WO1998050189A1 - Apparatus and method for forming solder bonding pads - Google Patents

Apparatus and method for forming solder bonding pads Download PDF

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Publication number
WO1998050189A1
WO1998050189A1 PCT/US1998/009162 US9809162W WO9850189A1 WO 1998050189 A1 WO1998050189 A1 WO 1998050189A1 US 9809162 W US9809162 W US 9809162W WO 9850189 A1 WO9850189 A1 WO 9850189A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
islands
laser
strip
holes
Prior art date
Application number
PCT/US1998/009162
Other languages
French (fr)
Inventor
Herbert M. Shapiro
Original Assignee
Shapiro Herbert M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shapiro Herbert M filed Critical Shapiro Herbert M
Priority to AU72871/98A priority Critical patent/AU7287198A/en
Publication of WO1998050189A1 publication Critical patent/WO1998050189A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0607Solder feeding devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/11001Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10424Frame holders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0338Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3478Applying solder preforms; Transferring prefabricated solder patterns

Definitions

  • solder balls are presently so small that they frequently become lodged in undesirable positions in the apparatus necessitating frequent
  • the laser can be raster scanned over the carrier and pulsed at each position of a gold dot or a laser diode array can be used to supply a pulse to the solder strip over
  • Fig's's 8-11 are schematic representatives of various components of figure 7 during the successive steps of the method practiced by the apparatus of figure 7;
  • Fig. 12 is a flow diagram of the method practiced by the apparatus of figure 7.
  • the apparatus comprises a strip of solder 11 having a
  • the laser output in one embodiment, is
  • the carrier may be removed
  • the (coherent) light source is directed at a metallized dot (or dots) on the
  • solder balls Various selected sites on the solder layer were melted by directing a 15
  • solder paste made in strips at a previous position along a conveyor belt, filled with solder paste at a
  • FIG. 12 is a flow diagram of the method practiced by the apparatus of
  • a sieve also is suitable.
  • the material should be essentially non absorbing of the laser

Abstract

The placement of solder 'balls' in a Ball Grid Array is accomplished by placing a solder strip (73) in contact with the top surface of the ball grid array carrier. The pulsing of a laser directed at the solder (74) in discrete positions permits the transfer of the solder to the gold dot (70), of the array of dots, on the carrier (71) in registry with the laser output (82) when activated. Selective solder placement is possible and increasingly higher throughput is achieved by the use of laser diode bars (80) or optical fiber fans to effect solder transfer to a plurality of dots of the array simultaneously. The use of a transparent strip (73) with a pattern of holes filled with solder paste (74) permits easy transfer of the solder to the gold dots or islands (70) on the carrier (71) in registry with laser beam.

Description

APPARATUS AND METHOD FOR FORMING SOLDER BONDING PADS FIELD OF INVENTION
This invention relates to semiconductor packages and more particularly to
apparatus for attaching semiconductor devices to metallic islands on a carrier through
which signals are supplied to the device.
REFERENCE TO RELATED APPLICATIONS
This application is a continuation in part of Patent Application Serial No.
08/854,064 Filed May 8, 1997 (SHAP-1), for the present applicant and entitled:
APPARATUS FOR POPULATING A BALL GRID ARRAY CARRIER.
Semiconductor devices typically comprise a plurality of components formed by
photolithographic processes in a multilayered structure. The structure is supplied with signals typically via a sunburst pattern which makes electrical contact to lands on the
semiconductor device. For completing the packaging of the device, the sunburst
pattern is connected to external signal and power sources for the device to operate
and the device is protected from the environment.
One attractive technology for completing the semiconductor package is
termed a "Ball Grid Array" (BGA). The BGA comprises a planar component
"carrier" which may comprise a rigid plastic layer with metallic (gold) islands or dots
on the top surface. The dots are connected to lands on the bottom surface of the carrier by through connections which provide electrical continuity from the power and
signal sources to the metallic dots. The BGA, thus, is employed as a support of
carrier for the semiconductor device and as a medium for providing the requisite drive and signals to the attached semiconductor device.
The semiconductor device, accordingly, has to be connected to the carrier in a
manner to permit electrical continuity. To this end, it is necessary to provide solder
on top of each of the gold dots on the top surface of the carrier to bond the
semiconductor securely in place. This has been accomplished typically by apparatus which places a pattern of tiny solder balls on top of the gold dots. U.S. patents
5,431,332 issued July 11, 1995 and 5,551,216 issued September 3, 1996 disclose
techniques for the placement of such solder alls. Each of these patents discloses a
techniques where a tolling plate or stencil with an array of apertures, which matches
the array of gold dots, is filled with tiny solder balls and is then juxtaposed with the
carrier to transfer the balls to the carrier. The carrier has a coating of adhesive to hold the balls in place and the carrier is then heated to affix the balls permanently.
The apparatus to place the balls on the carrier is expensive and not sufficiently
fast to meet present throughput requirements inexpensively. Further, the apparatus is not easily adapted to increasingly fine resolution to meet projected semiconductor
packaging requirements. Also, solder balls are presently so small that they frequently become lodged in undesirable positions in the apparatus necessitating frequent
inspection and down time.
BRIEF DESCRIPTION OF THE INVENTION
In accordance with the principles of this invention, a solder strip is placed in
contact with the carrier on which the gold dot array is formed. A laser is scanned
over the surface of the solder strip and pulsed in registry with the position of each of
the gold dots. The solder is liquefied where impacted by the laser beam and thus, solder is transferred to the dots.
The laser can be raster scanned over the carrier and pulsed at each position of a gold dot or a laser diode array can be used to supply a pulse to the solder strip over
each row of gold dots simultaneously. Also, a fiber fan can be used to supply pulses,
a row at a time, from a single laser diode source. The adhesive over the carrier, as is
presently used, may be useful for adhering the solder until it is heated for permanent
attachment but does not seem to be necessary on prototype device packages.
The technique is also useful for BGA carriers comprising flexible plastic films
with ceramic wafers attached to the underside thereof covering conductor lands and through connections to the gold dot arrays.
The technique has the further advantage that universal BGA carriers can be
made with solder provided only where necessary on selected ones of the gold dots.
At a present, there is no capability for populating with solder balls fewer than all the
dots in an array except by mistake.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is an exploded view of apparatus in accordance with the principles of
this invention;
Fig's 2 and 3 are schematic views of alternate heat sources for the apparatus of
figure 1;
Fig. 4 is a schematic view of an alternative solder source for the apparatus of
figure 1;
Fig. 5 is a schematic block diagram of an automated line for the apparatus of
figure 1; Fig. 7 is a schematic illustration of an alternative apparatus for the practice of the invention;
Fig's's 8-11 are schematic representatives of various components of figure 7 during the successive steps of the method practiced by the apparatus of figure 7; and
Fig. 12 is a flow diagram of the method practiced by the apparatus of figure 7.
DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS OF THE INVENTION
Figure 1 is a schematic exploded view of apparatus 10 in accordance with the
principles of this invention. The apparatus comprises a strip of solder 11 having a
width to extend over the width of a BGA carrier 12 and having a thickness to
correspond to the diameter (0.015 to 0.130 inch) of presently available solder balls.
The figure shows solder strip 11 spaced apart from carrier 12 to illustrate the array of metallized (gold) dots 14 on the top surface of the carrier. In operation, the carrier is moved into juxtaposition with solder strip 11 by riser 15. Then, laser diode
16 is activated to generate a light pulse in registry with the pattern of gold dots to
transfer solder to the gold dots. To this end, the laser output, in one embodiment, is
scanned over the array of gold dots, for example, by a spinning polygon mirror 17 in a
manner similar to that used in a laser printer , line by line, as the solder strip and the
carrier are moved incrementally to permit successive lines of dots to be solder coated.
The movement f the solder strip and the carrier is indicated by arrow 18.
Once solder is provided on the dots of the array, the carrier may be removed
from the solder strip and the solder recycled so that a new solder strip can be
extruded.
In the event that it is desired to move only the carrier with respect to the solder strip, or vice versa, the carrier and the solder strip may be spaced apart slightly, say by the thickness of the solder film (0.015 to 0.030) inch). The solder strip, in such
an embodiment, may be formed on a glass slide to ensure that the solder film remains planar and rigid.
Figure 2 illustrates a laser diode (16) with a fan 20 of optical fibers for
delivering light to a row of dots on a carrier surface. In such an embodiment, a laser
pulse causes solder to be deposited on all the dots of a row. Figure 3 illustrates a
laser bar 30 with a linear array of laser diodes. The lasers of bar 30 may be activated selectively and thus can be operated to deposit solder on selected dots of a line of
gold dots. The selective option is also possible with the embodiment of figure 1
where the polygon mirror scans the laser beam to consecutive dot positions in a raster
pattern where the presence or absence of a pule in each position determines whether
or not solder is deposited.
Figure 4 illustrates a solder film 40 on the underside of a glass slide 41 for
ensuring a rigid planar geometry to the solder layer in embodiments where the solder
layer is spaced apart from the carrier.
Figure 5 illustrates a manufacturing line wherein successive carriers 50 are moved along a conveyer belt to the position of riser 15. Riser 15 is operative, as
described hereinbefore, to move the carrier into juxtaposition with the solder strip.
Thereafter, the carrier is lowered and moved to the right, as viewed, into an oven 52.
The solder strip can be arranged in a continuous strip and recycled at means
56 to reconstitute the strip for further use. Operation of the line is under the control
of controller 58. The use of a laser permits high speed operation allowing a significant increase in throughput over prior art ball placement apparatus now in commercial use.
Moreover, the simplicity of the system permits the cost of the system to be nearer to the cost of a laser printer compared to the significantly higher cost of presently available BGA apparatus.
Further, since the diameter of the output beam from a laser is small, the
resolution of apparatus, in accordance with the principles of this invention, is greater
than that which could be achieved easily with present BGA apparatus.
Figure 6 is a flow diagram of the method practiced by the apparatus of figure 1. First, a solder strip and a BGA carrier are brought together as indicated by block
60. Next, the (coherent) light source is directed at a metallized dot (or dots) on the
surface of the carrier as represented by block 61. The source is then activated to transfer solder to the dot (dots) in registry wit the beam (or beams) of light as
indicated by block 62.
In one specific embodiment, a layer of solder .030 inch thick, adhered to a
standard microscope slide, was placed in contact with a standard work piece (carrier)
on which a pattern of metallic (gold) islands was formed normally for placement of
solder balls. Various selected sites on the solder layer were melted by directing a 15
watt turnkey laser, at a wavelength of about 800 manometers operated at four watt
output power, first for two seconds followed by a one half second pulse. The solder
was transferred to the selected metal islands and there was no need for later heating to
reflux the solder.
In another embodiment, a solder ribbon is used in the absence of a glass slide. In this embodiment, a laser bar is used to bond solder to selected ones, or all, of the
sites of a row of islands simultaneously. The solder ribbon is simply peeled away from the carrier leaving solder in place at the selected islands.
This latter embodiment is easily automated by moving standard carriers along a conveyer belt in close proximity to the periphery of a "squirrel cage" type
arrangement rotatable about an axis in synchronism with the movement of the conveyer belt. A (moving) solder ribbon is fed into the space between the periphery
of the cage and the surface of the carrier. A laser bar, positioned at the axis of the
squirrel cage, is activated to direct beams at the solder at positions in registry with
selected islands in the carrier to bond the solder to the islands. The unbonded
portions of the ribbon are removed from the carrier conveniently by elevating the path
of the ribbon prior to and after the ribbon is urged into juxtaposition with the carrier
by the squirrel cage.
Lasers are highly controllable and registry of the laser beams with the islands
of a carrier is easily accomplished by the use of fiducials as is well understood in the
art.
The invention was reduced to practice using a two millimeter thick stiff plastic
sheet used to make projection transparencies. Holes were made in the nylon with a
dental pick and the holes were filled with solder paste. The transparency was laid
over a standard substrate with gold (metallic) islands on one side with through
connections to metallic traces on the other. A laser was directed at a now paste filled
holes in registry with an island on the carrier. The solder was transferred in about
one-half second. The solder formed a mound on the island and required no reflux step.
The use of a sieve with a feature size (hole size) corresponding to the carrier island size (or much finer) permits a laser to be moved to preregistered positions to transfer solder from the previously paste filled holes in a "sieve". The sieve may be
made in strips at a previous position along a conveyor belt, filled with solder paste at a
next position and urged into juxtaposition with a carrier by a squirrel cage
arrangement with a laser diode arrangement arranged along the plane of the axes of
the squirrel cage in a manner to deliver the (4 walls) power used to effect solder
transfer.
The carrier which can already come in strips can be moved along a conveyor belt to position islands thereon for solder transfer. Figure 7 illustrates one
arrangement by which solder is formed in islands 70 on a suitable substrate 71 such as
used in ball grid array apparatus. The solder is carried into position by a transparent
plastic strip 73 which has a pattern of holes 74 shown more clearly in figure 8. Figure
9 shows the holes (74) filled with solder paste (75).
The strip (73) is urged into juxtaposition with substrate 71 by a friction wheel
or by a squirrel cage type arrangement 76 rotatable about on axis 77. Figure 10
illustrates the resulting relationship between substrate 71, strip 73, island 70, and
solder 75. If we assume that strip 73 and substrate 71 are moving to the right as
viewed in figure 7 and the squirrel cage is moving counter clockwise as represented
by arrows 78, 79, and 80 respectively, a laser beam directed at the islands along the
leading edge operates to transfer solder from holes 74 to islands in registry with those
islands just prior to the separation of strip 73 from substrate 71 as illustrated in figures 10 and 11. Specifically, a laser bar 80 (of figure 7) is positioned at the periphery of the squirrel cage to direct a light beam 82 at the holes (74) in strip 73 which are in
registry with islands along the leading edge of substrate 71. The beams are operative to transfer solder to the islands as indicated at 85 in figure 11.
The laser bar is activated in synchronism with the advance of the substrate and strip to transfer solder to a row of islands simultaneously.
The substrate 71 and strip 73 may be moved in any straightforward manner
such as from a feed spool to a take up spool (neither shown) as is clear from figure 7.
The movements of the substrate and strip and the rotation of the squirrel cage are
synchronized with the activation of the lasers of laser bar 80 in a well understood
manner. The motors for driving the spools an for rotating the cage are under the
control of a controller 88 shown in figure 7.
In an experimental arrangement strip 73 was made of a transparency used to make view graphs. A standard substrate with islands having diameters of 0.015 inch
was used. A pattern of holes was made in the strip with a dental pick and the holes were filled with solder using a knife blade. Transfer of the solder to the islands was
accomplished by laser pulses of four watts for about one-half second.
It is clear that an arrangement for transferring solder to metallic islands of a
substrate in accordance with the principles of this invention is easily automate. A
pattern of holes in a plastic strip can be formed in a well understood manner as a strip
is advanced. Also, a sieve of a material which is essentially transparent to the laser
beam can be used. Further, the pattern of holes in the strip can be made much finer
than the pattern of islands. Solder will still transfer to islands in registry with the laser beams.
The registration of the laser beams with the islands is straightforward. At the
feature size now required commercially, the synchronization of the movement of the strip, substrate and squirrel cage with the laser activation should suffice. If not,
fiducials on the substrate can be used with an appropriate sensor to ensure registration.
Figure 12 is a flow diagram of the method practiced by the apparatus of
figures 7 through 11. First, a pattern of holes is formed in a strip as indicated by
block 90 and the holes are filled with solder as indicated by block 91. The strip is then
moved into juxtaposition with a substrate with a pattern of islands on its surface as
indicated by block 92. Laser beams are directed at the solder filled holes registry with
islands to transfer solder to those islands as indicated by block 93. The strip is then separated from the substrate in a manner to leave solder coating in the islands as
indicated by block 94.
Any means for moving strip 73 of figure 7 would be suitable. The squirrel
cage is only illustrative. A sprocket gear could be used if substrate 71 were adapted
like a move film real to include the familiar holes along the edges of the film. Also, a
friction roller could be. The laser could be positioned separately next to the roller or
between two spaced apart rollers.
The strip (73) also may be any material capable of having holes formed in it
which could be filled with solder. A plastic transparency served nicely in this respect.
A sieve also is suitable. The material should be essentially non absorbing of the laser
radiation. The pattern of holes in strip 73 may be made to match the pattern of islands on substrate 71 or can be made much finer. The laser beam can be directed to a sequence
of positions corresponding to the pattern of islands and is operative to transfer solder, from a number of holes in a relatively finer pattern in the strip, to a relatively large area island corresponding to the position of the laser beam.
The laser beam diameter may be adjusted optically and can be used to transfer
a solder spot on the order of tens of microns.
The cooling of the substrate was thought to be helpful in transferring the
solder to an island destination. But this has been found unnecessary. Further,
although the invention has been illustrated in terms of a laser diode light source, other focused sources of radiation may be suitable as long as they effect solder melting
without effecting the solder carrier strip.
It is clear also that a solder carrier could be recycled by replacing solder in any
empty holes in the carrier. It should also be clear that the apparatus and method
described herein also can be used to place solder, or any similar conductive metal, on
any substrate adapted to receive such a material. In this connection the term "solder" is intended to encompass such conductive material.

Claims

WHAT IS CLAIMED IS
1 Apparatus for the placement of solder onto metallized dots of an array of dots on the surface of a carrier, said apparatus comprising means for placing a solder
strip in close proximity with said surface, said apparatus including a source of
coherent light and means for moving the light output from said source to selected
positions on said solder strip in registry with said dots, and means for activating said
source for transferring solder from said strip to the metallized dot in registry
therewith
2 Apparatus as in claim 1 wherein said solder strip is in contact with said
surface
3 Apparatus as in claim 1 wherein said solder strip is spaced apart from said
surface a distance of from 0.015 to 0 030 inch.
4 Apparatus as in claim 1 wherein said source comprises a laser diode
5 Apparatus as in claim 4 also including a mirror and means for rotating said
mirror in synchronism with the activation of said laser of transferring solder to the
metallized dots on said surface in registry with the position of said laser diode when
pulsed
6 Apparatus as in claim 4 also including a fiber optic fan coupled to said laser
diode and operative to direct light in registry with a plurality of said diodes
simultaneously.
7 Apparatus as in claim 3 wherein said solder strip is formed on the surface
of a transparent member
8 Apparatus as in claim 4 wherein said source comprises a laser bar including a plurality of laser diodes.
9. Apparatus for forming a layer of solder on metallic islands on a substrate, said apparatus comprising a layer of a transparent material having a pattern of holes therein, said holes occupying positions which correspond to the positions of said
islands, means for filling said holes with solder, means for moving said layer into a
position with respect to said substrate such that said holes are in registry with said
islands, means for directing beams of radiation at said holes at an intensity and for a
time to transfer solder from said holes to said islands, and means for separating said
layer from said substrate.
10. Apparatus as in claim 9 wherein said layer is a transparent strip and said means for directing beams comprises a laser means.
11. Apparatus as in claim 10 wherein said strip and said substrate are formed
as continuous strips and are urged into juxtaposition by a rotating wheel as the strips
are advanced.
12. Apparatus as in claim 1 1 wherein said laser mans comprises a laser bar
positioned at the periphery of said wheel.
13. A method for forming a layer of solder on metallic islands on a substrate,
said method comprising the steps of forming a pattern of holes in a strip of material
which is essentially non absorbing of radiation at a selected range of wave lengths
where the pattern of holes includes holes which correspond in position to the positions
of said islands, filling said holes with solder, placing said strip in juxtaposition with
said substrate, and directing a beam of radiation in said range at selected ones of said
holes in registry with selected ones of said islands in a manner and for a time to transfer solder to said selected islands.
14 A method as in claim 13 including the steps of moving said strips and said substrate in synchronism with one another, directing a beam of light at each island at the leading edge of said substrate, and separating said strip and said substrate at said
leading edge after transfer of solder to the islands there for defining a next consecutive
leading edge, and repeating said steps for transferring solder to the islands of
consecutive leading edges as said strips and said substrate are moved.
15 A ribbon of material non absorbing of light energy, said ribbon having therein a pattern of holes, said holes being filled with solder
16 A ribbon as in claim 15 which is flexible but retains a planar configuration,
said ribbon being transparent to laser beams, wherein said holes are filled with solder
paste.
17 Apparatus for the placement of solder onto metallized dots of an array of
dots on the surface of a carrier, said apparatus comprising means for placing a solder
strip in close proximity with said surface, said apparatus including a source of coherent light and means for moving the light output from said source to selected
positions on said solder strip in registry with said dots, and means for activating said
source for transferring solder from said strip to the metallized dot in registry
therewith
18 Apparatus as in claim 17 wherein said solder strip is in contact with said
surface
19 Apparatus as in claim 17 wherein said solder strip is spaced apart from
said surface a distance of from 0.015 to 0 030 inch
20 Apparatus as in claim 17 wherein said source comprises a laser diode
21 Apparatus as in claim 20 also including a mirror and means for rotating said mirror in synchronism with the activation of said laser for transferring solder to
the metallized dots on said surface in registry with the position of said laser diode
when pulsed
22 Apparatus as in claim 20 also including a fiber optic fan coupled to said
laser diode and operative to direct light in registry with a plurality of said diodes simultaneously
23 Apparatus as in claim 19 wherein said solder strip is formed on the surface
of a glass slide
24 Apparatus as in claim 20 wherein said source comprises a laser bar
including a plurality of laser diodes
25 Apparatus for coating metallized islands on the surface of a carrier, said
apparatus comprising means for placing a solder ribbon in contact with said surface,
said apparatus including a source of at least one beam of light and means for directing
said at least one beam at a selected one of said metallized islands, said apparatus also
including means for activating said source in a manner and for a time to transfer solder
from said ribbon to said selected island
26 Apparatus as in claim 25 wherein said source comprises a laser diode
27 Apparatus as in claim 26 wherein said source comprises a laser bar
28 Apparatus as in claim 26 including means for removing said ribbon from
said surface in a manner to leave solder coating said selected islands
29 Apparatus for placing solder onto the islands of a first pattern of metallic islands arranged in rows on a substrate, said apparatus including a planar member having a plurality of holes therein in a second pattern corresponding to said first
pattern of islands and closely spaced with respect to said islands, said planar member including solder in each of said holes, said apparatus including laser means for
directing a beam of light at the solder in said planar member a row at a time, said apparatus also including means for moving said islands and said member together with
respect to said beam of light such that said beam is directed at successive rows of said
pattern, said beam being of sufficient energy to reflow said solder.
30. Apparatus as in claim 29 wherein said laser means comprises a laser diode
and means for scanning said beam from island to island in a row.
31. Apparatus as in claim 29 wherein said laser means comprises a laser diode
and a fiber optic fan for directing said beam to all islands in a row simultaneously.
32. Apparatus as in claim 29 wherein said laser means comprises a laser diode
assembly comprising a linear array of laser diodes in positions corresponding to the
positions of islands in a row.
PCT/US1998/009162 1997-05-08 1998-05-05 Apparatus and method for forming solder bonding pads WO1998050189A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU72871/98A AU7287198A (en) 1997-05-08 1998-05-05 Apparatus and method for forming solder bonding pads

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US85406497A 1997-05-08 1997-05-08
US08/854,064 1997-05-08
US08/877,270 1997-06-17
US08/877,270 US5873511A (en) 1997-05-08 1997-06-17 Apparatus and method for forming solder bonding pads

Publications (1)

Publication Number Publication Date
WO1998050189A1 true WO1998050189A1 (en) 1998-11-12

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AU (1) AU7287198A (en)
WO (1) WO1998050189A1 (en)

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Also Published As

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AU7287198A (en) 1998-11-27

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