WO1999008297A3 - Method of manufacturing a plurality of electronic components - Google Patents

Method of manufacturing a plurality of electronic components Download PDF

Info

Publication number
WO1999008297A3
WO1999008297A3 PCT/IB1998/000916 IB9800916W WO9908297A3 WO 1999008297 A3 WO1999008297 A3 WO 1999008297A3 IB 9800916 W IB9800916 W IB 9800916W WO 9908297 A3 WO9908297 A3 WO 9908297A3
Authority
WO
WIPO (PCT)
Prior art keywords
segment
slots
thin
walls
major surface
Prior art date
Application number
PCT/IB1998/000916
Other languages
French (fr)
Other versions
WO1999008297A2 (en
Inventor
Antonius Johannes Ma Nellissen
Grunsven Erik Cornelis Egb Van
Original Assignee
Koninkl Philips Electronics Nv
Philips Svenska Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Philips Svenska Ab filed Critical Koninkl Philips Electronics Nv
Priority to EP98923002A priority Critical patent/EP0941545B1/en
Priority to DE69833193T priority patent/DE69833193T2/en
Priority to CNB98801419XA priority patent/CN1179381C/en
Priority to JP11511887A priority patent/JP2001502123A/en
Publication of WO1999008297A2 publication Critical patent/WO1999008297A2/en
Publication of WO1999008297A3 publication Critical patent/WO1999008297A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Abstract

A method of manufacturing a plurality of thin-film, surface-mountable, electronic components (23), comprising the following successive steps: a) providing a substantially planar, ceramic substrate (1) having a first (a) and second (1b) major surface which are mutually parallel, the substrate (1) containing a series of mutually parallel slots (3) which extend from the first major surface (1a) through to the second major surface (1b), such slots (3) serving to subdivide the substrate (1) into elongated segments (5) extending parallel to the slots (3) and located between consecutive pairs thereof, each segment (5) having two oppositely located walls (7a, 7b) extending along the edges of the adjacent slots (3), each segment carrying a thin-film electrode structure (9) on at least one of its first (1a) and second (1b) major surfaces; b) with the aid of a three-dimensional lithographic technique, providing electrical contacts (21) which extend along both walls (7a, 7b) of each segment (5) and which make electrical contact with the electrode structure (9) on each segment (5); c) severing the segments (5) into individual block-shaped components (23) by severing them along a series of division lines (25) extending substantially perpendicular to the walls (7a, 7b) of each segment (5). This method can be used to manufacture various types of component (23), such as thin-film resistors, fuses, capacitors and inductors, but also passive networks, such as RC and LCR networks.
PCT/IB1998/000916 1997-08-05 1998-06-11 Method of manufacturing a plurality of electronic components WO1999008297A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP98923002A EP0941545B1 (en) 1997-08-05 1998-06-11 Method of manufacturing a plurality of electronic components
DE69833193T DE69833193T2 (en) 1997-08-05 1998-06-11 METHOD FOR PRODUCING MULTIPLE ELECTRONIC COMPONENTS
CNB98801419XA CN1179381C (en) 1997-08-05 1998-06-11 Method of mfg. plurality of electronic components
JP11511887A JP2001502123A (en) 1997-08-05 1998-06-11 Manufacturing method of multiple electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP97202432 1997-08-05
EP97202432.7 1997-08-05

Publications (2)

Publication Number Publication Date
WO1999008297A2 WO1999008297A2 (en) 1999-02-18
WO1999008297A3 true WO1999008297A3 (en) 1999-04-15

Family

ID=8228622

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1998/000916 WO1999008297A2 (en) 1997-08-05 1998-06-11 Method of manufacturing a plurality of electronic components

Country Status (8)

Country Link
US (1) US6240621B1 (en)
EP (1) EP0941545B1 (en)
JP (1) JP2001502123A (en)
KR (1) KR100561792B1 (en)
CN (1) CN1179381C (en)
DE (1) DE69833193T2 (en)
TW (1) TW412763B (en)
WO (1) WO1999008297A2 (en)

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US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6018448A (en) * 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US6452247B1 (en) 1999-11-23 2002-09-17 Intel Corporation Inductor for integrated circuit
US6856228B2 (en) * 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
US6870456B2 (en) * 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US6815220B2 (en) 1999-11-23 2004-11-09 Intel Corporation Magnetic layer processing
US6891461B2 (en) * 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
JP3955241B2 (en) * 2002-06-21 2007-08-08 東京エレクトロン株式会社 MEMS array, manufacturing method thereof, and manufacturing method of MEMS device based thereon
KR100678496B1 (en) * 2002-09-10 2007-02-06 티디케이가부시기가이샤 Multilayer capacitor
ATE426837T1 (en) * 2002-09-27 2009-04-15 Koninkl Philips Electronics Nv LITHOGRAPHIC METHOD FOR WIRING A SIDE SURFACE OF A SUBSTRATE
US7852185B2 (en) * 2003-05-05 2010-12-14 Intel Corporation On-die micro-transformer structures with magnetic materials
KR20060120683A (en) 2003-12-22 2006-11-27 엑스2와이 어테뉴에이터스, 엘.엘.씨 Internally shielded energy conditioner
US7817397B2 (en) 2005-03-01 2010-10-19 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
US7630188B2 (en) 2005-03-01 2009-12-08 X2Y Attenuators, Llc Conditioner with coplanar conductors
US8134548B2 (en) * 2005-06-30 2012-03-13 Micron Technology, Inc. DC-DC converter switching transistor current measurement technique
CN101395683A (en) 2006-03-07 2009-03-25 X2Y衰减器有限公司 Energy conditioner structures
JP4872134B2 (en) * 2008-03-31 2012-02-08 Ｔｄｋ株式会社 Terminal electrode formation method
JP5233637B2 (en) * 2008-04-02 2013-07-10 日立金属株式会社 Multilayer ceramic substrate and electronic component
CN102122553B (en) * 2010-12-17 2013-03-20 深圳顺络电子股份有限公司 Low-resistance-value sheet-type negative-temperature-coefficient thermal resistor with horizontal structure and manufacturing method thereof
DE102011005658A1 (en) * 2011-03-16 2012-09-20 Sirona Dental Systems Gmbh Carrier, preferably for an electronic component, an assembly of such carriers and a method for producing an assembly of such carriers
DE102012109704A1 (en) * 2012-10-11 2014-04-17 Epcos Ag Ceramic component with protective layer and method for its production
JP6136507B2 (en) * 2013-04-16 2017-05-31 Tdk株式会社 Multilayer capacitor array
CN109963409B (en) * 2019-04-10 2021-02-23 京东方科技集团股份有限公司 Manufacturing method of substrate side surface wire and substrate structure

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Also Published As

Publication number Publication date
KR100561792B1 (en) 2006-03-21
EP0941545B1 (en) 2006-01-11
US6240621B1 (en) 2001-06-05
CN1241285A (en) 2000-01-12
TW412763B (en) 2000-11-21
EP0941545A2 (en) 1999-09-15
CN1179381C (en) 2004-12-08
DE69833193T2 (en) 2006-09-21
JP2001502123A (en) 2001-02-13
DE69833193D1 (en) 2006-04-06
WO1999008297A2 (en) 1999-02-18
KR20000068710A (en) 2000-11-25

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