USRE45245E1 - Apparatus and methods for determining overlay of structures having rotational or mirror symmetry - Google Patents
Apparatus and methods for determining overlay of structures having rotational or mirror symmetry Download PDFInfo
- Publication number
- USRE45245E1 USRE45245E1 US13/875,160 US201313875160A USRE45245E US RE45245 E1 USRE45245 E1 US RE45245E1 US 201313875160 A US201313875160 A US 201313875160A US RE45245 E USRE45245 E US RE45245E
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- United States
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- structures
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- Expired - Fee Related
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- 238000000034 method Methods 0.000 title abstract description 64
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 110
- 238000007689 inspection Methods 0.000 description 14
- 238000013461 design Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4785—Standardising light scatter apparatus; Standards therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/975—Substrate or mask aligning feature
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/875,160 USRE45245E1 (en) | 2000-08-30 | 2013-05-01 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
Applications Claiming Priority (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US22925600P | 2000-08-30 | 2000-08-30 | |
US09/894,987 US7068833B1 (en) | 2000-08-30 | 2001-06-27 | Overlay marks, methods of overlay mark design and methods of overlay measurements |
US43131402P | 2002-12-05 | 2002-12-05 | |
US44097003P | 2003-01-17 | 2003-01-17 | |
US44949603P | 2003-02-22 | 2003-02-22 | |
US49852403P | 2003-08-27 | 2003-08-27 | |
US50409303P | 2003-09-19 | 2003-09-19 | |
US10/729,838 US7317531B2 (en) | 2002-12-05 | 2003-12-05 | Apparatus and methods for detecting overlay errors using scatterometry |
US10/785,396 US7385699B2 (en) | 2003-02-22 | 2004-02-23 | Apparatus and methods for detecting overlay errors using scatterometry |
US10/785,732 US7289213B2 (en) | 2003-02-22 | 2004-02-23 | Apparatus and methods for detecting overlay errors using scatterometry |
US69853505P | 2005-07-11 | 2005-07-11 | |
US11/227,764 US7541201B2 (en) | 2000-08-30 | 2005-09-14 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
US12/410,317 US8138498B2 (en) | 2000-08-30 | 2009-03-24 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
US13/875,160 USRE45245E1 (en) | 2000-08-30 | 2013-05-01 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/410,317 Reissue US8138498B2 (en) | 2000-08-30 | 2009-03-24 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE45245E1 true USRE45245E1 (en) | 2014-11-18 |
Family
ID=37618037
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/227,764 Expired - Lifetime US7541201B2 (en) | 2000-08-30 | 2005-09-14 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
US12/410,317 Ceased US8138498B2 (en) | 2000-08-30 | 2009-03-24 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
US13/407,124 Expired - Fee Related US9182680B2 (en) | 2000-08-30 | 2012-02-28 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
US13/875,160 Expired - Fee Related USRE45245E1 (en) | 2000-08-30 | 2013-05-01 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
US14/873,120 Expired - Lifetime US9347879B2 (en) | 2000-08-30 | 2015-10-01 | Apparatus and methods for detecting overlay errors using scatterometry |
US15/136,855 Expired - Lifetime US9702693B2 (en) | 2000-08-30 | 2016-04-22 | Apparatus for measuring overlay errors |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/227,764 Expired - Lifetime US7541201B2 (en) | 2000-08-30 | 2005-09-14 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
US12/410,317 Ceased US8138498B2 (en) | 2000-08-30 | 2009-03-24 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
US13/407,124 Expired - Fee Related US9182680B2 (en) | 2000-08-30 | 2012-02-28 | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/873,120 Expired - Lifetime US9347879B2 (en) | 2000-08-30 | 2015-10-01 | Apparatus and methods for detecting overlay errors using scatterometry |
US15/136,855 Expired - Lifetime US9702693B2 (en) | 2000-08-30 | 2016-04-22 | Apparatus for measuring overlay errors |
Country Status (3)
Country | Link |
---|---|
US (6) | US7541201B2 (en) |
JP (1) | JP4926171B2 (en) |
WO (1) | WO2007008473A2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9410902B1 (en) | 2015-05-05 | 2016-08-09 | United Microelectronics Corp. | Overlay measurement method |
US9702693B2 (en) | 2000-08-30 | 2017-07-11 | Kla-Tencor Corporation | Apparatus for measuring overlay errors |
US10451412B2 (en) | 2016-04-22 | 2019-10-22 | Kla-Tencor Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
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US7068833B1 (en) * | 2000-08-30 | 2006-06-27 | Kla-Tencor Corporation | Overlay marks, methods of overlay mark design and methods of overlay measurements |
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EP2028605A1 (en) * | 2007-08-20 | 2009-02-25 | Delphi Technologies, Inc. | Detection method for symmetric patterns |
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US8329360B2 (en) * | 2009-12-04 | 2012-12-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus of providing overlay |
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US9702693B2 (en) | 2000-08-30 | 2017-07-11 | Kla-Tencor Corporation | Apparatus for measuring overlay errors |
US9410902B1 (en) | 2015-05-05 | 2016-08-09 | United Microelectronics Corp. | Overlay measurement method |
US10451412B2 (en) | 2016-04-22 | 2019-10-22 | Kla-Tencor Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
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WO2007008473A2 (en) | 2007-01-18 |
US9182680B2 (en) | 2015-11-10 |
JP2009500863A (en) | 2009-01-08 |
US9347879B2 (en) | 2016-05-24 |
US7541201B2 (en) | 2009-06-02 |
US20090051917A9 (en) | 2009-02-26 |
US20120153281A1 (en) | 2012-06-21 |
WO2007008473A3 (en) | 2007-03-01 |
US20090224413A1 (en) | 2009-09-10 |
US20160047744A1 (en) | 2016-02-18 |
JP4926171B2 (en) | 2012-05-09 |
US20160313116A1 (en) | 2016-10-27 |
US20070008533A1 (en) | 2007-01-11 |
US9702693B2 (en) | 2017-07-11 |
US8138498B2 (en) | 2012-03-20 |
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