WO2001065294A3 - Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs - Google Patents

Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs Download PDF

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Publication number
WO2001065294A3
WO2001065294A3 PCT/US2001/006659 US0106659W WO0165294A3 WO 2001065294 A3 WO2001065294 A3 WO 2001065294A3 US 0106659 W US0106659 W US 0106659W WO 0165294 A3 WO0165294 A3 WO 0165294A3
Authority
WO
WIPO (PCT)
Prior art keywords
modules
motherboard
aligned
common substrate
plugs
Prior art date
Application number
PCT/US2001/006659
Other languages
French (fr)
Other versions
WO2001065294A2 (en
Inventor
Kelvin Chau
Original Assignee
Onix Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Onix Microsystems Inc filed Critical Onix Microsystems Inc
Priority to AU2001250791A priority Critical patent/AU2001250791A1/en
Publication of WO2001065294A2 publication Critical patent/WO2001065294A2/en
Publication of WO2001065294A3 publication Critical patent/WO2001065294A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10484—Obliquely mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

For any optically interconnected assembly, the packaging tasks include alignment of one or multiple optical devices (712), and attachement of aligned modules to a common substrate (702). The concept disclosed here is a packaging method to assemble pre-aligned optical modules (712) on a common structure called motherboard (702). The apparatus consists of two components: device carrier (704) or motherboard (702) with openings on the sides and adjustable plugs (706) in the form of pins or balls. The method and apparatus utilize plugs (706) as connection bridges between device carriers (704) and motherboard (702), allowing solid contacts and a rigid aligned structure among modules (712). The direct benefits include relaxation of dimensional tolerances on parts and elimination of the need for high-precision spacers.
PCT/US2001/006659 2000-02-28 2001-02-28 Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs WO2001065294A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001250791A AU2001250791A1 (en) 2000-02-28 2001-02-28 Apparatus and packaging method to assemble optical modules to a common substratewith adjustable plugs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/514,424 US6375365B1 (en) 2000-02-28 2000-02-28 Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs
US09/514,424 2000-02-28

Publications (2)

Publication Number Publication Date
WO2001065294A2 WO2001065294A2 (en) 2001-09-07
WO2001065294A3 true WO2001065294A3 (en) 2002-03-07

Family

ID=24047062

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/006659 WO2001065294A2 (en) 2000-02-28 2001-02-28 Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs

Country Status (3)

Country Link
US (2) US6375365B1 (en)
AU (1) AU2001250791A1 (en)
WO (1) WO2001065294A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375365B1 (en) * 2000-02-28 2002-04-23 Onix Microsystems, Inc. Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs
US6547452B1 (en) * 2000-05-11 2003-04-15 International Business Machines Corporation Alignment systems for subassemblies of overmolded optoelectronic modules
GB2402100B (en) * 2000-05-11 2005-01-19 Ibm Alignment systems for subassemblies of overmolded optoelectronic modules
US6886989B2 (en) 2000-12-15 2005-05-03 Intel Corporation Alignment of fiber optic bundle to array waveguide using pins
US6707970B2 (en) * 2000-12-15 2004-03-16 Intel Corporation Alignment of fiber optic bundle to array waveguide using an epoxy
WO2003003093A1 (en) * 2001-06-29 2003-01-09 Xanoptix, Inc. Method for relaxing mechanical tolerance in an opto-electronic unit
US20030174419A1 (en) * 2001-12-06 2003-09-18 David Kindler Optical assembly and method of making
US7009136B2 (en) * 2002-10-09 2006-03-07 General Motors Corporation Method of fabricating a bipolar plate assembly
JP6383529B2 (en) * 2013-09-30 2018-08-29 株式会社エンプラス Optical receptacle and optical module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758063A (en) * 1986-05-20 1988-07-19 Konechny Jr Edward T Optical device and circuit board set
US5864642A (en) * 1997-02-10 1999-01-26 Motorola, Inc. Electro-optic device board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4347655A (en) 1978-09-28 1982-09-07 Optical Information Systems, Inc. Mounting arrangement for semiconductor optoelectronic devices
US4240098A (en) 1978-09-28 1980-12-16 Exxon Research & Engineering Co. Semiconductor optoelectronic device package
US4763412A (en) 1986-06-26 1988-08-16 American Telephone And Telegraph Company Method and apparatus for inserting pins in a substrate
US4758263A (en) 1986-10-27 1988-07-19 Sandoz Ltd. 2-(2,5-difluorophenyl)-4-methyl-1,2,4-oxadiazolidine-3,5 diones
US5026138A (en) 1989-08-29 1991-06-25 Gte Laboratories Incorporated Multi-fiber alignment package for tilted facet optoelectronic components
US5042709A (en) 1990-06-22 1991-08-27 International Business Machines Corporation Methods and apparatus for precise alignment of objects
EP0562211A1 (en) * 1992-03-25 1993-09-29 International Business Machines Corporation Self-aligning fiber couplers
US5388174A (en) * 1993-02-22 1995-02-07 At&T Corp. Optical fiber connector techniques
JPH0774343A (en) * 1993-08-31 1995-03-17 Fujitsu Ltd Integrated optical device and manufacture thereof
US5692084A (en) 1996-06-11 1997-11-25 The Whitaker Corporation Package for an optoelectronic device
US5768456A (en) 1996-11-22 1998-06-16 Motorola, Inc. Optoelectronic package including photonic device mounted in flexible substrate
US6375365B1 (en) * 2000-02-28 2002-04-23 Onix Microsystems, Inc. Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758063A (en) * 1986-05-20 1988-07-19 Konechny Jr Edward T Optical device and circuit board set
US5864642A (en) * 1997-02-10 1999-01-26 Motorola, Inc. Electro-optic device board

Also Published As

Publication number Publication date
US6853779B2 (en) 2005-02-08
WO2001065294A2 (en) 2001-09-07
US20020159707A1 (en) 2002-10-31
AU2001250791A1 (en) 2001-09-12
US6375365B1 (en) 2002-04-23

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