WO2002067321A3 - Enhanced die-down ball grid array and method for making the same - Google Patents

Enhanced die-down ball grid array and method for making the same Download PDF

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Publication number
WO2002067321A3
WO2002067321A3 PCT/US2002/002207 US0202207W WO02067321A3 WO 2002067321 A3 WO2002067321 A3 WO 2002067321A3 US 0202207 W US0202207 W US 0202207W WO 02067321 A3 WO02067321 A3 WO 02067321A3
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WO
WIPO (PCT)
Prior art keywords
grid array
ball grid
making
same
die
Prior art date
Application number
PCT/US2002/002207
Other languages
French (fr)
Other versions
WO2002067321A2 (en
Inventor
Reza-Ur Rahman Khan
Sam Ziqun Zhao
Original Assignee
Broadcom Corp
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Filing date
Publication date
Application filed by Broadcom Corp filed Critical Broadcom Corp
Priority to EP02702083.3A priority Critical patent/EP1374305B1/en
Priority to AU2002235468A priority patent/AU2002235468A1/en
Publication of WO2002067321A2 publication Critical patent/WO2002067321A2/en
Publication of WO2002067321A3 publication Critical patent/WO2002067321A3/en

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Abstract

An apparatus, system, and method for assembling a ball grid array (BGA) package is described. A stiffener/heat spreader is provided. A substrate has a first surface and a second surface. The substrate has a central window-shaped aperture that extends through the substrate surface to the second substrate surface. The first substrate surface is attached to a surface of the stiffener/heat spreader. A portion of the stiffener/heat spreader is accessible through the central window-shaped aperture. An IC die has a first surface and a second surface. The first IC die surface is mounted to the accessible portion of the stiffener/heat spreader. A drop-in heat spreader has a surface that is mounted to the second IC die surface.
PCT/US2002/002207 2001-02-15 2002-01-25 Enhanced die-down ball grid array and method for making the same WO2002067321A2 (en)

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EP02702083.3A EP1374305B1 (en) 2001-02-15 2002-01-25 Enhanced die-down ball grid array and method for making the same
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US09/783,034 2001-02-15
US09/783,034 US6853070B2 (en) 2001-02-15 2001-02-15 Die-down ball grid array package with die-attached heat spreader and method for making the same

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WO2002067321A3 true WO2002067321A3 (en) 2002-12-19

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US7402906B2 (en) 2008-07-22
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AU2002235468A1 (en) 2002-09-04
EP1374305B1 (en) 2013-04-10
US6853070B2 (en) 2005-02-08
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US20050012203A1 (en) 2005-01-20
US20020109226A1 (en) 2002-08-15

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