WO2000041217A3 - Method and apparatus for preventing warp of clamp ring used for wafer coating apparatus - Google Patents

Method and apparatus for preventing warp of clamp ring used for wafer coating apparatus Download PDF

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Publication number
WO2000041217A3
WO2000041217A3 PCT/US1999/030673 US9930673W WO0041217A3 WO 2000041217 A3 WO2000041217 A3 WO 2000041217A3 US 9930673 W US9930673 W US 9930673W WO 0041217 A3 WO0041217 A3 WO 0041217A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
wafer
ring
clamping ring
clamp ring
Prior art date
Application number
PCT/US1999/030673
Other languages
French (fr)
Other versions
WO2000041217A2 (en
Inventor
Ira Reiss
Original Assignee
Tokyo Electron Ltd
Tokyo Electron Arizona Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Tokyo Electron Arizona Inc filed Critical Tokyo Electron Ltd
Priority to JP2000592861A priority Critical patent/JP3834478B2/en
Priority to EP99968531A priority patent/EP1062690A1/en
Publication of WO2000041217A2 publication Critical patent/WO2000041217A2/en
Publication of WO2000041217A3 publication Critical patent/WO2000041217A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Abstract

Warping of a clamping ring, by which a series of semiconductor wafers (17) is held to a wafer holder (10) for vapor deposition of coatings onto the wafers (17), is retarded by providing a clamping ring (12) formed of the material having a coefficient of thermal expansion that is approximately the same as or close to that of the coating material being deposited onto the wafers (17). Preferably, the clamping ring (12) is one having a generally circular opening (24) that is slightly smaller than the wafers (17) to be clamped and that has a flat edge (29) on the inner edge (18) of the ring (12) corresponding to the orientation flat found on the outer edge of an industry standard wafer (17), so that the ring (12) engages the wafer during clamping around the entire outer rim of the wafer (17).
PCT/US1999/030673 1999-01-08 1999-12-22 Method and apparatus for preventing warp of clamp ring used for wafer coating apparatus WO2000041217A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000592861A JP3834478B2 (en) 1999-01-08 1999-12-22 Wafer coating apparatus clamping ring bending prevention method and apparatus
EP99968531A EP1062690A1 (en) 1999-01-08 1999-12-22 Method and apparatus for preventing warp of clamp ring used for wafer coating apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/227,911 US6258228B1 (en) 1999-01-08 1999-01-08 Wafer holder and clamping ring therefor for use in a deposition chamber
US09/227,911 1999-01-08

Publications (2)

Publication Number Publication Date
WO2000041217A2 WO2000041217A2 (en) 2000-07-13
WO2000041217A3 true WO2000041217A3 (en) 2001-02-22

Family

ID=22854952

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/030673 WO2000041217A2 (en) 1999-01-08 1999-12-22 Method and apparatus for preventing warp of clamp ring used for wafer coating apparatus

Country Status (6)

Country Link
US (1) US6258228B1 (en)
EP (1) EP1062690A1 (en)
JP (1) JP3834478B2 (en)
KR (1) KR100439287B1 (en)
TW (1) TW448529B (en)
WO (1) WO2000041217A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6299153B1 (en) * 1999-07-26 2001-10-09 Discreet Industries Corporation Wafer latch with a ball bearing assembly
US6783299B2 (en) * 1999-07-26 2004-08-31 Ovadia Meron Latch for detachably attaching and mounting a semiconductor wafer to a support ring
DE60026476D1 (en) * 2000-12-21 2006-05-04 Oxford Instr Plasma Technology Substrateneinschleusenvorrichtung
US6652656B2 (en) 2001-07-24 2003-11-25 Tokyo Electron Limited Semiconductor wafer holding assembly
US6837974B2 (en) * 2002-02-01 2005-01-04 Tokyo Electron Limited Single piece pod shield for vertical plenum wafer processing machine
KR100523824B1 (en) * 2002-07-11 2005-10-25 에이에스엠엘 네델란즈 비.브이. Substrate Holder and Device Manufacturing Method
US7381276B2 (en) * 2002-07-16 2008-06-03 International Business Machines Corporation Susceptor pocket with beveled projection sidewall
US20040214108A1 (en) * 2003-04-25 2004-10-28 Ray Kevin B. Ionic liquids as dissolution inhibitors in imageable elements
KR100583522B1 (en) * 2005-01-05 2006-05-25 삼성에스디아이 주식회사 Holding tray for substrate, substrate alignment system using the same and method thereof
US8171877B2 (en) * 2007-03-14 2012-05-08 Lam Research Corporation Backside mounted electrode carriers and assemblies incorporating the same
CN101980959A (en) * 2008-03-26 2011-02-23 Gt太阳能公司 Gold-coated polysilicon reactor system and method
KR100985185B1 (en) * 2008-05-19 2010-10-05 주식회사 에스 피 씨 Punch for office use
US8276604B2 (en) * 2008-06-30 2012-10-02 Lam Research Corporation Peripherally engaging electrode carriers and assemblies incorporating the same
TWI402137B (en) * 2008-12-10 2013-07-21 Lam Res Corp A dual function electrode platen and a process for polishing a silicon electrode utilizing a polishing turntable and a dual function electrode platen
KR100952896B1 (en) 2010-01-21 2010-04-16 주식회사 이노비즈 Gripper of wafer stage of led testing system
US9054188B2 (en) * 2012-02-24 2015-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Curved wafer processing on method and apparatus
KR101406669B1 (en) * 2012-07-31 2014-06-11 주식회사 오킨스전자 Wafer carrier and system thereof
US11015244B2 (en) 2013-12-30 2021-05-25 Advanced Material Solutions, Llc Radiation shielding for a CVD reactor
DE102017000528A1 (en) * 2017-01-20 2018-07-26 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co. Method for processing a holding plate, in particular for a wafer-holding clamp
CN109402594A (en) * 2018-12-13 2019-03-01 浙江舜宇光学有限公司 A kind of film coating jig and carrying tooling
CN116288131B (en) * 2023-05-23 2023-08-08 西安稀有金属材料研究院有限公司 Method for strengthening inner and outer surfaces of high-brittleness semiconductor component with thin-wall structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054444A (en) * 1983-09-05 1985-03-28 Oki Electric Ind Co Ltd Manufacture of semiconductor device
US4997677A (en) * 1987-08-31 1991-03-05 Massachusetts Institute Of Technology Vapor phase reactor for making multilayer structures
EP0498752A1 (en) * 1991-01-31 1992-08-12 International Business Machines Corporation Electrostatic chuck with diamond coating
EP0725426A2 (en) * 1995-01-31 1996-08-07 Applied Materials, Inc. High temperature polymide electrostatic chuck
US5730803A (en) * 1996-02-23 1998-03-24 Applied Materials, Inc. Apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold body

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US997677A (en) * 1911-02-07 1911-07-11 Robert W Ivey Window-sash.
US3641402A (en) * 1969-12-30 1972-02-08 Ibm Semiconductor device with beta tantalum-gold composite conductor metallurgy
US4311427A (en) 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
US4915564A (en) 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4860439A (en) 1988-10-25 1989-08-29 Riley Bryan R Universal alignment fixture
US5391275A (en) * 1990-03-02 1995-02-21 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
US5372612A (en) * 1993-06-28 1994-12-13 Motorola, Inc. Semiconductor material contacting member
US5598189A (en) * 1993-09-07 1997-01-28 Hewlett-Packard Company Bipolar integrated ink jet printhead driver
US5820329A (en) * 1997-04-10 1998-10-13 Tokyo Electron Limited Vacuum processing apparatus with low particle generating wafer clamp
US6143147A (en) * 1998-10-30 2000-11-07 Tokyo Electron Limited Wafer holding assembly and wafer processing apparatus having said assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054444A (en) * 1983-09-05 1985-03-28 Oki Electric Ind Co Ltd Manufacture of semiconductor device
US4997677A (en) * 1987-08-31 1991-03-05 Massachusetts Institute Of Technology Vapor phase reactor for making multilayer structures
EP0498752A1 (en) * 1991-01-31 1992-08-12 International Business Machines Corporation Electrostatic chuck with diamond coating
EP0725426A2 (en) * 1995-01-31 1996-08-07 Applied Materials, Inc. High temperature polymide electrostatic chuck
US5730803A (en) * 1996-02-23 1998-03-24 Applied Materials, Inc. Apparatus and method for transferring heat from a hot electrostatic chuck to an underlying cold body

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 185 (E - 332) 31 July 1985 (1985-07-31) *

Also Published As

Publication number Publication date
TW448529B (en) 2001-08-01
JP2002534798A (en) 2002-10-15
WO2000041217A2 (en) 2000-07-13
US6258228B1 (en) 2001-07-10
KR20010083782A (en) 2001-09-01
EP1062690A1 (en) 2000-12-27
KR100439287B1 (en) 2004-07-07
JP3834478B2 (en) 2006-10-18

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