WO2002086910A2 - A method and system for forming electrically conductive pathways - Google Patents
A method and system for forming electrically conductive pathways Download PDFInfo
- Publication number
- WO2002086910A2 WO2002086910A2 PCT/US2002/012233 US0212233W WO02086910A2 WO 2002086910 A2 WO2002086910 A2 WO 2002086910A2 US 0212233 W US0212233 W US 0212233W WO 02086910 A2 WO02086910 A2 WO 02086910A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- electrically conductive
- recited
- conductive pathways
- transfer ribbon
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Definitions
- the present invention relates to a system and method for forming electrically conductive pathways.
- the system and method is for making variably printed radio frequency antennas for radio frequency tags.
- the following steps are carried out: providing a thermal transfer ribbon, moving the thermal transfer ribbon past a heat source, engaging the thermal transfer ribbon with a receiver substrate as the thermal transfer ribbon moves past the heat source, selectively heating portions of the thermal transfer ribbon with the heat source, and transferring a composition from the thermal transfer ribbon to the receiver substrate, the selective heating enabling a desired pattern of the composition to be transferred to the receiver substrate, the composition including an electrically conductive material.
- the following steps are carried out: providing a substrate coated with reactive material, moving the substrate past a heat source, selectively heating portions of the substrate with the heat source, and developing the reactive material on the substrate during exposure to heat from the heat source to develop a desired pattern on the substrate, the reactive material becoming an electrically conductive material.
- Yet another object of the invention is to enable a radio frequency tag to be produced by using a receiver substrate which has an electrically conductive pathway formed thereon and by using a microchip. This microchip can be affixed on or embedded in the receiver substrate before or after the electrically conductive pathway is formed.
- a system for producing radio frequency tags comprising a conveyor for moving a substrate, a thermal print head, the conveyor moving the substrate past the thermal print head, the thermal print head being selectively actuatable to heat a desired pattern on the substrate, means on the substrate for reacting with the heat source to form electrically conductive pathways, the means including a heat sensitive composition on the substrate.
- Figure 1 is a schematic side view of a first system for forming electrically conductive pathways of the present invention
- Figure 2 is a schematic side view of a second system for forming electrically conductive pathways of the present invention
- Figure 3 is a perspective view of a radio frequency tag produced by either method of the present invention.
- a first system 10 for forming electrically conductive pathways is shown.
- This system 10 includes a conveyor 12 for infeeding a thermal transfer ribbon 14 and a received substrate 16.
- This conveyor 12 is only schematically shown in Figure 1 as a pair of feed rolls. It should be appreciated that any type of conveyor system could be utilized. For example, a belt conveyor, chain conveyor, series of rollers, or any other known conveyor system could be used. Moreover, while only a pair of rollers 12 are shown, it should be contemplated that a continuous conveyor can be used over the length of the system 10 or any suitable number of conveyor units can be incorporated into the conveyor system. [0014]
- the thermal transfer ribbon 14 and receiver substrate 16 are fed past a heat source or thermal print head 18.
- the thermal print head 18 will selectively heat portions of the thermal transfer ribbon 14 to ultimately form a desired pattern on the receiver 16, as will be discussed below. While such a thermal print head 18 is known, its use in a method for forming electrically conductive pathways is new.
- a backing roller 20 is provided to support the thermal transfer ribbon 14 and receiver substrate 16. While a backing roller 20 is shown, it should be noted that other support surfaces could be used. For example, a flat supporting table or other structure could be opposed to the print head 18.
- This device 22 can be any known device which will apply a microchip 30 onto the treated received substrate 16 in order to form a radio frequency tag 24, as shown in Figure 3. Alternatively, this device 22 could be omitted and the receiver substrate 16 can have microchips already incorporated thereon. The microchips 30 can be applied to the surface or embedded ⁇ n the receiver substrate 16.
- the thermal transfer ribbon 14 has a reactive coating or a conductive transferable material thereon. When this reactive coating or material is heated by the thermal print head 18, an electrically conductive pathway can be printed on the receiver substrate 16.
- Thermal transfer ribbon 14 either has a conductive material or a material that becomes conductive upon the application of heat. The heat from print head 18 will serve to transfer the material to receiver substrate 16 and in some instances will also serve to activate the material to make it conductive. In those circumstances, the transferred composition will be an electrical conductor precursor.
- the use of this print head 18 allows printing of a conductive pathway in any shape, length, or size onto the receiver substrate 16. Thus, great flexibility is had with the use of the thermal print head 18.
- the electrically conductive pathway 26 is schematically shown in Figure 1.
- a microchip can be placed thereon in order to form a radio frequency tag. While a generally U-shaped pathway is shown, it is important to note that the length, width, shape and size of the pathway can easily be varied by using print head 18.
- the conveyor 12 will enable on-the-fly printing of pathways 26. Of course, batch processing is also possible. In such an arrangement, a continuous transfer ribbon and receiver substrate can be incrementally fed past the print head 18 or discrete portions of a ribbon 14 and substrate 16 could be used. For example, a feeder conveyor could move rectangular overlaying sheets of transfer ribbon and substrate through the system 10 past the print head 18.
- the thermal transfer ribbon 14 is brought into engagement with the receiver substrate 16. This engagement, along with the heating of the thermal transfer ribbon 14 by the thermal print head 18, will cause transfer of a conductive composition from the ribbon 14 to the receiver substrate 16.
- a complicated arrangement using magnets as taught in U.S. Patent
- the thermal transfer ribbon 14 is coated with the conductive composition.
- the transfer ribbon is made up of a transfer substrate which can be made from a polymeric film or paper.
- Suitable transfer substrate materials include, but are not limited to, paper, polyester, polyethylene naphthalate, polyamide, polyolefin, cellulose and polycarbonate.
- One preferred transfer substrate is polyester film, manufactured by DupontTM under the MylarTM brand name.
- MylarTM is a polyester flexible film. Important properties of the transfer substrate include high tensile strength, thin thickness and low heat resistance.
- the transfer substrate of the thermal transfer ribbon is coated with a conductive composition that is designed to be transferred to the received substrate 16 using the thermal print head 18. This coating is comprised of a conductive material, wax, binders, surfactants, dispersants and other additives.
- the primary component of the transfer layer is the electrically conductive material.
- the conductive material may be comprised of metallic inks, metallic substances, metallic dispersions, metallic salts, carbon based inks, or other conductive substances, etc.
- a preferred metallic substance is manufactured by ParelecTM under the ParamodTM brand name. The higher the conductivity of the conductive material, the better.
- the transfer coating for the thermal transfer ribbon 14 also contains a wax as another main component.
- the wax is designed to melt or soften under the heat supplied by the thermal print head 18. This will aid in the transfer of the coating layer to the receiver substrate 16.
- suitable waxes are carnuaba wax, paraffin wax, low molecular weight polyethylene wax, etc.
- Binders are also included in the thermal transfer ribbon 14. These binders in the coating layer aid in cohesion of the coating and provide tack properties for adhesion to the receiver substrate 16. Examples of suitable binders are styrene copolymers, polyethylene resin, polystyrene, vinyl chloride polymers, vinyl acetate polymers, etc. Surfactants, dispersant and other additives are incorporated as needed for proper processing, coating and to aid in the transfer properties. [0023] The transfer coating layer can be applied to the transfer ribbon substrate using a Meyer rod, airknife, roll coater, blade or any suitable coating method. The coat weight applied is in the range 1.5g/m 2 to 30 g/m 2 .
- the coated transfer ribbon can then be used with the thermal print head 18 and a thermal printer to create any size, shape, length, etc. of an antenna to be incorporated with a microchip for a construction of a radio frequency identification tag 24.
- the conductive material is transferred onto the receiver sheet 16.
- This receiver sheet is a substantially non-conductive substrate such as paper, plastic film and the like.
- the sheet can be a conductive substrate that has been coated with an electrical insulating layer.
- Figure 2 a second method and system 10' for forming electrically conductive pathways will be described. These pathways can also be used for antennas in radio frequency tags 24, similarly to that described in Figure 1.
- a thermal transfer ribbon 14 is not used. Rather, a second receiver substrate 16' is utilized.
- This substrate used can be selected from paper, polymeric films, cellulose materials and other thin, flat substrates.
- This substrate is coated with a composition that is designed to react when exposed to heat generated from the thermal print head 18. This coating is comprised of a reducible metallic material, binders, fillers, surfactants, dispersants, and other additives.
- the primary component of the transfer layer is the reducible metallic material.
- This reducible material may be comprised of sorbitol copper formate, copper sulfate, cuprite, tenorite, silver nitrate, and the like. The higher the conductivity of the reduced reducible material, the better.
- Binders are included in the coating layer to aid in cohesion of the coating while not inhibiting the conductivity of the reduced material. Examples of suitable binders are styrene butadiene copolymers, polyvinyl alcohols, starch, vinyl chloride polymers, vinyl acetate polymers, methyl cellulose, etc.
- the coating layer can be applied to the substrate using a Meyer rod, airknife, roll coater, blade or any other suitable coating method.
- the coat weight applied is in the range of 1.5 g/m 2 to 30 g/m 2 .
- the antenna may be formed by either method to create the antenna portion of a radio frequency tag.
- the antenna or electrically conductive pathway may be printed either before or after the microchip is affixed to the substrate.
- this device 22 is shown downstream from the print head 18 in Figure 1 and 2, this device 22 could instead be upstream so that the microchip is first applied to the receiver substrate 16 or 16'.
- the device 22 can be omitted and substrates 16 or 16' using already incorporated microchips could instead be used.
- an interposer 28 may be used to decrease the precision needed when forming an electrically conductive pathway relative to the microchip connection.
- variable, on-demand printed electrically conductive pathways can be formed.
- the invention utilizes two methods for printing the conductive pathways, thermal transfer and direct thermal.
- the printed conductive pathways are suitable for use as an antenna for a radio frequency identification tag 24.
- a ribbon 14 coated with a conductive material is used that is transferred to another substrate 16 upon application of heat by the thermal print head 18.
- a receiver substrate 16' is used that has a conductive material which, when exposed to heat from a thermal print head 18, will form the conductive pathways.
- a thermal transfer ribbon 14 is provided. This thermal transfer ribbon 14 is moved past a heat source or thermal print head 18 by conveyor 12. The thermal transfer ribbon 14 is engaged with a receiver substrate as it moves past the heat source or thermal print head 18. This thermal print head 18 will selectively heat portions of the thermal transfer ribbon 14, in order to transfer a composition to the receiver substrate 16. This transferred composition forms an electrically conductive pathway 26. The selective heating by the thermal print head 18 enables a desired pattern of composition to be transferred to the receiver substrate 16.
- a substrate 16' is provided with a reactive material.
- This substrate 16' is moved by conveyor 12 past a heat source or thermal print head 18.
- the heat source or thermal print head 18 can selectively heat portions of the substrate. This will develop the reactive material on the substrate 16' to develop a desired pattern on the substrate. This desired pattern will form the electrically conductive pathway 26.
- a system 10 or 10' can be used.
- the conductive composition on ribbon 14 or the reducible material on the second receiver substrate will act as means on the substrate for reacting to heat from the heat source or print head 18.
- the conductive composition or reducible material is a heat sensitive composition on substrate 14 or 16'.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02726768A EP1393328A2 (en) | 2001-04-23 | 2002-04-18 | A method and system for forming electrically conductive pathways |
JP2002584337A JP2004527912A (en) | 2001-04-23 | 2002-04-18 | Method and apparatus for forming conductive paths |
CA002444969A CA2444969A1 (en) | 2001-04-23 | 2002-04-18 | A method and system for forming electrically conductive pathways |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/839,126 | 2001-04-23 | ||
US09/839,126 US6892441B2 (en) | 2001-04-23 | 2001-04-23 | Method for forming electrically conductive pathways |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002086910A2 true WO2002086910A2 (en) | 2002-10-31 |
WO2002086910A3 WO2002086910A3 (en) | 2003-12-04 |
Family
ID=25278917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/012233 WO2002086910A2 (en) | 2001-04-23 | 2002-04-18 | A method and system for forming electrically conductive pathways |
Country Status (5)
Country | Link |
---|---|
US (2) | US6892441B2 (en) |
EP (1) | EP1393328A2 (en) |
JP (1) | JP2004527912A (en) |
CA (1) | CA2444969A1 (en) |
WO (1) | WO2002086910A2 (en) |
Cited By (3)
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US7098794B2 (en) | 2004-04-30 | 2006-08-29 | Kimberly-Clark Worldwide, Inc. | Deactivating a data tag for user privacy or tamper-evident packaging |
US7151455B2 (en) | 2004-04-30 | 2006-12-19 | Kimberly-Clark Worldwide, Inc. | Activating a data tag by load or orientation or user control |
US7948381B2 (en) | 2004-04-30 | 2011-05-24 | Binforma Group Limited Liability Company | Reversibly deactivating a radio frequency identification data tag |
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JP4763237B2 (en) * | 2001-10-19 | 2011-08-31 | キャボット コーポレイション | Method for manufacturing a conductive electronic component on a substrate |
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US7621043B2 (en) * | 2005-11-02 | 2009-11-24 | Checkpoint Systems, Inc. | Device for making an in-mold circuit |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US7098794B2 (en) | 2004-04-30 | 2006-08-29 | Kimberly-Clark Worldwide, Inc. | Deactivating a data tag for user privacy or tamper-evident packaging |
US7151455B2 (en) | 2004-04-30 | 2006-12-19 | Kimberly-Clark Worldwide, Inc. | Activating a data tag by load or orientation or user control |
US7701346B2 (en) | 2004-04-30 | 2010-04-20 | Jeffrey Dean Lindsay | Deactivating a data tag for user privacy or tamper-evident packaging |
EP2209100A2 (en) | 2004-04-30 | 2010-07-21 | Binforma Group Limited Liability Company | Deactivating a data tag for user privacy or tamper-evident packaging |
US7948381B2 (en) | 2004-04-30 | 2011-05-24 | Binforma Group Limited Liability Company | Reversibly deactivating a radio frequency identification data tag |
US8487769B2 (en) | 2004-04-30 | 2013-07-16 | Binforma Group Limited Liability Company | Reversibly deactivating a radio frequency identification data tag |
EP2388736A1 (en) | 2006-12-19 | 2011-11-23 | Binforma Group Limited Liability Company | Reversibly deactivating a radio frequency identification data tag |
Also Published As
Publication number | Publication date |
---|---|
JP2004527912A (en) | 2004-09-09 |
WO2002086910A3 (en) | 2003-12-04 |
US20050151700A1 (en) | 2005-07-14 |
EP1393328A2 (en) | 2004-03-03 |
US20020152604A1 (en) | 2002-10-24 |
US6892441B2 (en) | 2005-05-17 |
CA2444969A1 (en) | 2002-10-31 |
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