WO2002089184A3 - Method for manufacturing a semiconductor device and support plate therefor - Google Patents

Method for manufacturing a semiconductor device and support plate therefor Download PDF

Info

Publication number
WO2002089184A3
WO2002089184A3 PCT/IB2002/001446 IB0201446W WO02089184A3 WO 2002089184 A3 WO2002089184 A3 WO 2002089184A3 IB 0201446 W IB0201446 W IB 0201446W WO 02089184 A3 WO02089184 A3 WO 02089184A3
Authority
WO
WIPO (PCT)
Prior art keywords
support plate
elements
manufacturing
semiconductor device
attached
Prior art date
Application number
PCT/IB2002/001446
Other languages
French (fr)
Other versions
WO2002089184A2 (en
Inventor
Samber Marc A De
Veen Nicolaas J A Van
Johannus W Weekamp
Grunsven Erik C E Van
Original Assignee
Koninkl Philips Electronics Nv
Samber Marc A De
Veen Nicolaas J A Van
Johannus W Weekamp
Grunsven Erik C E Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Samber Marc A De, Veen Nicolaas J A Van, Johannus W Weekamp, Grunsven Erik C E Van filed Critical Koninkl Philips Electronics Nv
Priority to EP02720409A priority Critical patent/EP1386345A2/en
Priority to JP2002586386A priority patent/JP2004520717A/en
Publication of WO2002089184A2 publication Critical patent/WO2002089184A2/en
Publication of WO2002089184A3 publication Critical patent/WO2002089184A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a method of manufacturing a semiconductor device (10) comprising a semiconductor element (1), with two or more elements (1) being attached to a support plate (2). It is often desired in such a case that the elements(1) are positioned on the support plate (2) or on a further support plate (22) at a larger mutual distance than in the semiconductor body (100) in which the elements (1) are formed. According to the invention, the support plate (2) is formed as an array of rigid subplates (2A) to which the elements (1) are attached, and the rigid subplates (2A) are interconnected within the plate (2) by means of one or more flexible elements (3). In this way the elements (1) - after they have been attached to the support plate (2) and after they have been separated from each other within the semiconductor body (100) and after stretching of the flexible elements (3) - can be positioned in an accurate manner at a larger mutual distance. Subsequently - or after having been transferred to a further plate (22) - the elements (1) may be provided with an encapsulation (20) and can be mounted on to individual semiconductor devices (10).
PCT/IB2002/001446 2001-04-26 2002-04-22 Method for manufacturing a semiconductor device and support plate therefor WO2002089184A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP02720409A EP1386345A2 (en) 2001-04-26 2002-04-22 Method for manufacturing a semiconductor device and support plate therefor
JP2002586386A JP2004520717A (en) 2001-04-26 2002-04-22 Semiconductor device manufacturing method, semiconductor device obtained by the present manufacturing method, and support plate suitable for the present semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01201524 2001-04-26
EP01201524.4 2001-04-26

Publications (2)

Publication Number Publication Date
WO2002089184A2 WO2002089184A2 (en) 2002-11-07
WO2002089184A3 true WO2002089184A3 (en) 2003-01-09

Family

ID=8180211

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2002/001446 WO2002089184A2 (en) 2001-04-26 2002-04-22 Method for manufacturing a semiconductor device and support plate therefor

Country Status (3)

Country Link
EP (1) EP1386345A2 (en)
JP (1) JP2004520717A (en)
WO (1) WO2002089184A2 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164749A (en) * 1961-02-13 1965-01-05 Ibm Electronic component packaging
US4323155A (en) * 1980-01-21 1982-04-06 Kling Jarrett B Integrated circuit carrier
US4703920A (en) * 1986-08-25 1987-11-03 Amp Incorporated Manufacturing method for integrated circuit chip carriers and work holder for use in the method
US5715143A (en) * 1996-07-22 1998-02-03 Delco Electronics Corporation Carrier system for integrated circuit carrier assemblies
US5989982A (en) * 1997-10-08 1999-11-23 Oki Electric Industry Co., Ltd. Semiconductor device and method of manufacturing the same
US6029427A (en) * 1999-04-05 2000-02-29 Lucent Technologies, Inc. Method and apparatus for handling semiconductor chips
US6049972A (en) * 1997-03-04 2000-04-18 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
US6112795A (en) * 1998-03-12 2000-09-05 International Business Machines Corporation Fixture for multi-layered ceramic package assembly

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04324944A (en) * 1991-04-25 1992-11-13 Hitachi Ltd Wire bonding device
JP3462312B2 (en) * 1995-08-08 2003-11-05 富士通株式会社 Semiconductor device manufacturing method and semiconductor manufacturing apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164749A (en) * 1961-02-13 1965-01-05 Ibm Electronic component packaging
US4323155A (en) * 1980-01-21 1982-04-06 Kling Jarrett B Integrated circuit carrier
US4703920A (en) * 1986-08-25 1987-11-03 Amp Incorporated Manufacturing method for integrated circuit chip carriers and work holder for use in the method
US5715143A (en) * 1996-07-22 1998-02-03 Delco Electronics Corporation Carrier system for integrated circuit carrier assemblies
US6049972A (en) * 1997-03-04 2000-04-18 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
US5989982A (en) * 1997-10-08 1999-11-23 Oki Electric Industry Co., Ltd. Semiconductor device and method of manufacturing the same
US6112795A (en) * 1998-03-12 2000-09-05 International Business Machines Corporation Fixture for multi-layered ceramic package assembly
US6029427A (en) * 1999-04-05 2000-02-29 Lucent Technologies, Inc. Method and apparatus for handling semiconductor chips

Also Published As

Publication number Publication date
JP2004520717A (en) 2004-07-08
WO2002089184A2 (en) 2002-11-07
EP1386345A2 (en) 2004-02-04

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