic circuit chip can be arranged on the same plane surface, which is perfectly suited for flip-chip mounting the electronic circuit chip.
- An intermediate chip is arranged between the electronic circuit chip and the transducer chip.
- the intermediate chip has another opening with feedthrough electrical connections on a surface of the opening.
- the feedthrough connections establish electrical connections between the transducer element on the transducer chip and the electronic circuit chip. This gives a high degree of freedom in designing both the transducer chip and the electronic circuit chip and in particular their electrical terminations.
- the invention uses a separate integrated electronic circuit chip, preferably a CMOS ASIC (Application Specific Integrated Circuit) which can be designed and manufactured separately and independent of the design and manufacture of the transducer portion of the microphone.
- CMOS ASIC Application Specific Integrated Circuit
- FIG. 1 is a cross section of a microphone according to the invention.
- FIG. 2 is an enlarged view of a portion of the microphone in FIG. 1 .
- the illustrated microphone has the following structure.
- a silicon transducer chip 1 with a central opening etched therein carries a diaphragm 12 and a backplate 13 covering the central opening in the transducer chip.
- the term “backplate” means a structural element which is relatively rigid as compared to the associated diaphragm, which in turn is relatively moveable.
- the backplate can be placed on either side of the diaphragm.
- the transducer chip with the diaphragm 12 and a backplate 13 are preferably manufactured as described in The copending Danish patent application PA 199800671.
- the diaphragm 12 and the backplate 13 are both electrically conductive or semi-conductive and are arranged parallel and in close proximity to each other and with a well defined air gap in between, so that they form an electrical capacitor.
- the backplate 13 has a plurality of perforations 19 making it acoustically transparent, and the diaphragm has a tiny vent hole 15 for equalising the static pressure on both sides of the diaphragm.
- An electronic circuit chip 3 having an integrated circuit on a surface thereof is flip chip mounted with its circuit facing the transducer chip 1 and with an intermediate chip 2 between the transducer chip 1 and the electronic circuit chip 3 .
- the intermediate chip 2 has a cavity 10 and a first through going opening 4 and a second through going opening 18 both communicating with the cavity 10 .
- the intermediate chip 2 is secured to the transducer chip 1 by means of an electrically conductive solder ring 9 or by other means.
- the electronic circuit chip 3 is secured to the intermediate chip 2 by means of an underfill material 6 .
- the diaphragm 12 and the backplate 13 are electrically connected Lo respective ones of solder bumps 8 , which connect the diaphragm 12 and the backplate 13 to electrical feedthrough conductors 14 on the surface of the cavity 10 and the opening 18 and further to the upper surface of the intermediate chip 2 where connections to the electronic circuit chip 3 are established via a conventional flip-chip interconnect method e.g. gold studs 7 with conductive adhesive. This is most clearly seen in FIG. 2 .
- the opening 4 is covered with a filter 5 or a flexible sheet or diaphragm of acoustically transparent material.
- the whole structure is encapsulated in a polymer encapsulation 16 leaving the filter 5 free.
- the function of the above described structure is as follows.
- the opening 4 functions as a sound inlet, and ambient sound pressure enters through the filter 5 covering the opening 4 to the cavity 10 functioning as a front chamber for the microphone.
- the cavity 11 functions as a backchamber for the microphone.
- the diaphragm 12 is movable relative to the backplate 13 in response to incident sound. When the diaphragm is moved in response to the incident sound, the electrical capacity of the electrical capacitor formed by the diaphragm 12 and the backplate 13 will vary in response to the incident sound.
- the circuit on the integrated circuit chip 3 is electrically connected to the diaphragm 12 And the backplate 13 via the electrical feedthrough conductors 14 , and the circuit is designed to detect variations in the electrical capacity of the capacitor formed by the diaphragm 12 and the backplate 13 .
- the circuit has electrical connections for electrically connecting it to a power supply and other electronic circuitry in eg a hearing instrument.
- the transducer element on the transducer chip is a condenser microphone with a diaphragm and a single backplate.
- the transducer element has its diaphragm arranged between two backplates. Such a microphone can give balanced output signal which is less sensitive to electrical interference.
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/903,207 USRE42347E1 (en) | 1998-10-30 | 2007-09-20 | Solid state silicon-based condenser microphone |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/182,668 US6088463A (en) | 1998-10-30 | 1998-10-30 | Solid state silicon-based condenser microphone |
US10/193,055 USRE42346E1 (en) | 1998-10-30 | 2002-07-11 | Solid state silicon-based condenser microphone |
US11/903,207 USRE42347E1 (en) | 1998-10-30 | 2007-09-20 | Solid state silicon-based condenser microphone |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/182,668 Reissue US6088463A (en) | 1998-10-30 | 1998-10-30 | Solid state silicon-based condenser microphone |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE42347E1 true USRE42347E1 (en) | 2011-05-10 |
Family
ID=22669506
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/182,668 Ceased US6088463A (en) | 1998-10-30 | 1998-10-30 | Solid state silicon-based condenser microphone |
US10/193,055 Expired - Lifetime USRE42346E1 (en) | 1998-10-30 | 2002-07-11 | Solid state silicon-based condenser microphone |
US11/903,207 Expired - Lifetime USRE42347E1 (en) | 1998-10-30 | 2007-09-20 | Solid state silicon-based condenser microphone |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/182,668 Ceased US6088463A (en) | 1998-10-30 | 1998-10-30 | Solid state silicon-based condenser microphone |
US10/193,055 Expired - Lifetime USRE42346E1 (en) | 1998-10-30 | 2002-07-11 | Solid state silicon-based condenser microphone |
Country Status (1)
Country | Link |
---|---|
US (3) | US6088463A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090067659A1 (en) * | 2007-09-12 | 2009-03-12 | Christian Wang | Miniature microphone assembly with hydrophobic surface coating |
US20110006381A1 (en) * | 2007-12-07 | 2011-01-13 | Epcos Ag | Mems package and method for the production thereof |
US20110180924A1 (en) * | 2010-01-22 | 2011-07-28 | Lingsen Precision Industries, Ltd. | Mems module package |
US20130094679A1 (en) * | 2011-10-14 | 2013-04-18 | Robert Bosch Gmbh | Microelectromechanical loudspeaker array, and method for operating a microelectromechanical loudspeaker array |
US9056760B2 (en) | 2010-01-29 | 2015-06-16 | Epcos Ag | Miniaturized electrical component comprising an MEMS and an ASIC and production method |
US20160050499A1 (en) * | 2013-01-31 | 2016-02-18 | Invensense, Inc. | Noise mitigating microphone system |
US20170142514A1 (en) * | 2015-11-17 | 2017-05-18 | Kabushiki Kaisha Audio-Technica | Boundary microphone |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000041432A2 (en) * | 1999-01-07 | 2000-07-13 | Sarnoff Corporation | Hearing aid with large diaphragm microphone element including a printed circuit board |
US6522762B1 (en) * | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
US6732588B1 (en) * | 1999-09-07 | 2004-05-11 | Sonionmems A/S | Pressure transducer |
US6782109B2 (en) * | 2000-04-04 | 2004-08-24 | University Of Florida | Electromechanical acoustic liner |
US7606608B2 (en) * | 2000-05-02 | 2009-10-20 | Sensys Medical, Inc. | Optical sampling interface system for in-vivo measurement of tissue |
US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
US8629005B1 (en) | 2000-11-28 | 2014-01-14 | Knowles Electronics, Llc | Methods of manufacture of bottom port surface mount silicon condenser microphone packages |
US6741709B2 (en) * | 2000-12-20 | 2004-05-25 | Shure Incorporated | Condenser microphone assembly |
GB2386031B (en) | 2000-12-22 | 2004-08-18 | Bruel & Kjaer Sound & Vibratio | A highly stable micromachined capacitive transducer |
WO2002073792A2 (en) * | 2001-03-09 | 2002-09-19 | Techtronic A/S | An electret condensor microphone preamplifier that is insensitive to leakage currents at the input |
US6859542B2 (en) | 2001-05-31 | 2005-02-22 | Sonion Lyngby A/S | Method of providing a hydrophobic layer and a condenser microphone having such a layer |
US7298856B2 (en) * | 2001-09-05 | 2007-11-20 | Nippon Hoso Kyokai | Chip microphone and method of making same |
WO2003024149A1 (en) * | 2001-09-10 | 2003-03-20 | Sonion A/S | Miniature speaker with integrated signal processing electronics |
US7146016B2 (en) * | 2001-11-27 | 2006-12-05 | Center For National Research Initiatives | Miniature condenser microphone and fabrication method therefor |
US6696645B2 (en) * | 2002-05-08 | 2004-02-24 | The Regents Of The University Of Michigan | On-wafer packaging for RF-MEMS |
US7072482B2 (en) | 2002-09-06 | 2006-07-04 | Sonion Nederland B.V. | Microphone with improved sound inlet port |
US6667189B1 (en) | 2002-09-13 | 2003-12-23 | Institute Of Microelectronics | High performance silicon condenser microphone with perforated single crystal silicon backplate |
US7142682B2 (en) * | 2002-12-20 | 2006-11-28 | Sonion Mems A/S | Silicon-based transducer for use in hearing instruments and listening devices |
US7466835B2 (en) | 2003-03-18 | 2008-12-16 | Sonion A/S | Miniature microphone with balanced termination |
DE10343292B3 (en) * | 2003-09-18 | 2004-12-02 | Siemens Audiologische Technik Gmbh | Hearing aid e.g. for hearing impaired people, without separate microphone housing, has hearing aid housing and a microphone housing which are formed from a one-piece with housing having cover for acoustic isolation |
EP1599067B1 (en) * | 2004-05-21 | 2013-05-01 | Epcos Pte Ltd | Detection and control of diaphragm collapse in condenser microphones |
US7929714B2 (en) * | 2004-08-11 | 2011-04-19 | Qualcomm Incorporated | Integrated audio codec with silicon audio transducer |
TWI260938B (en) * | 2004-10-01 | 2006-08-21 | Ind Tech Res Inst | Dynamic pressure sensing structure |
JP4539450B2 (en) * | 2004-11-04 | 2010-09-08 | オムロン株式会社 | Capacitive vibration sensor and manufacturing method thereof |
JP2007081614A (en) * | 2005-09-13 | 2007-03-29 | Star Micronics Co Ltd | Condenser microphone |
JP5174673B2 (en) * | 2005-10-14 | 2013-04-03 | エスティーマイクロエレクトロニクス エス.アール.エル. | Electronic device with substrate level assembly and method of manufacturing the same |
DE102006011545B4 (en) * | 2006-03-14 | 2016-03-17 | Robert Bosch Gmbh | Micromechanical combination component and corresponding manufacturing method |
ATE471635T1 (en) * | 2006-03-30 | 2010-07-15 | Sonion Mems As | SINGLE-CHIP ACOUSTIC MEMS TRANSDUCER AND MANUFACTURING METHOD |
US8134375B2 (en) * | 2006-05-17 | 2012-03-13 | Nxp B.V. | Capacitive MEMS sensor device |
TWI319690B (en) * | 2006-09-08 | 2010-01-11 | Ind Tech Res Inst | Structure and manufacturing method of inversed microphone module and microphone chip component |
EP1906704B1 (en) * | 2006-09-26 | 2012-03-21 | Epcos Pte Ltd | A calibrated microelectromechanical microphone |
DE102006047203B4 (en) * | 2006-10-05 | 2013-01-31 | Austriamicrosystems Ag | Microphone arrangement and method for its production |
US7903835B2 (en) * | 2006-10-18 | 2011-03-08 | The Research Foundation Of State University Of New York | Miniature non-directional microphone |
JP2010514172A (en) * | 2006-12-22 | 2010-04-30 | パルス・エムイーエムエス・アンパルトセルスカブ | Microphone assembly using underfill agent with low coefficient of thermal expansion |
TWI370101B (en) * | 2007-05-15 | 2012-08-11 | Ind Tech Res Inst | Package and packaging assembly of microelectromechanical sysyem microphone |
TWI323242B (en) * | 2007-05-15 | 2010-04-11 | Ind Tech Res Inst | Package and packageing assembly of microelectromechanical system microphone |
US8604566B2 (en) * | 2008-06-17 | 2013-12-10 | Infineon Technologies Ag | Sensor module and semiconductor chip |
EP2252077B1 (en) | 2009-05-11 | 2012-07-11 | STMicroelectronics Srl | Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof |
US8571249B2 (en) * | 2009-05-29 | 2013-10-29 | General Mems Corporation | Silicon microphone package |
DE102010022204B4 (en) | 2010-05-20 | 2016-03-31 | Epcos Ag | Electric component with flat design and manufacturing process |
EP2774390A4 (en) | 2011-11-04 | 2015-07-22 | Knowles Electronics Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
US20140003632A1 (en) * | 2012-06-28 | 2014-01-02 | Ams Ag | Microphone arrangement |
US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
US9181086B1 (en) | 2012-10-01 | 2015-11-10 | The Research Foundation For The State University Of New York | Hinged MEMS diaphragm and method of manufacture therof |
US9143870B2 (en) | 2012-11-09 | 2015-09-22 | Invensense, Inc. | Microphone system with mechanically-coupled diaphragms |
US8809973B2 (en) * | 2013-01-23 | 2014-08-19 | Infineon Technologies Ag | Chip package comprising a microphone structure and a method of manufacturing the same |
ITTO20130350A1 (en) | 2013-04-30 | 2014-10-31 | St Microelectronics Srl | SLICE ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATIVE MEMS SENSOR DEVICE |
US9584889B2 (en) | 2013-08-27 | 2017-02-28 | Infineon Technologies Ag | System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille |
JP6179297B2 (en) * | 2013-09-13 | 2017-08-16 | オムロン株式会社 | Acoustic transducer and microphone |
JP6149628B2 (en) * | 2013-09-13 | 2017-06-21 | オムロン株式会社 | Acoustic transducer and microphone |
US9264832B2 (en) * | 2013-10-30 | 2016-02-16 | Solid State System Co., Ltd. | Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level |
CN204046818U (en) | 2014-07-28 | 2014-12-24 | 瑞声声学科技(深圳)有限公司 | Capacitance MEMS (micro-electro-mechanical system) microphone |
US9565488B2 (en) * | 2015-05-20 | 2017-02-07 | Infineon Technologies Ag | Micro-electro-mechanical system devices |
US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
DE102017115405B3 (en) | 2017-07-10 | 2018-12-20 | Epcos Ag | MEMS microphone with improved particle filter |
IT201700103489A1 (en) | 2017-09-15 | 2019-03-15 | St Microelectronics Srl | METHOD OF MANUFACTURE OF A THIN FILTERING MEMBRANE, ACOUSTIC TRANSDUCER INCLUDING THE FILTERING MEMBRANE, ASSEMBLY METHOD OF THE ACOUSTIC TRANSDUCER AND ELECTRONIC SYSTEM |
Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3325961A1 (en) | 1983-07-19 | 1985-01-31 | Dietmar Hohm | Silicon-based capacitive transducers incorporating silicon dioxide electret |
US4922471A (en) | 1988-03-05 | 1990-05-01 | Sennheiser Electronic Kg | Capacitive sound transducer |
EP0490486A2 (en) | 1990-12-07 | 1992-06-17 | Wisconsin Alumni Research Foundation | Micromachined differential pressure transducers and method of producing the same |
US5146435A (en) | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
EP0561566A2 (en) | 1992-03-18 | 1993-09-22 | Knowles Electronics, Inc. | Solid state condenser and microphone |
WO1993019343A1 (en) | 1992-03-16 | 1993-09-30 | Lynxvale Limited | Micromechanical sensor |
US5255246A (en) | 1991-09-17 | 1993-10-19 | Siemens Nederland N.V. | Electroacoustic transducer of the electret type |
US5303210A (en) | 1992-10-29 | 1994-04-12 | The Charles Stark Draper Laboratory, Inc. | Integrated resonant cavity acoustic transducer |
WO1994025863A2 (en) | 1993-05-05 | 1994-11-10 | Siemens Aktiengesellschaft | Process for depositing a large-surface layer through a mask and optional closure of said mask |
WO1994030030A1 (en) | 1993-06-04 | 1994-12-22 | The Regents Of The University Of California | Microfabricated acoustic source and receiver |
US5452268A (en) | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
WO1995034917A1 (en) | 1994-06-10 | 1995-12-21 | The Regents Of The University Of California | Cantilever pressure transducer |
US5490220A (en) | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5531787A (en) | 1993-01-25 | 1996-07-02 | Lesinski; S. George | Implantable auditory system with micromachined microsensor and microactuator |
US5573679A (en) | 1995-06-19 | 1996-11-12 | Alberta Microelectronic Centre | Fabrication of a surface micromachined capacitive microphone using a dry-etch process |
WO1997001258A1 (en) | 1995-06-23 | 1997-01-09 | Microtronic A/S | Micromechanical microphone |
JPH0937382A (en) | 1995-07-19 | 1997-02-07 | Honda Motor Co Ltd | Microphone |
EP0783108A1 (en) | 1996-01-08 | 1997-07-09 | Siemens Aktiengesellschaft | Micromechanical element with planarized cover over a cavity and method of fabrication |
US5658710A (en) | 1993-07-16 | 1997-08-19 | Adagio Associates, Inc. | Method of making superhard mechanical microstructures |
US5659195A (en) | 1995-06-08 | 1997-08-19 | The Regents Of The University Of California | CMOS integrated microsensor with a precision measurement circuit |
US5677965A (en) | 1992-09-11 | 1997-10-14 | Csem Centre Suisse D'electronique Et De Microtechnique | Integrated capacitive transducer |
US5717631A (en) | 1995-07-21 | 1998-02-10 | Carnegie Mellon University | Microelectromechanical structure and process of making same |
US5740258A (en) | 1995-06-05 | 1998-04-14 | Mcnc | Active noise supressors and methods for use in the ear canal |
US5870482A (en) | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
US6178249B1 (en) | 1998-06-18 | 2001-01-23 | Nokia Mobile Phones Limited | Attachment of a micromechanical microphone |
US6806593B2 (en) | 1996-04-18 | 2004-10-19 | California Institute Of Technology | Thin film electret microphone |
-
1998
- 1998-10-30 US US09/182,668 patent/US6088463A/en not_active Ceased
-
2002
- 2002-07-11 US US10/193,055 patent/USRE42346E1/en not_active Expired - Lifetime
-
2007
- 2007-09-20 US US11/903,207 patent/USRE42347E1/en not_active Expired - Lifetime
Patent Citations (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3325961A1 (en) | 1983-07-19 | 1985-01-31 | Dietmar Hohm | Silicon-based capacitive transducers incorporating silicon dioxide electret |
US4922471A (en) | 1988-03-05 | 1990-05-01 | Sennheiser Electronic Kg | Capacitive sound transducer |
US5146435A (en) | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
EP0490486A2 (en) | 1990-12-07 | 1992-06-17 | Wisconsin Alumni Research Foundation | Micromachined differential pressure transducers and method of producing the same |
US5255246A (en) | 1991-09-17 | 1993-10-19 | Siemens Nederland N.V. | Electroacoustic transducer of the electret type |
WO1993019343A1 (en) | 1992-03-16 | 1993-09-30 | Lynxvale Limited | Micromechanical sensor |
US5490220A (en) | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
EP0561566A2 (en) | 1992-03-18 | 1993-09-22 | Knowles Electronics, Inc. | Solid state condenser and microphone |
US5677965A (en) | 1992-09-11 | 1997-10-14 | Csem Centre Suisse D'electronique Et De Microtechnique | Integrated capacitive transducer |
US5303210A (en) | 1992-10-29 | 1994-04-12 | The Charles Stark Draper Laboratory, Inc. | Integrated resonant cavity acoustic transducer |
US5531787A (en) | 1993-01-25 | 1996-07-02 | Lesinski; S. George | Implantable auditory system with micromachined microsensor and microactuator |
WO1994025863A2 (en) | 1993-05-05 | 1994-11-10 | Siemens Aktiengesellschaft | Process for depositing a large-surface layer through a mask and optional closure of said mask |
WO1994030030A1 (en) | 1993-06-04 | 1994-12-22 | The Regents Of The University Of California | Microfabricated acoustic source and receiver |
US5658710A (en) | 1993-07-16 | 1997-08-19 | Adagio Associates, Inc. | Method of making superhard mechanical microstructures |
WO1995034917A1 (en) | 1994-06-10 | 1995-12-21 | The Regents Of The University Of California | Cantilever pressure transducer |
US5452268A (en) | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
US5740258A (en) | 1995-06-05 | 1998-04-14 | Mcnc | Active noise supressors and methods for use in the ear canal |
US5659195A (en) | 1995-06-08 | 1997-08-19 | The Regents Of The University Of California | CMOS integrated microsensor with a precision measurement circuit |
US5573679A (en) | 1995-06-19 | 1996-11-12 | Alberta Microelectronic Centre | Fabrication of a surface micromachined capacitive microphone using a dry-etch process |
WO1997001258A1 (en) | 1995-06-23 | 1997-01-09 | Microtronic A/S | Micromechanical microphone |
JPH0937382A (en) | 1995-07-19 | 1997-02-07 | Honda Motor Co Ltd | Microphone |
US5717631A (en) | 1995-07-21 | 1998-02-10 | Carnegie Mellon University | Microelectromechanical structure and process of making same |
US5970315A (en) | 1995-07-21 | 1999-10-19 | Carnegie Mellon University | Microelectromechanical structure and process of making same |
EP0783108A1 (en) | 1996-01-08 | 1997-07-09 | Siemens Aktiengesellschaft | Micromechanical element with planarized cover over a cavity and method of fabrication |
US6806593B2 (en) | 1996-04-18 | 2004-10-19 | California Institute Of Technology | Thin film electret microphone |
US5870482A (en) | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
US6178249B1 (en) | 1998-06-18 | 2001-01-23 | Nokia Mobile Phones Limited | Attachment of a micromechanical microphone |
Non-Patent Citations (14)
Title |
---|
Bay, Jesper, et al., "Design Of A Silicon Microphone With Differential Read-Out Of A Sealed Double Parallel-Plate Capacitor," Sensors and Actuators A, vol. 53, pp. 232-236 (1996). |
Bouwstra, Siebe, et al., "Silicon Microphones-A Danish Perspective," J. Micromech. Microeng., vol. 8, pp. 64-68 (1998). |
Chowdhury, Sazzadur, et al., "MEMS Acousto-Magnetic Components for Use In A Hearing Instrument," Presentation at SPIE's Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 14 pages (May 9-11, 2000). |
Dehé, A., et al., "Silicon Micromachined Microphone Chip At Siemens," 4 pages (no date). |
Emkay Innovative Products, "Surface Mount Microphones: A New Options for OEMs," EPN, 2 pages (Jun. 11, 2002). |
Emkay Innovative Products, Brochure for "SiSonic(TM) Silicon Microphone," 2 pages (no date). |
Emkay Innovative Products, Brochure for "SiSonic™ Silicon Microphone," 2 pages (no date). |
Emkay Innovative Products, Press Release for "Advancement In Silicon Technology Leads To Partnership With Institute Of Microelectronics-Singapore," 2 pages (Jan. 9, 1998). |
Hsu, P.-C, et al., "A High Sensitivity Polysilicon Diaphragm Condenser Microphone," Presentation at MEMS Conference, 6 pages (Jan. 25-29, 1998). |
Müllenborn, Matthias, "Microsystems For Hearing Instruments," Micro Structure Bulletin, No. 3, 1 page (Aug. 1998). |
Ouellette, Jennifer, "The Incredible Shrinking Microphone," The Industrial Physicist, 3 pages (Aug. 1999). |
Scheeper, P. R., et al., "Fabrication Of Silicon Condenser Microphones Using Single Wafer Technology," Journal Of Microelectromechanical Systems, vol. 1, No. 3, pp. 147-154 (Sep. 1992). |
SonionMEMS, Brochure for Silicon Microphone, 4 pages (no date). |
van der Donk, A.G.H., et al., "Preliminary Results Of A Silicon Condenser Microphone With Internal Feedback," IEEE, pp. 262-265 (1991). |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090067659A1 (en) * | 2007-09-12 | 2009-03-12 | Christian Wang | Miniature microphone assembly with hydrophobic surface coating |
US8542850B2 (en) | 2007-09-12 | 2013-09-24 | Epcos Pte Ltd | Miniature microphone assembly with hydrophobic surface coating |
US20110006381A1 (en) * | 2007-12-07 | 2011-01-13 | Epcos Ag | Mems package and method for the production thereof |
US8674498B2 (en) | 2007-12-07 | 2014-03-18 | Epcos Ag | MEMS package and method for the production thereof |
US20110180924A1 (en) * | 2010-01-22 | 2011-07-28 | Lingsen Precision Industries, Ltd. | Mems module package |
US9056760B2 (en) | 2010-01-29 | 2015-06-16 | Epcos Ag | Miniaturized electrical component comprising an MEMS and an ASIC and production method |
US20130094679A1 (en) * | 2011-10-14 | 2013-04-18 | Robert Bosch Gmbh | Microelectromechanical loudspeaker array, and method for operating a microelectromechanical loudspeaker array |
US8761418B2 (en) * | 2011-10-14 | 2014-06-24 | Robert Bosch Gmbh | Microelectromechanical loudspeaker array with predetermined period of time of diaphragm relaxation |
US20160050499A1 (en) * | 2013-01-31 | 2016-02-18 | Invensense, Inc. | Noise mitigating microphone system |
US9872112B2 (en) * | 2013-01-31 | 2018-01-16 | Invensense, Inc. | Noise mitigating microphone system |
US20170142514A1 (en) * | 2015-11-17 | 2017-05-18 | Kabushiki Kaisha Audio-Technica | Boundary microphone |
US9788104B2 (en) * | 2015-11-17 | 2017-10-10 | Kabushiki Kaisha Audio-Technica | Boundary microphone |
Also Published As
Publication number | Publication date |
---|---|
US6088463A (en) | 2000-07-11 |
USRE42346E1 (en) | 2011-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USRE42347E1 (en) | Solid state silicon-based condenser microphone | |
US7221767B2 (en) | Surface mountable transducer system | |
EP1214864B1 (en) | Silicon-based sensor system | |
EP1219136B1 (en) | A pressure transducer | |
US6732588B1 (en) | Pressure transducer | |
US9769554B2 (en) | Semiconductor integrated device for acoustic applications with contamination protection element, and manufacturing method thereof | |
US9236275B2 (en) | MEMS acoustic transducer and method for fabricating the same | |
US8643129B2 (en) | MEMS device | |
CN109511066B (en) | Method for manufacturing a thin filter membrane and acoustic transducer device comprising a filter membrane | |
TWI732617B (en) | Vibration sensor | |
EP3330688B1 (en) | Multi-transducer modulus, electronic apparatus including the multi-transducer modulus and method for manufacturing the multi-transducer modulus | |
EP2094028B1 (en) | Miniature microphone assembly with solder sealing ring | |
US8428281B2 (en) | Small hearing aid | |
WO2022127540A1 (en) | Mems chip, mems microphone, and electronic device | |
JP2006332799A (en) | Acoustic sensor | |
CN115002630A (en) | Microphone assembly and electronic equipment | |
US8687827B2 (en) | Micro-electro-mechanical system microphone chip with expanded back chamber | |
TW202026613A (en) | Integrated optical transducer and method for fabricating an integrated optical transducer | |
KR20170064256A (en) | Mems transducer with mesh type substrate, method of producing the transducer and condenser microphone using the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SONION ROSKILDE A/S, DENMARK Free format text: CHANGE OF NAME;ASSIGNOR:MICROTRONIC A/S;REEL/FRAME:020505/0808 Effective date: 20060328 Owner name: SONION MEMS A/S, DENMARK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ROSKILDE, SONION;REEL/FRAME:020562/0623 Effective date: 20070531 Owner name: MICROTRONIC A/S, DENMARK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ROMBACH, PIRMIN;MULLENBOM, MATTHIAS;HANSEN, OLE;AND OTHERS;SIGNING DATES FROM 19981221 TO 19990107;REEL/FRAME:020564/0413 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: EPCOS PTE LTD, SINGAPORE Free format text: ASSET TRANSFER AGREEMENT;ASSIGNOR:PULSE MEMS APS;REEL/FRAME:030743/0262 Effective date: 20090430 Owner name: PULSE MEMS A/S, DENMARK Free format text: CHANGE OF NAME;ASSIGNOR:SONION MEMS A/S;REEL/FRAME:030743/0195 Effective date: 20080604 Owner name: PULSE MEMS APS, DENMARK Free format text: CHANGE OF NAME;ASSIGNOR:PULSE MEMS A/S;REEL/FRAME:030743/0232 Effective date: 20080908 |
|
AS | Assignment |
Owner name: TDK CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:EPCOS PTE LTD;REEL/FRAME:041132/0144 Effective date: 20161101 |