WO2001020948A3 - Mems digital-to-acoustic transducer with error cancellation - Google Patents

Mems digital-to-acoustic transducer with error cancellation Download PDF

Info

Publication number
WO2001020948A3
WO2001020948A3 PCT/US2000/025062 US0025062W WO0120948A3 WO 2001020948 A3 WO2001020948 A3 WO 2001020948A3 US 0025062 W US0025062 W US 0025062W WO 0120948 A3 WO0120948 A3 WO 0120948A3
Authority
WO
WIPO (PCT)
Prior art keywords
diaphragm
acoustic transducer
micromachined
depositing
substrate
Prior art date
Application number
PCT/US2000/025062
Other languages
French (fr)
Other versions
WO2001020948A2 (en
Inventor
Wayne A Loeb
John J Neumann Jr
Kaigham J Gabriel
Original Assignee
Univ Carnegie Mellon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Carnegie Mellon filed Critical Univ Carnegie Mellon
Priority to DE60039898T priority Critical patent/DE60039898D1/en
Priority to EP00961871A priority patent/EP1216602B1/en
Priority to JP2001524394A priority patent/JP4987201B2/en
Priority to DK00961871T priority patent/DK1216602T3/en
Priority to AU73765/00A priority patent/AU7376500A/en
Publication of WO2001020948A2 publication Critical patent/WO2001020948A2/en
Publication of WO2001020948A3 publication Critical patent/WO2001020948A3/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers

Abstract

An acoustic transducer comprising a substrate; and a diaphragm formed by depositing a micromachined membrane onto the substrate. The diaphragm is formed as a single silicon chip using a CMOS MEMS (microelectromechanical systems) semiconductor fabrication process. The curling of the diaphragm during fabrication is reduced by depositing the micromachined membrane for the diaphragm in a serpentine-spring configuration with alternating longer and shorter arms. As a microspeaker, the acoustic transducer of the present invention converts a digital audio input signal directly into a sound wave, resulting in a very high quality sound reproduction at a lower cost of production in comparison to conventional acoustic transducers. The micromachined diaphragm may also be used in microphone applications.
PCT/US2000/025062 1999-09-13 2000-09-13 Mems digital-to-acoustic transducer with error cancellation WO2001020948A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE60039898T DE60039898D1 (en) 1999-09-13 2000-09-13 MEMS DIGITAL ACOUSTIC TRANSFORMER WITH ERROR SUPPRESSION
EP00961871A EP1216602B1 (en) 1999-09-13 2000-09-13 Mems digital-to-acoustic transducer with error cancellation
JP2001524394A JP4987201B2 (en) 1999-09-13 2000-09-13 MEMS digital-acoustic transducer with error cancellation
DK00961871T DK1216602T3 (en) 1999-09-13 2000-09-13 MEMS transducer for digital to emergency response with error suppression
AU73765/00A AU7376500A (en) 1999-09-13 2000-09-13 Mems digital-to-acoustic transducer with error cancellation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/395,073 1999-09-13
US09/395,073 US6829131B1 (en) 1999-09-13 1999-09-13 MEMS digital-to-acoustic transducer with error cancellation

Publications (2)

Publication Number Publication Date
WO2001020948A2 WO2001020948A2 (en) 2001-03-22
WO2001020948A3 true WO2001020948A3 (en) 2002-01-31

Family

ID=23561585

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/025062 WO2001020948A2 (en) 1999-09-13 2000-09-13 Mems digital-to-acoustic transducer with error cancellation

Country Status (8)

Country Link
US (3) US6829131B1 (en)
EP (1) EP1216602B1 (en)
JP (1) JP4987201B2 (en)
AT (1) ATE405130T1 (en)
AU (1) AU7376500A (en)
DE (1) DE60039898D1 (en)
DK (1) DK1216602T3 (en)
WO (1) WO2001020948A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8345895B2 (en) 2008-07-25 2013-01-01 United Microelectronics Corp. Diaphragm of MEMS electroacoustic transducer

Families Citing this family (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6829131B1 (en) * 1999-09-13 2004-12-07 Carnegie Mellon University MEMS digital-to-acoustic transducer with error cancellation
US6674383B2 (en) * 2000-11-01 2004-01-06 Onix Microsystems, Inc. PWM-based measurement interface for a micro-machined electrostatic actuator
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US8623710B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
AU2002331624A1 (en) * 2001-08-17 2003-03-03 Carnegie Mellon University Method and apparatus for reconstruction of soundwaves from digital signals
US20030108098A1 (en) * 2001-08-24 2003-06-12 Geddes Earl Russell Pulse width modulated controller
US7298856B2 (en) * 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
US20030048911A1 (en) * 2001-09-10 2003-03-13 Furst Claus Erdmann Miniature speaker with integrated signal processing electronics
US20030210799A1 (en) * 2002-05-10 2003-11-13 Gabriel Kaigham J. Multiple membrane structure and method of manufacture
US20040017921A1 (en) * 2002-07-26 2004-01-29 Mantovani Jose Ricardo Baddini Electrical impedance based audio compensation in audio devices and methods therefor
DE10238523B4 (en) * 2002-08-22 2014-10-02 Epcos Ag Encapsulated electronic component and method of manufacture
SG143934A1 (en) 2002-11-08 2008-07-29 Semiconductor Energy Lab Display appliance
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US6943448B2 (en) 2003-01-23 2005-09-13 Akustica, Inc. Multi-metal layer MEMS structure and process for making the same
US7049051B2 (en) 2003-01-23 2006-05-23 Akustica, Inc. Process for forming and acoustically connecting structures on a substrate
ATE445254T1 (en) * 2003-05-06 2009-10-15 Enecsys Ltd POWER SUPPLY CIRCUITS
DE10327053A1 (en) * 2003-06-16 2005-01-05 Volkswagen Ag Audio system, especially for a vehicle interior, has a signal processor that receives a signal from a microphone integrated in a headset and processes it in conjunction with audio source signals to remove unwanted background noise
DE10340367B4 (en) * 2003-09-02 2007-11-29 Robert Bosch Gmbh Method and device for improving the sound pressure level of a sound generator
US20050069153A1 (en) * 2003-09-26 2005-03-31 Hall David S. Adjustable speaker systems and methods
US7756279B2 (en) * 2003-10-14 2010-07-13 Audioasics A/S Microphone preamplifier
US6936524B2 (en) 2003-11-05 2005-08-30 Akustica, Inc. Ultrathin form factor MEMS microphones and microspeakers
US20050095814A1 (en) * 2003-11-05 2005-05-05 Xu Zhu Ultrathin form factor MEMS microphones and microspeakers
KR200355341Y1 (en) * 2004-04-02 2004-07-06 주식회사 솔리토닉스 Mobile-communication terminal board with ultrasonic-speaker system
DE102004020204A1 (en) * 2004-04-22 2005-11-10 Epcos Ag Encapsulated electrical component and method of manufacture
US7929714B2 (en) * 2004-08-11 2011-04-19 Qualcomm Incorporated Integrated audio codec with silicon audio transducer
US7608789B2 (en) 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
US7346178B2 (en) 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
US7329933B2 (en) 2004-10-29 2008-02-12 Silicon Matrix Pte. Ltd. Silicon microphone with softly constrained diaphragm
US20060159424A1 (en) * 2005-01-19 2006-07-20 Chenming Hu Tamper-Proof Content-Playback System Offering Excellent Copyright Protection
US7795695B2 (en) 2005-01-27 2010-09-14 Analog Devices, Inc. Integrated microphone
DE102005008511B4 (en) 2005-02-24 2019-09-12 Tdk Corporation MEMS microphone
DE102005008512B4 (en) 2005-02-24 2016-06-23 Epcos Ag Electrical module with a MEMS microphone
JP4450751B2 (en) * 2005-03-17 2010-04-14 富士通株式会社 Mesh model creation method, simulation apparatus, and program
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US7885423B2 (en) 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
US7449356B2 (en) * 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US20070071268A1 (en) * 2005-08-16 2007-03-29 Analog Devices, Inc. Packaged microphone with electrically coupled lid
US7449355B2 (en) * 2005-04-27 2008-11-11 Robert Bosch Gmbh Anti-stiction technique for electromechanical systems and electromechanical device employing same
US7589456B2 (en) * 2005-06-14 2009-09-15 Siemens Medical Solutions Usa, Inc. Digital capacitive membrane transducer
JP4706578B2 (en) * 2005-09-27 2011-06-22 セイコーエプソン株式会社 Electrostatic ultrasonic transducer, electrostatic ultrasonic transducer design method, electrostatic ultrasonic transducer design apparatus, electrostatic ultrasonic transducer design program, manufacturing method, and display device
US20070040231A1 (en) * 2005-08-16 2007-02-22 Harney Kieran P Partially etched leadframe packages having different top and bottom topologies
US8351632B2 (en) * 2005-08-23 2013-01-08 Analog Devices, Inc. Noise mitigating microphone system and method
US8477983B2 (en) * 2005-08-23 2013-07-02 Analog Devices, Inc. Multi-microphone system
US7961897B2 (en) * 2005-08-23 2011-06-14 Analog Devices, Inc. Microphone with irregular diaphragm
US8130979B2 (en) * 2005-08-23 2012-03-06 Analog Devices, Inc. Noise mitigating microphone system and method
EP1764162B1 (en) * 2005-09-14 2008-04-30 Esaote S.p.A. Electro-acoustic transducer for high frequency applications
JP2008042869A (en) * 2005-10-05 2008-02-21 Seiko Epson Corp Electrostatic ultrasonic transducer, ultrasonic speaker, sound signal reproducing method, ultra-directional acoustic system, and display device
US7420472B2 (en) * 2005-10-16 2008-09-02 Bao Tran Patient monitoring apparatus
DE102005050398A1 (en) * 2005-10-20 2007-04-26 Epcos Ag Cavity housing for a mechanically sensitive electronic device and method of manufacture
DE102005053765B4 (en) 2005-11-10 2016-04-14 Epcos Ag MEMS package and method of manufacture
DE102005053767B4 (en) 2005-11-10 2014-10-30 Epcos Ag MEMS microphone, method of manufacture and method of installation
DE102006001886A1 (en) * 2006-01-13 2007-07-19 Siemens Audiologische Technik Gmbh Microphone device with multiple silicon microphones for a hearing device
GB2443756B (en) * 2006-02-24 2010-03-17 Wolfson Microelectronics Plc MEMS device
JP2007229825A (en) * 2006-02-27 2007-09-13 Hirosaki Univ Minute electromechanical structure and manufacturing method thereof, and minute electromechanical element
ATE471635T1 (en) * 2006-03-30 2010-07-15 Sonion Mems As SINGLE-CHIP ACOUSTIC MEMS TRANSDUCER AND MANUFACTURING METHOD
US20070268209A1 (en) * 2006-05-16 2007-11-22 Kenneth Wargon Imaging Panels Including Arrays Of Audio And Video Input And Output Elements
JP4689542B2 (en) * 2006-06-08 2011-05-25 パナソニック株式会社 Membrane stiffness measuring apparatus and measuring method
US8344487B2 (en) 2006-06-29 2013-01-01 Analog Devices, Inc. Stress mitigation in packaged microchips
US20080013747A1 (en) * 2006-06-30 2008-01-17 Bao Tran Digital stethoscope and monitoring instrument
JP4951067B2 (en) * 2006-07-25 2012-06-13 アナログ デバイシス， インコーポレイテッド Multiple microphone systems
EP1906704B1 (en) * 2006-09-26 2012-03-21 Epcos Pte Ltd A calibrated microelectromechanical microphone
US8165323B2 (en) * 2006-11-28 2012-04-24 Zhou Tiansheng Monolithic capacitive transducer
TW200847827A (en) * 2006-11-30 2008-12-01 Analog Devices Inc Microphone system with silicon microphone secured to package lid
US20080139893A1 (en) * 2006-12-08 2008-06-12 Warren Lee Apparatus And System For Sensing and Analyzing Body Sounds
US7970148B1 (en) * 2007-05-31 2011-06-28 Raytheon Company Simultaneous enhancement of transmission loss and absorption coefficient using activated cavities
WO2009017718A2 (en) * 2007-07-27 2009-02-05 Kenneth Wargon Flexible sheet audio-video device
US7829366B2 (en) * 2008-02-29 2010-11-09 Freescale Semiconductor, Inc. Microelectromechanical systems component and method of making same
US8280097B2 (en) * 2008-08-21 2012-10-02 United Microelectronics Corp. Microelectromechanical system diaphragm and fabricating method thereof
FR2938918B1 (en) * 2008-11-21 2011-02-11 Commissariat Energie Atomique METHOD AND DEVICE FOR THE ACOUSTIC ANALYSIS OF MICROPOROSITIES IN MATERIALS SUCH AS CONCRETE USING A PLURALITY OF CMUTS TRANSDUCERS INCORPORATED IN THE MATERIAL
GB2467776A (en) 2009-02-13 2010-08-18 Wolfson Microelectronics Plc Integrated MEMS transducer and circuitry
DE102009026502B4 (en) 2009-05-27 2017-03-16 Robert Bosch Gmbh Micromechanical component
US8238018B2 (en) 2009-06-01 2012-08-07 Zhou Tiansheng MEMS micromirror and micromirror array
US9036231B2 (en) 2010-10-20 2015-05-19 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US10551613B2 (en) 2010-10-20 2020-02-04 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US9148712B2 (en) 2010-12-10 2015-09-29 Infineon Technologies Ag Micromechanical digital loudspeaker
DE102011003168A1 (en) * 2011-01-26 2012-07-26 Robert Bosch Gmbh Speaker System
US8643140B2 (en) 2011-07-11 2014-02-04 United Microelectronics Corp. Suspended beam for use in MEMS device
US8525354B2 (en) 2011-10-13 2013-09-03 United Microelectronics Corporation Bond pad structure and fabricating method thereof
EP2774390A4 (en) 2011-11-04 2015-07-22 Knowles Electronics Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
US9385634B2 (en) 2012-01-26 2016-07-05 Tiansheng ZHOU Rotational type of MEMS electrostatic actuator
DE102012202921A1 (en) 2012-02-27 2013-08-29 Robert Bosch Gmbh Acoustic transducer e.g. direct digital transducer used in integrated switching circuit, has control device divides received digital audio data into individual samples and controls spark gap devices according to respective samples
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
DE102012216996A1 (en) 2012-09-21 2014-03-27 Robert Bosch Gmbh Micro-electromechanical systems (MEMS) sound transducer of MEMS sound transducer arrangement, has diaphragm whose projection is arranged above projection of substrate, and whose recess is extended themselves into recess of substrate
US9183829B2 (en) 2012-12-21 2015-11-10 Intel Corporation Integrated accoustic phase array
US9173024B2 (en) 2013-01-31 2015-10-27 Invensense, Inc. Noise mitigating microphone system
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
US8680894B1 (en) * 2013-03-06 2014-03-25 Calient Technologies, Inc. Precision driver circuits for micro-electro-mechanical system
US8981501B2 (en) 2013-04-25 2015-03-17 United Microelectronics Corp. Semiconductor device and method of forming the same
DE102013106353B4 (en) * 2013-06-18 2018-06-28 Tdk Corporation Method for applying a structured coating to a component
US10659889B2 (en) * 2013-11-08 2020-05-19 Infineon Technologies Ag Microphone package and method for generating a microphone signal
WO2015112498A1 (en) * 2014-01-21 2015-07-30 Knowles Electronics, Llc Microphone apparatus and method to provide extremely high acoustic overload points
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
JP6213679B2 (en) * 2015-05-20 2017-10-18 第一精工株式会社 Digital speaker, speaker system and earphone
EP3099047A1 (en) * 2015-05-28 2016-11-30 Nxp B.V. Echo controller
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
JP6429759B2 (en) * 2015-10-24 2018-11-28 キヤノン株式会社 Capacitance type transducer and information acquisition device including the same
CN105744449A (en) * 2016-01-06 2016-07-06 吴泓均 Film speaker and manufacturing method thereof
US9716955B1 (en) * 2016-03-24 2017-07-25 Revx Technologies Device for monitoring a sound pressure level
US9918173B1 (en) 2016-03-24 2018-03-13 Revx Technologies Adaptable sound quality device
DE102016113347A1 (en) * 2016-07-20 2018-01-25 Infineon Technologies Ag METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
US11243192B2 (en) 2016-09-27 2022-02-08 Vaon, Llc 3-D glass printable hand-held gas chromatograph for biomedical and environmental applications
US11203183B2 (en) * 2016-09-27 2021-12-21 Vaon, Llc Single and multi-layer, flat glass-sensor structures
US10015658B1 (en) 2017-05-18 2018-07-03 Motorola Solutions, Inc. Method and apparatus for maintaining mission critical functionality in a portable communication system
DE102018104561A1 (en) * 2018-02-28 2019-08-29 USound GmbH Method for operating a piezoelectric loudspeaker
US10899605B2 (en) 2018-03-05 2021-01-26 Sharp Kabushiki Kaisha MEMS device and manipulation method for micro-objects
US10636936B2 (en) 2018-03-05 2020-04-28 Sharp Kabushiki Kaisha MEMS array system and method of manipulating objects
US10681488B1 (en) * 2019-03-03 2020-06-09 xMEMS Labs, Inc. Sound producing apparatus and sound producing system
JP7433870B2 (en) 2019-12-04 2024-02-20 エルジー ディスプレイ カンパニー リミテッド Display device and information processing device
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993019343A1 (en) * 1992-03-16 1993-09-30 Lynxvale Limited Micromechanical sensor
WO1994030030A1 (en) * 1993-06-04 1994-12-22 The Regents Of The University Of California Microfabricated acoustic source and receiver
US5658710A (en) * 1993-07-16 1997-08-19 Adagio Associates, Inc. Method of making superhard mechanical microstructures
EP0911952A2 (en) * 1997-10-27 1999-04-28 Hewlett-Packard Company Electrostatic actuator

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4555787A (en) * 1980-09-12 1985-11-26 Northrop Corporation Gas laser preionization device
NL8303185A (en) 1983-09-15 1985-04-01 Philips Nv HYBRID SPEAKER SYSTEM MAY INCLUDE ONE OR MORE CORRECTION CHAINS.
JPH0722439B2 (en) * 1985-10-14 1995-03-08 松下電器産業株式会社 Low distortion speaker device
JPS62115994A (en) * 1985-11-14 1987-05-27 Sony Corp Motional feedback circuit
JPS62120195A (en) * 1985-11-20 1987-06-01 Matsushita Electric Ind Co Ltd Low distortion speaker device
JPH0750789B2 (en) * 1986-07-18 1995-05-31 日産自動車株式会社 Method for manufacturing semiconductor pressure converter
JP2701279B2 (en) * 1987-12-28 1998-01-21 ヤマハ株式会社 Sound equipment
JPH01312485A (en) * 1988-06-13 1989-12-18 Agency Of Ind Science & Technol Electrostatic capacitor type ultrasonic wave transducer
JPH077788A (en) * 1993-03-19 1995-01-10 Ford Motor Co Sound reproduction system and sound reproduction method
EP0618435A3 (en) * 1993-03-30 1995-02-01 Siemens Ag Capacitive pressure sensor.
US5774252A (en) 1994-01-07 1998-06-30 Texas Instruments Incorporated Membrane device with recessed electrodes and method of making
US5876187A (en) 1995-03-09 1999-03-02 University Of Washington Micropumps with fixed valves
US5717631A (en) 1995-07-21 1998-02-10 Carnegie Mellon University Microelectromechanical structure and process of making same
US5828394A (en) * 1995-09-20 1998-10-27 The Board Of Trustees Of The Leland Stanford Junior University Fluid drop ejector and method
US5949892A (en) * 1995-12-07 1999-09-07 Advanced Micro Devices, Inc. Method of and apparatus for dynamically controlling operating characteristics of a microphone
IL116536A0 (en) 1995-12-24 1996-03-31 Harunian Dan Direct integration of sensing mechanisms with single crystal based micro-electric-mechanics systems
US5751469A (en) 1996-02-01 1998-05-12 Lucent Technologies Inc. Method and apparatus for an improved micromechanical modulator
AU2923397A (en) * 1996-04-18 1997-11-07 California Institute Of Technology Thin film electret microphone
JPH09325032A (en) * 1996-06-03 1997-12-16 Ngk Spark Plug Co Ltd Angular velocity sensor
EP0856825B1 (en) 1997-01-31 2004-11-17 STMicroelectronics S.r.l. Process for manufacturing integrated semiconductor devices comprising a chemoresistive gas microsensor
JP3502524B2 (en) * 1997-02-19 2004-03-02 日本碍子株式会社 Transducer array
JP3845487B2 (en) * 1997-02-19 2006-11-15 日本碍子株式会社 Electrostatic speaker
US5867302A (en) 1997-08-07 1999-02-02 Sandia Corporation Bistable microelectromechanical actuator
JPH11160181A (en) * 1997-11-28 1999-06-18 Omron Corp Electrostatic capacity type sensor
US6829131B1 (en) * 1999-09-13 2004-12-07 Carnegie Mellon University MEMS digital-to-acoustic transducer with error cancellation
US6262946B1 (en) * 1999-09-29 2001-07-17 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993019343A1 (en) * 1992-03-16 1993-09-30 Lynxvale Limited Micromechanical sensor
WO1994030030A1 (en) * 1993-06-04 1994-12-22 The Regents Of The University Of California Microfabricated acoustic source and receiver
US5658710A (en) * 1993-07-16 1997-08-19 Adagio Associates, Inc. Method of making superhard mechanical microstructures
EP0911952A2 (en) * 1997-10-27 1999-04-28 Hewlett-Packard Company Electrostatic actuator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8345895B2 (en) 2008-07-25 2013-01-01 United Microelectronics Corp. Diaphragm of MEMS electroacoustic transducer
US8553911B2 (en) 2008-07-25 2013-10-08 United Microelectronics Corp. Diaphragm of MEMS electroacoustic transducer

Also Published As

Publication number Publication date
US7019955B2 (en) 2006-03-28
US20050061770A1 (en) 2005-03-24
EP1216602A2 (en) 2002-06-26
AU7376500A (en) 2001-04-17
JP2003509984A (en) 2003-03-11
EP1216602B1 (en) 2008-08-13
DK1216602T3 (en) 2008-12-15
US20050013455A1 (en) 2005-01-20
US6829131B1 (en) 2004-12-07
DE60039898D1 (en) 2008-09-25
JP4987201B2 (en) 2012-07-25
WO2001020948A2 (en) 2001-03-22
US7215527B2 (en) 2007-05-08
ATE405130T1 (en) 2008-08-15

Similar Documents

Publication Publication Date Title
WO2001020948A3 (en) Mems digital-to-acoustic transducer with error cancellation
US20190116428A1 (en) Ultrasonic operation of a digital microphone
CN101453684B (en) Sound input device
EP1398298A3 (en) Process of making an all-silicon microphone
US20100166235A1 (en) Silicon condenser microphone
US7003125B2 (en) Micromachined piezoelectric microspeaker and fabricating method thereof
TW201216729A (en) A microphone apparatus and method
US20120056282A1 (en) MEMS Transducer for an Audio Device
KR20090059756A (en) Piezoelectric micro speaker using micro electro mechanical systems and manufacturing method thereof
WO2013071951A1 (en) Mems microphone with reduced parasitic capacitance
JPS6132879B2 (en)
Kim et al. Improved IC-compatible piezoelectric microphone and CMOS process
WO2002091796A3 (en) Surface micromachined process for manufacturing electroacoustic transducers
US9532125B2 (en) Noise cancellation microphones with shared back volume
KR101452396B1 (en) Mems microphone having multiple sound pass hole
WO2021000070A1 (en) Mems microphone
CN101682816A (en) Electro-acoustic sound transducer, receiver and microphone
Fueldner Microphones
CN104822117A (en) Packaging structure for MEMS microphones
KR20200040958A (en) Directional MEMS microphone and MEMS microphone module comprising it
Yi et al. Piezoelectric microspeaker with compressive nitride diaphragm
CN201312384Y (en) Anti-noise bone-conduction microphone
WO2022057197A1 (en) Silicon-based microphone device and electronic device
WO2005053357A1 (en) Piezoelectric microspeaker with corrugated diaphragm
WO2022057198A1 (en) Silicon based microphone apparatus and electronic device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

ENP Entry into the national phase

Ref country code: JP

Ref document number: 2001 524394

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 2000961871

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2000961871

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642