WO2002003464A3 - Halbleiter-chip - Google Patents
Halbleiter-chip Download PDFInfo
- Publication number
- WO2002003464A3 WO2002003464A3 PCT/DE2001/002174 DE0102174W WO0203464A3 WO 2002003464 A3 WO2002003464 A3 WO 2002003464A3 DE 0102174 W DE0102174 W DE 0102174W WO 0203464 A3 WO0203464 A3 WO 0203464A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor chip
- chip
- enhances
- modifying
- modules
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01951372A EP1295340B1 (de) | 2000-06-30 | 2001-06-12 | Halbleiter-chip |
DE50112868T DE50112868D1 (de) | 2000-06-30 | 2001-06-12 | Halbleiter-chip |
US10/331,535 US6845027B2 (en) | 2000-06-30 | 2002-12-30 | Semiconductor chip |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10030994A DE10030994A1 (de) | 2000-06-30 | 2000-06-30 | Halbleiter-Chip |
DE10030994.1 | 2000-06-30 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/331,535 Continuation US6845027B2 (en) | 2000-06-30 | 2002-12-30 | Semiconductor chip |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002003464A2 WO2002003464A2 (de) | 2002-01-10 |
WO2002003464A3 true WO2002003464A3 (de) | 2002-06-06 |
Family
ID=7646784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/002174 WO2002003464A2 (de) | 2000-06-30 | 2001-06-12 | Halbleiter-chip |
Country Status (4)
Country | Link |
---|---|
US (1) | US6845027B2 (de) |
EP (1) | EP1295340B1 (de) |
DE (2) | DE10030994A1 (de) |
WO (1) | WO2002003464A2 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003099414A (ja) * | 2001-09-21 | 2003-04-04 | Mitsubishi Electric Corp | 半導体集積回路 |
US8081474B1 (en) | 2007-12-18 | 2011-12-20 | Google Inc. | Embossed heat spreader |
US8090897B2 (en) * | 2006-07-31 | 2012-01-03 | Google Inc. | System and method for simulating an aspect of a memory circuit |
US9507739B2 (en) | 2005-06-24 | 2016-11-29 | Google Inc. | Configurable memory circuit system and method |
US20080126690A1 (en) * | 2006-02-09 | 2008-05-29 | Rajan Suresh N | Memory module with memory stack |
US7609567B2 (en) * | 2005-06-24 | 2009-10-27 | Metaram, Inc. | System and method for simulating an aspect of a memory circuit |
US8244971B2 (en) | 2006-07-31 | 2012-08-14 | Google Inc. | Memory circuit system and method |
US8055833B2 (en) | 2006-10-05 | 2011-11-08 | Google Inc. | System and method for increasing capacity, performance, and flexibility of flash storage |
US8041881B2 (en) | 2006-07-31 | 2011-10-18 | Google Inc. | Memory device with emulated characteristics |
US8111566B1 (en) | 2007-11-16 | 2012-02-07 | Google, Inc. | Optimal channel design for memory devices for providing a high-speed memory interface |
US8335894B1 (en) | 2008-07-25 | 2012-12-18 | Google Inc. | Configurable memory system with interface circuit |
US8386722B1 (en) | 2008-06-23 | 2013-02-26 | Google Inc. | Stacked DIMM memory interface |
US20080028136A1 (en) | 2006-07-31 | 2008-01-31 | Schakel Keith R | Method and apparatus for refresh management of memory modules |
US10013371B2 (en) | 2005-06-24 | 2018-07-03 | Google Llc | Configurable memory circuit system and method |
US8089795B2 (en) | 2006-02-09 | 2012-01-03 | Google Inc. | Memory module with memory stack and interface with enhanced capabilities |
US8796830B1 (en) | 2006-09-01 | 2014-08-05 | Google Inc. | Stackable low-profile lead frame package |
US8397013B1 (en) | 2006-10-05 | 2013-03-12 | Google Inc. | Hybrid memory module |
US8077535B2 (en) | 2006-07-31 | 2011-12-13 | Google Inc. | Memory refresh apparatus and method |
US9171585B2 (en) | 2005-06-24 | 2015-10-27 | Google Inc. | Configurable memory circuit system and method |
US20080082763A1 (en) | 2006-10-02 | 2008-04-03 | Metaram, Inc. | Apparatus and method for power management of memory circuits by a system or component thereof |
US7386656B2 (en) | 2006-07-31 | 2008-06-10 | Metaram, Inc. | Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit |
US8060774B2 (en) | 2005-06-24 | 2011-11-15 | Google Inc. | Memory systems and memory modules |
DE112006001810T5 (de) * | 2005-06-24 | 2008-08-21 | Metaram Inc., San Jose | Integrierte Speicherkern - und Speicherschnittstellenschaltung |
US8438328B2 (en) | 2008-02-21 | 2013-05-07 | Google Inc. | Emulation of abstracted DIMMs using abstracted DRAMs |
US9542352B2 (en) | 2006-02-09 | 2017-01-10 | Google Inc. | System and method for reducing command scheduling constraints of memory circuits |
US8327104B2 (en) | 2006-07-31 | 2012-12-04 | Google Inc. | Adjusting the timing of signals associated with a memory system |
US8359187B2 (en) * | 2005-06-24 | 2013-01-22 | Google Inc. | Simulating a different number of memory circuit devices |
US8130560B1 (en) | 2006-11-13 | 2012-03-06 | Google Inc. | Multi-rank partial width memory modules |
WO2007028109A2 (en) | 2005-09-02 | 2007-03-08 | Metaram, Inc. | Methods and apparatus of stacking drams |
US9632929B2 (en) | 2006-02-09 | 2017-04-25 | Google Inc. | Translating an address associated with a command communicated between a system and memory circuits |
US7724589B2 (en) * | 2006-07-31 | 2010-05-25 | Google Inc. | System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits |
US20080028137A1 (en) * | 2006-07-31 | 2008-01-31 | Schakel Keith R | Method and Apparatus For Refresh Management of Memory Modules |
US20080025136A1 (en) * | 2006-07-31 | 2008-01-31 | Metaram, Inc. | System and method for storing at least a portion of information received in association with a first operation for use in performing a second operation |
US8209479B2 (en) * | 2007-07-18 | 2012-06-26 | Google Inc. | Memory circuit system and method |
US8080874B1 (en) | 2007-09-14 | 2011-12-20 | Google Inc. | Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween |
US7827336B2 (en) * | 2008-11-10 | 2010-11-02 | Freescale Semiconductor, Inc. | Technique for interconnecting integrated circuits |
US20100117242A1 (en) * | 2008-11-10 | 2010-05-13 | Miller Gary L | Technique for packaging multiple integrated circuits |
DE202010017690U1 (de) * | 2009-06-09 | 2012-05-29 | Google, Inc. | Programmierung von Dimm-Abschlusswiderstandswerten |
US9170974B2 (en) | 2013-02-25 | 2015-10-27 | Freescale Semiconductor, Inc. | Methods and systems for interconnecting host and expansion devices within system-in-package (SiP) solutions |
US9176916B2 (en) | 2013-02-25 | 2015-11-03 | Freescale Semiconductor, Inc. | Methods and systems for address mapping between host and expansion devices within system-in-package (SiP) solutions |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH025455A (ja) * | 1988-06-24 | 1990-01-10 | Hitachi Ltd | チップオンチップの半導体装置 |
EP0486829A2 (de) * | 1990-10-22 | 1992-05-27 | Seiko Epson Corporation | Halbleiteranordnung und Verpackungssystem für Halbleiteranordnung |
EP0766311A2 (de) * | 1995-09-28 | 1997-04-02 | Matsushita Electric Industrial Co., Ltd. | Chip-auf-Chip-Montage |
US5767009A (en) * | 1995-04-24 | 1998-06-16 | Matsushita Electric Industrial Co., Ltd. | Structure of chip on chip mounting preventing from crosstalk noise |
EP0905779A2 (de) * | 1997-09-30 | 1999-03-31 | Siemens Aktiengesellschaft | Verfahren zur Herstellung einer Emulationsschaltkreisanordnung sowie Anordnung mit zwei integrierten Schaltkreisen |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285107A (en) * | 1989-04-20 | 1994-02-08 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
JP2876773B2 (ja) * | 1990-10-22 | 1999-03-31 | セイコーエプソン株式会社 | プログラム命令語長可変型計算装置及びデータ処理装置 |
US5994774A (en) * | 1997-10-30 | 1999-11-30 | Stmicroelectronics, Inc. | Surface mountable integrated circuit package with detachable module and interposer |
-
2000
- 2000-06-30 DE DE10030994A patent/DE10030994A1/de not_active Withdrawn
-
2001
- 2001-06-12 WO PCT/DE2001/002174 patent/WO2002003464A2/de active IP Right Grant
- 2001-06-12 DE DE50112868T patent/DE50112868D1/de not_active Expired - Lifetime
- 2001-06-12 EP EP01951372A patent/EP1295340B1/de not_active Expired - Lifetime
-
2002
- 2002-12-30 US US10/331,535 patent/US6845027B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH025455A (ja) * | 1988-06-24 | 1990-01-10 | Hitachi Ltd | チップオンチップの半導体装置 |
EP0486829A2 (de) * | 1990-10-22 | 1992-05-27 | Seiko Epson Corporation | Halbleiteranordnung und Verpackungssystem für Halbleiteranordnung |
US5767009A (en) * | 1995-04-24 | 1998-06-16 | Matsushita Electric Industrial Co., Ltd. | Structure of chip on chip mounting preventing from crosstalk noise |
EP0766311A2 (de) * | 1995-09-28 | 1997-04-02 | Matsushita Electric Industrial Co., Ltd. | Chip-auf-Chip-Montage |
EP0905779A2 (de) * | 1997-09-30 | 1999-03-31 | Siemens Aktiengesellschaft | Verfahren zur Herstellung einer Emulationsschaltkreisanordnung sowie Anordnung mit zwei integrierten Schaltkreisen |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 014, no. 142 (E - 0904) 16 March 1990 (1990-03-16) * |
SCHMITT W: "NEXUS - Debug-Konzept der Zukunft? Universelle Emulations- und Kalibrierschnittstelle für Mikrocontroller", ELEKTRONIK, FRANZIS VERLAG GMBH. MÜNCHEN, DE, vol. 48, no. 17, 24 August 1999 (1999-08-24), pages 52 - 59, XP000931028, ISSN: 0013-5658 * |
Also Published As
Publication number | Publication date |
---|---|
DE50112868D1 (de) | 2007-09-27 |
US6845027B2 (en) | 2005-01-18 |
US20030117828A1 (en) | 2003-06-26 |
EP1295340A2 (de) | 2003-03-26 |
WO2002003464A2 (de) | 2002-01-10 |
DE10030994A1 (de) | 2002-01-17 |
EP1295340B1 (de) | 2007-08-15 |
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