WO2002027785A3 - Direct heatpipe attachment to die using center point loading - Google Patents

Direct heatpipe attachment to die using center point loading Download PDF

Info

Publication number
WO2002027785A3
WO2002027785A3 PCT/US2001/030367 US0130367W WO0227785A3 WO 2002027785 A3 WO2002027785 A3 WO 2002027785A3 US 0130367 W US0130367 W US 0130367W WO 0227785 A3 WO0227785 A3 WO 0227785A3
Authority
WO
WIPO (PCT)
Prior art keywords
heatpipe
die
attachment
direct
center point
Prior art date
Application number
PCT/US2001/030367
Other languages
French (fr)
Other versions
WO2002027785A2 (en
Inventor
Ajit Sathe
Kristopher Frutschy
Eric Distefano
Ravi Prasher
Original Assignee
Intel Corp
Ajit Sathe
Kristopher Frutschy
Eric Distefano
Ravi Prasher
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, Ajit Sathe, Kristopher Frutschy, Eric Distefano, Ravi Prasher filed Critical Intel Corp
Priority to EP01973599A priority Critical patent/EP1356512B1/en
Priority to DE60126341T priority patent/DE60126341T2/en
Priority to AU2001293159A priority patent/AU2001293159A1/en
Priority to CN018191754A priority patent/CN1531754B/en
Publication of WO2002027785A2 publication Critical patent/WO2002027785A2/en
Publication of WO2002027785A3 publication Critical patent/WO2002027785A3/en
Priority to HK04100812A priority patent/HK1058104A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.
PCT/US2001/030367 2000-09-29 2001-09-27 Direct heatpipe attachment to die using center point loading WO2002027785A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP01973599A EP1356512B1 (en) 2000-09-29 2001-09-27 Direct heatpipe attachment to die using center point loading
DE60126341T DE60126341T2 (en) 2000-09-29 2001-09-27 DIRECT MOUNTING OF A HEATER TO A CHIP BY CENTER POLE LOADING
AU2001293159A AU2001293159A1 (en) 2000-09-29 2001-09-27 Direct heatpipe attachment to die using center point loading
CN018191754A CN1531754B (en) 2000-09-29 2001-09-27 Direct heatpipe attachment to die using center point loading
HK04100812A HK1058104A1 (en) 2000-09-29 2004-02-06 Direct heatpipe attachment to die using center point loading

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/675,314 2000-09-29
US09/675,314 US6469893B1 (en) 2000-09-29 2000-09-29 Direct heatpipe attachment to die using center point loading

Publications (2)

Publication Number Publication Date
WO2002027785A2 WO2002027785A2 (en) 2002-04-04
WO2002027785A3 true WO2002027785A3 (en) 2003-08-14

Family

ID=24709934

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/030367 WO2002027785A2 (en) 2000-09-29 2001-09-27 Direct heatpipe attachment to die using center point loading

Country Status (9)

Country Link
US (2) US6469893B1 (en)
EP (1) EP1356512B1 (en)
CN (1) CN1531754B (en)
AT (1) ATE352872T1 (en)
AU (1) AU2001293159A1 (en)
DE (1) DE60126341T2 (en)
HK (1) HK1058104A1 (en)
MY (1) MY122824A (en)
WO (1) WO2002027785A2 (en)

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US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
DE60209423T2 (en) * 2002-11-08 2006-08-10 Agilent Technologies Inc., A Delaware Corp., Palo Alto Microchip cooling on circuit board
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US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
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US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
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DE102005033249B3 (en) * 2005-07-15 2006-10-05 Fujitsu Siemens Computers Gmbh Cooling arrangement for computer system, has retaining plate provided between base plate and system circuit board in area of processor, and cooling device movably connected with retaining plate by screws and springs
US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
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US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
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Also Published As

Publication number Publication date
HK1058104A1 (en) 2004-04-30
WO2002027785A2 (en) 2002-04-04
MY122824A (en) 2006-05-31
EP1356512A2 (en) 2003-10-29
US6469893B1 (en) 2002-10-22
DE60126341D1 (en) 2007-03-15
EP1356512B1 (en) 2007-01-24
DE60126341T2 (en) 2007-11-15
US6625022B2 (en) 2003-09-23
CN1531754A (en) 2004-09-22
AU2001293159A1 (en) 2002-04-08
CN1531754B (en) 2010-05-26
ATE352872T1 (en) 2007-02-15
US20020051341A1 (en) 2002-05-02

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