WO2001081954A3 - Configuring optical fibers in a multi-chip module - Google Patents

Configuring optical fibers in a multi-chip module Download PDF

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Publication number
WO2001081954A3
WO2001081954A3 PCT/US2001/013584 US0113584W WO0181954A3 WO 2001081954 A3 WO2001081954 A3 WO 2001081954A3 US 0113584 W US0113584 W US 0113584W WO 0181954 A3 WO0181954 A3 WO 0181954A3
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WO
WIPO (PCT)
Prior art keywords
optical
fiber
optical fibers
port
chip module
Prior art date
Application number
PCT/US2001/013584
Other languages
French (fr)
Other versions
WO2001081954A9 (en
WO2001081954A2 (en
Inventor
Herzel Laor
Original Assignee
Herzel Laor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Herzel Laor filed Critical Herzel Laor
Priority to AU2001278844A priority Critical patent/AU2001278844A1/en
Publication of WO2001081954A2 publication Critical patent/WO2001081954A2/en
Publication of WO2001081954A3 publication Critical patent/WO2001081954A3/en
Publication of WO2001081954A9 publication Critical patent/WO2001081954A9/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4237—Welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
    • H01L2224/05599—Material
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    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/7825—Means for applying energy, e.g. heating means
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    • H01L2224/78313—Wedge
    • H—ELECTRICITY
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/12042—LASER
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Abstract

The present invention is directed to a methodology, structure and process (200) for routing, connecting, and forming optical fibers between optical ports such as optical transmitters and receivers/detectors to create optical pathways for signal transfer therebetween. More particularly, when connecting timed optoelectronic chips on a Multi Chip Module, an optical fiber is aligned above an optical port (202), the fiber and the port surface are heated (204), (206) and contacted (208) creating an adhesion bond therebetween. The fiber is then routed (210) to another optical port for connection (214). The fiber may then be connected to additional ports (218) or severed (220). Once severed, the optical pathway may be adjusted to synchronize timing between optoelectronic chips. If a chip's timing is advanced or delayed, the connecting optical pathway may be lengthened (224) or shortened (226). Last, the optical fibers are annealed (228) to relieve internal stresses and cure surface defects.
PCT/US2001/013584 2000-04-26 2001-04-26 Configuring optical fibers in a multi-chip module WO2001081954A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001278844A AU2001278844A1 (en) 2000-04-26 2001-04-26 Configuring optical fibers in a multi-chip module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19971300P 2000-04-26 2000-04-26
US60/199,713 2000-04-26

Publications (3)

Publication Number Publication Date
WO2001081954A2 WO2001081954A2 (en) 2001-11-01
WO2001081954A3 true WO2001081954A3 (en) 2002-01-31
WO2001081954A9 WO2001081954A9 (en) 2002-11-07

Family

ID=22738710

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/013584 WO2001081954A2 (en) 2000-04-26 2001-04-26 Configuring optical fibers in a multi-chip module

Country Status (3)

Country Link
US (1) US6516121B2 (en)
AU (1) AU2001278844A1 (en)
WO (1) WO2001081954A2 (en)

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US6874948B2 (en) * 2001-02-14 2005-04-05 The Regents Of The University Of California System, method and apparatus for fiber bonding procedure for optoelectronic packaging
US6934427B2 (en) * 2002-03-12 2005-08-23 Enablence Holdings Llc High density integrated optical chip with low index difference waveguide functions
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US6961259B2 (en) * 2003-01-23 2005-11-01 Micron Technology, Inc. Apparatus and methods for optically-coupled memory systems
US6948860B1 (en) * 2003-02-21 2005-09-27 Edwards Phillip J Optical subassembly for optoelectronic devices
US20040223684A1 (en) * 2003-05-09 2004-11-11 Creo Srl Calibration of optical cross-connect switches
US6917728B2 (en) * 2003-06-27 2005-07-12 International Business Machines Corporation Fiber optic attachment method, structure, and system
US20050036728A1 (en) * 2003-08-12 2005-02-17 Henning Braunisch Curved surface for improved optical coupling between optoelectronic device and waveguide
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Publication number Publication date
AU2001278844A1 (en) 2001-11-07
WO2001081954A9 (en) 2002-11-07
US6516121B2 (en) 2003-02-04
US20020009270A1 (en) 2002-01-24
WO2001081954A2 (en) 2001-11-01

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