Classifications

• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
  • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
  • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
  • G11B7/2403—Layers; Shape, structure or physical properties thereof
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
  • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
  • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
  • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
  • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
  • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0266—Marks, test patterns or identification means
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Definitions

• the present invention relates to a storage medium and method for manufacturing thereof, especially storage medium having electronic circuit and method for manufacturing thereof.
• the present invention has been made in consideration of the above situation and it is an object of the present invention to provide a storage medium having intelligence which enables not only to reduce burden of the system itself in processing information stored in the storage medium but also, to control or manage equipment in an external system by integrating into the storage medium an electronic circuit which is adapted to the storage medium.
• Another object of the present invention is to provide a method for manufacturing such a storage medium as above.
• a storage medium comprising: a plurality of information storage surfaces for storing information ; and an electronic-circuit-mounting-surface including an electronic circuit mounted on at least a portion thereof .
• the foregoing object is attained by providing a storage medium comprising; an information storage surface for storing information ; and an electronic-circuit-mounting-surface including an electronic circuit mounted on at least a portion thereof, wherein the recording medium includes a construction enable to distinguish between an information storage surface and an electronic-circuit- mounting-surface .
• the foregoing object is attained by providing a method for manufacturing a storage medium including an electronic circuit, comprising: a step for manufacturing a plurality of parts having information storage surface for storing information, a. step for manufacturing a part having an electronic-circuit-mounting-surface including an electronic circuit on at least a portion thereof; and a step for attaching the plurality of parts having information storage surface with the part having electronic-circuit-mounting-surface.
• the electronic- circuit-mounting-surface is put between the plurality of information recording surfaces .
• the electronic- circuit-mounting-surface is put on a surface of any one of the information recording surfaces .
• the information recording surface on which the electronic-circuit- mounting-surface is put is a dummy surface.
• the electronic- circuit-mounting-surface is formed as shaped like a seal.
• balance means for adjusting balance to reduce rotational fluctuations or rotational vibration.
• the balance means includes an additional weight member disposed in a position suitable for balancing and/or an eliminated portion in a certain redundant portion of the storage maxim . .
• the storage medium is an optical disc.
• the distinction is performed by color.
• the part having electronic-circuit-mounting-surface is inserted between the plurality of parts having information storage surfaces to be bonded together.
• the plurality of parts having information recording surface are bonded together, and the part having electronic-circuit-mounting-surface is bonded on one of the surface of the parts .
• the electronic- circuit-mounting-surface is formed as shaped like a seal.
• a step for adjusting balance to compensate change in balance due to bonding of the parts having electronic-circuit-mounting-surface includes a step for adjusting balance to compensate change in balance due to bonding of the parts having electronic-circuit-mounting-surface.
• the storage medium is an optical disc .
• Fig. 1 is a drawing illustrating an example of construction of an intelligent disc, especially an optical disc of an embodiment of the present invention.
• Fig. 2 is a drawing illustrating an example of the method for manufacturing the intelligent disc of Fig. 1.
• Fig. 3 is a drawing illustrating another example of construction of the intelligent disc, especially an optical disc of an embodiment of the present invention.
• Fig. 4 is a drawing illustrating another example of the method for manufacturing the intelligent disc of Fig. 3.
• any other removable storage mediums or fixed storage mediums such as a hard-disc drive with similar effects.
• any system such as personal computers , TV receivers , video tape recorders , audio tape recorders or the like and game players or telecommunication equipment or manufacturing equipment is suitable for application of this invention as long as it uses one form or another of storage mediums .
• the electronic circuit of the intelligent disc of this embodiment can be utilized as an auxiliary of a system in video tape recorders or audio tape recorders and it also can be used as a main control of a system in game players, telecommunications equipment or manufacturing equipment. [An example of construction of the intelligent disc of this embodiment]
• Fig. 1 is a drawing illustrating an example of construction of the intelligent disc, especially an optical disc of an embodiment of the present invention.
• an intelligent disc 100 comprises information storage surfaces 101, 103 and an electronic-circuit-mounting-surface 102.
• the electronic-circuit-mounting-surface 102 includes a control member comprising, in this embodiment, a CPU 121, a ROM 122, a RAM 123, an interface circuit 126 which are interconnected through a bus 125.
• a power source 124 is further included thereon for supplying electricity to each element of the electronic circuit. [Electronic circuit]
• the electronic circuit mounted on the electronic- circuit-mounting-surface 102 is illustrated in Fig. 1 as being constructed by providing functionally separated component parts or elements but it may be mounted on a dielectric substrate such as a printed circuit board or a ceramic substrate. Also, each element may be constructed by providing a combination of logic elements, gate arrays, one chip device or SOC (system-on-chip) . Also, it may be constructed by semiconductor circuits formed on a silicon substrate, a ceramic substrate or dielectric substrate. It further may be constructed by laminating those substrates.
• the electronic circuit is preferably positioned around the center portion of the disc for the benefit of stability of the interface or disc but it may be positioned in any portion of the disc by providing some measures necessary to maintain stability of the disc, such as addition of a balance weight or elimination of some portion of the disc to attain balance.
• the power source 124 may be a battery or an air cell which generates electricity by itself by means of chemical reactions or any of those which is constructed so as to receive energy supply from an external source through transmission by means of light, wireless or induction or any combination of those mentioned above. Further it may be a system in which both signals and power are transmitted and received in duplicated manner. Further, the power source 124 can serve not only for supplying power to each element carried on electronic-circuit-mounting-surface 102 but also, can work as a power source for an external system, if the intelligent disc 100 is to serve as a main control for the external system. In such an instance the intelligent disc 100 can serve as a "certification card" to enable to use the external system. On the contrary if power is supplied from the system, no power source 124 is required on the intelligent disc 100. [Interface]
• the interface circuit 126 is a circuit for conducting communication between the intelligent disc and external circuits. In practice, it can be a circuit for coupling signals from the bus 125 with an external circuit or may be a circuit for conducting on signals from the bus 125 such operations as modification, conversion, amplification or modulation to couple and transmit the resultant signals to an external circuit. Of course it may be a circuit which conduct parallel- serial conversion for serial-transmission or a circuit with massively parallel path (one with a transmission path having larger number of parts than that of the bus) or with additional error-correcting codes.
• junction or connecting terms between the interface circuit 126 and the external circuit should desirably be standardized or specified in both hardware-related connecting terms such as electrical connecting terms regarding to electrical signals and timing and mechanical or constructional connecting terms regarding to mechanical structure and software-related connecting terms such as processing terms, procedures and protocols. Further, as for the manner for coupling the interface, either a contact type, contactless type or one with both type may be suitable. [Information storage surface]
• the information storage surfaces 101 and 103 in Fig. 1 are the surfaces on which information of the intelligent disc 100 of this embodiment is recorded which is, for example, an information storage surfaces of optical discs.
• the storage format of the information recorded on the information storage surface may be in a similar .form of bits as in the conventional optical disc or that of MO disc or may be recorded by changing dye for storage.
• the information stored in the optical disc is retrieved by an optical disc control device (not shown) .
• an optical disc control device not shown
• Fig. 2 illustrates an example of the production process of the intelligent disc according to the present embodiment in Fig. 1.
• Fig. 2 is a drawing to describe main production process of the intelligent disc, specifically of the optical disc and checking step in each production step and the final inspection step before shipment of the finished products are omitted.
• the production process of the intelligent disc according to the present embodiment illustrated in Fig. 2 is as follows:
• Fig. 2 illustrates the production process of the intelligent disc along that of the optical disc but the intelligent disc is not necessarily limited to an optical disc.
• production process of the information storage surface comprises a production line for the first information storage surface and that of the second information storage surface. However, as production steps in both lines are similar, each step in the production lines for the first information storage surface and the second information storage surface will be described in parallel.
• a mold or stamper is produced before the steps illustrated in Fig. 2 and starting from the stamper each step in the production of the information storage surface in Fig. 2 proceeds.
• production process of a stamper generally comprises first polishing and cleansing a glass disc for production of a stamper and next applying photoresist on its surface. Then the photoresist is exposed to a laser beam to perform cutting. By developing the exposed photoresist necessary pits and bumps are formed on the glass disc. Next the surface is plated with a silver layer over which a nickel layer is plated further to produce a master stamper by peeling off the nickel layer. The nickel stamper is further plated again with a nickel layer which is removed to obtain a mother stamper. As illustrated in Fig. 2 the production line for the first information storage surface comprises steps Sll to S15, while the production line for the second information storage surface comprises steps S21 to S25.
• First steps Sll or S21 are for forming a substrate, in which molten resin such as polyolefin is injected onto a stamper used as a matrix. At this time transparent resin is. used to produce the substrate for the first information storage surface and blue-colored resin for the second information storage surface. Then, in cooling and removal steps of S12 or S22, a resin disc is cooled and removed out of the stamper. In the next steps of S13 or S23 a reflective film is formed on the resin disc by spattering process. In steps S14 or S24 the reflective film is coated with a protective film to be hardened by UV light. Then, in steps S15 or S25 adhesive is coated to advance to the bonding step. [Production of electronic-circuit-mounting-surface]
• the production line of the electronic-circuit- mounting-surface comprises steps S31 to S37 in Fig. 2.
• step S31 a resin disc is prepared by injection.
• step S32 a conductive layer is formed by spattering.
• step S33 photoresist is printed (coated) on portions which is later to become wiring of circuits. Drying of the photoresist, though omitted in Fig. 2, in some cases, done under ambient conditions but usually drying is conducted under UV light or infrared radiation.
• steps without photoresist is etched. This etching may be conducted either by dry-etching or by wet-etching.
• step S35 after completion of etching photoresist printed in step S33 is removed by ashing.
• the ashing step may be either dry or wet-ashing. Some types of. photoresist does not require any ashing.
• step S36 electronic elements or component parts are mounted.
• Those electrical parts mounted in step S36 may be, as aforementioned, discrete ones such as functionally separated component parts or discrete devices, or they may be mounted on a printed circuit board, a flexible printed circuit board, a ceramic substrate or other kinds of dielectric substrate.
• each of the electronic circuits may be constructed with combination of logic elements or may include gate arrays , one chip microprocessors, or semiconductor circuits formed as SOC (silicon-on-chip) to be mounted as a chip. Needless to say semiconductor circuits may be directly formed on the electronic-circuit-mounting-surface.
• process proceeds to the next step S37 to coat or form a protective layer.
• the protective layer may or may not be applied in accordance with requirement.
• Balance adjustment process In case electrical parts are formed on the resin in the production process of the electronic-circuit- mounting-surface, there is likelihood of irregular revolution being developed during disc rotation, if there is any eccentricity in weight distribution. This eccentricity is adjusted in a balance adjustment step which, for example, is placed after the step S36 as shown in. Fig. 2. In the balance adjustment step balance is achieved by placing a weight at a balancing position as shown by 130 in Fig. 2 or by removing a part of the resin disc as shown by 131 in Fig. 2. Looking downward on a disc a weight 132 is placed on the disc surface or a part of the resin disc is removed as shown by 133. As these steps require precision, in mass production process, positioning of component parts, placing of specified weight at specified position or a part to be removed are predetermined, so that it is possible to integrate those steps into the production process. [Bonding steps]
• the intelligent disc in the present invention can also be produced by first preparing a information storage surface and then by laminating a electronic-circuit-mounting-surface including electronic circuits on at least a part of the other side of the information storage surface. Also, it is possible to prepare, first, a electronic-circuit-mounting-surface on one side, then produce the information storage surface on the other side thereof. Another information storage surface can be bonded afterwards so as to sandwich the electronic-circuit-mounting-surface.
• the intelligent disc 200 comprises information storage surfaces 201, 202 and an electronic-circuit-mounting-surface 203.
• the electronic-circuit-mounting-surface 203 includes a control member comprising, in this embodiment, a CPU 221, a ROM 222, a RAM 223, an interface circuit 226 which are interconnected through a bus 225.
• a power source 224 is further included thereon for supplying electricity to each element of the electronic circuit.
• the construction and function of each of the components of the electronic-circuit-mounting-surface 203 are similar to those shown in Fig. 1.
• the second information storage surface is colored to distinguish the top side from the bottom of the disc but in this instance the electronic-circuit-mounting-surface is colored for this purpose.
• Fig. 4 illustrates an example of the production process of an intelligent disc according to the present embodiment in Fig. 3.
• the production process of the intelligent disc according to the present embodiment illustrated in Fig. 3 is as follows: In the production line for the information storage surface produced is the information storage surface 201 and the dummy surface 202, both of which are bonded together to produce a single-sided optical disc. Also, in the production line for the electronic-circuit- mounting-surface the electronic-circuit-mounting-surface 203 is produced and next in the electronic-circuit- mount.ing-surface bonding step the electronic-circuit- mounting-surface and dummy surface 202 of the single- sided optical disc are bonded together to complete the production process and to obtain finished products.
• production process of a stamper generally comprises first polishing and cleansing a glass disc for production of a stamper and next applying photoresist on its surface.
• the photoresist is exposed to a laser beam to perform cutting. By developing the exposed photoresist necessary pits and bumps are formed on the glass disc.
• the surface is plated with a silver layer over which a nickel layer is plated further to produce a master stamper by peeling off the nickel layer.
• the master stamper further plated again with a nickel layer which is removed to obtain a mother stamper.
• steps S41 to S45 of production line for the information storage surface correspond with steps Sll to S15 of Fig. 2.
• step 46 the dummy surface is bonded the protective layer and the process proceeds to the step of bonding together of electronic-circuit-mounting-surface.
• the production line of the electronic-circuit- mounting-surface comprises steps S51 to S57 in Fig. 4 which correspond with steps S31 to S37 in Fig. 2. Also, the balance adjustment step between S56 and S57 is the same as that of Fig. 2.
• a hardware system or a peripheral equipment (not shown) is controlled, as a peripheral equipment viewed from the intelligent disc 100 of Fig. 1, by means of a standardized interface between the information storage surface and the hardware system or the peripheral equipment, which is an external circuit or system connected with the information-storage- medium through the interface circuit, in place of the basic input/output system (BIOS) of the conventional operating system (OS) .
• BIOS basic input/output system
• OS or internal processing program may operate for internal processing, as long as the interface used for connecting with the interface circuit 126 complies with the standardized specifications.
• the external equipment which is connected as a peripheral equipment through the interface circuit 126 to the electronic circuit mounted on the electronic-circuit-mounting- surface 102 of the intelligent disc 100 to serve as the control circuit, is connected as an external device or a peripheral device which performs standardized specified operations in the similar manner of connection in the case of a conventional software in which the control of a peripheral equipment is conducted in accordance with specified procedures by separating the peripheral equipment by using a BIOS.
• An external circuit such as a peripheral equipment or a system (not shown) is connected as a peripheral equipment viewed from the intelligent disc 100 through the interface circuit 126.
• any external circuit can be connected with the intelligent disc 100 as long as the interface terms are complied with.
• the basic program of CPU 121 is stored in ROM 122 and when the intelligent disc is mounted in the external device, the program stored in ROM 122 starts running using RAM 123, if necessary. From then on, the external device works as a peripheral equipment of the intelligent disc in response to input/output of signals from the interface circuit 126 exchanging data with each other. In this instance a expanded RAM may be included in the external device .
• a necessary program such as an operating system, information or data are retrieved from information storage surfaces 101 or 103 by means of an optical disc control circuit (not shown) .
• the program, information or data thus retrieved are fed through the interface circuit 126 into the intelligent disc for processing or modification of data, if required, or for synthesizing with data information stored in ROM 122 or RAM 123, if necessary, or for forming control signals or data by referring to a table, if necessary, to transmit to the external device as control signals or data and to store in RAM 123 or expanded RAM.
• the external device is not necessarily limited or restricted to a video device or a display device.
• the present invention provide a storage medium having an intelligent disc which enables not only to reduce the burden of a system in processing information stored in the storage medium but also, to manage or control an external system equipment by integrating into a storage medium an electronic circuit adapted to the storage medium and a method for manufacturing thereof .
• the present invention is described referring to the preferred embodiments but it should be understood that the present invention is not limited to the specific embodiments described in this specification. To the contrary, the present invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the claims.

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Citations (6)

• 1997
  • 1997-06-19 JP JP9162960A patent/JPH1116206A/ja active Pending
• 1998
  • 1998-06-18 WO PCT/JP1998/002697 patent/WO1998058372A1/en not_active Application Discontinuation
  • 1998-06-18 EP EP98928547A patent/EP0919057A1/de not_active Withdrawn
  • 1998-06-18 AU AU80340/98A patent/AU8034098A/en not_active Abandoned
  • 1998-06-18 KR KR1019997000960A patent/KR20000068059A/ko not_active Application Discontinuation

Patent Citations (6)

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