WO1997034247A2

WO1997034247A2 - Smart card, connection arrangement and method of producing a smart card

Info

Publication number: WO1997034247A2
Application number: PCT/EP1997/001256
Authority: WO
Inventors: Robert Wilm
Original assignee: Pav Card Gmbh
Priority date: 1996-03-14
Filing date: 1997-03-12
Publication date: 1997-09-18
Also published as: AU2155697A; EP0976104A2; WO1997034247A3

Abstract

The invention concerns a smart card, a connection arrangement and a method of producing a smart card, a semiconductor chip located on a module being inserted into a recess (24) in a card carrier so as to be connected electrically and mechanically. According to a first feature of the invention, during the milling-out of the recess, a contact bump section is exposed (22, 23) such that a reliable connection is provided between the module and induction or antenna coil (11). According to a second and third feature, the required electrical contacts are produced by soldering and the required mechanical contacts are produced by heat-sealing or fusion adhesives. Furthermore, the adhesive is provided with conductive particles and is compressed when the connection is made, such that the necessary electrical contact is brought about. According to a fourth feature, a special reinforcement frame comprising insulating sections is provided. The reinforcement frame is used to increase mechanical stability and absorb torsion forces and stresses which can occur when the card is used. At the same time, the reinforcement frame permits easy contact with strip conductors inside the card, e.g. for elements which form an antenna for contactless data-transmission.

Description

Chip card, connection arrangement and method for producing a chip card

description

The invention relates to a chip card, a connection arrangement and a method for producing a chip card, a semiconductor chip located on a module being used in a recess of a card carrier while maintaining an electrical and mechanical connection.

Chip cards for contact-based, but also contactless, ie inductive data transmission have a chip card module connected to the card body, which comprises a semiconductor chip located on a plastic carrier, which is connected to a galvanically generated contact field in contact cards. These contact areas are electrically scanned in a card reader, so that the necessary communication is possible. In contactless, inductive systems, the data is transmitted by alternating electromagnetic fields, by means of at least one induction coil or antenna arranged in the chip card or in the card carrier.

In so-called combination cards, both systems mentioned are combined in one card. The combination card therefore has both a contact field for contact-based transmission and an inductively connectable contact. For this purpose, it is necessary to establish not only the electrically conductive connections from the semiconductor chip to the system for contact-based transmission, but also connections to the system for inductive data transmission.

In a known method for producing a chip card, in particular one in which there are both means for contactless data transmission and the aforementioned galvanic contact level, a module is inserted into a card body, which comprises an IC chip.

The module is inserted into a recess in the card body and the like by means of joining. laminated with the card body to obtain a corresponding mechanical and electrical connection.

An electrically conductive connection between the module and the card body or contacts located on the card body, which are connected to the induction coil, comes about, for example, from the fact that an anisotropic conductive adhesive in the area of the connection points and / or the connection points of the respective agent applied for contactless data transmission and the adhesive is compressed or compressed so far at least in the area of the connection points that an electrically conductive bridge is formed.

In the case of an adhesive with conductive particles, this leads to the particles touching in the area between the connection points and the means for contactless data transmission, which results in the conductive connection. The modules used in the production of chip cards generally use a plastic carrier on which the IC chip mentioned at the outset is optionally provided with ISO contact surfaces. The prefabricated module is connected to the card carrier, which can be made of polycarbonate, for example. This connection or the insertion of the module into the card body in a milled recess, for example, usually takes place using a gluing method when using a hot or hot melt adhesive.

In the event that the combination cards, which are suitable for both contactless and contact-related use, or contactless cards are to be produced, a further contact level with connection points for the induction loop or the induction coil must be provided.

Chip cards are known in which a coil wound from wire is provided in the card body, the ends of which are connected to antenna contacts of the chip or its carrier. This overall arrangement is cast in the card body, the production being technologically very complex.

In addition, chip cards have already been presented in which the antenna has been etched out of an antenna layer, the antenna having chip contacts which are connected to the antenna contacts of the chip or its carrier via a conductive adhesive. During the production of the card body, the chip contacts are left free via a corresponding recess in a cover layer applied to the antenna layer, which also makes the production complex.

In the case of raised connection points which are located on the surface of the module and / or on the surface or on the side surfaces of the recess in the card carrier, the module and card carrier can be bonded by means of the production of the electrically conductive connection in a single operation . However, it has been shown that the temperature and time regime required for the production of reliable electrical and mechanical connections is subject to narrow tolerances, so that the long-term stability of cards produced in this way is reduced if the process parameters are not optimal, and because of the dimensions and the plastic properties of the module as well as of the card carrier leads to twists and tension in the card with the consequence of contact faults and thus less reliability.

It is therefore an object of the invention to provide a chip card, a method for producing a chip card and a connection arrangement for such a production method, with which a semiconductor chip located on a module can be both electrically and also into a recess in a card carrier can be contacted mechanically with high reliability and torsional stiffness, the resulting overall arrangement ensuring high long-term stability and sufficient reliability of the chip card thus created under all circumstances.

The object of the invention is achieved with a chip card, a connection arrangement or manufacturing method as defined in detail in the independent patent claims.

According to a first aspect of the invention, an antenna layer is initially completely built into the card material, but the chip contacts have sections which are thickened in such a way that the recess for the chip and its chip, which is also customary for the production of previously conventional chip cards, is milled Carrier parts of the thickened sections are milled and thereby chip contact surfaces are created, which can then be easily connected to the antenna contacts of the chip or its carrier.

The thickened sections can be made in various ways. For example, it is possible to selectively apply material in galvanic baths produce. However, the thickened sections are preferably formed from solder, in particular from soft solder. This can be done, for example, in the usual way which is used when tinning printed circuits, for example by passing the antenna layer over a solder wave or a wave soldering device, in which case only the contacts are uncovered. In another embodiment of the invention, the chip contacts are processed by means of known soldering or bonding machines, with a short wire possibly also being left inside the soldering "hill", which during the subsequent connection to the antenna contacts of a chip or its carrier can be beneficial. The only essential thing here is that the thickening is so strong that when the receiving recess for the chip or its carrier is subsequently milled out, the milling or the carrier, despite sufficient milling tolerance

Chip contacts can be safely exposed or formed. If one assumes that the antenna layer has a carrier thickness of approximately 200 μm and a copper layer of approximately 35 μm, then this copper layer thickness would not be properly and safely exposed with the predetermined milling tolerances of approximately 20 to 30 μm. If, however, a thickening of 100 to 200 μm is provided by soldering and forms such a bump, it is easy to see that a safe chamfering is then possible despite the specified tolerances and at the same time it is ensured that the very thin copper coating the antenna layer is not damaged or injured.

So far it has been customary to etch such antenna layers with their relief lying on the surface

Embed traces in map material. It is extremely surprising that the path that has now been followed actually leads to success and that such strong thickenings of 100 to 200 μm can easily be embedded in the standard cards with a total thickness of 760 μm ± 80 μm.

The antenna contacts can be connected to the chip cards by a large number of electrical connection processes, which will be explained in more detail later. It is here For example, reminded of welding or gluing using electrically conductive glue. However, the connection is preferably made by soldering, which is technologically easy to handle and at the same time provides particularly durable connections. This is especially true when the chip contacts are made of soft solder.

The arrangement is particularly favorable for the user or the programming manufacturer of the chip card if the chip or its carrier has additional contacts on its side facing away from the antenna layer for direct (contact-related) connection. A card designed in this way, which can be used both contactlessly and with contact, can be programmed, for example, by the manufacturer via direct, contact-based access and can then only be used by the user in a contactless manner.

According to the first aspect of the invention, the card body preferably comprises at least two cover layers, between which the antenna layer is laminated. The cover layer, which is on the side of the chip contacts, absorbs the thickening at the same time. Even if the thickening on the outside of the card becomes apparent after lamination, which would not be optimal for a finished card, this is not harmful since the area in which the chip contacts are located is later milled off.

In a corresponding embodiment of the invention, the chip has a carrier with contact surfaces on the outside of the card, the antenna contacts being formed by plated-through sections (for example bores with corresponding galvanic metal deposits in the borehole) which pass through an insulating carrier material for holding the contact surfaces. Such cards can also be used in contact systems.

In a further embodiment according to the first aspect of the invention, the chip is mounted on a carrier with contact surfaces on the inside of the card, so that the antenna contacts come to rest directly on the chip contacts. In order to enable the contacts to be soldered to one another, it is advantageous if the carrier material for the contact surfaces of the chip is removed in the antenna contact areas, so that areas which are open to the outside lie over the rear sides of the antenna contacts. As a result, the contact surfaces are accessible from the outside in order to be able to press tools, in particular those for heating, onto the rear of the antenna contact. It is also possible to use infrared radiation, in particular a laser, to heat the contact surfaces for the purpose of soldering.

In the case of a carrier for the chip coated on both sides, as explained above, a contactless as well as a contact-type additional device can again be used to program the card or to use it. In this case too, however, it is important that heat transfer for soldering the antenna contacts to the chip contacts can take place in the area of the antenna contacts. For this purpose, openings are again provided in the carrier or in the contact areas attached to it in the area of the chip card.

The method according to the invention for producing a chip card according to the first aspect of the invention comprises the following steps:

An antenna with chip contacts for connecting a chip is formed on an antenna layer. It should be emphasized here that the term "antenna" is to be understood as meaning a multiplicity of such structures which are possible for forming additional functions which are desired in addition to those of the chip and which are connected to the chip via its carrier Need to become.

In a next step, thick sections are formed on the chip contacts. This can be done by all possible electrochemical processes, by build-up welding or by the application of conductive plastics. In a next step, a card body is formed in such a way that the antenna layer and the chip contacts, including the thickened sections, are covered by card material and are firmly connected to it.

A recess is formed in the card body in such a way that the thickened sections are at least partially removed and thereby exposed.

A chip comprising a carrier with antenna contacts for

Connection of the carrier conductor structures to the antenna is inserted into the recess.

The antenna contacts are connected to the chip contacts.

The antenna is preferably formed from the antenna layer in an etching or cutting process.

The application of material to the chip contacts is preferably carried out in a soldering process in a manner known per se.

The card body is preferably formed by means of a lamination process, the antenna layer being laminated in between two cover layers. The top layer is of course not to be understood as an absolutely homogeneous structure, since such layers in turn usually have a multilayer structure, for example an imprint is covered by a clear top layer, or a layer to be laminated on to connect with the layers underneath

Layer includes special connection or adhesive layers.

The recess in the card is preferably formed in a manner known per se by milling. The chip and its carrier are inserted and preferably glued into the recess formed in this way, using a hot melt adhesive. The reason for this lies in particular in the fact that when the antenna contacts are subsequently soldered to the chip contacts, a height loss due to flowing solder material to the Contact occurs, which is difficult to compensate for when using known cyan acrylate adhesives, but is easy to compensate for when using welding adhesives, and can also be compensated for later by reheating.

The heat for soldering can be applied by an external soldering tool, that is, by heat conduction. In a further embodiment of the method based on the first aspect of the invention, the heat is supplied by radiation, in particular by radiation from an IR laser. It is of course also possible to provide the heat using ultrasound, that is to say using frictional heat.

According to a second aspect of the invention, a chip card for contactless and / or contact-based data transmission is specified, which comprises a semiconductor chip and contact areas for contact-based data transmission and next to connection points and at least one means for contactless data transmission, which is generally an induction coil. The chip card according to the second aspect of the invention is characterized in that the electrically conductive connections between the connection points and the means for contactless data transmission are also made by means of soldering, the mechanical connection being done by hot or hot melt, but also by Soldering, can be done.

According to the second aspect of the invention, the hot or hot melt adhesive expediently has partial electrically conductive and also solderable particles. These electrically conductive, solderable particles are particularly preferably added or applied already on the carrier film during the preparation of the adhesive.

The size and amount of the solder particles added to the adhesive in sections depends on the contact formation or the contact areas of the chip card. The diameter of a contact surface between provided and on a hot or melting The solder ball located in the adhesive is, for example, in the range between 15 and 25 μm.

The amount of conductive particles is expediently chosen so that there are sufficient particles between the connection points and the means for contactless data transmission in order to establish a sufficient electrical connection by soldering.

According to the method according to the invention according to the second aspect of the invention, the electrically conductive connection is brought about by the fact that the adhesive on the carrier film has conductive particles or layers at least in the area of the connection points and / or the connection points of the agent for contactless data transmission can form an electrically conductive bridge between the connection points and the means for contactless data transmission by soldering.

In the production of chip cards, the procedure is predominantly such that a module is first produced which comprises a plastic carrier on which a semiconductor chip is arranged. The module is then attached to the plastic card holder, e.g. Connected polycarbonate. The module is usually implanted in a cavity milled into the card body, as has already been explained.

The chip cards according to the invention are particularly preferably produced using the already known components and method steps described. According to the second aspect, the invention expediently uses a conventional module, to which, however, a contact level with the connection points for the means for contactless data transmission is added. As a rule, the module is supplemented with two further connection points which are connected to the semiconductor chip in the usual way.

The connection points are particularly preferably raised on a surface of the module carrier, preferably the side that faces the Semiconductor chip carries, trained. The height of the connection points according to the second aspect of the invention depends on the type and dimensions of the card and can be, for example, between 1 and 20 μm. The connection points are preferably made of metal and are known per se

Manner, e.g. by gluing, printing, vapor deposition, electroplating or the like. The additional connection level is particularly preferably produced by laminating a strip of metal onto the module carrier and then structuring it. Location and size depends on the size and location of the means for contactless data transmission and especially its connection points.

The means for contactless data transmission, preferably an induction coil or antenna, is expediently integrated into or arranged on the card body, the connection points to the connection points being exposed. For example, in the case of a copper wire coil integrated in the card body, connection points can also be exposed when milling the cavity. With such an arrangement, it is possible to carry out the adhesive bonding of the module and card carrier simultaneously with the establishment of the electrically conductive connection between the means for contactless data transmission and the connection points of the module. A special stamp can be used for this, which provides both compressive forces and thermal energy for producing the adhesive and soldered connection.

In order to be able to use the known hotmelt process, the adhesive, as explained, is provided with conductive and solderable particles in predetermined contact sections. The mechanical adhesive connection according to the second aspect of the invention is then produced in a manner known per se, the electrical connection of the contacts being realized by targeted introduction or application of heat at least in or onto the areas of the contact sections.

According to a third aspect of the invention, a basic method according to the method is to produce a electrical and mechanical connection of a module inserted in a recess of a card carrier of a chip card to a non-conductive hot or hot-melt adhesive layer located on a film-like carrier, this hot or hot-melt adhesive layer in the area of electrical contacts to be formed between the module and the card carrier with a additional conductive layer or to be provided with conductive particles. This additional conductive layer or the conductive particles can be formed by perforating the hot or hot melt adhesive layer with subsequent filling, using conductive material.

The hot or hot-melt adhesive layer with conductive sections thus prepared in accordance with the third aspect of the invention is then pre-fixed on the module or in the recess of the card carrier. This fixing takes place in such a way that the sections provided with the additional conductive layer or the conductive particles are located between the contact surfaces of the module and the recess of the card carrier. Following this fixing, both the mechanical between the module and the card carrier as well as the electrical contacting between the opposing contact surfaces is realized in a single pressure-temperature action step. According to the third aspect of the invention, it is not necessary that the generally only small contact surface sections, based on the connection surface mentioned, make a significant contribution to the adhesive connection, rather optimized electrical properties, such as low line inductances or a low contact resistance, are to be achieved here. The usual hot-melt or hot-melt adhesive connection ensures sufficient pressing and compression of the conductive particles, so that the desired long-term contact stability results.

In the case where, as explained in relation to the third aspect of the invention, a solder paste or a solder ball is used for the conductive particles, this can already be done by a defined supply of thermal energy in the contact area for the second aspect of the invention, soldering is carried out after or during the gluing of the module in the card carrier, as a result of which there is a further increase in contact reliability. In this case, the solder joint is kept free of mechanical tensions, shear forces or other forces, since these can be absorbed over a large area by the adhesive connection even when the card is in use.

According to a further basic idea according to the third aspect of the invention, depending on the material of the card carrier or the

Module selected a suitable pre-assembled hot or hot melt adhesive and individually prepared and thus optimized with regard to layer thickness and selection of the conductive particles for the respective application.

The conductive particles or the conductive layer can be applied locally to the hot-melt or hot-melt adhesive film, for example by means of a dispenser, a roller or a stamp, a mask being able to be used if necessary, so that the reproducibility when applying conductive coatings is increased. In the case of the application of a conductive layer or of conductive particles on the surface, in one embodiment according to the third aspect of the invention the layer applied in this way is briefly subjected to a thermal treatment, so that a certain melting of the respective particles and thus adhesion and connection with them the hot glue or the hot melt adhesive is the result. This measure ensures that the conductive layer or the conductive material is protected from unwanted removal during subsequent handling.

In the case when the hot or hot melt adhesive layer has recesses or perforations which are filled with conductive particles such as solder balls or solder paste, customary and proven solder can be used. The metering of the amount of particles to be introduced into the recesses or perforations is not critical, since excess material during soldering and / or pressing and simultaneous gluing into the Adhesive layer can be displaced into it without the overall contact reliability being impaired.

The connecting means according to the third aspect for carrying out the described method consists of a non-conductive hot or hot-melt adhesive layer located on a carrier film, which has sections with conductive particles or a conductive layer in the area of electrical contacts to be produced.

These sections can consist of recesses or perforations filled with solder paste or conductive adhesive.

In one embodiment of the connecting means, the conductive sections are located inside a hot or

Hot melt adhesive layer, which is displaced during assembly by the action of pressure and temperature and raised contact surfaces come into active connection with the inner conductive layer or the inner conductive sections.

According to the third aspect of the invention, it is possible to specify a method and a connecting means for producing an electrical and mechanical connection of a module inserted in a recess in a card holder of a chip card, known hot or hot melt adhesives being used on the one hand and high quality electrical ones on the other hand Contacts or electrical connections can be realized and the required mechanical strength of the module is given in the card carrier without adverse shear forces or other forces acting on the contact areas during operation. r

The inventive method according to the third aspect is particularly suitable for contactless chip cards or combination cards, in which both mechanically contactable

Contact surfaces as well as inductive components are available. By using the hot-melt or hot-melt adhesive films modified according to the invention, the costs in card production can be reduced since it is no longer necessary is to fall back on cost-intensive anisotropically conductive adhesives, which are otherwise only very suitable for gluing the modules to the card carrier.

As a result of the only partial electrical connection at the respective electrical contacting points, there is sufficient space to carry out the cohesive adhesive connection in order to securely fasten the module to the card carrier.

Taking into account the problems mentioned with regard to the long-term stability of the card carrier when it is subjected to twisting and / or tension, a basic aspect of the method according to a fourth aspect of the invention is that the module to be implanted in the card recess is on its insert side or on its edge side has a conductive stiffening frame with insulated sections. This stiffening frame has contact surfaces which, when the module is inserted, come into electrical connection with mating contact surfaces located in the recess.

When the module with the semiconductor chip and the stiffening frame according to the fourth aspect of the invention is inserted into the recess of the card carrier, this is done, for example, by pressing in, additional material and / or form-fitting connections being possible. By designing the module with a stiffening frame, which fulfills both mechanical and electrical functions, simple technologies for connecting the module to the card carrier, namely press-in or a snap-in connection, can be used, so that overall productivity increases . The stiffening frame leads to a stable design of the module, as a result of which twists and tensions can be absorbed during operation of the IC card without undesired forces reaching the semiconductor chip or other electronic components.

It is in the sense of the fourth aspect of the invention that the stiffening frame is, for example, in two parts, so that two electrically insulated contact surfaces are created which can interact with corresponding counter-contact surfaces which are connected, for example, to an induction loop or an antenna which is arranged in the card carrier.

The connection arrangement according to the fourth aspect for producing a chip card is based on the stiffening frame, which is arranged on the insert side of the module and has mutually insulating sections and is electrically connected to connections of the semiconductor chip. This stiffening frame has contact surfaces which are located, for example, in the lateral edge area and / or on the underside, so that it is possible to work with very different counter-contact surfaces in the recess of the card carrier.

As mentioned, counter-contact surfaces are formed in the recess of the card carrier, the contact and counter-contact surfaces being pressed together and / or integrally or positively connected when the module is inserted.

In a special embodiment of the stiffening frame according to the fourth aspect of the invention, it is arranged on the outer edge side or with the outer edge of the module and has an essentially square or rectangular cutout shape.

In order to obtain a snap-in connection between the module and the recess in the card carrier, the stiffening frame has lateral projections or latching lugs which interact with recesses located on the side walls of the recess.

Alternatively, the counter-contact surfaces in the side surfaces of the recess can have projections or latching lugs or be designed in this way, and can interact with corresponding recesses in the stiffening frame when the latter is inserted or pressed into the card carrier. As explained, according to the invention the snap-in connection can be formed in the area of the contact and counter-contact surfaces, but other sections of the stiffening frame or opposite surfaces of the recess of the card carrier can also comprise, so that the desired strength and reliability of the Connection between module and card is guaranteed.

In a further embodiment according to the fourth aspect of the invention, the arrangement has a stiffening frame which is formed integrally with a chip carrier, the mutually insulated contact surfaces of the stiffening frame being electrically connected to respective chip contacts or bonding surfaces.

In this embodiment, it is not necessary to produce a separate stiffening frame, but the module to be used can be formed by the chip carrier and stiffening frame, which carries the semiconductor chip attached by chip bonding on its underside. In the last-mentioned embodiment, a separate plastic module or wiring carrier for the semiconductor chip can therefore be dispensed with. Any electrical external insulation that may become necessary is possible by laminating on an insulation layer, expediently over the entire surface of the chip card.

According to the fourth aspect of the invention, it is possible to specify a method for producing a chip card or a connection arrangement for such a production method, with which or with which a high degree of use stiffness of the card, in particular in the area of the recess for receiving a module, containing a semiconductor chip is achieved. The stiffening frame provided, which can also be formed integrally with a chip carrier, makes it possible to press the complete module into the recess and to use advantageous positive and / or non-positive connections for electrical and mechanical contacting of the module in the card carrier. Of course, a cohesive connection, in particular a soldered connection, can also take place in that thermal energy is supplied to the soldered connection points in a targeted manner using the metallic stiffening frame. Ultimately, other types of connection are also conceivable, such as the hot or melt adhesive mentioned.

It is also within the scope of the invention to combine the aspects mentioned with one another.

The invention explained according to the first to fourth aspect is to be explained in more detail with the aid of exemplary embodiments and with the aid of figures.

Here show:

1 shows schematic representations of five method steps according to the first aspect of the invention;

2 to 4 show three different embodiments of the chip card according to the first aspect in a schematic cross-section;

5 schematically shows a cross section through a chip card according to the second aspect of the invention in the region of an electrically conductive connection point between a connection point and a means for contactless data transmission;

FIG. 6 shows a schematic sketch to explain the method according to the second aspect of the invention, namely using the example of the production of the electrically conductive connection which is shown in FIG. 5;

7 shows a section through a hot melt adhesive according to the third aspect of the invention;

8 shows a plan view of a prepared hot melt film according to the third aspect of the invention; 9 shows a section through a hot-elt film with conductive particles inside according to the third aspect of the invention;

10 shows a basic sectional illustration of the installation position of the module in the recess of a card carrier using the connecting means according to an exemplary embodiment according to the third aspect of the invention;

11 is a perspective view of a top view of a module with a semiconductor chip and stiffening frame according to the fourth aspect of the invention and

Fig. 12 is a sectional view through a module along the

Line A / A of Fig. 11, with the module already inserted in the card carrier.

With regard to the following description of exemplary embodiments, it should be pointed out that the size relationships shown in the drawings do not correspond to the actual circumstances, in particular the layer thicknesses of the conductive layers are considerably smaller or lower than the plastic layers.

In Fig. 1, an antenna layer 10 is shown in cross section, which consists of a carrier 11 with a coating 12 thereon. The layer thickness of the carrier can be approximately 200 μm, the coating 12 approximately 35 μm (copper).

In a first method step, in a manner known per se, a conductor track pattern is formed by selective etching, which according to FIG. 1b antenna tracks 13, 14, 15 (in itself is only a single track, but cut several times in FIG. 1b) and chip contacts 20, 21 includes.

In a next step, the result of which is shown in FIG. 1c, thickenings 16, 17 are formed on the chip contacts 20, 21 created, which are formed in this embodiment of the invention as a soldering job. These thickening tongues can be about 100 to 200 μm thick, but they should in any case be so thick that the inevitable tolerances that occur during the subsequent milling can be safely absorbed in any case.

In a next step, the result of which is shown in FIG. 1d, an upper cover layer 18 and a lower cover layer 19 are laminated onto the overall arrangement shown in FIG. 1c, that is to say the antenna layer 10 together with the thickenings 16 and 17, so that the antenna layer ( 1c) is completely enclosed.

In a next step, the end result of which is shown in FIG. 1e, a recess 24 is milled in the card body according to FIG. 1d in a manner known per se. The milling here is so deep that in the area in which the chip carrier (not yet shown) comes to lie later, the thickenings 16 and 17 are also milled or milled, so that they are in a bottom surface of the Depression 24 form exposed access areas 22, 23.

In a next step, the end result of which is shown for three alternatives in FIGS. 2 to 4, a chip with carrier 25 is then used. This comprises an IC 26 and a carrier made of a carrier material 30 with external contacts 33, 34 and internal antenna contacts 31, 32, the connecting contacts (not shown) of the IC 26 being led to the external contacts 33, 34 via connecting wires 28, 29. The IC 26 is covered together with parts of its carrier by means of a casting compound 27.

When inserting the chip with carrier 25 into the recess 24 of the card, the arrangement is made using hot-melt adhesive in the

Fixed opening. Then a soldering tool is placed on the antenna contacts 31, 32, so that the solder contained in them melts and the underlying thickenings 16, 17, which are formed from solder material, also melt. Thereby a continuous soldering between the chip contacts 20, 21 and the external contacts 33, 34 and via the connecting wires 28, 29 to the IC 26 is created. After soldering, another final fixation can be done by warming up the hot melt adhesive.

The embodiment of the invention shown in FIG. 3 differs from that according to FIG. 2 in that the antenna contacts 31, 32 are formed as metallization layers which are formed on the carrier material 30 on the surface carrying the IC 26. In this embodiment of the invention, bores 35, 36 are provided in the carrier material 30, so that the thickenings 16, 17 or the soldering application provided there are freely accessible from the outside. In this case, a laser beam can be directed through the bores 35, 36 for heating onto the soldering job 16 or 17, in order to establish a soldered connection between the chip contacts 20, 21 and the antenna contacts 31, 32.

The variant shown in FIG. 4 differs from that according to FIG. 3 in that the bores 35, 36 are not led through the antenna contacts 31, 32 or the layers forming them, but end on the rear side thereof. As a result, however, it is still possible to mount the antenna contacts 31, 32 by means of attached tools or by heat radiation

(IR laser) to be heated, so that a soldered connection between the antenna contacts 31, 32 and the chip contacts 20, 21 is established.

It can be seen from the above description that several features which are shown in the embodiments in FIGS. 2 to 4 can also be combined with one another. In particular, the use of carrier materials 30 coated on both sides is possible. It is also possible to use self-supporting metal contact devices as chip carriers 25, as are known per se.

5 shows a cross section through a chip card 1 in the region of an electrically conductive connection point between a connection point 2 and a means 3 for contactless data transmission, here an induction coil. The induction coil 3 is integrated in the card carrier 5, which usually consists of plastic, for example polycarbonate. A portion of the coil is exposed in the area of the connection point, for example by milling the card carrier surface. The one of the two connection points 2 of the card to the coil 3 shown in FIG. 5 is designed as a metal strip on the carrier 6 of the module, for example a plastic film, and is located outside the region of the carrier in which the semiconductor chip is arranged. The electrically conductive connection is made between connection point 2 and induction coil 3 by means of soldering in the adhesive layer 4 of selectively introduced solder balls 8. In the case shown, the adhesive is applied in the area of the entire surface of the module, the conductive and solderable particles selectively located in the adhesive coming to rest between the induction coil 3 and the connection point 2.

As mentioned, a hot or hot melt adhesive is used as the preferred adhesive. When such adhesives are used, the connection from the module with the plastic carrier 6 and the connection point 2 to the card body 5 can be made while simultaneously making the soldered connection by means of solder balls 8 between the connection point 2 and the induction coil 3 using the widespread hot-melt method, for which a universal seller Heating and pressure stamp 9 can be used.

This is schematically illustrated in FIG. 6, where a cross section through the chip card according to FIG. 5 is shown before the module and card body 5 are connected.

The card body 5 with integrated induction coil 3, which is coated with adhesive in the cavity for the module, is placed in a suitable position on the module with carrier 6 and connection point 2. Now pressure and heat is supplied with the help of the heating and pressure stamp 9. This softens the adhesive layer 4, and the module and card body 5 are pressed together until the coil 3 is electrically conductive Particles 8 and junction 2 touch each other and a soldered connection is created. At the same time, an adhesive connection is created between the surface of the card body cavity and the module. The adhesive is then allowed to harden by cooling.

In the manner described, the module and card body can be glued and electrically conductive connections made to the contactless data transmission system in one step using known methods.

The section through a hotmelt film shown in FIG. 7 has a carrier film 41 which is coated with a hot or hot melt adhesive 42. The layer thickness is in the range between 20 and 80 μm, whereby different adhesives are used depending on the card material such as ABS, PVC, PC or PET.

The prepared hot or hot melt adhesive shown in FIG. 8 has perforations 43 for receiving the chip as well as laterally arranged sections 44 which consist of a conductive layer or of conductive particles 416 or contain them.

These sections 44 can, for example, be perforations or recesses which have been filled with solder paste. As can be seen from FIG. 8, the hot or hot melt adhesive 42 located on a carrier film 41 is made up. The module 410 (FIG. 10) provided with a chip 411 can be attached to this blister-like film strip, in order to then, in a next operation, the module 410 provided with carrier film 41 and hot or hot melt adhesive 42 towards the recess 412 of a card carrier 413 to position (Fig. 10).

In a further exemplary embodiment, solder balls with a diameter of 25 μm were selectively applied to the hot or hot-melt adhesive layer, so that in a subsequent pressure-temperature process both a solder connection between the opposing contact surfaces using the Solder ball as well as the adhesive connection between module and card carrier can be realized.

In the case of the hot-melt or hot-melt adhesive 42 shown in FIG. 9, this has an inner layer 45 made of conductive particles. In the case when the configuration according to FIG. 9 is used, raised contact surfaces on the module or on the card carrier are able to displace the hot or melt adhesive which changes to the semi-liquid state during the pressure-temperature treatment step thus to come into active connection with the conductive particles of the inner layer, as a result of which the desired contacting is formed.

10, which shows a basic sectional illustration through a card carrier 413 which has a recess 412, the method for establishing the connection will now be explained.

The provided with the prepared hot or hot melt adhesive layer 42 module 410, which comprises a chip 411, z. B. positioned in the recess 412 by means of a suitable tool.

Contact surfaces 414, which are connected to an induction coil for contactless data transmission, are located on the inner surface side of the recess 412. The hot or hot-melt adhesive in the layer 42 heats up by exerting a compressive force in the direction of the arrow and by the action of temperature conductive particles 416, which are located in the sections 44 or in the layer 55, establish an electrical connection between the contact surfaces 414 and the opposite contact surfaces 415 of the module. When the adhesive cools and hardens, there is both a secure mechanical connection of the module 410 in the recess 412 of the card carrier 413 and a corresponding electrical connection between the contact surfaces 414 and 415. In the case, for example, if solder paste in recesses or holes in the hot - or Hot melt adhesive 41 is introduced, this serves to implement the electrical connection between the opposing contact surfaces 414 and 415.

In a further exemplary embodiment, when using a solder ball in the adhesive film, during or after the pressure-temperature action step, additional heat can be applied locally in the area of the contact surfaces 414 and / or 415, so that the desired soldering process is carried out.

It is clear from the exemplary embodiments described above that the conductive particles or the conductive layer can both be located inside the hot-melt adhesive film and can be applied on the surface side. A layer applied on the surface or of particles arranged on the surface can be fixed by brief heat treatment, as a result of which the corresponding particles adhere to the adhesive. For the heat treatment, for example, a heated roller, which is guided over the film, can be used, the roller also being usable at the same time for applying the conductive particles.

In the module shown in FIG. 11, the latter comprises a chip carrier 51 and a semiconductor chip 52 fastened to the chip carrier 51 by bonding. The chip carrier 51 can comprise regions which are insulated or structured from one another and which are electrical with corresponding contact surfaces of the semiconductor chip 52 are connected. This electrical connection can be achieved by wire bonding, but there is also the possibility of electrically connecting the semiconductor chip 52 directly to the chip carrier 51 by means of rear-side contacts.

A two-part stiffening frame 53, which has insulated sections 54, is arranged on the chip carrier 51. The two parts of the stiffening frame 53 each form contact surfaces; 11 and 12 in the side region 55 in the example shown. The side regions 55, but also the other side surfaces of the stiffening frame 53, can have means for achieving a snap-in connection when the module is inserted into a recess in a card carrier (FIG. 12).

In one embodiment, the chip carrier 51 is made with the stiffening frame 53 as a one-piece part. Alternatively, however, the parts or sections of the stiffening frame 53 on the chip carrier 51 can be obtained by maintaining the desired electrical and mechanical connection

Soldering or the like can be arranged. The surfaces 56 of the stiffening frame 53 pointing towards the insert side can be provided on the surface side with an adhesive, in particular hot-melt adhesive, so that a secure mechanical connection of the module is achieved without the contact and counter-contact surfaces 55; 513 excessive forces have to be absorbed.

The insertion of the module with stiffening frame will be explained in more detail with the aid of FIG.

An IC card 510 has a recess 511, which can be produced, for example, by milling. Inside the IC card 510 there are conductor tracks 512 which e.g. Can be parts of an inductive element for wireless information exchange. These conductor tracks 512 extend as far as the recess 511 and have a counter-contact surface 513. This counter-contact surface 513 forms a contact with the stiffening frame 53 or the respective side regions 55 when the module 514 is inserted into the recess 511 of the IC card 510.

As already explained with reference to FIG. 11, the side regions 55 of the stiffening frame 53 can be provided with latching lugs or projections, which correspond to the corresponding recesses in the

Area of the side surfaces of the recess 511 in the IC card 510 cooperates. A reverse principle is also conceivable here, ie there are projections and locking lugs in the IC Card 510 formed, which cooperate with grooves, grooves or recesses in the stiffening frame 53 of the module 514.

If, before the module 514 is inserted, the side area 55 is provided with solder at least in the section of the contact areas, or solder or flux is applied to the counter-contact areas 513, the module 514 can be pressed or pressed into the recess 511 of the IC card 510 are additionally applied specifically to the stiffening frame 53 by means of soldering stamps / heat, so that soldering is possible in the area of the connection between contact surfaces 55 and counter-contact surfaces 513.

Reference list

1 chip card

2 connection point

3 means for contactless data transmission

4 adhesive layer

5 card body 6 plastic carrier

8 solder balls

9 heating pressure stamps

10 antenna layer

11 carrier 12 coating

13 antenna track

14 antenna track

15 antenna track

16 Soldering order 17 Soldering order

18 upper cover layer

19 lower cover layer

20 chip contact

21 chip contact 22 access area

23 access area

24 recess

25 chip with carrier

26 IC 27 sealing compound

28 connecting wire

29 connecting wire

30 carrier material

31 Antenna contact 32 Antenna contact

33 external contact

34 External contact

35 hole

36 hole 41 carrier film

42 Hot or hot melt adhesive 43 Hole for chip

44 sections 45 inner layer

410 module

411 chip

412 recess

413 card carrier 414 contact surfaces card carrier

415 module contact surfaces

416 conductive particles

51 chip carrier

52 semiconductor chip 53 stiffening frame

54 isolated sections

55 side area, contact areas

56 areas 510 IC card 511 recess

512 interconnects

513 mating contact surfaces

514 module

Claims

claims

1. chip card, comprising a card body, a recess (24) machined therefrom, a chip (25) with antenna contacts (31, 32) for connecting an antenna, an antenna layer (11, 12) with antenna devices, in particular a coil in the card body, which has chip contacts (20, 21) for connecting the chip (25), the chip contacts (20, 21) having thickened sections (16, 17) which are embedded in the card body and at least in sections when working out or milling out the Recess (24) are removed and the antenna contacts (31, 32) with the chip contacts (20, 21) are conductively connected.

2. Chip card according to claim 1, so that the thickened sections (16, 17) consist of (soft) solder.

3. Chip card according to one of the preceding claims, so that the antenna contacts (31, 32) are connected to the chip contacts (20, 21) by soldering.

4. Chip card according to one of the preceding claims, so that the chip (25) on its side facing away from the antenna layer (11, 12) has additional contacts (33, 34) for direct connection.

5. Chip card according to one of the preceding claims, characterized in that the card body comprises at least two cover layers (18, 19), between which the antenna layer (11, 12) is laminated.

6. Chip card according to one of the preceding claims, characterized in that the chip (25) comprises a carrier (30) with contact surfaces (33, 34) on the outside of the card, and that the antenna contacts (31, 32) are formed by through-contacting sections which form the Cross the beam (30).

7. Chip card according to one of claims 1-5, that the chip (25) comprises a carrier (30) with contact surfaces (31, 32) on the inside of the card.

8. Chip card according to claim 7, so that the antenna contacts (31, 32) are accessible, in particular heatable, directly or via openings (35, 36) from the outside.

9. Chip card according to one of claims 1-5, so that the chip (25) comprises a carrier coated on both sides.

10. Chip card according to one of claims 6, 7 or 9, characterized in that the carrier (30) and / or the contact surfaces mounted thereon (33, 34) in the region of the chip contacts (20, 21) have openings (35, 36 ) exhibit.

11. A method for producing a chip card, comprising the steps a) an antenna with chip contacts for connecting a chip is formed on an antenna layer; b) thickened sections are formed on the chip contacts; c) a card body is formed in such a way that the antenna layer and the chip contacts, including the thickened sections, are completely covered by card material; d) a recess is formed in the card body in such a way that the thickened sections are at least partially removed and thereby exposed; e) a chip comprising a carrier with antenna contacts, the recess is used; f) the antenna contacts are connected to the chip contacts in an electrically conductive manner.

12. The method of claim 11, d a d u r c h g e k e n n z e i c h n e t that step a) comprises an etching process.

13. The method of claim 11, d a d u r c h g e k e n n z e i c h n e t that in step b) material is applied in an electrochemical process.

14. The method of claim 11, d a d u r c h g e k e n n z e i c h n e t that in step b) material is applied by a soldering process.

15. The method according to claim 11, d a d u r c h g e k e n n z e i c h n e t that step c) comprises a lamination process.

16. The method according to claim 15, so that the antenna layer is laminated between at least two cover layers in step c).

17. The method according to claim 11, d a d u r c h g e k e n n z e i c h n e t that in step d) the recess is formed by milling.

18. The method according to claim 11, characterized in that in step e) the chip is glued to the carrier in the recess.

19. The method according to claim 18, so that the chip is stuck in the recess with the carrier by means of hot-melt adhesive.

20. The method of claim 11, d a d u r c h g e k e n n z e i c h n e t that the antenna contacts are soldered to the chip contacts in step f).

21. The method according to claim 20, d a d u r c h g e k e n n z e i c h n e t that heat is supplied during soldering by means of an externally placed tool.

22. The method of claim 20, d a d u r c h g e k e n n z e i c h n e t that heat is supplied by radiation, in particular an IR laser during soldering.

23. The method according to claim 20, so that heat is supplied by mechanical movement, in particular ultrasonic vibrations, during soldering.

24. Chip card (1) for contactless and / or contact-laden data transmission, which comprises a module with a semiconductor chip, a contact body and connection points (2) and at least one means (3) for contactless data transmission, characterized in that the electrically conductive connection between the connection points (2) and the means (3) for contactless data transmission is established by means of soldering.

25. Chip card according to claim 24, characterized in that the means (3) for contactless data transmission is an induction coil.

26. Chip card according to one of claims 24 or 25, so that the means (3) for the contactless data transmission are arranged in the region of the card body (5), for example printed on or glued to it or integrated into it.

27. Chip card according to one of claims 24 to 26, so that the connection points (2) are arranged on a surface of a carrier (6) which carries the semiconductor chip and the contact surfaces for contact-based data transmission.

28. Chip card according to claim 27, which also means that the connection points (2) on the surface of the

Carrier (6) are arranged, which carries the semiconductor chip.

29. Chip card according to claim 27 or 28, d a d u r c h g e k e n n z e i c h n e t that the connection points (2) consist of metal.

30. Chip card according to one of claims 27 to 29, so that the connections (2) protrude 1 to 20 μm above the surface of the carrier (6).

31. Chip card according to one of claims 24 to 30, characterized in that a hot or hot melt adhesive (4), in particular a phenolic resin-based adhesive is used for the connection, which in the area of the connection point (2) electrically conductive and solderable particles (8) are added or these are applied to the adhesive layer.

32. Method for producing a chip card according to one of claims 24 to 31, characterized in that an adhesive (4) substantially in the area of the entire surface of the chip card module, which in the card body (5), which means (3) for contact ¬ loose data transmission, is to be implanted, is applied, conductive and solderable particles (8), which are selectively inserted or applied in the adhesive (4), positioned in the area of the connection points (2).

33. The method according to claim 32, characterized in that the connection of connection points (2) and means (3) for contactless data transmission and of card body (5) and carrier (6), which carries a semiconductor chip and contact surfaces for contact-related data transmission, by a only common pressure-temperature action step takes place.

34. A method for producing an electrical and mechanical connection of a module used in a recess in a card holder of a chip card using a hot or hot melt adhesive, characterized in that the non-conductive hot or hot melt adhesive layer located on a film-like support in the area of electrical contacts to be formed between module and card carrier is provided with an additional conductive layer or conductive particles, then the hot or melt adhesive layer thus prepared is fixed to the module or in the recess of the card carrier, the one with the additional conductive layer or the sections provided with the conductive particles is located between the contact surfaces of the module and the recess of the card carrier and furthermore in a single pressure-temperature action step both the mechanical connection between Module and card carrier as well as the electrical contacting is realized.

35. The method according to claim 34, so that depending on the given material of the card carrier and the module, suitable hot or hot melt adhesives are selected and these are individually prepared with regard to their layer thickness and selection of the conductive particles for the respective application.

36. The method according to claim 34 or 35, characterized in that the conductive particles or the conductive layer are applied locally by means of a dispenser, roller or stamp, optionally by means of a mask, the particles or the layer components being obtained by simultaneous or subsequent brief heat treatment be adhesively bonded to the adhesive layer.

37. The method according to any one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t that solder balls are used as conductive particles.

38. The method according to any one of the preceding claims, d a d u r c h g e k e n e z e i c h n e t that recesses or perforations are made in the hot or hot melt adhesive layer, which are filled with conductive particles.

39. The method of claim 38, d a d u r c h g e k e n n z e i c h n e t that solder paste is used as the conductive particle.

40. Connection means for carrying out the method according to one of claims 34 to 39, characterized by a non-conductive hot or hot melt adhesive layer (42) located on a carrier film (41), which in the region electrical contacts to be produced has sections (44) with conductive particles (416) or a conductive layer.

41. Connection means according to claim 40, so that the sections (44) consist of recesses or perforations in the hot or hot melt adhesive film filled with solder paste or hot glue.

42. Connection means according to claim 40, so that the conductive sections (44; 45) are located inside a hot or hot-melt adhesive layer which can be displaced when exposed to temperature and pressure.

43. Connection means according to claim 40, so that the connection is realized by means of previously applied, rolled solder wire.

44. A method for producing a chip card, wherein a semiconductor chip located on a module is inserted into a recess in a card carrier while maintaining an electrical and mechanical connection, characterized in that the module to be implanted in the card recess has a conductive stiffener on the insert side frame is provided with contact surfaces, these contact surfaces being electrically connected to mating contact surfaces located in the recess of the card carrier.

45. The method according to claim 44, characterized in that the connection between the contact surfaces of the frame and counter-contact surfaces of the recess is material, non-positive and / or positive.

46. The method according to claim 45, so that the module provided with the stiffening frame is pressed into the card recess in order to obtain the mechanical connection and the electrical contacting.

47. Connection arrangement for producing a chip card, consisting of a module with a semiconductor chip and a card carrier with a recess for receiving the module, characterized in that on the insert side of the module (514) a conductive, mutually insulated sections having stiffening frame (53) is formed is, which is electrically connected to terminals of the semiconductor chip (52), wherein the stiffening frame (53) has contact surfaces (55), and that in the recess (511) of the card carrier (510) mating contact surfaces (513) are formed, with the insertion of the Module (414) the contact and counter-contact surfaces (55; 513) come together in press fit and / or are integrally and / or positively connected.

48. Connection arrangement according to claim 47, so that the stiffening frame (53) is arranged on the outside edge of the module (514) and has a substantially square or rectangular shape.

49. Connection arrangement according to claim 47 or 48, so that the stiffening frame (53) has lateral protrusions or

Has locking lugs with on the side walls of the recess

(511) located recesses or grooves interact.

50. Connection arrangement according to one of claims 47 to 49, characterized in that the counter-contact surfaces (513) in the side surfaces of the recess (511) and projections or Have locking lugs which interact with corresponding recesses in the stiffening frame (33).

51. Connection arrangement according to one of claims 47 to 49, characterized in that the stiffening frame (53) is integrally formed with a chip carrier (51), the mutually insulated contact surfaces of the connecting frame (53) being connected to respective chip contacts or bonding surfaces stand.