WO2001078116A3 - System for the preferential removal of silicon oxide - Google Patents

System for the preferential removal of silicon oxide Download PDF

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Publication number
WO2001078116A3
WO2001078116A3 PCT/US2001/011604 US0111604W WO0178116A3 WO 2001078116 A3 WO2001078116 A3 WO 2001078116A3 US 0111604 W US0111604 W US 0111604W WO 0178116 A3 WO0178116 A3 WO 0178116A3
Authority
WO
WIPO (PCT)
Prior art keywords
silicon oxide
polishing
preferential removal
planarizing
composition
Prior art date
Application number
PCT/US2001/011604
Other languages
French (fr)
Other versions
WO2001078116A2 (en
Inventor
Brian L Mueller
Jeffrey P Chamberlain
David J Schroeder
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Priority to JP2001575472A priority Critical patent/JP2003530713A/en
Priority to AU2001253308A priority patent/AU2001253308A1/en
Priority to IL15197701A priority patent/IL151977A0/en
Priority to KR1020027013601A priority patent/KR20020086949A/en
Priority to EP01926798A priority patent/EP1272580A2/en
Publication of WO2001078116A2 publication Critical patent/WO2001078116A2/en
Publication of WO2001078116A3 publication Critical patent/WO2001078116A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives

Abstract

A system, a composition, and a method for planarizing or polishing a composite substrate are provided. The planarizing or polishing system comprises (i) a polishing composition comprising (a) about 0.5 wt.% or more of fluoride ions, (b) about 1 wt.% or more of an amine, (c) about 0.1 wt.% or more of a base, and (d) water, and (ii) and abrasive. The present invention also provides a method of planarizing or polishing a composite substrate comprising contacting the substrate with a system comprising (i) a polishing composition comprising (a) about 0.5 wt.% or more of fluoride ions, (b) about 1 wt.% or more of an amine, (c) about 0.1 wt.% or more of a base, and (d) water, and (ii) an abrasive.
PCT/US2001/011604 2000-04-11 2001-04-09 System for the preferential removal of silicon oxide WO2001078116A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2001575472A JP2003530713A (en) 2000-04-11 2001-04-09 Priority removal system for silicon oxide
AU2001253308A AU2001253308A1 (en) 2000-04-11 2001-04-09 System for the preferential removal of silicon oxide
IL15197701A IL151977A0 (en) 2000-04-11 2001-04-09 System for the preferential removal of silicon oxide
KR1020027013601A KR20020086949A (en) 2000-04-11 2001-04-09 System for the Preferential Removal of Silicon Oxide
EP01926798A EP1272580A2 (en) 2000-04-11 2001-04-09 System for the preferential removal of silicon oxide

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US54742500A 2000-04-11 2000-04-11
US09/547,425 2000-04-11

Publications (2)

Publication Number Publication Date
WO2001078116A2 WO2001078116A2 (en) 2001-10-18
WO2001078116A3 true WO2001078116A3 (en) 2002-02-21

Family

ID=24184595

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/011604 WO2001078116A2 (en) 2000-04-11 2001-04-09 System for the preferential removal of silicon oxide

Country Status (8)

Country Link
US (2) US7238618B2 (en)
EP (1) EP1272580A2 (en)
JP (1) JP2003530713A (en)
KR (1) KR20020086949A (en)
CN (1) CN1422314A (en)
AU (1) AU2001253308A1 (en)
IL (1) IL151977A0 (en)
WO (1) WO2001078116A2 (en)

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Also Published As

Publication number Publication date
AU2001253308A1 (en) 2001-10-23
IL151977A0 (en) 2003-04-10
WO2001078116A2 (en) 2001-10-18
CN1422314A (en) 2003-06-04
US7365013B2 (en) 2008-04-29
US7238618B2 (en) 2007-07-03
KR20020086949A (en) 2002-11-20
EP1272580A2 (en) 2003-01-08
US20050072524A1 (en) 2005-04-07
US20070120090A1 (en) 2007-05-31
JP2003530713A (en) 2003-10-14

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