WO1999002023A1 - Device for a circuit board - Google Patents

Device for a circuit board Download PDF

Info

Publication number
WO1999002023A1
WO1999002023A1 PCT/SE1998/001256 SE9801256W WO9902023A1 WO 1999002023 A1 WO1999002023 A1 WO 1999002023A1 SE 9801256 W SE9801256 W SE 9801256W WO 9902023 A1 WO9902023 A1 WO 9902023A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
thermally conductive
plate
plateau
components
Prior art date
Application number
PCT/SE1998/001256
Other languages
French (fr)
Inventor
Hans Hallberg
Original Assignee
Aktiebolaget Electrolux
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aktiebolaget Electrolux filed Critical Aktiebolaget Electrolux
Publication of WO1999002023A1 publication Critical patent/WO1999002023A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge

Definitions

  • the present invention relates to a device for a circuit board having at least one printed circuit with electronic components, at least one of the components being a heat emitting power component that is thermally connected to a plate of thermally conductive material arranged as a sandwich construction at the circuit board. It has previously been suggested to cool electronic power components arranged on a circuit board by using separate cooling flanges or cooling surfaces of metal, and to thermally connect such surfaces or flanges with the power components. However, these cooling devices are space demanding and cumbersome to assemble and do not fit into current series production. It has also been proposed to use cooling devices for circuit boards, see US
  • the circuit board is combined with a thermally conductive plate and a thermally conductive, electrically insulating layer into one single compact unit.
  • the pins of the power component are the thermally conductive part and protrude into the electrically insulated layer beneath.
  • the heat transfer capacity for this arrangement is, however, limited between the power component, the thermally conductive layer, and the plate in dependence on the size of the heat conductive surfaces of the thin pins. In order to achieve a reasonable heat transfer the pins have to be comparatively long which means that the thermally conductive layer in which the pins are embedded has to be comparatively thick which increases the total thickness of the sandwich or laminate construction.
  • the present invention is directed toward a cooling arrangement which is integrated with the circuit board to provide a thin compact unit which is easy to produce.
  • the cooling surfaces of the power components which generally have the same extension as one of the sides of the components, fully abut the plate or the thermally conductive layer.
  • the abutting surface between the plate and the power component is generally in the same plane as the outwardly facing surface of the circuit board on which the integrated circuit and the components are arranged by means of surface mounting.
  • the present invention permits circuit boards comprising several layers to be used, i.e. such circuit boards that comprise more than one layer with electrically conductive paths, the components on the side facing the plate being allowed to protrude through the plate via openings in the plate.
  • the different parts are connected to each other by means of mechanical joints which means that conventional, production unfriendly gluing methods, can be avoided.
  • Fig. 1 is a top plan view of a circuit board and thermally conductive plate according to the present invention
  • Fig. 2 is a bottom plan view of the circuit board and plate shown in Fig. 1 ;
  • Fig. 3 is a vertical section of the circuit board and plate as seen along the line III-III in Fig. 1; and
  • Fig. 4 is an enlarged portion of Fig. 3.
  • an arrangement according to the present invention comprises a circuit board 10, a thermally conductive plate 11, an electrically insulating layer 12, and several thermally conductive and electrically insulating layers 13.
  • the thermally conductive plate 11 is preferably formed from aluminum.
  • the illustrated circuit board 10 is a two layer board having electrically conductive paths on both sides but, of course, it is possible to use suitable circuit boards having several layers.
  • the electrically conductive paths are, by means of surface mounting methods and/or via soldering joints, connected to electronic components 14, 15 protruding from both sides of the circuit board.
  • Some of the components are power components 15 which emit rather large quantities of heat and, accordingly, need some type of cooling.
  • the thermally conductive plate 11 has several upwardly protruding plateaus
  • the thermally conductive layers 13 are formed on the plateaus 16.
  • the plate 11 also has several openings 17 and recesses 18 through which some of the components, which are placed on the side of the circuit board 10 facing the plate 11, protrude.
  • the plateaus 16 protrude through openings 19 in the circuit board 10 and serve as supports for the power components 15.
  • a bottom side of the power components 15 have a heat transferring surface 20 resting directly against the thermally conductive layer 13 which, in turn, is arranged on the plateaus 16.
  • the power components 15 in a conventional manner are provided with several pins 21 which are electrically connected to the electrically conductive paths arranged on the circuit board and are pressed toward the plateaus 16, for instance, by means of spring clamps 22.
  • the electrically insulating layer 12 which preferably is a plastic film sold under the trademark MYLAR, i.e. a flexible film of polyester, is clamped between the plate 11 and the circuit board 10.
  • the plate 11 and circuit board 10 are fixed to each other by means of mechanical joints or fasteners, such as a screw 23. It is also possible to secure the plate 11 to the board 10 by using pins which extend from the cooling plate 11 through the insulating layer 12 and the circuit board, and which are deformed or bent over on an opposite side of the circuit board 10.
  • the thermally conductive plate 11 absorbs heat from the power components
  • the relatively large surface area of the plate 11 provides good heat dissipation characteristics. Placing the plateaus 16 on the same plane as the circuit board 10 permits power components 15 to be secured to the plateaus and to the circuit board without requiring any structural modification of the components 15. Mechanical fastening of the plate 11 to the board 10 permits secure attachment without use of time and labor intensive gluing techniques.

Abstract

A device for a circuit board (10) having one or more printed circuits with electronic components (14, 15). At least one of the components is a heat emitting power component (15) that is thermally connected to a plate (11) of thermally conductive material arranged as a sandwich or laminate construction at the circuit board. The thermally conductive plate (11) includes plateaus (16) extending toward the circuit board. The plateaus are covered by an electrically insulating and thermally conductive layer (13). The power component (15) is provided with a heat transferring surface (20) which abuts the plateau (16) or the thermally conductive layer (13).

Description

DEVICE FOR A CIRCUIT BOARD
The present invention relates to a device for a circuit board having at least one printed circuit with electronic components, at least one of the components being a heat emitting power component that is thermally connected to a plate of thermally conductive material arranged as a sandwich construction at the circuit board. It has previously been suggested to cool electronic power components arranged on a circuit board by using separate cooling flanges or cooling surfaces of metal, and to thermally connect such surfaces or flanges with the power components. However, these cooling devices are space demanding and cumbersome to assemble and do not fit into current series production. It has also been proposed to use cooling devices for circuit boards, see US
4979074, wherein the circuit board is combined with a thermally conductive plate and a thermally conductive, electrically insulating layer into one single compact unit. According to this arrangement, the pins of the power component are the thermally conductive part and protrude into the electrically insulated layer beneath. The heat transfer capacity for this arrangement is, however, limited between the power component, the thermally conductive layer, and the plate in dependence on the size of the heat conductive surfaces of the thin pins. In order to achieve a reasonable heat transfer the pins have to be comparatively long which means that the thermally conductive layer in which the pins are embedded has to be comparatively thick which increases the total thickness of the sandwich or laminate construction.
The present invention is directed toward a cooling arrangement which is integrated with the circuit board to provide a thin compact unit which is easy to produce. In accordance with the present invention, the cooling surfaces of the power components, which generally have the same extension as one of the sides of the components, fully abut the plate or the thermally conductive layer. The abutting surface between the plate and the power component is generally in the same plane as the outwardly facing surface of the circuit board on which the integrated circuit and the components are arranged by means of surface mounting. The present invention permits circuit boards comprising several layers to be used, i.e. such circuit boards that comprise more than one layer with electrically conductive paths, the components on the side facing the plate being allowed to protrude through the plate via openings in the plate. In further accordance with the present invention, the different parts are connected to each other by means of mechanical joints which means that conventional, production unfriendly gluing methods, can be avoided.
These and further features of the invention will be apparent with reference to the following description and drawings, wherein: Fig. 1 is a top plan view of a circuit board and thermally conductive plate according to the present invention;
Fig. 2 is a bottom plan view of the circuit board and plate shown in Fig. 1 ; Fig. 3 is a vertical section of the circuit board and plate as seen along the line III-III in Fig. 1; and Fig. 4 is an enlarged portion of Fig. 3.
With reference to the drawing figures, an arrangement according to the present invention comprises a circuit board 10, a thermally conductive plate 11, an electrically insulating layer 12, and several thermally conductive and electrically insulating layers 13. The thermally conductive plate 11 is preferably formed from aluminum.
The illustrated circuit board 10 is a two layer board having electrically conductive paths on both sides but, of course, it is possible to use suitable circuit boards having several layers. The electrically conductive paths are, by means of surface mounting methods and/or via soldering joints, connected to electronic components 14, 15 protruding from both sides of the circuit board. Some of the components are power components 15 which emit rather large quantities of heat and, accordingly, need some type of cooling.
The thermally conductive plate 11 has several upwardly protruding plateaus
16 which lie generally in the same plane as the upper side of the circuit board 10, as shown in Fig. 3, and which have been shaped in the plate by suitable deforming methods such as pressing. The thermally conductive layers 13 are formed on the plateaus 16. The plate 11 also has several openings 17 and recesses 18 through which some of the components, which are placed on the side of the circuit board 10 facing the plate 11, protrude. The plateaus 16 protrude through openings 19 in the circuit board 10 and serve as supports for the power components 15. A bottom side of the power components 15 have a heat transferring surface 20 resting directly against the thermally conductive layer 13 which, in turn, is arranged on the plateaus 16. The power components 15 in a conventional manner are provided with several pins 21 which are electrically connected to the electrically conductive paths arranged on the circuit board and are pressed toward the plateaus 16, for instance, by means of spring clamps 22.
The electrically insulating layer 12, which preferably is a plastic film sold under the trademark MYLAR, i.e. a flexible film of polyester, is clamped between the plate 11 and the circuit board 10. The plate 11 and circuit board 10 are fixed to each other by means of mechanical joints or fasteners, such as a screw 23. It is also possible to secure the plate 11 to the board 10 by using pins which extend from the cooling plate 11 through the insulating layer 12 and the circuit board, and which are deformed or bent over on an opposite side of the circuit board 10. The thermally conductive plate 11 absorbs heat from the power components
15 and communicates the absorbed heat away from the power components. The relatively large surface area of the plate 11 provides good heat dissipation characteristics. Placing the plateaus 16 on the same plane as the circuit board 10 permits power components 15 to be secured to the plateaus and to the circuit board without requiring any structural modification of the components 15. Mechanical fastening of the plate 11 to the board 10 permits secure attachment without use of time and labor intensive gluing techniques.

Claims

1. Device for a circuit board (10) having at least one printed circuit and a plurality of electronic components (14, 15), at least one of the components being a heat emitting power component (15) that is thermally connected to a plate (11) of thermally conductive material arranged as a sandwich construction on the circuit board, characterized in that the thermally conductive plate (11) comprises at least one plateau (16) which extends toward the circuit board, said at least one plateau is covered by an electrically insulating and thermally conductive layer (13), and said power component (15) has a heat transferring surface (20) which abuts said thermally conductive layer (13).
2. Device according to claim 1, characterized in that the circuit board (10) is provided with at least one opening (19), and said plateau (16) extends into said at least one opening (19).
3. Device according to claim 1 or 2, characterized in that said plateau (16) is disposed at an edge portion of the plate (11).
4. Device according to claim 3, characterized in that the power component (15) is urged toward said thermally conductive layer (13) by means of at least one spring clamp (22) surrounding the edge portion.
5. Device according to claim 4, characterized in that the plate (11) has at least one opening (17) through which components (14) of a circuit of the circuit board (10) facing the plate (11) extend.
6. Device according to claim 1, characterized in that an abutting surface of the plateau (16) lies generally in the same plane as one side of the circuit board (10).
7. Device according to any of the preceding claims, characterized in that the circuit board (10) and the thermally conductive plate (11) are mechanically connected to each other.
8. Device according to any of the preceding claims, characterized in that the circuit board (10) and the thermally conductive plate (11) are mechanically connected to each other.
9. Device according to any of the preceding claims, characterized in that said at least one plateau (16) has a surface which is generally co-planar with a surface of said circuit board.
PCT/SE1998/001256 1997-07-04 1998-06-26 Device for a circuit board WO1999002023A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9702593A SE9702593D0 (en) 1997-07-04 1997-07-04 Device on a circuit board
SE9702593-6 1997-07-04

Publications (1)

Publication Number Publication Date
WO1999002023A1 true WO1999002023A1 (en) 1999-01-14

Family

ID=20407646

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1998/001256 WO1999002023A1 (en) 1997-07-04 1998-06-26 Device for a circuit board

Country Status (2)

Country Link
SE (1) SE9702593D0 (en)
WO (1) WO1999002023A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1049362A2 (en) * 1999-04-30 2000-11-02 Würth Elektronik GmbH Circuit substrate with heat conducting portion
EP1345265A2 (en) * 2002-03-15 2003-09-17 Delphi Technologies, Inc. Electronics assembly with improved heatsink configuration
DE102005034546A1 (en) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Module with cooling device, has melt-body retained in number of cooling chambers
DE102005039374A1 (en) * 2005-08-19 2007-02-22 BSH Bosch und Siemens Hausgeräte GmbH Housing for an electronic circuit having one housing part formed as a heat sink
US7271781B2 (en) 2000-03-03 2007-09-18 The United States Of America As Represented By The Secretary Of The Department Of Health And Human Services Multiplex hybridization system for identification of pathogenic mycobacterium and method of use
GB2460124A (en) * 2008-05-21 2009-11-25 Nujira Ltd Printed circuit board with co-planar plate
DE102009051632A1 (en) * 2009-11-02 2011-05-05 Beru Ag Printed circuit board for glow plug control device, has cooling body designed as metal plate, which carries board and exhibits projections that are engaged or pressed into recess of board, where projections carry electronic components

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774078A (en) * 1972-03-29 1973-11-20 Massachusetts Inst Technology Thermally integrated electronic assembly with tapered heat conductor
US4535385A (en) * 1983-04-22 1985-08-13 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US5526229A (en) * 1992-02-26 1996-06-11 Seiko Epson Corporation Temperature control for add-on electronic devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3774078A (en) * 1972-03-29 1973-11-20 Massachusetts Inst Technology Thermally integrated electronic assembly with tapered heat conductor
US4535385A (en) * 1983-04-22 1985-08-13 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US5526229A (en) * 1992-02-26 1996-06-11 Seiko Epson Corporation Temperature control for add-on electronic devices
US5615085A (en) * 1992-02-26 1997-03-25 Seiko Epson Corporation Temperature control for add-on electronic devices

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1049362A2 (en) * 1999-04-30 2000-11-02 Würth Elektronik GmbH Circuit substrate with heat conducting portion
EP1049362B1 (en) * 1999-04-30 2006-05-31 Würth Elektronik Rot am See GmbH & Co. KG Circuit substrate with heat conducting portion
US7271781B2 (en) 2000-03-03 2007-09-18 The United States Of America As Represented By The Secretary Of The Department Of Health And Human Services Multiplex hybridization system for identification of pathogenic mycobacterium and method of use
EP1345265A2 (en) * 2002-03-15 2003-09-17 Delphi Technologies, Inc. Electronics assembly with improved heatsink configuration
EP1345265A3 (en) * 2002-03-15 2005-05-11 Delphi Technologies, Inc. Electronics assembly with improved heatsink configuration
DE102005034546A1 (en) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Module with cooling device, has melt-body retained in number of cooling chambers
DE102005039374A1 (en) * 2005-08-19 2007-02-22 BSH Bosch und Siemens Hausgeräte GmbH Housing for an electronic circuit having one housing part formed as a heat sink
GB2460124A (en) * 2008-05-21 2009-11-25 Nujira Ltd Printed circuit board with co-planar plate
DE102009051632A1 (en) * 2009-11-02 2011-05-05 Beru Ag Printed circuit board for glow plug control device, has cooling body designed as metal plate, which carries board and exhibits projections that are engaged or pressed into recess of board, where projections carry electronic components

Also Published As

Publication number Publication date
SE9702593D0 (en) 1997-07-04

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