WO2001076878A1 - High density component structure formed by assembling and method for making same - Google Patents

High density component structure formed by assembling and method for making same Download PDF

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Publication number
WO2001076878A1
WO2001076878A1 PCT/FR2001/001092 FR0101092W WO0176878A1 WO 2001076878 A1 WO2001076878 A1 WO 2001076878A1 FR 0101092 W FR0101092 W FR 0101092W WO 0176878 A1 WO0176878 A1 WO 0176878A1
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WIPO (PCT)
Prior art keywords
bars
axis
elements
succession
bar
Prior art date
Application number
PCT/FR2001/001092
Other languages
French (fr)
Inventor
François BALERAS
Claude Massit
Gilles Poupon
Henri Sibuet
Original Assignee
Commissariat A L'energie Atomique
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Application filed by Commissariat A L'energie Atomique filed Critical Commissariat A L'energie Atomique
Publication of WO2001076878A1 publication Critical patent/WO2001076878A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Definitions

  • the invention relates to a structure comprising a succession of elements intended to transmit or receive a signal along an axis.
  • the invention advantageously applies to the case where the elements intended to transmit or receive the signal must reach a high density. It can be, for example, arrays of optical components (laser diodes, optical fibers, detectors), arrays of antennas, 'printheads, etc.
  • the invention will be more particularly described in the case of a print head.
  • a known printing technique is printing using bars.
  • Each bar includes elements aligned side by side.
  • Each element is either a magnetic head or a resistor, depending on whether the printing signal is magnetostatic or thermal.
  • One or more strips placed end to end form a line the width of the support to be printed.
  • the support which receives the impression scrolls in relation to the bars which transform the electrical writing signals received either into magnetic signals or into thermal signals.
  • the printing of the support is carried out line by line by relative scrolling of the support or the bars.
  • Each element receives a write signal which is renewed with each line to be printed.
  • a first known technique consists in assembling individual printheads.
  • An individual print head can include, for example, a magnetic head controlled by a diode or a transistor.
  • the magnetic head is made on a mechanical support and the control diode is welded on the support.
  • the individual print heads are then mounted on a mechanical support with an interposer between the heads.
  • This manufacturing method limits the resolution of the print head to values between 150 and 300 dpi (dpi for "dot per inch”).
  • a second manufacturing method is linked to microelectronics techniques.
  • the print heads are then produced collectively on a semiconductor substrate.
  • An example of a collective structure of printheads obtained according to this second method is shown in FIG. 1.
  • the print head 1 consists of a set of individual magnetic heads 3 produced on a semiconductor substrate 4. Each individual magnetic head 3 is controlled by a diode 2.
  • the diodes 2 can be integrated or attached to the semi substrate -conductor 4.
  • This second manufacturing technique achieves resolutions of the order of 600 dpi.
  • the drum 5 of the printer comes into contact with the magnetic heads 3.
  • the diodes 2 are attached to the substrate 4, it is then necessary to move the diodes 2 away from the heads 3 in order to d '' prevent the drum from coming into contact with the diodes.
  • the area between the diodes 2 and the heads 3 is then lost.
  • the length of the line which separates a diode 2 from a magnetic head 3 can then have an electrical resistance capable of reducing the performance of the magnetic head.
  • the invention relates to a structure comprising a succession of elements for transmitting or receiving a signal along an axis.
  • the structure includes at least a set of two bars (10, 11) stacked in the direction perpendicular to the axis, each bar comprising a succession of elements aligned in a direction parallel to the axis, two successive elements of the structure in the direction parallel to the axis belonging to two different bars.
  • the invention also relates to a method of manufacturing a structure comprising a succession of elements intended to transmit or receive a signal along an axis.
  • the method comprises at least one step of stacking two bars in a direction perpendicular to the axis, each bar comprising a succession of elements aligned in a direction parallel to the axis, the stacking being carried out so that two elements of the structure belong to two different bars.
  • two successive elements of the structure in the direction of the axis are offset, one with respect to the other, in the direction perpendicular to the axis.
  • the offset of the elements relative to the axis can be compensated by an electronic time-shift system. This is the case when the difference between two successive elements in the direction perpendicular to the axis is greater than the pitch which separates two elements along the axis. When the difference is less than or equal to said step, the phase shift system is not necessary.
  • the invention also relates to a device comprising a structure such as that according to the invention.
  • the device further comprises a electronic time shift system to compensate for the offset between two successive elements in the direction perpendicular to the axis.
  • the invention also relates to a print head comprising a succession of magnetic heads or resistors for carrying out printing along an axis.
  • the print head is a structure such as according to the invention mentioned above.
  • a print head according to the invention comprises a line of magnetic heads or resistors per assembled level.
  • the printhead according to the invention does not include an intermediate level for establishing the connection between the magnetic heads or the resistors and the control circuits of the magnetic heads or of the resistances.
  • the invention also relates to a method of manufacturing a print head comprising a succession of magnetic heads or resistors for carrying out printing along an axis.
  • the method implements a method such as according to the invention mentioned above.
  • the invention advantageously makes it possible to obtain a high resolution structure.
  • FIG. 1 represents a printhead according to the prior art
  • FIG. 2 represents a sectional view of the print head of FIG. 1, equipped with its drum,
  • FIG. 3 represents a perspective view of a first example of a printhead according to the invention
  • FIG. 4 shows a sectional view of a second example of a print head according to
  • FIG. 5A-5J represent a method of manufacturing a print head as shown in Figure 4
  • - Figures 6A and 6B respectively represent a third example and a fourth example of a print head according to the invention.
  • FIG. 3 represents a perspective view of two sub-assemblies making it possible to produce a first example of a printhead according to the invention.
  • a first subset El comprises a first strip 6, a second strip 7, and several blocks of diodes B1, B2, B3.
  • a second subset E2, identical to the first subset El, comprises a first strip 8, a second strip 9 and several blocks of diodes (not shown in the figure).
  • the bars 6 and 7 of the subassembly El, as well as the bars 8 and 9 of the subassembly E2, are fixed to each other, for example using solder balls deposited on the pads d hooking. These solder balls also allow an electrical connection between the bars 6 and 7 of the sub-assembly El and the bars 8 and 9 of the sub-assembly E2.
  • Each bar includes a set of magnetic heads produced on one of its faces.
  • the face on which the magnetic heads of the strip 6 are located is fixed to the face on which the magnetic heads of the strip 7 are located.
  • the face on which the magnetic heads of the strip 8 are located is fixed to the face on which the magnetic heads of the bar 9 are located.
  • the bar 7 (respectively 9) is positioned on the bar 6 (respectively 8) and during the phase of recasting of the solder balls, the parts are self-align.
  • the control diodes of the magnetic heads of the first sub-assembly El are produced by blocks (B1, B2, B3) attached to the face of the bar 6 on which the magnetic heads are produced.
  • the diodes of the blocks Bl, B2, B3 advantageously make it possible to control both the magnetic heads of the strip 6 and the magnetic heads of the strip 7.
  • the inputs / outputs (not shown in the figure) of the control circuits of the magnetic heads bars 6 and 7 can then advantageously be positioned at the same level.
  • control diodes of the magnetic heads of the second sub-assembly E2 are produced in blocks (not shown in the figure) attached to the face of the bar 8 on which the magnetic heads are produced.
  • the diodes of the blocks thus attached make it possible to control the magnetic heads of the bars 8 and 9.
  • the inputs / outputs (not shown in the figure) of the control circuits of the magnetic heads of the bars 8 and 9 can then advantageously be positioned at the same level.
  • the two sub-assemblies El and E2 are assembled together using spacers T, for example rigid balls, placed in cavities C previously produced on the rear faces of the respective bars 6 and 8.
  • the two sub-assemblies El and E2 are pressed one against the other and aligned.
  • the remaining space between the modules can then be filled with glue, for example epoxy resin.
  • the assembly of the sub-assemblies E1 and E2 can be carried out by fusible balls attached to the attachment studs. These attachment studs are then previously produced on the rear faces of the respective bars 6 and 8.
  • the reflow temperature of the balls used for the assembly of the subassemblies El and E2 is then lower than that of the balls used for the assembly of the bars 6 and 7 (respectively 8 and 9). If this were not the case, during the assembly step (reflow), all the fusible balls would pass into liquid phase and the weight of the bars would induce a crushing of the different fusible material between the upper and lower stages of the structure. This would then lead to different spacings between the bars. According to the invention, the use of two different fusible materials advantageously makes it possible not to modify the spacings between bars.
  • the two sub-assemblies El and E2 self-align, thus allowing very precise control of the distances.
  • a space between stages of 45 ⁇ m ⁇ 1 ⁇ m, over a length of 2.54 cm, can be obtained.
  • the assembly can, at the end of the process, be advantageously filled, for example, with resin, to obtain a mechanically rigid assembly (the same is true for the others examples of implementation). Filling with resin can be done in one pass.
  • the ends of the magnetic heads of the sub-assembly El and E2 constitute magnetic poles.
  • the sub-assembly El comprises 14 magnetic poles pEli, ..., pEl 14 and the sub-assembly E2 comprises 14 magnetic poles pE2 ⁇ , ..., pE2 ⁇ 4 .
  • the signals which make it possible to form a printing line on the support then consist, for example, of signals coming from successive magnetic poles pEl x , pE2 ⁇ , pEl 2 , pE2 2 , • • •, PEI14, pE2 14 .
  • the difference in height of the poles in the direction perpendicular to the axis defined by the printing line can be compensated by an electronic time-shift system.
  • a pitch of the magnetic poles leading to a resolution of 225 dpi for a bar (6, 7, 8 or 9)
  • the assembly of the two subsets E1 and E2 with an offset of a quarter of a step then leads to a resolution of 900 dpi.
  • Such a resolution can be further increased if the pitch of the magnetic poles of a strip leads to a resolution greater than 225 dpi.
  • a resolution of 300 dpi for bars 6, 7, 8 and 9 leads to a resolution of 1200 dpi (4 x 300 dpi) for the print head made up of the two sub-assemblies El and E2.
  • the offset of the magnetic poles in a direction parallel to the printing axis can be achieved in different ways. It is for example possible either to produce different bars as to the position of the magnetic poles and to assemble the bars symmetrically, or to make identical bars and to assemble the bars with an offset.
  • FIG. 4 represents a sectional view of a second example of a printhead according to the invention.
  • the print head shown, by way of example, in FIG. 4 comprises four bars 10, 11, 12, 13.
  • the distance d can, for example, be substantially equal to 110 ⁇ m.
  • the face on which the magnetic heads of each bar are located also includes ball attachment points pa.
  • a first sub-assembly is formed by assembling the bars 10 and 11 using solder balls b.
  • a second sub-assembly is formed by assembling the bars 12 and 13 using solder balls b.
  • the two subsets as well constituted are fixed together by spacers T, for example glass beads.
  • the magnetic poles are offset by assembling the bars.
  • the distance d represents the step which separates two successive magnetic poles of the same bar.
  • the magnetic poles of the strip 10 are offset by a quarter of a step (d / 8) relative to the latching pads pa which connect the strip 10 to the strip 11.
  • the magnetic poles of the strip 13 are likewise offset d '' a 1/8 of a step (d / 8) relative to the latching studs pa which connect the bar 13 to the bar 12.
  • the bar 11 (respectively 13) is offset by a quarter of a step (d / 4) relative to the bar 10 (respectively 12) and the two sub-assemblies FI and F2 are offset by a half-step (d / 2) between them.
  • the pitch of the magnetic poles along the printing axis is then equal to d / 4.
  • a structure with four bars according to the invention makes it possible to obtain 2 4 configurations for the order of the heads. In certain configurations, it is possible not to have identical bars.
  • the precision on the pitch of the magnetic poles is obtained by the precision of assembly by solder balls. For example, it is possible to obtain an accuracy of + 0.2 ⁇ m along the printing axis and an accuracy of + 1 ⁇ m in the direction perpendicular to this axis.
  • the precision on the relative positioning of the two sub-assemblies can also be equal to + 1 ⁇ m if solder balls are used to assemble the two sub-assemblies.
  • FIGS. 5A-5J represent a method for manufacturing a print head as shown in FIG. 4.
  • FIG. 5A represents a substrate S, for example a silicon substrate, a first face of which is covered with magnetic heads and a second face of which is covered with an etching mask 14 produced, for example, by a layer of silicon nitride .
  • the ends of the magnetic heads constitute the magnetic poles Plli, pll 2 , pll 3 and pll 4 .
  • An insulating layer I on the surface of the substrate S surrounds the magnetic heads plli, pll 2 , pll 3 , pll.
  • FIG. 51 represents the assembly of the bars 10 and 11.
  • FIG. 5J represents the assembly of the bars 10, 11, 12 and 13 to constitute a print head as shown in FIG. 4.
  • the method of manufacturing the bar 11 from the structure shown in FIG. 5A consists of the following steps:
  • the etching can be dry or wet etching, for example using a KOH-based solution,
  • FIG. 51 shows the assembly of the bars 10 and 11.
  • the bar 10 is made from a structure such as that of Figure 5A but devoid of etching mask 14.
  • the bars 10 and 11 are assembled using solder balls b.
  • the distance between the bars can be adjusted by the height of the solder balls.
  • FIG. 5J represents the step of assembling, by spacers T, a first subset Fl consisting of bars 10 and 11 and a second sub-assembly F2 consisting of bars 12 and 13.
  • glue for example epoxy resin, can be introduced into the space remaining between the sub-assemblies FI and F2, as well as in the space which separates the bars.
  • the invention also relates to the case where no glue is introduced between the sub-assemblies FI and F2 and / or the space which separates the bars.
  • the method according to the invention then advantageously allows easy repair of the print head. It is indeed possible to replace a defective sub-assembly FI or F2 by another, or even a bar by another.
  • the magnetic heads are controlled by control diodes.
  • the diodes for controlling the magnetic heads of the structure constituted by the bars 10 and 11 are preferably assembled at the same time as the bars 10 and 11 are assembled. the same is true for the control diodes of the magnetic heads of the structure constituted by the bars 12 and 13 which are preferably assembled at the same time as the bars 12 and 13 are assembled.
  • the diodes can also be integrated into the substrate S.
  • FIGS. 6A and 6B respectively represent a sectional view of a third example of assembly of bars according to the invention and a view in section of a fourth example of assembly of bars according to the invention.
  • the print head comprises four bars 17, 18, 19, 20 stacked in a pyramidal fashion.
  • the bars are connected to each other by solder balls b deposited on hooking pads.
  • Connection wires F electrically connect the faces of the bars on which the magnetic heads are located. The use of electrical connection wires makes it possible to bring all the input / output pads on the same bar.
  • the print head also comprises four superimposed bars 21, 22, 23, 24.
  • a first sub-assembly consists of the two bars 21, 22 assembled by solder balls.
  • a second sub-assembly consists of the two bars 23, 24 also assembled by solder balls.
  • the first and second sub-assemblies are assembled by a solder ball B of dimensions greater than the solder balls b which connect the bars together. This ball B also makes it possible to electrically connect the sub-assemblies.
  • the printheads are magnetic printheads. More generally, the invention also relates to other types of printhead, for example printheads which include resistors in place of magnetic heads.

Abstract

The invention concerns a structure comprising a succession of elements for transmitting or receiving a signal along an axis. The structure comprises at least an assembly of two arrays (10, 11) stacked along the direction perpendicular to the axis, each array comprising a succession of elements aligned along a direction parallel to the axis, the aligned elements belonging to a first array are offset, in the direction of the axis, relative to the aligned elements belonging to another array. The invention is applicable to the field of medium printing and, more particularly, high resolution medium printing.

Description

STRUCTURE DE COMPOSANTS HAUTE-DENSITE FORMEE PAR ASSEMBLAGE ET SON PROCEDE DE FABRICATION STRUCTURE OF HIGH-DENSITY COMPONENTS FORMED BY ASSEMBLY AND MANUFACTURING METHOD THEREOF
Domaine technique et art antérieur L'invention concerne une structure comprenant une succession d'éléments destinés à émettre ou à recevoir un signal le long d'un axe.TECHNICAL FIELD AND PRIOR ART The invention relates to a structure comprising a succession of elements intended to transmit or receive a signal along an axis.
L'invention s'applique avantageusement au cas où les éléments destinés à émettre ou à recevoir le signal doivent atteindre une haute densité. Il peut s'agir, par exemple, de réseaux de composants optiques (diodes laser, fibres optiques, détecteurs), de réseaux d'antennes, 'de têtes d'impression, etc.The invention advantageously applies to the case where the elements intended to transmit or receive the signal must reach a high density. It can be, for example, arrays of optical components (laser diodes, optical fibers, detectors), arrays of antennas, 'printheads, etc.
A titre d'exemple non limitatif, l'invention sera plus particulièrement décrite dans le cas d'une tête d'impression.By way of nonlimiting example, the invention will be more particularly described in the case of a print head.
Une technique d'impression connue est l'impression à l'aide de barrettes. Chaque barrette comprend des éléments alignés côte à côte. Chaque élément est soit une tête magnétique, soit une résistance, selon que le signal d'impression est magnétostatique ou thermique. Une ou plusieurs barrettes mises bout à bout forment une ligne de la largeur du support à imprimer. Le support qui reçoit l'impression défile par rapport aux barrettes qui transforment les signaux électriques d'écriture reçus soit en signaux magnétiques, soit en signaux thermiques. L'impression du support s'effectue ligne par ligne par défilement relatif du support ou des barrettes. Chaque élément reçoit un signal d'écriture qui se renouvelle à chaque ligne à imprimer. Plusieurs procédés de fabrication de tête d'impression sont connus de l'art antérieur.A known printing technique is printing using bars. Each bar includes elements aligned side by side. Each element is either a magnetic head or a resistor, depending on whether the printing signal is magnetostatic or thermal. One or more strips placed end to end form a line the width of the support to be printed. The support which receives the impression scrolls in relation to the bars which transform the electrical writing signals received either into magnetic signals or into thermal signals. The printing of the support is carried out line by line by relative scrolling of the support or the bars. Each element receives a write signal which is renewed with each line to be printed. Several methods for manufacturing a print head are known in the prior art.
Une première technique connue consiste à assembler des têtes d'impression individuelles. Une tête d'impression individuelle peut comporter, par exemple, une tête magnétique commandée par une diode ou un transistor. La tête magnétique est réalisée sur un support mécanique et la diode de commande est soudée sur le support. Les têtes d'impression individuelles sont alors montées sur un support mécanique avec un interposeur entre les têtes .A first known technique consists in assembling individual printheads. An individual print head can include, for example, a magnetic head controlled by a diode or a transistor. The magnetic head is made on a mechanical support and the control diode is welded on the support. The individual print heads are then mounted on a mechanical support with an interposer between the heads.
Cette méthode de fabrication limite la résolution de la tête d'impression à des valeurs comprises entre 150 et 300 dpi (dpi pour "dot per inch") .This manufacturing method limits the resolution of the print head to values between 150 and 300 dpi (dpi for "dot per inch").
Une deuxième méthode de fabrication est liée aux techniques de la micro-électronique. Les têtes d'impression sont alors réalisées de façon collective sur un substrat semi-conducteur. Un exemple de structure collective de têtes d'impression obtenue selon cette deuxième méthode est représentée en figure 1.A second manufacturing method is linked to microelectronics techniques. The print heads are then produced collectively on a semiconductor substrate. An example of a collective structure of printheads obtained according to this second method is shown in FIG. 1.
La tête d'impression 1 est constituée d'un ensemble de têtes magnétiques individuelles 3 réalisées sur un substrat semi-conducteur 4. Chaque tête magnétique individuelle 3 est commandée par une diode 2. Les diodes 2 peuvent être intégrées ou rapportées sur le substrat semi-conducteur 4.The print head 1 consists of a set of individual magnetic heads 3 produced on a semiconductor substrate 4. Each individual magnetic head 3 is controlled by a diode 2. The diodes 2 can be integrated or attached to the semi substrate -conductor 4.
Cette deuxième technique de fabrication permet d'atteindre des résolutions de l'ordre de 600 dpi.This second manufacturing technique achieves resolutions of the order of 600 dpi.
Cependant, de telles résolutions ne peuvent être atteintes qu'à l'aide d'une réduction de la taille des têtes magnétiques. De façon désavantageuse il en résulte une diminution de 1 ' intensité du champ magnétique induit par les têtes magnétiques . Cette technique présente également d'autres inconvénients .However, such resolutions cannot be achieved only by reducing the size of the magnetic heads. Disadvantageously, this results in a decrease in the intensity of the magnetic field induced by the magnetic heads. This technique also has other drawbacks.
Comme représenté en figure 2, le tambour 5 de 1 ' imprimante vient au contact des têtes magnétiques 3. Dans le cas où les diodes 2 sont rapportées sur le substrat 4, il est alors nécessaire d'éloigner les diodes 2 des têtes 3 afin d'éviter que le tambour ne vienne au contact des diodes. La zone située entre les diodes 2 et les têtes 3 est alors perdue. La longueur de la ligne qui sépare une diode 2 d'une tête magnétique 3 peut alors présenter une résistance électrique susceptible de réduire les performances de la tête magnétique.As shown in FIG. 2, the drum 5 of the printer comes into contact with the magnetic heads 3. In the case where the diodes 2 are attached to the substrate 4, it is then necessary to move the diodes 2 away from the heads 3 in order to d '' prevent the drum from coming into contact with the diodes. The area between the diodes 2 and the heads 3 is then lost. The length of the line which separates a diode 2 from a magnetic head 3 can then have an electrical resistance capable of reducing the performance of the magnetic head.
Dans le cas où les diodes 2 sont intégrées au substrat 4, l'inconvénient mentionné ci-dessus n'existe pas. Cependant, il est alors nécessaire de mettre en oeuvre deux technologies de fabrication différentes : une pour les diodes, une autre pour les têtes magnétiques. Le rendement de fabrication s'en trouve diminué . L'invention ne présente pas les inconvénients mentionnés ci-dessus.In the case where the diodes 2 are integrated into the substrate 4, the drawback mentioned above does not exist. However, it is then necessary to implement two different manufacturing technologies: one for the diodes, another for the magnetic heads. The manufacturing yield is thereby reduced. The invention does not have the drawbacks mentioned above.
Exposé de 1 ' inventionStatement of the invention
L'invention concerne une structure comprenant une succession d'éléments pour émettre ou recevoir un signal le long d'un axe. La structure comprend au moins un ensemble de deux barrettes (10, 11) empilées selon la direction perpendiculaire à l'axe, chaque barrette comprenant une succession d'éléments alignés selon une direction parallèle à l'axe, deux éléments successifs de la structure selon la direction parallèle à l'axe appartenant à deux barrettes différentes.The invention relates to a structure comprising a succession of elements for transmitting or receiving a signal along an axis. The structure includes at least a set of two bars (10, 11) stacked in the direction perpendicular to the axis, each bar comprising a succession of elements aligned in a direction parallel to the axis, two successive elements of the structure in the direction parallel to the axis belonging to two different bars.
L'invention concerne également un procédé de fabrication d'une structure comprenant une succession d'éléments destinés à émettre ou à recevoir un signal le long d'un axe. Le procédé comprend au moins une étape d'empilement de deux barrettes selon une direction perpendiculaire à l'axe, chaque barrette comprenant une succession d'éléments alignés selon une direction parallèle à l'axe, l'empilement étant effectué de sorte que deux éléments successifs de la structure appartiennent à deux barrettes différentes.The invention also relates to a method of manufacturing a structure comprising a succession of elements intended to transmit or receive a signal along an axis. The method comprises at least one step of stacking two bars in a direction perpendicular to the axis, each bar comprising a succession of elements aligned in a direction parallel to the axis, the stacking being carried out so that two elements of the structure belong to two different bars.
Selon l'invention, deux éléments successifs de la structure dans la direction de l'axe sont décalés, l'un par rapport à l'autre, dans la direction perpendiculaire à l'axe.According to the invention, two successive elements of the structure in the direction of the axis are offset, one with respect to the other, in the direction perpendicular to the axis.
Le décalage des éléments par rapport à l'axe peut être compensé par un système électronique de déphasage temporel. C'est le cas lorsque l'écart entre deux éléments successifs selon la direction perpendiculaire à l'axe est supérieur au pas qui sépare deux éléments selon l'axe. Lorsque l'écart est inférieur ou égal audit pas, le système de déphasage n'est pas nécessaire.The offset of the elements relative to the axis can be compensated by an electronic time-shift system. This is the case when the difference between two successive elements in the direction perpendicular to the axis is greater than the pitch which separates two elements along the axis. When the difference is less than or equal to said step, the phase shift system is not necessary.
Ainsi, l'invention concerne-t-elle également un dispositif comprenant une structure telle que celle selon l'invention. Le dispositif comprend, en outre, un système électronique de déphasage temporel pour compenser le décalage entre deux éléments successifs dans la direction perpendiculaire à l'axe.Thus, the invention also relates to a device comprising a structure such as that according to the invention. The device further comprises a electronic time shift system to compensate for the offset between two successive elements in the direction perpendicular to the axis.
L'invention concerne encore une tête d'impression comprenant une succession de têtes magnétiques ou de résistances pour réaliser une impression le long d'un axe. La tête d'impression est une structure telle que selon l'invention mentionnée ci-dessus. Avantageusement, une tête d'impression selon l'invention comprend une ligne de têtes magnétiques ou de résistances par niveau assemblé. Contrairement aux structures de têtes d'impression selon l'art antérieur, la tête d'impression selon l'invention ne comprend pas de niveau intermédiaire pour établir la connexion entre les têtes magnétiques ou les résistances et les circuits de commande des têtes magnétiques ou des résistances .The invention also relates to a print head comprising a succession of magnetic heads or resistors for carrying out printing along an axis. The print head is a structure such as according to the invention mentioned above. Advantageously, a print head according to the invention comprises a line of magnetic heads or resistors per assembled level. Unlike the printhead structures according to the prior art, the printhead according to the invention does not include an intermediate level for establishing the connection between the magnetic heads or the resistors and the control circuits of the magnetic heads or of the resistances.
L'invention concerne encore un procédé de fabrication d'une tête d'impression comprenant une succession de têtes magnétiques ou de résistances pour réaliser une impression le long d'un axe. Le procédé met en œuvre un procédé tel que selon l'invention mentionné ci-dessus.The invention also relates to a method of manufacturing a print head comprising a succession of magnetic heads or resistors for carrying out printing along an axis. The method implements a method such as according to the invention mentioned above.
L'invention permet avantageusement d'obtenir une structure à haute résolution.The invention advantageously makes it possible to obtain a high resolution structure.
A titre d'exemple non limitatif, dans la suite de la description, l'invention sera plus particulièrement décrite dans le cas où la structure est une tête d'impression dont les éléments sont des têtes magnétiques . Brève description des figuresBy way of nonlimiting example, in the following description, the invention will be more particularly described in the case where the structure is a print head, the elements of which are magnetic heads. Brief description of the figures
D'autres caractéristiques et avantages de 1 ' invention apparaîtront à la lecture de modes de réalisation préférentiels de 1 ' invention fait en référence aux figures ci-annexées parmi lesquelles :Other characteristics and advantages of the invention will appear on reading preferential embodiments of the invention made with reference to the appended figures among which:
- la figure 1 représente une tête d'impression selon l'art antérieur,FIG. 1 represents a printhead according to the prior art,
- la figure 2 représente une vue en coupe de la tête d'impression de la figure 1, équipée de son tambour,FIG. 2 represents a sectional view of the print head of FIG. 1, equipped with its drum,
- la figure 3 représente une vue en perspective d'un premier exemple de tête d'impression selon 1 ' invention,FIG. 3 represents a perspective view of a first example of a printhead according to the invention,
- la figure 4 représente une vue en coupe d'un deuxième exemple de tête d'impression selon- Figure 4 shows a sectional view of a second example of a print head according to
1 ' invention,The invention,
- les figures 5A-5J représentent un procédé de fabrication de tête d'impression telle que représentée en figure 4, - les figures 6A et 6B représentent respectivement un troisième exemple et un quatrième exemple de tête d'impression selon l'invention.- Figures 5A-5J represent a method of manufacturing a print head as shown in Figure 4, - Figures 6A and 6B respectively represent a third example and a fourth example of a print head according to the invention.
Description détaillée de modes de mise en œuyre de 1 ' inventionDetailed description of methods of implementing the invention
Sur toutes les figures, les mêmes repères désignent les mêmes éléments.In all the figures, the same references designate the same elements.
Les figures 1 et 2 ont été décrites précédemment, il est donc inutile d'y revenir. La figure 3 représente une vue en perspective de deux sous-ensembles permettant de réaliser un premier exemple de tête d'impression selon l'invention. Un premier sous-ensemble El comprend une première barrette 6, une deuxième barrette 7, et plusieurs blocs de diodes Bl, B2 , B3. Un deuxième sous- ensemble E2 , identique au premier sous-ensemble El, comprend une première barrette 8, une deuxième barrette 9 et plusieurs blocs de diodes (non représentés sur la figure) .Figures 1 and 2 have been described above, so there is no point in returning to them. FIG. 3 represents a perspective view of two sub-assemblies making it possible to produce a first example of a printhead according to the invention. A first subset El comprises a first strip 6, a second strip 7, and several blocks of diodes B1, B2, B3. A second subset E2, identical to the first subset El, comprises a first strip 8, a second strip 9 and several blocks of diodes (not shown in the figure).
Les barrettes 6 et 7 du sous-ensemble El, de même que les barrettes 8 et 9 du sous-ensemble E2 , sont fixées l'une à l'autre, par exemple à l'aide de billes de soudure déposées sur des plots d'accrochage. Ces billes de soudure permettent aussi une connexion électrique entre les barrettes 6 et 7 du sous-ensemble El et les barrettes 8 et 9 du sous-ensemble E2.The bars 6 and 7 of the subassembly El, as well as the bars 8 and 9 of the subassembly E2, are fixed to each other, for example using solder balls deposited on the pads d hooking. These solder balls also allow an electrical connection between the bars 6 and 7 of the sub-assembly El and the bars 8 and 9 of the sub-assembly E2.
Chaque barrette comprend un ensemble de têtes magnétiques réalisées sur l'une de ses faces. La face sur laquelle sont situées les têtes magnétiques de la barrette 6 est fixée à la face sur laquelle sont situées les têtes magnétiques de la barrette 7. De même, la face sur laquelle sont situées les têtes magnétiques de la barrette 8 est fixée à la face sur laquelle sont situées les têtes magnétiques de la barrette 9.Each bar includes a set of magnetic heads produced on one of its faces. The face on which the magnetic heads of the strip 6 are located is fixed to the face on which the magnetic heads of the strip 7 are located. Similarly, the face on which the magnetic heads of the strip 8 are located is fixed to the face on which the magnetic heads of the bar 9 are located.
Pour fixer la barrette 7 (respectivement 9) à la barrette 6 (respectivement 8) , la barrette 7 (respectivement 9) est positionnée sur la barrette 6 (respectivement 8) et pendant la phase de refonte des billes de soudure, les pièces s ' auto-alignent . Les diodes de commande des têtes magnétiques du premier sous-ensemble El sont réalisées par blocs (Bl, B2 , B3 ) rapportés sur la face de la barrette 6 sur laquelle sont réalisées les têtes magnétiques. Les diodes des blocs Bl, B2 , B3 permettent avantageusement de commander à la fois les têtes magnétiques de la barrette 6 et les têtes magnétiques de la barrette 7. Les entrées/sorties (non représentées sur la figure) des circuits de commande des têtes magnétiques des barrettes 6 et 7 peuvent alors avantageusement être positionnées au même niveau.To fix the bar 7 (respectively 9) to the bar 6 (respectively 8), the bar 7 (respectively 9) is positioned on the bar 6 (respectively 8) and during the phase of recasting of the solder balls, the parts are self-align. The control diodes of the magnetic heads of the first sub-assembly El are produced by blocks (B1, B2, B3) attached to the face of the bar 6 on which the magnetic heads are produced. The diodes of the blocks Bl, B2, B3 advantageously make it possible to control both the magnetic heads of the strip 6 and the magnetic heads of the strip 7. The inputs / outputs (not shown in the figure) of the control circuits of the magnetic heads bars 6 and 7 can then advantageously be positioned at the same level.
De même, les diodes de commande des têtes magnétiques du deuxième sous-ensemble E2 sont réalisées par blocs (non représentés sur la figure) rapportés sur la face de la barrette 8 sur laquelle sont réalisées les têtes magnétiques. De façon avantageuse, les diodes des blocs ainsi rapportés permettent de commander les têtes magnétiques des barrettes 8 et 9. Les entrées/sorties (non représentées sur la figure) des circuits de commande des têtes magnétiques des barrettes 8 et 9 peuvent alors avantageusement être positionnées au même niveau.Likewise, the control diodes of the magnetic heads of the second sub-assembly E2 are produced in blocks (not shown in the figure) attached to the face of the bar 8 on which the magnetic heads are produced. Advantageously, the diodes of the blocks thus attached make it possible to control the magnetic heads of the bars 8 and 9. The inputs / outputs (not shown in the figure) of the control circuits of the magnetic heads of the bars 8 and 9 can then advantageously be positioned at the same level.
Selon un premier mode de réalisation de l'invention, les deux sous-ensembles El et E2 sont assemblés entre eux à l'aide d ' entretoises T, par exemple des billes rigides, placées dans des cavités C préalablement réalisées sur les faces arrières des barrettes respectives 6 et 8. Les deux sous-ensembles El et E2 sont pressés l'un contre l'autre et alignés. L'espace restant entre les modules peut alors être rempli par de la colle, par exemple de la résine époxy. Selon un autre mode de réalisation de l'invention, l'assemblage des sous-ensembles El et E2 peut être réalisé par des billes fusibles rapportées sur des plots d'accrochage. Ces plots d'accrochage sont alors préalablement réalisés sur les faces arrières des barrettes respectives 6 et 8.According to a first embodiment of the invention, the two sub-assemblies El and E2 are assembled together using spacers T, for example rigid balls, placed in cavities C previously produced on the rear faces of the respective bars 6 and 8. The two sub-assemblies El and E2 are pressed one against the other and aligned. The remaining space between the modules can then be filled with glue, for example epoxy resin. According to another embodiment of the invention, the assembly of the sub-assemblies E1 and E2 can be carried out by fusible balls attached to the attachment studs. These attachment studs are then previously produced on the rear faces of the respective bars 6 and 8.
Selon cet autre mode de réalisation de l'invention, la température de refusion des billes utilisées pour l'assemblage des sous-ensembles El et E2 est alors inférieure à celle des billes utilisées pour l'assemblage des barrettes 6 et 7 (respectivement 8 et 9) . Si tel n'était pas le cas, pendant l'étape d'assemblage (refusion) , toutes les billes fusibles passeraient en phase liquide et le poids des barrettes induirait un écrasement du matériau fusible différent entre les étages supérieurs et inférieurs de la structure. Cela conduirait alors à des espacements différents entre les barrettes. Selon l'invention, l'utilisation de deux matériaux fusibles différents permet avantageusement de ne pas modifier les espacements entre barrettes .According to this other embodiment of the invention, the reflow temperature of the balls used for the assembly of the subassemblies El and E2 is then lower than that of the balls used for the assembly of the bars 6 and 7 (respectively 8 and 9). If this were not the case, during the assembly step (reflow), all the fusible balls would pass into liquid phase and the weight of the bars would induce a crushing of the different fusible material between the upper and lower stages of the structure. This would then lead to different spacings between the bars. According to the invention, the use of two different fusible materials advantageously makes it possible not to modify the spacings between bars.
Pendant la phase de refonte, les deux sous- ensembles El et E2 s ' auto-alignent , permettant ainsi un contrôle très précis des distances. A titre d'exemple non limitatif, un espace entre étages de 45μm ± lμm, sur une longueur de 2,54 cm, peut être obtenu.During the recasting phase, the two sub-assemblies El and E2 self-align, thus allowing very precise control of the distances. By way of nonlimiting example, a space between stages of 45 μm ± 1 μm, over a length of 2.54 cm, can be obtained.
Quel que soit l'empilement réalisé, l'ensemble peut, en fin de procédé, être avantageusement rempli, par exemple, par de la résine, pour obtenir un ensemble mécaniquement rigide (il en est de même pour les autres exemples de réalisation) . Le remplissage avec de la résine peut être effectué en un seul passage.Whatever the stack made, the assembly can, at the end of the process, be advantageously filled, for example, with resin, to obtain a mechanically rigid assembly (the same is true for the others examples of implementation). Filling with resin can be done in one pass.
Les extrémités des têtes magnétiques du sous- ensemble El et E2 constituent des pôles magnétiques. A titre d'exemple non limitatif, le sous-ensemble El comprend 14 pôles magnétiques pEli, ... , pEl14 et le sous-ensemble E2 comprend 14 pôles magnétiques pE2χ, ..., pE2χ4. Selon l'invention, les signaux qui permettent de former une ligne d'impression sur le support sont alors constitués, par exemple, des signaux issus des pôles magnétiques successifs pElx, pE2ι, pEl2, pE22, • • • , PEI14, pE214.The ends of the magnetic heads of the sub-assembly El and E2 constitute magnetic poles. By way of nonlimiting example, the sub-assembly El comprises 14 magnetic poles pEli, ..., pEl 14 and the sub-assembly E2 comprises 14 magnetic poles pE2χ, ..., pE2χ 4 . According to the invention, the signals which make it possible to form a printing line on the support then consist, for example, of signals coming from successive magnetic poles pEl x , pE2ι, pEl 2 , pE2 2 , • • •, PEI14, pE2 14 .
La différence de hauteur des pôles dans la direction perpendiculaire à l'axe que définit la ligne d'impression peut être compensée par un système électronique de déphasage temporel .The difference in height of the poles in the direction perpendicular to the axis defined by the printing line can be compensated by an electronic time-shift system.
A titre d'exemple non limitatif, pour un pas des pôles magnétiques conduisant à une résolution de 225 dpi pour une barrette (6, 7, 8 ou 9), on peut obtenir une résolution de 450 dpi pour chaque sous- ensemble El, E2 en assemblant les barrettes respectives de ces sous-ensembles avec un décalage d'un demi-pas. L'assemblage des deux sous-ensembles El et E2 avec un décalage d'un quart de pas conduit alors à une résolution de 900 dpi. Une telle résolution peut encore être augmentée si le pas des pôles magnétiques d'une barrette conduit à une résolution supérieure à 225 dpi. Par exemple, une résolution de 300 dpi pour les barrettes 6, 7, 8 et 9 conduit à une résolution de 1200 dpi (4 x 300 dpi) pour la tête d'impression constituée des deux sous-ensembles El et E2. Le décalage des pôles magnétiques selon une direction parallèle à l'axe d'impression peut être réalisé de différentes manières. Il est par exemple possible soit de réaliser des barrettes différentes quant à la position des pôles magnétiques et d'assembler symétriquement les barrettes, soit de réaliser des barrettes identiques et d'assembler les barrettes avec un décalage.By way of nonlimiting example, for a pitch of the magnetic poles leading to a resolution of 225 dpi for a bar (6, 7, 8 or 9), one can obtain a resolution of 450 dpi for each subset El, E2 by assembling the respective bars of these sub-assemblies with an offset of half a step. The assembly of the two subsets E1 and E2 with an offset of a quarter of a step then leads to a resolution of 900 dpi. Such a resolution can be further increased if the pitch of the magnetic poles of a strip leads to a resolution greater than 225 dpi. For example, a resolution of 300 dpi for bars 6, 7, 8 and 9 leads to a resolution of 1200 dpi (4 x 300 dpi) for the print head made up of the two sub-assemblies El and E2. The offset of the magnetic poles in a direction parallel to the printing axis can be achieved in different ways. It is for example possible either to produce different bars as to the position of the magnetic poles and to assemble the bars symmetrically, or to make identical bars and to assemble the bars with an offset.
La figure 4 représente une vue en coupe d'un deuxième exemple de tête d'impression selon 1 ' invention.FIG. 4 represents a sectional view of a second example of a printhead according to the invention.
La tête d'impression représentée, à titre d'exemple, en figure 4 comprend quatre barrettes 10, 11, 12, 13. A titre d'exemple non limitatif, chaque barrette N (N=10, 11, 12, 13) comprend une face sur laquelle sont situées quatre têtes magnétiques. Les extrémités des têtes magnétiques de la barrette N (N=10, 11, 12, 13) constituent des pôles magnétiques alignés pNl , pN2 , pN3 , pN4. Deux pôles magnétiques successifs pN1+i et p x (i=l, 2, 3) sont séparés par une même distance d. La distance d peut être, par exemple, sensiblement égale à 110 μm.The print head shown, by way of example, in FIG. 4 comprises four bars 10, 11, 12, 13. By way of nonlimiting example, each bar N (N = 10, 11, 12, 13) comprises a face on which are located four magnetic heads. The ends of the magnetic heads of the strip N (N = 10, 11, 12, 13) constitute aligned magnetic poles pNl, pN2, pN3, pN4. Two successive magnetic poles pN 1 + i and p x (i = 1,2,3) are separated by the same distance d. The distance d can, for example, be substantially equal to 110 μm.
La face sur laquelle sont situées les têtes magnétiques de chaque barrette comprend également des plots d'accrochage de bille pa .The face on which the magnetic heads of each bar are located also includes ball attachment points pa.
Un premier sous-ensemble est constitué par l'assemblage des barrettes 10 et 11 à l'aide de billes de soudure b. Un deuxième sous-ensemble est constitué par l'assemblage des barrettes 12 et 13 à l'aide de billes de soudure b. Les deux sous-ensembles ainsi constitués sont fixés entre eux par des entretoises T, par exemple des billes de verre.A first sub-assembly is formed by assembling the bars 10 and 11 using solder balls b. A second sub-assembly is formed by assembling the bars 12 and 13 using solder balls b. The two subsets as well constituted are fixed together by spacers T, for example glass beads.
Le décalage des pôles magnétiques est réalisé par l'assemblage des barrettes. La distance d représente le pas qui sépare deux pôles magnétiques successifs d'une même barrette. Les pôles magnétiques de la barrette 10 sont décalés d'un quart de pas (d/8) par rapport aux plots d'accrochage pa qui relient la barrette 10 à la barrette 11. Les pôles magnétiques de la barrette 13 sont de même décalés d'un 1/8 de pas (d/8) par rapport aux plots d'accrochage pa qui relient la barrette 13 à la barrette 12. La barrette 11 (respectivement 13) est décalée d'un quart de pas (d/4) par rapport à la barrette 10 (respectivement 12) et les deux sous- ensembles FI et F2 sont décalés d'un demi-pas (d/2) entre eux. Le pas des pôles magnétiques selon l'axe d'impression est alors égal à d/4.The magnetic poles are offset by assembling the bars. The distance d represents the step which separates two successive magnetic poles of the same bar. The magnetic poles of the strip 10 are offset by a quarter of a step (d / 8) relative to the latching pads pa which connect the strip 10 to the strip 11. The magnetic poles of the strip 13 are likewise offset d '' a 1/8 of a step (d / 8) relative to the latching studs pa which connect the bar 13 to the bar 12. The bar 11 (respectively 13) is offset by a quarter of a step (d / 4) relative to the bar 10 (respectively 12) and the two sub-assemblies FI and F2 are offset by a half-step (d / 2) between them. The pitch of the magnetic poles along the printing axis is then equal to d / 4.
De façon plus générale, il faut noter qu'une structure à quatre barrettes selon 1 ' invention permet d'obtenir 24 configurations pour l'ordre des têtes. Dans certaines configurations on peut ne pas avoir de barrettes identiques.More generally, it should be noted that a structure with four bars according to the invention makes it possible to obtain 2 4 configurations for the order of the heads. In certain configurations, it is possible not to have identical bars.
La précision sur le pas des pôles magnétiques est obtenue par la précision d'assemblage par billes de soudure. A titre d'exemple, il est possible d'obtenir une précision de + 0,2 μm selon l'axe d'impression et une précision de + 1 μm dans la direction perpendiculaire à cet axe. La précision sur le positionnement relatif des deux sous-ensembles peut également être égale à + 1 μm si des billes de soudure sont utilisées pour assembler les deux sous-ensembles.The precision on the pitch of the magnetic poles is obtained by the precision of assembly by solder balls. For example, it is possible to obtain an accuracy of + 0.2 μm along the printing axis and an accuracy of + 1 μm in the direction perpendicular to this axis. The precision on the relative positioning of the two sub-assemblies can also be equal to + 1 μm if solder balls are used to assemble the two sub-assemblies.
Le procédé de fabrication selon 1 ' invention permet ainsi d'obtenir une bonne précision sur la distance qui sépare les têtes magnétiques, puisque l'assemblage utilise un système d'auto-alignement (billes fusibles et/ou entretoises imbriquées dans les substrats) et une meilleure résolution que dans l'art antérieu . Les figures 5A-5J représentent un procédé de fabrication de tête d'impression telle que représentée en figure 4.The manufacturing method according to the invention thus makes it possible to obtain good precision over the distance which separates the magnetic heads, since the assembly uses a self-alignment system (fusible balls and / or spacers nested in the substrates) and better resolution than in prior art. FIGS. 5A-5J represent a method for manufacturing a print head as shown in FIG. 4.
La figure 5A représente un substrat S, par exemple un substrat de silicium, dont une première face est recouverte de têtes magnétiques et dont une deuxième face est recouverte d'un masque de gravure 14 réalisé, par exemple, par une couche de nitrure de silicium. Les extrémités des têtes magnétiques constituent les pôles magnétiques Plli, pll2, pll3 et pll4. Une couche isolante I en surface du substrat S entoure les têtes magnétiques plli, pll2, pll3, pll .FIG. 5A represents a substrate S, for example a silicon substrate, a first face of which is covered with magnetic heads and a second face of which is covered with an etching mask 14 produced, for example, by a layer of silicon nitride . The ends of the magnetic heads constitute the magnetic poles Plli, pll 2 , pll 3 and pll 4 . An insulating layer I on the surface of the substrate S surrounds the magnetic heads plli, pll 2 , pll 3 , pll.
Les figures 5B à 5H représentent la fabrication de la barrette 11 à partir de la structure représentée en figure 5A. La figure 51 représente l'assemblage des barrettes 10 et 11. La figure 5J représente l'assemblage des barrettes 10, 11, 12 et 13 pour constituer une tête d'impression telle que représentée en figure 4. Le procédé de fabrication de la barrette 11 à partir de la structure représentée en figure 5A se compose des étapes suivantes :Figures 5B to 5H show the manufacture of the bar 11 from the structure shown in Figure 5A. FIG. 51 represents the assembly of the bars 10 and 11. FIG. 5J represents the assembly of the bars 10, 11, 12 and 13 to constitute a print head as shown in FIG. 4. The method of manufacturing the bar 11 from the structure shown in FIG. 5A consists of the following steps:
- dépôt d'une couche métallique d'accrochage 15 sur la première face de la structure (figure 5B) ,- depositing a metallic bonding layer 15 on the first face of the structure (FIG. 5B),
- dépôt, insolation et développement de résine photosensible 16 sur le masque de gravure 14 (figure 5C) ,- deposition, exposure and development of photosensitive resin 16 on the etching mask 14 (FIG. 5C),
- gravure du masque de gravure 14 aux endroits où la résine photosensible 16 est absente (figure 5D) ,- Etching of the etching mask 14 at the places where the photosensitive resin 16 is absent (FIG. 5D),
- retrait de la résine photosensible 16 (figure 5E) ,- removal of the photosensitive resin 16 (FIG. 5E),
- gravure du substrat S pour former les cavités C (figure 5F) ; la gravure peut être une gravure sèche ou humide, par exemple à l'aide d'une solution à base de KOH,- Etching of the substrate S to form the cavities C (Figure 5F); the etching can be dry or wet etching, for example using a KOH-based solution,
- dépôt, insolation et développement de résine photosensible 17 sur la couche métallique d'accrochage 15 aux emplacements des plots d'accrochage de billes (figure 5G) , - gravure de la couche métallique d'accrochage et retrait de la résine photosensible pour constituer les plots d'accrochage de billes pa (figure 5H) .- deposition, exposure and development of photosensitive resin 17 on the metal bonding layer 15 at the locations of the ball bonding pads (FIG. 5G), - etching of the metal bonding layer and removal of the photosensitive resin to constitute the ball attachment studs pa (Figure 5H).
La figure 51 représente l'assemblage des barrettes 10 et 11. La barrette 10 est fabriquée à partir d'une structure telle que celle de la figure 5A mais dépourvue de masque de gravure 14. Les barrettes 10 et 11 sont assemblées à l'aide de billes de soudure b. Avantageusement, la distance entre les barrettes peut être réglées par la hauteur des billes de soudure. La figure 5J représente l'étape d'assemblage, par des entretoises T, d'un premier sous-ensemble Fl constitué des barrettes 10 et 11 et d'un deuxième sous- ensemble F2 constitué des barrettes 12 et 13. Comme cela a été mentionné précédemment, de la colle, par exemple de la résine époxy, peut être introduite dans l'espace restant entre les sous-ensembles FI et F2 , de même que dans 1 ' espace qui sépare les barrettes .Figure 51 shows the assembly of the bars 10 and 11. The bar 10 is made from a structure such as that of Figure 5A but devoid of etching mask 14. The bars 10 and 11 are assembled using solder balls b. Advantageously, the distance between the bars can be adjusted by the height of the solder balls. FIG. 5J represents the step of assembling, by spacers T, a first subset Fl consisting of bars 10 and 11 and a second sub-assembly F2 consisting of bars 12 and 13. As mentioned previously, glue, for example epoxy resin, can be introduced into the space remaining between the sub-assemblies FI and F2, as well as in the space which separates the bars.
L'invention concerne également le cas où aucune colle n'est introduite entre les sous-ensembles FI et F2 et/ou l'espace qui sépare les barrettes. Le procédé selon 1 ' invention permet alors avantageusement une réparation facile de la tête d'impression. Il est en effet possible de remplacer un sous-ensemble défectueux FI ou F2 par un autre, voire une barrette par une autre . Comme cela a été mentionné précédemment, les têtes magnétiques sont commandées par des diodes de commande. Selon le procédé de fabrication de têtes d'impression représenté aux figures 5A-5J, les diodes de commande des têtes magnétiques de la structure constituée par les barrettes 10 et 11 sont préférentiellement assemblées en même temps que sont assemblées les barrettes 10 et 11. Il en est de même pour les diodes de commande des têtes magnétiques de la structure constituée par les barrettes 12 et 13 qui sont préférentiellement assemblées en même temps que sont assemblées les barrettes 12 et 13. Les diodes peuvent également être intégrées au substrat S.The invention also relates to the case where no glue is introduced between the sub-assemblies FI and F2 and / or the space which separates the bars. The method according to the invention then advantageously allows easy repair of the print head. It is indeed possible to replace a defective sub-assembly FI or F2 by another, or even a bar by another. As mentioned previously, the magnetic heads are controlled by control diodes. According to the method for manufacturing printheads shown in FIGS. 5A-5J, the diodes for controlling the magnetic heads of the structure constituted by the bars 10 and 11 are preferably assembled at the same time as the bars 10 and 11 are assembled. the same is true for the control diodes of the magnetic heads of the structure constituted by the bars 12 and 13 which are preferably assembled at the same time as the bars 12 and 13 are assembled. The diodes can also be integrated into the substrate S.
Les figures 6A et 6B représentent respectivement une vue en coupe d'un troisième exemple d'assemblage de barrettes selon l'invention et une vue en coupe d'un quatrième exemple d'assemblage de barrettes selon l'invention.FIGS. 6A and 6B respectively represent a sectional view of a third example of assembly of bars according to the invention and a view in section of a fourth example of assembly of bars according to the invention.
Selon 1 ' exemple représenté en figure 6A, la tête d'impression comprend quatre barrettes 17, 18, 19, 20 empilées de façon pyramidale. Les barrettes sont reliées les unes aux autres par des billes de soudure b déposées sur des plots d'accrochage. Des fils de connexion F relient électriquement les faces des barrettes sur lesquelles sont situées les têtes magnétiques. L'utilisation de fils de connexion électrique permet de ramener tous les plots d'entrée/sortie sur une même barrette.According to the example shown in FIG. 6A, the print head comprises four bars 17, 18, 19, 20 stacked in a pyramidal fashion. The bars are connected to each other by solder balls b deposited on hooking pads. Connection wires F electrically connect the faces of the bars on which the magnetic heads are located. The use of electrical connection wires makes it possible to bring all the input / output pads on the same bar.
Selon l'exemple représenté en figure 6B, la tête d'impression comprend également quatre barrettes superposées 21, 22, 23, 24. Un premier sous-ensemble est constitué des deux barrettes 21, 22 assemblées par des billes de soudure. Un deuxième sous-ensemble est constitué des deux barrettes 23, 24 également assemblées par des billes de soudure. Le premier et le deuxième sous-ensembles sont assemblés par une bille de soudure B de dimensions supérieures aux billes de soudure b qui relient entre elles les barrettes. Cette bille B permet en outre de relier électriquement les sous-ensembles. Selon les modes de réalisation décrits ci- dessus, les têtes d'impression sont des têtes d'impression magnétiques. De façon plus générale, l'invention concerne également d'autres types de tête d'impression, par exemple les têtes d'impression qui comprennent des résistances à la place des têtes magnétiques . According to the example shown in FIG. 6B, the print head also comprises four superimposed bars 21, 22, 23, 24. A first sub-assembly consists of the two bars 21, 22 assembled by solder balls. A second sub-assembly consists of the two bars 23, 24 also assembled by solder balls. The first and second sub-assemblies are assembled by a solder ball B of dimensions greater than the solder balls b which connect the bars together. This ball B also makes it possible to electrically connect the sub-assemblies. According to the embodiments described above, the printheads are magnetic printheads. More generally, the invention also relates to other types of printhead, for example printheads which include resistors in place of magnetic heads.

Claims

REVENDICATIONS
1. Structure comprenant une succession d'éléments pour émettre ou recevoir un signal le long d'un axe, caractérisée en ce qu'elle comprend au moins un ensemble de deux barrettes (10, 11) empilées selon la direction perpendiculaire à l'axe, chaque barrette comprenant une succession d'éléments alignés selon une direction parallèle à l'axe, deux éléments successifs de la structure selon la direction parallèle à l'axe appartenant à deux barrettes différentes de sorte que lesdits deux éléments successifs soient décalés, l'un par rapport à l'autre, dans la direction perpendiculaire à l'axe.1. Structure comprising a succession of elements for transmitting or receiving a signal along an axis, characterized in that it comprises at least one set of two bars (10, 11) stacked in the direction perpendicular to the axis , each bar comprising a succession of elements aligned in a direction parallel to the axis, two successive elements of the structure in the direction parallel to the axis belonging to two different bars so that said two successive elements are offset, the one relative to the other, in the direction perpendicular to the axis.
2. Structure selon la revendication 1, caractérisée en ce que les deux barrettes d'un ensemble sont connectées par des billes de soudure (b) .2. Structure according to claim 1, characterized in that the two bars of an assembly are connected by solder balls (b).
3. Structure selon la revendication 1 ou 2, caractérisée en ce qu'au moins deux ensembles (El, E2 ) de deux barrettes sont fixés l'un à l'autre par des entretoises (T) .3. Structure according to claim 1 or 2, characterized in that at least two sets (El, E2) of two bars are fixed to each other by spacers (T).
4. Structure selon l'une quelconque des revendications 1 ou 3 , caractérisée en ce qu'au moins deux ensembles de deux barrettes sont fixés l'un à l'autre par au moins une bille de soudure (B) .4. Structure according to any one of claims 1 or 3, characterized in that at least two sets of two bars are fixed to each other by at least one solder ball (B).
5. Structure selon l'une quelconque des revendications 1 à 4, caractérisée en ce que les éléments qui appartiennent à une barrette sont situés sur une face de la barrette.5. Structure according to any one of claims 1 to 4, characterized in that the elements which belong to a bar are located on one face of the bar.
6. Structure selon l'une quelconque des revendications précédentes, caractérisée en ce qu'elle comprend au moins un bloc de diodes (Bl, B2 , B3 ) rapporté sur au moins une barrette d'un ensemble de deux barrettes, les diodes du bloc (Bl, B2 , B3 ) permettant de commander les éléments alignés sur les deux barrettes de l'ensemble.6. Structure according to any one of the preceding claims, characterized in that it comprises at least one block of diodes (B1, B2, B3) attached to at least one strip of a set of two strips, the diodes of the block (Bl, B2, B3) for controlling the elements aligned on the two bars of the assembly.
7. Dispositif comprenant une structure selon l'une quelconque des revendications 1 à 6, caractérisé, en outre, en ce qu'il comprend un système électronique de déphasage temporel pour compenser le décalage entre deux éléments successifs selon la direction perpendiculaire à l'axe.7. Device comprising a structure according to any one of claims 1 to 6, further characterized in that it comprises an electronic time-shift system to compensate for the offset between two successive elements in the direction perpendicular to the axis .
8. Tête d'impression comprenant une succession de têtes magnétiques ou de résistances pour réaliser une impression le long d'un axe, caractérisée en ce qu'elle est une structure selon l'une quelconque des revendications 1 à 6 dans laquelle un élément de la succession d'éléments est une tête magnétique ou une résistance.8. Print head comprising a succession of magnetic heads or resistors for carrying out printing along an axis, characterized in that it is a structure according to any one of claims 1 to 6 in which an element of the succession of elements is a magnetic head or a resistor.
9. Procédé de fabrication d'une structure comprenant une succession d'éléments destinés à émettre ou à recevoir un signal le long d'un axe, caractérisé en ce qu'il comprend au moins une étape d'empilement de deux barrettes (10, 11) selon une direction perpendiculaire à l'axe, chaque barrette comprenant une succession d'éléments alignés selon une direction parallèle à l'axe, l'empilement étant effectué de sorte que deux éléments successifs de la structure appartiennent à deux barrettes différentes.9. A method of manufacturing a structure comprising a succession of elements intended to transmit or receive a signal along an axis, characterized in that it comprises at least one step of stacking two bars (10, 11) in one direction perpendicular to the axis, each bar comprising a succession of elements aligned in a direction parallel to the axis, the stacking being carried out so that two successive elements of the structure belong to two different bars.
10. Procédé selon la revendication 9, caractérisé en ce que l'étape d'empilement des deux barrettes selon la direction perpendiculaire à l'axe est effectuée en reliant les barrettes par des billes de soudure (b) .10. Method according to claim 9, characterized in that the step of stacking the two bars in the direction perpendicular to the axis is carried out by connecting the bars by solder balls (b).
11. Procédé selon l'une quelconque des revendications 9 ou 10, caractérisé en ce qu'il comprend une étape de report d'au moins un bloc de diodes de commande sur au moins une barrette d'un ensemble de deux barrettes empilées, les diodes d'un bloc permettant de commander les éléments alignés sur les deux barrettes de 1 ' ensemble .11. Method according to any one of claims 9 or 10, characterized in that it comprises a step of transferring at least one block of control diodes to at least one strip of a set of two stacked strips, the diodes of a block enabling the elements aligned on the two bars of the assembly to be controlled.
12. Procédé selon l'une quelconque des revendications 9 à 11, caractérisé en ce qu'il comprend au moins une étape d'empilement (T) de deux ensembles de deux barrettes empilées (FI, F2 ) à l'aide d' entretoises (T) .12. Method according to any one of claims 9 to 11, characterized in that it comprises at least one stacking step (T) of two sets of two stacked bars (FI, F2) using spacers (T).
13. Procédé selon l'une quelconque des revendications 9 à 11, caractérisé en ce qu'il comprend au moins une étape d'empilement de deux ensembles de deux barrettes empilées (FI, F2 ) à l'aide d'au moins une bille soudure (B) . 13. Method according to any one of claims 9 to 11, characterized in that it comprises at least one step of stacking two sets of two stacked bars (FI, F2) using at least one ball solder (B).
14. Procédé selon l'une quelconque des revendications 11 à 13, caractérisé en ce qu'il comprend une étape pour introduire de la colle dans l'espace existant entre les deux sous-ensembles (FI, F2) .14. Method according to any one of claims 11 to 13, characterized in that it comprises a step for introducing glue into the space existing between the two sub-assemblies (FI, F2).
15. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il comprend une étape pour introduire de la colle dans l'espace existant entre deux barrettes.15. Method according to any one of the preceding claims, characterized in that it comprises a step for introducing glue into the space existing between two bars.
16. Procédé de fabrication d'une tête d'impression comprenant une succession de têtes magnétiques ou de résistances pour réaliser une impression le long d'un axe, caractérisé en ce qu'il met en œuvre un procédé selon l'une quelconque des revendications 9 à 15 dans lequel un élément de la succession d'éléments est une tête magnétique ou une résistance . 16. A method of manufacturing a print head comprising a succession of magnetic heads or resistors for carrying out printing along an axis, characterized in that it implements a method according to any one of claims 9 to 15 in which an element of the succession of elements is a magnetic head or a resistor.
PCT/FR2001/001092 2000-04-11 2001-04-10 High density component structure formed by assembling and method for making same WO2001076878A1 (en)

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US4463359A (en) * 1979-04-02 1984-07-31 Canon Kabushiki Kaisha Droplet generating method and apparatus thereof
US4571602A (en) * 1983-11-01 1986-02-18 Agfa-Gevaert, N.V. Recording apparatus
US4736210A (en) * 1985-10-23 1988-04-05 Bull S.A. Magnetic transducer including a plurality of heads and method for producing the magnetic transducer
US4901178A (en) * 1986-02-13 1990-02-13 Sony Corporation Thin film magnetic head
EP0335473A1 (en) * 1988-04-01 1989-10-04 Dynamics Research Corporation High-resolution thermal printhead and method of fabrication
US5373189A (en) * 1992-08-13 1994-12-13 Commissariate A L'energie Atomique Three-dimensional multichip module
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