WO1995024734A1 - Technique for producing interconnecting conductive links - Google Patents
Technique for producing interconnecting conductive links Download PDFInfo
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- WO1995024734A1 WO1995024734A1 PCT/US1995/003107 US9503107W WO9524734A1 WO 1995024734 A1 WO1995024734 A1 WO 1995024734A1 US 9503107 W US9503107 W US 9503107W WO 9524734 A1 WO9524734 A1 WO 9524734A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
- H01L23/5254—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Definitions
- This invention relates generally to techniques for producing interconnecting conductive links and, more particularly, to a unique process for providing conductive links between two conductive materials having a non- conductive material positioned between them.
- Configurations of interconnected arrays of conductive elements requires the formation of conductive links, or paths, between selected conductive elements in a manner which produces relatively low resistance links between them.
- Techniques for producing such low resistance conductive links have been developed using either electrical or laser linking and cutting processes.
- a laser beam is used to provide sufficient power to blast a hole through an upper metal layer so as to form an opening at the link region.
- Multiple laser pulses of high energy density are used to create the opening and to remove the insulating layer between the metal elements.
- the multiple pulses also produce molten aluminum which spreads along the walls of a crater that is formed when the insulating layer is removed beneath the opening. Such aluminum flow along the crater walls produces a tube-like aluminum contact body between the upper and lower aluminum layers.
- an energy producing device e.g., a laser
- the strain that is produced initiates a fracturing of the non-conductive material so as to provide at least one fissure therein which extends between the conductive materials.
- the single energy pulse applied by the energy producing device further causes a portion of at least one of the conductive materials to flow in the at least one fissure to provide at least one conductive link between the conductive materials.
- an effective fissure extends from a point at or near an edge of at least one of the conductive materials to the other conductive material.
- the non-conductive material is a silicon based dielectric such as silicon oxide or silicon nitride.
- the fracture and conductive link is preferably obtained with a pulse of energy of less than 1 microjoule and a pulse duration of less than 1 microsecond. The most preferred pulse duration is in the range of 1 to 10 nanoseconds.
- the first and second conductive materials are metals lying substantially in the same plane and the fissure extends generally laterally between the first and second conductive materials.
- an interface between the layers can control the fracturing.
- the fracture may be formed along or be limited by the interface.
- an interface of hard material over softer material is provided at a level above the conductive materials.
- an upper metal layer is deposited on the non-conductive material in a manner so as to provide a preformed opening at the desired link site.
- a single pulse of energy can then be used to be effectively applied to the lower metal layer at the link site so as to produce the mechanical strain required to initiate the fracturing of the dielectric or insulating material, as discussed above.
- a single laser pulse of energy may be used to provide a desired chemical reaction, or desired alloying, or a desired removal of the dielectric to create a crater therein, without having to produce an opening through the upper metal layer.
- a conductive link may be formed from fracturing or from a chemical reduction reaction process, an alloying process, or the flow of metal in a crater formed in the dielectric which has been removed at the link site.
- the use of the preformed opening may not require a fracturing of the dielectric material between the metal elements.
- a first pattern of first preformed conductive elements and a second pattern of second conductive elements are provided on a substrate and lateral conductive links are formed at a single level between selected ones of the first and second conductive elements so as to provide a plurality of desired conductive paths.
- level is intended to include embodiments wherein the surfaces of the elements involved in the link lie at substantially the same level, whether or not the elements themselves are formed or deposited on the same planar surface.
- a first pattern of conductive elements is formed at a first level while a second pattern of second conductive elements is such that it has portions of its conductive elements at two levels, i.e., first portions thereof being at the same level as the first conductive elements and other portions thereof being at another second level below the first level.
- Lateral conductive links are then formed at a single level between selected ones of the first conductive elements and selected ones of the portions of the second conductive elements that are at the same level.
- the first and second patterns of conductive elements are all formed at the same level and lateral links are formed at such level.
- appropriate cuts can also be made to separate, as necessary, the conductive paths that are so formed.
- FIG. 1 shows a plan view of an embodiment of the invention depicting an exemplary site at which a conductive link is to be produced
- FIG. 2 shows a view in section along the lines 1-2 of the link site shown in FIG. 1;
- FIG. 3 shows a view in section of another embodiment of the invention depicting a site at which a conductive link has been produced in accordance with the invention
- FIG. 4 shows a view in section of another embodiment of the invention depicting a site at which a lateral conductive link is to be produced between metal elements, generally in the same plane;
- FIG. 5 shows a view in section of the site of FIG. 4 in which a conductive link is provided in accordance with the invention
- FIG. 6 shows a view in section of another embodiment of the invention depicting a site using an alloying or chemical reaction in the dielectric between the metal layers thereof;
- FIG. 7 shows a view in section of another embodiment of the invention depicting a site at which a conductive link is provided by forming a crater in the dielectric material between the metal layers thereof;
- FIG. 8 shows a view in section of another embodiment of the invention in which a lateral conductive link is to be provided
- FIG. 9 shows a view in section of the embodiment of FIG. 8 in which a lateral link has been provided
- FIG. 10 shows a view in section of another embodiment of the invention in which a lateral conductive link is to be provided
- FIG. 11 shows a view in section of the embodiment of FIG. 9 in which a lateral link has been provided
- FIG. 12 shows a view in section of another embodiment of the invention in which a lateral conductive link is to be provided.
- FIG. 13 shows a view in section of the embodiment of FIG. 12 in which a lateral link has been provided
- FIG. 14 depicts patterns of exemplary conductive elements in which links and cuts can be provided to form desired conductive paths
- FIG. 15 depicts in vertical section a portion of the pattern of FIG. 14;
- FIG. 16 depicts exemplary conductive paths that are formed in the patterns of FIG. 14 using the technique of the invention
- FIG. 17 depicts other patterns of exemplary conductive elements in which links and cuts can be provided to form desired conductive paths.
- FIG. 18 depicts exemplary conductive paths that are formed in the patterns of FIG. 17 using the technique of the invention.
- a lower conductive material in the form of a metal element 10 lies generally in a first plane 11 at a lower level with reference to an upper conductive material in the form of a metal element 12 which lies in generally a second plane 13 above metal element 10.
- a non- conductive (insulating) material 14 such as a glass dielectric, effectively encloses metal elements 10 and 12 and provides a layer 14A thereof between such elements.
- a preformed opening 15 is provided in metal element 12 at the desired link site.
- the metal elements and the insulating material are mounted on a suitable substrate 16 such as a further glass or other appropriate substrate material.
- a link site shown in FIG. 3 is similar to that depicted in FIGS. 1 and 2, except that the width of the lower metal layer 10 is co-extensive with the width of upper metal layer 12.
- an energy producing device such as a laser (not specifically shown in the Figure) is positioned above the link site so as to apply laser energy, depicted by arrows 17, through the structure of FIG 3. at the opening 15 thereof.
- laser energy is applied in the form of a single pulse of energy, as discussed in more detail below.
- the energy of the single pulse so applied is at a sufficient power level that it causes either or both metal elements 10 and 12 to become heated so that mechanical strains are produced therein and both elements thermally expand at portions thereof where the energy is applied, as shown by the exaggerated thermally expanded portions 10A and 12A thereof.
- the mechanical strains thereby initiate a fracturing of the glass dielectric material 14 so as to produce one or more fissures 18 therein, particularly in the region 14A thereof. While the fissures which are so produced may extend throughout the material 14 one or more of them will extend from metal element 12 to metal element 10, normally one or more of the latter fissures extending from a position at or near at least one edge 19 of metal element 12, as shown by exemplary fissure 18A.
- the laser energy further causes metal from at least one of the metal layers, e.g., the layer with the lower melting point, to flow from such layer into the fissure so as to contact the other layer, as shown. Similar fissures and at least one conductive link between layers 10 and 12 would be produced in the structure of FIGS.
- a continuous wave argon ion laser was applied to the link site, which had a site area of 4 ⁇ m x 4 ⁇ m and an opening area of 2 ⁇ m x 2 ⁇ m, via a suitable electro-optical shutter, shutter driver circuitry, and associated optical elements, such structures and operation being well known to those in the art.
- the metal layers were separated by a layer of a silicon oxide dielectric having a layer thickness of 0.75 ⁇ m. between the metal layers.
- the laser produced single pulses of laser output power of about 1.0 watts having a pulse width from about 1 microsecond ( ⁇ s) to about 3 ⁇ s.
- the shutter was arranged to provide laser power rise and fall times, i.e., between about 10% to 90% of full power, of about 200 nanoseconds (ns) .
- the laser output pulse was formed to provide a minimum beam diameter, through a microscope objective lens producing a 1/e radius of about 1.0 micrometers ( ⁇ m) .
- a laser is the preferred energy source
- other energy sources which introduce sufficient thermal energy into the conductive elements to cause the thermal expansion may be used.
- the invention may be implemented in a voltage programmable environment. Even where a radiant energy source such as a laser is used, a wide range of wavelengths may be used. It is only necessary that the energy be absorbed by the conductive material. Absorption can be enhanced by treating the conductive metal layer as by providing a thin titanium layer on the aluminum.
- the above dielectric fracturing technique for providing vertical links between upper and lower metal layers can also be used to produce horizontal, or lateral, links between metal elements lying in substantially the same plane, as shown in FIGS. 4 and 5. As seen therein, a pair of separated metal elements 20 and 21 are enclosed in a dielectric (e.g., a silicon based glass or polymer) material 22.
- a dielectric e.g., a silicon based glass or polymer
- a laser energy pulse 25 is applied to the region 23 between the metals.
- the laser pulse produces mechanical strains in the metal elements so that they tend to expand so as to provide stresses concentrated at the corners thereof adjacent region 23, as shown by expanded regions 20A and 21A.
- Such expansions initiate a fracturing of the dielectric material 22 so as to produce one or more fissures therein, at least one of which will extend from one metal element 20 to the other metal element 21, as shown by exemplary fissures 24.
- Metal from at least one of the metals will tend to flow through the at least one fissure to form a conductive link between metals 20 and 21, as shown by exemplary fissure 24A.
- the lateral link has several advantages over the vertical link.
- the laser spot size should be limited in order to pass through the window without being absorbed primarily by the upper metal layer. Further, positioning tolerance of the laser is more critical to avoid radiating the upper layer.
- the spot should be wide enough to heat the metal to either side of the gap. Further, because the metal is thermally conductive, the spot size can be considerably larger than the gap size. Accordingly, the lateral approach is more scalable since the gap size can be made as small as lithographically possible with significant tolerance in laser beam diameter and position. Further, the lateral link is particularly suited to applications such as flat panel displays which require a single level of metal.
- FIGS. 8 and 9 Another embodiment of the invention can also be used for forming horizontal, or lateral, links between metal elements lying in substantially the same plane, as shown in FIGS. 8 and 9.
- a pair of separated metal elements 40 and 41 are positioned on a first dielectric (e.g., a silicon oxide glass or polymer) material 42 and embedded in a second dielectric (e.g., a silicon nitride glass or polymer) material 43 above the first dielectric material 42.
- a first dielectric e.g., a silicon oxide glass or polymer
- a second dielectric e.g., a silicon nitride glass or polymer
- Energy in the form of one or more laser pulses 45 is applied generally to the region 46 between the metal elements 40 and 41 particularly so as to be applied to the ends of the metal elements.
- the mechanical strength characteristics of the dielectric materials are different and the thermal expansion coefficients of the metal elements are relatively higher than the thermal expansion coefficients of the dielectric materials. Accordingly, when such energy is applied, thermal energy is absorbed in the metal elements which then expand and produce mechanical stresses therein which tend to be concentrated at stress concentration points, e.g., at the lower corners thereof, at region 46.
- the expansions of the metal elements initiate a rupturing at the interface 44 of the dielectric materials which separate at the interface so as to produce a fissure which extends from one metal element 40 to the other metal element 41, as shown by the exemplary fissure 47.
- Molten metal from at least one of the metals flows through the fissure 47 to form a lateral conductive link between metals 40 and 41.
- such a lateral link was formed, between aluminum elements, in accordance with the technique of the invention discussed with reference to FIGS. 8 and 9, using a diode-pumped Q-switch laser, such as those made and sold by Spectra Physics Laser Diode Systems, Inc. of Mountainview, California under Model 7000 Series designation as an energy supplying source.
- the laser provided pulse energy at about 400 nJ which resulted in a range of usable linking resistances from about 0.5 ohms to about 5.5 ohms was achieved in the formation of over 30,000 links between aluminum alloy elements separated by about l.O ⁇ m. While aluminum, or alloys thereof, are found to be effective for use as the metal elements involved, any other metal materials having relatively high coefficients of thermal expansion, e.g., copper or copper alloys, can also be used.
- the same dielectric material can be used for dielectric layers 42 and 43, so long as the materials are deposited in layers so that a distinct, interface is clearly formed therebetween. Even when the same dielectric materials are so used, a rupturing will tend to occur at the interface 44 so as to form the desired lateral fissure. While the dielectric interface is shown in FIGS. 8 and 9 as being adjacent the lower surfaces of the metal elements, the interface can also be arranged to be adjacent the upper surfaces of the metal elements or somewhere in between such upper and lower surfaces. Rupturing and the formation of a fissure can also occur in such latter structures to provide the desired lateral conductive link between metal elements 40 and 41.
- FIGS. 8 and 9 show the use of two dielectric materials to form a single interface
- a pair of interfaces 44 and 49 can be formed using three layers of dielectric materials, as shown in the embodiment of FIGS. 10 and 11.
- the dielectrics can be different from each other or can be substantially the same, so long as two distinct interfaces are clearly formed at region 46.
- the application of laser energy may cause a fissure to be formed at one interface before one is formed at the other interface.
- a fissure 50 can be formed at upper interface 49 from the stress concentration points at the upper corners of the metal elements, prior to the formation of a fissure from the stress concentration points at lower interface 44, as shown in FIG. 11. Accordingly, fissure 50 will produce a conductive link between metal elements 40 and 41 in substantially the same manner as discussed above with reference to the formation of fissure 47.
- FIGS. 12 and 13 A further embodiment is shown in FIGS. 12 and 13 wherein, instead of forming a dielectric interface adjacent the upper surfaces of the metal elements, as in FIG. 10, the dielectric material 43 is deposited on dielectric 48 at a level above such upper surfaces to form an interface 51 at such level.
- the stress concentration points e.g., at the upper corners of the metal elements, which stresses initiating a fracturing of the dielectric material 48 which produces a fissure 52 extending from the upper corners up to the level of the interface 51 so as to be effectively confined to the region at and below interface 51.
- a rupturing at such interface also tends to occur to further enhance the formation of the fissure 52 particularly at and near the region of the interface 51. Accordingly, metal flows into such fissure to form a lateral conductive link between metal elements 40 and 41.
- the upper layer 43 be of a harder material than layer 48.
- layer 43 might be silicon nitride (Si 3 N 4 ) and the layer 48 might be silicon oxide (Si0 2 ) • It is a characteristic of multi- layered materials that a fracture which is initiated in a hard material tends to continue on through an adjacent soft material. On the other hand, a fracture which initiates in a soft material tends to be reflected by a hard material as illustrated in FIG. 13. Thus, the use of a harder material above the softer material tends to limit the vertical extension of the link 52 and any other fractures initiated in the layer 48. In fact, this feature is advantageous even where the conductive link 52 does not reach the interface 51.
- a preformed opening such as preformed in an upper metal layer
- a conductive link between an upper metal layer and a lower metal layer without necessarily requiring a fracturing of the dielectric material therebetween.
- the use of such a preformed opening tends to focus the laser beam energy more efficiently at the link region.
- an upper metal element 30 and a lower metal element 31 are enclosed by a dielectric material 32, the overall structure being positioned on a dielectric substrate 33.
- An opening 34 is preformed in metal element 30 prior to the application of any energy thereto.
- a single pulse of laser power 35 applied at the region of the opening 34 can be used to cause the metal near such region to flow into the dielectric region and to alloy with the dielectric material or to produce a chemical reduction reaction with the dielectric material, as discussed above, at the region 36.
- Such alloying or chemical reaction processes cause the dielectric material to become conductive and form a conductive link between metals 30 and 31.
- a single pulse of relatively low laser power can be used in contrast with prior art systems where the laser energy must be sufficient to provide the alloying or chemical reaction processes required, which processes tend to result in producing an opening in the upper metal element 30.
- the use of such preformed opening permits the laser energy to be focused more effectively at the dielectric material so as to remove such material in the region under the opening to expose the laser metal layer to form a crater 37.
- the laser energy also causes the metal from elements 30 and 31 to flow along the sides of the crater that is so formed, as shown in FIG. 7.
- FIGS. 14 and 15 depict an embodiment of the invention wherein a first pattern of first conductive elements 110 of the first pattern is formed at a first level 111 of a dielectric substrate 112.
- Two such conductive elements 110 are shown in FIG. 14 as extending along the same direction, i.e., they are essentially parallel to each other. It is clear that FIG. 14 shows only a representative portion of an overall array of such a pattern, the representative portion being along one edge 112A of the substrate, for example, while the overall array extends well beyond that shown in the figure in the directions shown by arrows 113.
- a second pattern of second conductive elements 14 extends in a direction generally orthogonal to the direction of first conductive elements 110, portions 114A of each of which lie at a second level 115 below that of the first level 111. Portions 114B of the second conductive elements 114 lie at the same level 111 as the first conductive elements 110, portions 114A and the portions 114B being interconnected by preformed vertical vias 116 at appropriate sides extending between levels 111 and 115 (FIG. 15) .
- the second conductive elements 114 are, in the particular embodiment depicted, formed in a generally zig-zag configuration at second level 115 in order to provide for a relatively high density of elements and to permit "cuts" in the conductive elements to be made more readily, as discussed below.
- Portions 114B in the embodiment depicted, effectively provide conductive portions, or tabs, at the first level 111 which are effectively parallel to portions of conductive elements 110 that are adjacent thereto.
- a plurality of conductive paths can be formed as desired by making suitable lateral conductive links at the same level 111 between selected ones of the conductive elements and, if necessary, by making appropriate cuts at selected regions of selected ones of the conductive elements.
- FIG. 16 One exemplary embodiment of the formation of a conductive path is illustrated in FIG. 16, wherein lateral links 120 and 121 are formed between a first conductive element 110 and adjacent tab portions 114B of a second conductive element 114 so that a conductive path shown by the shaded regions in the figure is formed between the points thereof depicted by arrows 125.
- a cut is made at region 122 of the adjacent first conductive element 110 to isolate such path from other conductive paths that may be formed.
- the use of the two lateral links 120 and 121 using tab portions 114B at the same level as conductive element 110, as shown, provides for redundancy in the conductive path so as to increase the current carrying capacity and the reliability of the path that has been formed.
- tab portion 114B may be made available and its associated tab portion as shown in FIG. 16 may be eliminated from the original pattern, in which case the conductive elements can be more densely positioned on the substrate. In such case, however, redundant links 120 and 121 cannot be formed so that, while an increased density can be achieved, it is attained at the expense of a possible decrease in reliability.
- FIG. 16 Another exemplary conductive path shown by the shaded regions between arrows 126 is also depicted in FIG. 16 wherein lateral links 127 and 128 are formed at the same level 111 between a first conductive element 110 and adjacent portions 114B of a second conductive element 114. An appropriate cut is made at region 129 of first conductive element 110 to isolate the conductive path from other conductive paths that may be formed.
- FIG. 17 A further embodiment of the invention is depicted in FIG. 17 wherein the first and second patterns of conductive elements involved lie at the same level in a substrate.
- a first pattern of first conductive elements 140 are positioned to lie generally in the same direction and a second pattern of second conductive elements 141 are positioned at the same level to lie in the same general direction so that the conductive elements of each pattern are arranged in an interdigital manner, as shown.
- Appropriate lateral links between selected ones of the conductive element 140 and 141 can be formed at the same level so as to form a plurality of conductive paths as desired, suitable cuts being also made to isolate the paths from each other. For example, as shown in FIG.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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EP95914015A EP0749634A1 (en) | 1994-03-10 | 1995-03-09 | Technique for producing interconnecting conductive links |
US08/704,505 US5920789A (en) | 1994-10-11 | 1995-03-09 | Technique for producing interconnecting conductive links |
JP7523696A JPH09510320A (en) | 1994-03-10 | 1995-03-09 | Method of manufacturing conductive link for connection |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/209,997 | 1994-03-10 | ||
US08/209,997 US5861325A (en) | 1994-03-10 | 1994-03-10 | Technique for producing interconnecting conductive links |
US08/320,925 US5940727A (en) | 1994-10-11 | 1994-10-11 | Technique for producing interconnecting conductive links |
US08/320,925 | 1994-10-11 | ||
US08/370,004 | 1995-01-09 | ||
US08/370,004 US5585602A (en) | 1995-01-09 | 1995-01-09 | Structure for providing conductive paths |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US08/320,925 Continuation-In-Part US5940727A (en) | 1994-03-10 | 1994-10-11 | Technique for producing interconnecting conductive links |
US08/370,004 Continuation-In-Part US5585602A (en) | 1994-03-10 | 1995-01-09 | Structure for providing conductive paths |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US08/704,505 A-371-Of-International US5920789A (en) | 1994-03-10 | 1995-03-09 | Technique for producing interconnecting conductive links |
US09/285,526 Continuation US6191486B1 (en) | 1994-03-10 | 1999-04-02 | Technique for producing interconnecting conductive links |
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WO1995024734A1 true WO1995024734A1 (en) | 1995-09-14 |
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PCT/US1995/003107 WO1995024734A1 (en) | 1994-03-10 | 1995-03-09 | Technique for producing interconnecting conductive links |
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US (2) | US6191486B1 (en) |
EP (1) | EP0749634A1 (en) |
JP (1) | JPH09510320A (en) |
KR (1) | KR100363410B1 (en) |
WO (1) | WO1995024734A1 (en) |
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US20060141681A1 (en) * | 2000-01-10 | 2006-06-29 | Yunlong Sun | Processing a memory link with a set of at least two laser pulses |
US6506981B1 (en) * | 2000-11-22 | 2003-01-14 | Janusz B. Liberkowski | Interconnect structure having fuse or anti-fuse links between profiled apertures |
US20070173075A1 (en) * | 2001-03-29 | 2007-07-26 | Joohan Lee | Laser-based method and system for processing a multi-material device having conductive link structures |
KR100408418B1 (en) * | 2001-11-22 | 2003-12-06 | 삼성전자주식회사 | Laser link structure capable protecting upper crack and broadening energy window of laser beam and fuse box using the same |
US6951995B2 (en) | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
KR100494561B1 (en) * | 2002-11-25 | 2005-06-13 | 한국전자통신연구원 | Switching device and electric circuit device having the same |
US20060000814A1 (en) * | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
US20060191884A1 (en) * | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
US8084706B2 (en) * | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
WO2009062061A1 (en) * | 2007-11-09 | 2009-05-14 | University Of Virginia Patent Foundation | Steerable epicardial pacing catheter system placed via the subxiphoid process |
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- 1995-03-09 EP EP95914015A patent/EP0749634A1/en not_active Ceased
- 1995-03-09 WO PCT/US1995/003107 patent/WO1995024734A1/en not_active Application Discontinuation
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Also Published As
Publication number | Publication date |
---|---|
JPH09510320A (en) | 1997-10-14 |
KR970701928A (en) | 1997-04-12 |
KR100363410B1 (en) | 2003-02-11 |
EP0749634A1 (en) | 1996-12-27 |
US6191486B1 (en) | 2001-02-20 |
US6541868B2 (en) | 2003-04-01 |
US20010001214A1 (en) | 2001-05-17 |
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