WO2000068770A1 - High-density removable expansion module having i/o and second-level removable expansion memory - Google Patents
High-density removable expansion module having i/o and second-level removable expansion memory Download PDFInfo
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- WO2000068770A1 WO2000068770A1 PCT/US2000/012796 US0012796W WO0068770A1 WO 2000068770 A1 WO2000068770 A1 WO 2000068770A1 US 0012796 W US0012796 W US 0012796W WO 0068770 A1 WO0068770 A1 WO 0068770A1
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- Prior art keywords
- module
- level
- removable
- expansion module
- expansion
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/0282—Adapters for connecting cards having a first standard in receptacles having a second standard
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/20—Instruments for performing navigational calculations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/946—Memory card cartridge
Definitions
- Expansion and application customization has been performed via only one, or at most two, slots for removable expansion modules for I/O, I/O adapters, memories, and memory adapters.
- Memory expansion modules have included DRAM, SRAM, ROM, and Flash technologies.
- I/O expansion modules have included dedicated peripherals, networking, modems, wireless communications, serial I/O, and bar-code and other scanners.
- expansion module or “expansion module,” and possibly prefaced by “removable,” should be construed as a general reference to a class of generally enclosed compact expansion devices that provide fast, reliable, and robust repeated field insertion, removal, handling, and storage, ideally suited for closed-case, user-serviceable, plug-in expansion of portable and handheld computing devices.
- slot should be construed as a reference to the physical and electrical means by which a portable computing device receives a removable expansion module ofthe class just defined.
- Closed-case serves to indicate that insertion and removal of an expansion device does not involve significant reconfiguration or removal ofthe external casing ofthe computing device. Closed-case is not meant to foreclose the possible user removal of a protective access panel or the user opening of a hinged access door. Nor is it meant to foreclose that the casing may need to be removed for more significant events best performed by a qualified service person.
- PC Module Two ofthe most popular industry standards for the slots and removable modules are the PC Module and the CompactFlash Module.
- the PC Module has a 16-bit variant, previously known as a PCMCIA module, and a newer 32-bit variant, also known as a Module-Bus module.
- PC Modules include Type I, Type II, and Type III devices. If not further qualified, a general reference to PC Modules in this specification and the attached claims should be construed to refer to any ofthe Module-Bus (32-bit), PCMCIA (16-bit), Type I, Type II, or Type III PC Module variants.
- U.S. Patent 5,815,426 ('426), ADAPTER FOR INTERFACING AN LNSERTABLE/REMOVABLE DIGITAL MEMORY APPARATUS TO A HOST DATA PART, assigned to Nexcom Technology, and hereby incorporated by reference, describes these and other removable expansion module and memory types suitable for PDAs.
- the '426 patent includes discussions of and references to Miniature Modules, Solid State Floppy Disk Modules (SSFDCs), MultiMediaModules (MMC), Integrated Circuit (IC) Modules (also known as Smart Modules), and Subscriber Identification Module (SIM) Modules.
- SSFDCs Solid State Floppy Disk Modules
- MMC MultiMediaModules
- IC Integrated Circuit
- SIM Subscriber Identification Module
- CompactFlash nomenclature uses CF to denote modules that are primarily limited to flash data storage, and uses CF+ to denote modules that may have any or all off flash data storage, I/O devices, and magnetic disk data storage.
- CF and CF+ modules presently include Type I (3.3 mm thick) and Type II (5 mm thick) devices. Both Type I and Type II CF modules are 36.4 mm long by 42.8 mm wide, or roughly "matchbook-sized.”
- a Type III device is being defined as discussed in a later section herein. If not further qualified, a general reference to CompactFlash (or CF) in this specification and the attached claims should be construed to refer to any ofthe CF, CF+, Type I, Type II, or Type III CompactFlash variants.
- FIG 1 represents a prior art MultiMediaModule (MMC) form factor and its pad definitions.
- MMC MultiMediaModule
- the MMC is 1.4 mm thick, 24 mm wide, and 32 mm long.
- Figure 2 represents the prior art internal architecture of a generic MultiMediaModule and its registers.
- Figure 3 illustrates the prior art functional partitioning of a generic MMC
- FIG. 4 illustrates the prior art physical partitioning of a generic MultiMediaModule system.
- Figures 1, 2, 3, 4, and part of 6 are reproduced or derived from the MultiMediaModule System Summary document.
- the Type column ofthe legend is used to categorize the pin type as one of: Supply (S), Input (I), Output (O), Push-Pull (PP), Open-Drain (OD), and Not Connected (NC).
- the DAT (data) pin is output only (O) for read-only modules.
- the Secure Digital Memory Module (SD Memory Module, or SD) is an extension ofthe MMC standard.
- the SD standard adds cryptographic security (enabling among other things, the protection of copyrighted data), up to a 4X improvement in peak data transfer rate (by redefining the existing reserved pin as a data pin and defining two additional data pins), a mechanical write-protect switch, and improved ESD tolerance.
- the SD asymmetrically modifies the 1.4 mm by 24 mm wide MMC form factor by augmenting the bottom (contact) side with a 0.7 mm thick and 22.5 mm wide "belly,” for an overall module thickness of 2.1 mm.
- the SD has the same 32 mm length as the MMC.
- Adapters exist or have been prophetically disclosed for physically and electrically coupling a removable memory on a slide, or stick, to a portable host via a removable expansion module of either the PCMCIA Module or CompactFlash Module form factors.
- the previously mentioned '426 patent describes such removable memory adapters.
- the focus of these existing memory adapters has been limited to merely providing an interface adapter, or bridge, between a first interface type (the host to removable-expansion-module interface) and a second interface type (the removable memory stick).
- the previously discussed expansion module (or module) implementations have been of a first type wherein the module is mated with a closed-back mother device by (full or partial) insertion into a receiving chamber that is inside the external casing of the mother device.
- the chamber usually is of a standardized minimum width and insertion depth.
- the module insertion into the chamber is facilitated by edge-guides internal to the chamber and insertion is (usually) via a standardized minimum width x minimum height circumscribed portal (mouth, or orifice) in the mother device's external casing.
- the chamber portal is sometimes protected by a hinged or removable access panel or by a stub (a dummy module with an external end flanged to block off most ofthe portal) inserted into the chamber.
- the modules are designed to have dimensions compatible with the insertion depth x width, edge guides, and width x height orifice ofthe chamber.
- a second type of expansion module also exists.
- the second type of expansion module makes use of a "open-back" (or open-face) industrial design approach previously applied to other hand-held devices, such as cellular telephones.
- open-back hand-held devices a standardized back-mount is made integral to the device. Families of removable components (such as batteries), varying widely size and make-up but otherwise interchangeable, are designed to be compatible to the standardized back-mount.
- the industrial design form-factor becomes a function of both the device and the mated component.
- an open-face expansion module is mated with a companion open-back device by (full or partial) insertion into a receiving recess of (usually) standardized width x minimum depth that is integral to, but substantially on the outside of, the device.
- the module insertion into the recess is via (usually) standardized module-edge guides incorporated into the open recess ofthe device.
- open-face modules are designed to have dimensions compatible with the width x minimum depth and edge guides ofthe device recess. But since the recess of an open- back device by definition has no circumscribed portal, the module height and shape are largely unrestricted. Instead the height and shape ofthe interchangeable modules are restricted only by bounds imposed by practical utility, bounds imposed to avoid mechanical interference with other objects in common system configurations, and bounds imposed by ergonometric concerns.
- Patent 5,579,430 ('430), DIGITAL ENCODING PROCESS, assigned to Fraunhofer Deutschen Kunststoff Foerd für für angewandten Anlagen e.V., and hereby incorporated by reference, teaches processes for encoding digitized analog signals. Such processes are useful for insuring high-quality reproduction while reducing transmission bandwidth and data storage requirements. Techniques are also known in the art for making and using record and playback portable host devices based on a dedicated flash memory. For example, see U.S. Patent 5,491,774 ('774), HANDHELD RECORD AND PLAYBACK DEVICE WITH FLASH MEMORY, assigned to Comp General Corporation, and hereby incorporated by reference, and U.S. Patent 5,839,108 ('108), FLASH MEMORY FILE SYSTEM IN A HANDHELD RECORD AND PLAYBACK DEVICE, assigned to Norris Communications, also hereby incorporated by reference.
- the utility of computer hosts including portable computer hosts, such as PDAs (or handhelds), is enhanced by methods and apparatus for removable expansion modules (cards) having application specific circuitry, a second-level-removable memory, and optional I/O, in a number of illustrative embodiments.
- the term "second-level" is intended to emphasize that while the expansion module is removable from a computer host at a first-level of functionality, the expansion memory is independently removable from the expansion module, providing a second-level of functionality.
- the present invention permits memory configuration versatility for application specific expansion modules, permitting easy user field selection and upgrades ofthe memory used in conjunction with the expansion module.
- the present invention enables increased parallelism and functionality previously not available to portable computer devices.
- the removable memory is in combination with an external-I/O connector or permanently attached external-I/O device, providing both I/O and memory functions in a single closed-case removable expansion module.
- This increases the expansion functional density for portable computer hosts, such as PDAs. That is, it increases the amount of functionality that can be accommodated within a given volume allocation for expansion devices. It also provides a viable alternative to 2-slot implementations.
- the removable memory is a private memory for application specific circuitry within the closed-case-removable expansion module. This enhances the utility of portable computer hosts, such as PDAs, as universal chassises for application specific uses.
- Another embodiment instead uses a first-level module with a top-cavity to accept a second-level module flush with the top ofthe first-level module, capturing the second-level module in place when the first-level module is inserted into a PDA.
- the application specific module will generally have some manner of I/O to required external devices, such as scanning devices, sensors, or transducers. Otherwise, all functionality for the application specific function is self- contained within the application specific module.
- Particular application specific modules for customizing general purpose PDAs via the instant invention include a media-player module for digitized media stored on removable memory and a bar-code-scanner module having scanning data stored on removable memory.
- Embodiments ofthe present invention that make use of second-level SSD Modules (generally having secure memory and I/O capability) enable "removable I/O in removable I/O" (or "IOIO") solutions, wherein each native expansion slot of a PDA can be simultaneously configured with two independent expansion-module-based I/O functions.
- Figure 2 represents the prior art internal architecture of a generic MultiMediaModule and its registers
- FIG. 3 illustrates the prior art functional partitioning of a generic MultiMediaModule system
- Figure 4 illustrates the prior art physical partitioning of a generic
- Figure 5 and 6 illustrate the form factors ofthe prior art CompactFlash module and MultiMediaModule, respectively;
- Figure 8 is an abstract drawing representing an exploded view ofthe removable expansion module, including the outer frame, inner PCB, and connectors;
- Figure 9 is an abstract drawing representing a view ofthe removable expansion module, with the outer frame removed, and a removable memory roughly aligned with the contact fingers to which it mates within the removable expansion module;
- Figure 10 is an abstract drawing representing a cut away side view ofthe removable expansion module, with the removable memory inserted into the removable expansion module;
- Figure 11 is an axonometric projection of a contact finger assembly for making electrical connection with the second-level-removable expansion memory
- Figure 12 is an axonometric projection ofthe upper section of a CF Type II frame in accordance with an illustrative embodiment
- Type II expansion module bottom case a Printed Circuit Board (PCB), a connector for mating with a PDA, a connector for mating with external I/O, an MMC connector mounted on the Printed Circuit Board, and a CF Type II expansion module top case without metal top;
- Figure 15 is an axonometric projection ofthe assembly of Figure 14 with a metal top, forming the complete CF Type II module, together with an inserted MMC;
- Figure 16 shows an axonometric projection of an expansion module according to an alternate embodiment ofthe present invention that has an open recess for receiving an expansion memory
- Figure 17 is a cross section view ofthe expansion module of Figure 16;
- Figure 18 illustrates a PDA populated with a first-level removable expansion module having I/O and wherein the first-level module is populated with a second-level removable memory in accordance with an embodiment ofthe present invention
- Figure 19 illustrates a PDA populated with a first- level removable open- face expansion module having I/O and wherein the first-level module is populated with a second-level removable memory in accordance with an embodiment ofthe present invention
- Figure 20 illustrates a PDA populated with a first-level removable open- face expansion module having I/O and wherein the first-level module is populated with a second-level removable expansion module having memory and I/O in accordance with an embodiment ofthe present invention
- Figure 21 illustrates some ofthe various types of I/O for which the PDA and removable expansion module of Figure 18 may be equipped
- Figure 22 illustrates some ofthe various types of I/O for which the PDA and removable open- face expansion module of Figure 19 may be equipped
- Figure 23 illustrates a PDA having a closed-back industrial design, equipped with a top-cavity expansion module, and coupled to various types of I/O, in accordance with embodiments ofthe present invention
- Figure 25 illustrates some ofthe various types of I/O for which the PDA and removable expansion module of Figure 20 may be equipped.
- Figure 7 is an abstract drawing representing a closed-case removable expansion module (card) 100, i.e., an expansion module that may be inserted into and removed out of a closed-case computer host.
- the module is especially suitable for use in a portable host, such as a PDA.
- the expansion module of Figure 7 includes a connector 141 for I/O interconnect and a slot 121 for a removable memory.
- Figure 7 shows the I/O interconnect 140 and removable memory 120 disengaged from the removable expansion module.
- Figure 8 is an abstract drawing representing an exploded view ofthe removable expansion module 100 of Figure 7, including upper 105 and lower 110 frame members ofthe outer frame, inner printed circuit board (PCB) 115, and connectors.
- An opening 111 is provided in the lower frame 110 for receiving the connector 141 for I/O interconnect.
- a second opening 113 is provided in the lower frame 110 for receiving the connector 150 for host interconnect.
- a slot 112 is provided on both sides of the opening 111 to aid in the alignment and retention ofthe connector 141, and a slot 114 is provided on both sides of opening 113 to aid in the alignment and retention ofthe connector 150.
- An opening 116 is provided in the PCB for receiving the connector 141.
- Figure 9 is an abstract drawing representing a view ofthe removable expansion module 100 of Figure 7, with the outer frame members removed, and a removable memory 120 roughly aligned with the contact fingers 180 to which it mates within the removable expansion module.
- Circuitry 160 is provided, including I/O adapter circuitry, removable memory adapter circuitry, and application-specific circuitry.
- a support shelf 170 supports, aligns, separates, and isolates the underside ofthe contact fingers 180 from the circuitry 160.
- Figure 10 is an abstract drawing representing a cut away side view ofthe removable expansion module 100 of Figure 7, with the removable memory 120 inserted into the removable expansion module.
- the expansion module 100 and associated host connector 150 are compatible with the Type II CompactFlash Module as described in the previously referenced CompactFlash Specification.
- the I/O connector 141 is compatible with a PC-Module industry standard Hyundai-style 15-pin connector.
- the slot 121, removable memory 120, and removable memory adapter circuitry of circuitry 160, are compatible with the MultiMediaModule as described in the previously referenced MultiMediaModule System Summary.
- Figure 11 through Figure 13 are axonometric projections showing the component assemblies for a CF Type II expansion module illustrative embodiment ofthe expansion module of Figure 7 and in accordance with the present invention.
- Figure 11 shows a contact finger assembly for making electrical connection with the second-level-removable expansion module.
- the contact fingers corresponding to the power supply module pins 3 and 4 in the assembly of Figure 11
- the underside ofthe contact finger assembly additionally has four alignment pins, two underneath the ends of each ofthe far side portions ofthe assembly. These pins and the assembly as a whole engage the PCB by way of matching alignment holes drilled in the PCB.
- a solder paste is applied to the PCB.
- the contact assembly and PCB will be ultimately reflow soldered, permanently attaching the contact assembly to the PCB.
- the PCB acts as a chassis, supporting the expansion bus connector, the I/O connector, the contact finger assembly, and the application specific active circuitry ofthe expansion module.
- the active circuitry is limited to the bottom side ofthe PCB.
- the use of other connectors and other contact finger assemblies will generally enable placement of active circuitry on the topside ofthe PCB.
- Figure 12 illustrates the upper section 105 of a CF Type II frame in accordance with an illustrative embodiment.
- Figure 13 diagrams a CF Type II top case, comprising the upper section ofthe CF frame of Figure 12 with a metal panel top, and in accordance with the present invention.
- "Hooks" 190 are formed into the upper section, specifically to act (in conjunction with the metal panel top) as a slotted guide for insertion ofthe expansion memory.
- Figures 14 and 15 are axonometric projections showing the CF Type II expansion module in various stages of assembly using the component assemblies of Figures 11 through 13.
- Figure 14 includes a CF Type II expansion module bottom case, a Printed Circuit Board (PCB), a connector for mating with a PDA, a connector for mating with external I/O, an MMC connector mounted on the Printed Circuit Board, and a CF Type II expansion module top case without metal top.
- Figure 15 shows the completed CF Type II module, including the metal top, together with an inserted MMC.
- PCB Printed Circuit Board
- Figure 16 shows an axonometric projection of an expansion module according to an alternative illustrative embodiment ofthe present invention.
- Figure 17 is a cross section view ofthe expansion module of Figure 16.
- the top case of this module has a cavity (an open recess) for receiving an expansion memory (an MMC in the illustration shown), the recess having the general shape ofthe expansion memory, but being slightly larger.
- the connector spring contacts for the memory emerge through the top ofthe case via one hole (a slot as shown), or a plurality of holes (slots) wherein each contact protrudes through a respective hole.
- the top-cavity expansion memory of Figure 16 is implemented in the CF Type I form factor.
- top-cavity modules may be readily implemented in either the closed-back or open-back industrial design approaches by appropriately varying the rail configuration ofthe package frame in accordance with the desired expansion module standard.
- the expansion memory is deposited into the receiving cavity, the top of the expansion memory being roughly flush to slightly above the outer perimeter ofthe top case.
- the expansion memory When the module is inserted into a compatible slot of a host device, the expansion memory is locked into the receiving cavity by the presence ofthe adjacent wall (or roof) ofthe slot.
- the connector spring contacts ofthe expansion module are depressed by the presence ofthe expansion memory, thus effecting the mating (electrical continuity) of these contacts with the contacts ofthe expansion memory.
- the top-cavity expansion module of Figure 16 and Figure 17 also has an I/O connector that is accessible for I/O functions, including any of those described herein.
- Figure 23 illustrates a PDA having a closed-back industrial design, equipped with a top- cavity expansion module, and coupled to various types of I/O, in accordance with the present invention.
- Figure 24 illustrates a PDA having a open-back industrial design, equipped with a top-cavity expansion module, and coupled to various types of I/O, in accordance with embodiments ofthe present invention.
- circuitry 160 includes I/O adapter circuitry and removable memory adapter circuitry.
- the I/O adapter functionality may include one or more of, but is not limited to, Ethernet, serial port, audio, telephone, antenna, and special-function interfaces such as bar code and other scanners.
- the removable memory adapter functionality may include one or more of, but is not limited to, main memory expansion, mass-media emulation, and other host-based special-purpose memory applications.
- circuitry 160 further includes application-specific circuitry for which the management ofthe removable memory is an ancillary function to the primary function ofthe specific application.
- the functions performed by the removable memory are those of a MultiMediaModule adapter as illustrated in the MultiMediaModule adapter section ofthe MultiMediaModule system architecture diagram of Figure 3. If the removable memory is being used to provide host-base-memory expansion, such as described for the first embodiment, then the host must provide the functionality illustrated by the Application and Application Adapter sections of Figure 3. If the removable memory is being used at least sometimes as an ancillary memory (at least sometimes private) to the application- specific circuitry contained on the expansion module, such as for the second embodiment, then the application-specific circuitry must provide the Application and Application Adapter section functionality, or else the application-specific circuitry must call on host services for such functionality.
- the top and bottom frames may be composed of metal or plastic.
- the top and bottom frame portions each have a plastic base augmented with an outer metal plate over much ofthe interior region ofthe large panel surface of each portion.
- the metal plate extends to the edges ofthe panel at the connector ends of each portion and is attached to both connectors.
- smaller metal strips, or ears, on both sides at the finger-grip end (opposite to the host connector) extend from the plate to the edges ofthe panel and continue onto the sides.
- the frame kit is assembled and the side strips are sonically welded together on both sides ofthe casings. The welded strips and plates form a single continuous metal band around the top and bottom frames that permanently physically retains the assembled kit.
- I/O devices may be interconnected with the expansion module via three different embodiments.
- a connector such as a PC-Module industry-standard Hyundai- style 15-pin connector may be used with a mating detachable cable.
- Detachable cables are preferred for light-duty applications where a continuous I/O device connection is neither needed nor desired.
- a fully integrated fixed cable, having a molded strain relief may be used. Such a fixed cable maintains solid contact in high vibration environments, is protected against lateral stress, and seals out dust. Fixed cables are preferred for dedicated industrial or field applications.
- Figure 18 illustrates a PDA 200 equipped with a removable expansion module 100 having both I/O interconnect 140 and removable memory 120 in accordance with an embodiment ofthe present invention.
- the application specific circuitry ofthe expansion module may be used in conjunction with application specific software running on the PDA. This permits the application specific circuitry ofthe expansion module to make use ofthe output (e.g., display, sound) and input (e.g., tablet, buttons, any I/O ports) capabilities ofthe PDA for user interface functions associated with the specific application.
- the PDA's display/input-tablet provides for virtual controls and visual indicators for the application.
- Figure 21 illustrates some ofthe various types of I/O for which the PDA and removable expansion module of Figure 18 may be equipped.
- Application-specific functions may include special-function digital, analog, and mixed- signal electronics; special-function I/O; special-function data-pumps; and special-function accelerators.
- Removable expansion modules may operate in a number of different modes. At a basic level, they may be used solely to interface an external peripheral to the host device via the I/O connector, they may be used solely to interface a second-level-removable expansion memory with the host device, and they may be used to simultaneously interface the host device with both an external peripheral and an expansion memory.
- Figure 26 shows a PDA 220, a first-level expansion module 1000, and a second-level expansion module 2000, in accordance with a "fully connected" implementation ofthe present invention.
- the expansion module 1000 of Figure 26 includes six major data transfer paths capable of simultaneous operation; application specific circuitry 160; and data buffers at the first- level expansion interface 150, the second-level expansion interface 1500, and the I/O port (plugged-wired, corded-wired, or wireless) 140.
- Each ofthe data buffers generally has one or more stages of FIFO storage for each data path coupled to each buffer.
- the second-level expansion module 2000 may include be of a variety of types, including SSD modules having a second-level I/O port (plugged-wired, corded- wired, or wireless) 1400.
- Prior art PDAs 200 have limited modes of use and can generally affect significant data transfers only between any of their integral main memory 210, integral serial port 220, and integral expansion module bus 150.
- the addition of prior art expansion modules to PDAs does not alter the number of significant data transfer paths or number of significant simultaneous data transfers.
- the expansion module 1000 of Figure 26 greatly increases the potential system-level parallelism over that ofthe prior- art.
- the non- volatile read/write memory is flash memory in accordance with the standard MultiMediaModule.
- Such removable flash- memory-based application-specific functions have particular utility to medical and other data acquisition, secure commerce, financial and personal productivity devices making use of unique removable memories for each of multiple individuals, projects, or accounts.
- the removable flash-based memory is also well suited where "sneaker- net" is a viable data transport. Provided manual/user intervention is acceptable, and depending on the speed of data link I/O incorporated into the expansion module, the physical transport of a removable memory device between a PDA-based expansion module and an external system may provide the best solution to fast local transport of large data-sets.
- removable memory devices may provide the best solution to rapidly reconfiguring an application-specific expansion module to initiate a large program or use a large data sets.
- labeled, color-coded, or otherwise distinctive, removable memory devices also may provide the best solution for ease of use for users needing to select a particular program or data set from many for reconfiguring an application-specific expansion module.
- Removable I/O functions generally include direct peripheral connections (such as pointing, keyboard, bar-code scanners, printing, or video/imaging/display devices), peripheral expansion buses (such as USB, Firewire, or SCSI), networking (such as Ethernet, Bluetooth, and other shared media methods), or communications (such as modems, serial devices, and other data communication methods).
- direct peripheral connections such as pointing, keyboard, bar-code scanners, printing, or video/imaging/display devices
- peripheral expansion buses such as USB, Firewire, or SCSI
- networking such as Ethernet, Bluetooth, and other shared media methods
- communications such as modems, serial devices, and other data communication methods.
- Connectivity is an increasingly important application class of I/O functionality for portable hosts.
- Specific connectivity scenarios include: portable-to- mobile phone, portable-to-portable(s), portable-to-desktop, portable-to-network, portable- to-peripheral, and portable-to-embedded system.
- "Removable-in-removable" configurations enabled by the present invention permit simultaneous realization of a plurality of connectivity scenarios.
- An embodiment ofthe present invention permits a general purpose PDA to be customized (specially adapted) for use as a portable/wearable media player, at the highest-level of functionality not unlike a portable Compact Disk player.
- a player uses the removable memory to store and playback digitally encoded media such as music, audio, or video.
- the player makes use ofthe MPEG Layer 3 standard for digital audio encoding, generally known as MP3.
- MP3 MPEG Layer 3 standard for digital audio encoding
- Another embodiment makes use ofthe Microsoft Digital Audio standard.
- Other aspects of a specific embodiment include an integral AM/FM receiver, a connector for a headset with an integral antenna for the receiver, and an auto-start on insert feature that initiates the media playback upon insertion ofthe removable memory.
- the PDA's display/input-tablet provides the virtual controls and visual indicators for the media player.
- an expansion module having I/O and removable memory is inserted into a computer host.
- the I/O is coupled to a receiver capable of receiving a large number of broadcast messages and services.
- the removable memory contains subscriber services information for each individual user.
- the expansion module uses the subscriber services information to filter out messages and services not applicable to the present status ofthe subscriber.
- the PDA's display/input- tablet provides the virtual controls and visual indicators for the display and access of captured messages and services.
- an expansion module having I/O and removable memory is inserted into a computer host, a bar-coding peripheral is connected to the I/O portion ofthe module, and a removable memory module is inserted into the memory slot ofthe module. After each scan the scanned information is transferred through the I/O connection to the host computer for processing. Additionally, a backup copy ofthe scanned information is stored on the removable memory. Should the computer host fail or should the operator need to verify scans, the backup can be interrogated with the same or a different host.
- An embodiment ofthe present invention permits a general purpose PDA to be customized as a portable/wearable personal environmental monitor. Equipped with the appropriate sensors and application-specific circuitry for sensor signal processing, such a device performs time-stamped data logging of environmental attributes such as ionizing radiation, temperature, and humidity. Similarly, a portable/wearable personal media monitor data logs health-related attributes such as pulse, temperature, respiration, and blood pressure.
- the PDA's display/input-tablet provides the virtual controls and visual indicators for the monitoring devices.
- the combined I/O interconnect and removable memory of embodiments of the present invention also permits a general purpose PDA to be customized for use as a data logging diagnostic monitor or time-based control device. It is known that the diagnostic connectors of certain vehicles can be adapted to interface with PDAs for realtime monitoring of critical vehicle subsystems. The present invention permits such diagnostic monitoring data to be communicated via the I/O interconnect and logged to the removable memory. Such a tool facilitates tracking subsystem performance over extended periods of time, and permits real-time and deferred graphics of time- varying system performance attributes.
- the PDA's display/input-tablet provides the virtual controls and visual indicators for the diagnostic monitor. Miscellaneous Removable Memory Applications
- a first-level removable I/O module provides a corded interface to a mobile phone acting as a wireless modem to a remote network (such as the Internet).
- a second- level SSD-compliant removable I/O module inserted into the first-level module, provides an interface to a Bluetooth-based local network with multiple devices.
- the first-level removable I/O and the second-level removable I/O are configured to provide a gateway between the two networks, enabling remote network access for any ofthe multiple devices in the Bluetooth local network.
- the expansion module ofthe present invention enables general-purpose portable hosts having a single native expansion slot to achieve a first-level expansion function (generally having I/O) in simultaneous conjunction with a second-level removable module.
- the second-level removable module may have little or no interrelationship with the first-level expansion function.
- a second-level removable memory may be dedicated to the system or application software running on the host, either directly, e.g., as some portion ofthe main-memory ofthe host, or indirectly as an emulation substitute for host mass-storage (i.e., disk drives).
- embodiments ofthe present invention also enable system approaches wherein the second-level removable module is interrelated to the first-level expansion function.
- a first-level removable expansion module having I/O functionality may have private (or shared) access to a second-level removable expansion module (generally having memory and/or I/O functionality).
- the present invention thus enables portable computer hosts, such as PDAs, to be used as customizable platforms for many application-specific functions that require a removable module dedicated to the application.
- the invention is equally applicable to any ofthe present and future variants ofthe CompactFlash (including any ofthe Type I, Type II, and proposed Type III variants), PC Module (including any ofthe 32-bit, 16-bit, Type I, Type II, and Type III variants), and Springboard (or other open-back expansion module) standards, as well as other removable expansion module standards and technologies.
- second-level removable expansion memory limited to the MultiMediaModule expansion memory standard ofthe illustrative embodiments, but is equally applicable to use of other types of second-level removable memory or media.
- the invention is equally applicable to the use of present and future variants of MMCs, SDs, SSDs, Miniature Modules, SSFDCs, Smart Modules, and SIM Modules.
- the invention is not limited to the illustrated embodiments in which a removable expansion module with second-level-removable expansion memory is directly plugged into a computing host, but is equally applicable to situations in which one or more intervening adapters or "dongles" is used to adapt or couple between the interfaces ofthe expansion module and a computing host device or system.
- the invention is applicable to the use of a CF Module with a CF-to-PC Module adapter, so that a CF Module according to the present invention can operate indirectly in a PC Module slot.
- the invention is also not limited to the illustrated embodiments in which a removable expansion module with second-level-removable expansion memory is used in a PDA, but is equally applicable to use in any host device or system benefiting from the use of a removable expansion module having second-level- removable expansion memory.
- the invention is equally applicable to present or future variants of desktops, servers, workstations, network computers, laptops, notebooks, palmtops, handheld computers (handhelds), information appliances, audio recording and playback devices, imaging devices including scanners and digital cameras, video recorders, fax machines, copy machines, smart phones, point-of-sale terminals, bar-code scanners, other special purpose data-acquisition devices, printers, other special purpose data-output devices, communication systems, network interface or networking infrastructure devices operating at any one or more levels of a data-communications protocol stack, network systems including any ofthe foregoing devices, and systems implementing networks and network applications at any scale including networks characterized as local area, departmental, enterprise wide, metropolitan area, state wide, regional, national, and the Internet.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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AU50010/00A AU5001000A (en) | 1999-05-11 | 2000-05-09 | High-density removable expansion module having i/o and second-level removable expansion memory |
GB0126382A GB2365182B (en) | 1999-05-11 | 2000-05-09 | High-density removable expansion module having I/O and second-level removable expansion memory |
US10/009,452 US6976111B1 (en) | 1999-05-11 | 2000-05-09 | High-density removable expansion module having I/O and second-level removable expansion memory |
JP2000616488A JP2003502727A (en) | 1999-05-11 | 2000-05-09 | High density removable expansion module with I / O and second level removable expansion memory |
US11/226,061 US7343439B2 (en) | 1999-05-11 | 2005-09-13 | Removable modules with external I/O flexibility via an integral second-level removable slot |
Applications Claiming Priority (4)
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US09/309,373 US6353870B1 (en) | 1999-05-11 | 1999-05-11 | Closed case removable expansion card having interconnect and adapter circuitry for both I/O and removable memory |
US09/309,373 | 1999-05-11 | ||
US09/439,966 | 1999-11-12 | ||
US09/439,966 US6599147B1 (en) | 1999-05-11 | 1999-11-12 | High-density removable expansion module having I/O and second-level-removable expansion memory |
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US11/226,061 Continuation US7343439B2 (en) | 1999-05-11 | 2005-09-13 | Removable modules with external I/O flexibility via an integral second-level removable slot |
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JP (1) | JP2003502727A (en) |
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US10194071B2 (en) | 2015-04-03 | 2019-01-29 | Red.Com, Llc | Modular motion camera |
US10306116B2 (en) | 2015-04-03 | 2019-05-28 | Red.Com, Llc | Modular motion camera |
US10447901B2 (en) | 2015-04-03 | 2019-10-15 | Red.Com, Llc | Modular motion camera |
US10771671B2 (en) | 2015-04-03 | 2020-09-08 | Red.Com, Llc | Modular motion camera |
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Also Published As
Publication number | Publication date |
---|---|
GB2365182B (en) | 2004-02-11 |
US6976111B1 (en) | 2005-12-13 |
JP2003502727A (en) | 2003-01-21 |
US6863557B2 (en) | 2005-03-08 |
AU5001000A (en) | 2000-11-21 |
US20050235086A1 (en) | 2005-10-20 |
US20040048503A1 (en) | 2004-03-11 |
TW526423B (en) | 2003-04-01 |
US6599147B1 (en) | 2003-07-29 |
US7343439B2 (en) | 2008-03-11 |
US20060164891A1 (en) | 2006-07-27 |
GB0126382D0 (en) | 2002-01-02 |
GB2365182A (en) | 2002-02-13 |
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