WO2002093696A3 - Small-scale optoelectronic package - Google Patents

Small-scale optoelectronic package Download PDF

Info

Publication number
WO2002093696A3
WO2002093696A3 PCT/US2002/015379 US0215379W WO02093696A3 WO 2002093696 A3 WO2002093696 A3 WO 2002093696A3 US 0215379 W US0215379 W US 0215379W WO 02093696 A3 WO02093696 A3 WO 02093696A3
Authority
WO
WIPO (PCT)
Prior art keywords
insulating substrate
transparent insulating
substrate
optoelectronic
optical
Prior art date
Application number
PCT/US2002/015379
Other languages
French (fr)
Other versions
WO2002093696A2 (en
Inventor
Richard J Pommer
Charles B Kuznia
Tri Q Le
Richard T Hagan
Ronald E Reedy
James S Cable
Donald J Albares
A Mark Miscione
Original Assignee
Peregrine Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/099,523 external-priority patent/US6869229B2/en
Application filed by Peregrine Semiconductor Corp filed Critical Peregrine Semiconductor Corp
Priority to AU2002318132A priority Critical patent/AU2002318132A1/en
Priority to JP2002590460A priority patent/JP2004533009A/en
Priority to EP02747835A priority patent/EP1396013A2/en
Publication of WO2002093696A2 publication Critical patent/WO2002093696A2/en
Publication of WO2002093696A3 publication Critical patent/WO2002093696A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Abstract

Integrated circuit/optoelectronic packaging system (100) which comprises OE and IC components packaged to provide electrical input/output using electrical connections (82, 83), thermal management using a heat sink (105), an optical window using a transparent insulating substrate (17), and precise passive or mechanical alignment using guide pins (72) to external optical receivers or transmitters (not shown). A transparent insulating substrate (17) having electrical circuitry (88) in a thin silicon layer formed on its top side is positioned between the optical fiber and the optoelectonic device (203) such that an optical path is described between the optoelectronic device and the optical fiber core through the transparent insulating substrate (17). Arrays of fibers (not shown) may be coupled to arrays of optoelectronic devices (203) through a single transparent substrate (17). The optoelectronic devices (203) are mounted on the transparent insulating substrate (17) in a precise positional relationship to guide holes in the substrate.
PCT/US2002/015379 2001-05-15 2002-05-15 Small-scale optoelectronic package WO2002093696A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2002318132A AU2002318132A1 (en) 2001-05-15 2002-05-15 Small-scale optoelectronic package
JP2002590460A JP2004533009A (en) 2001-05-15 2002-05-15 Small scale optoelectronic package
EP02747835A EP1396013A2 (en) 2001-05-15 2002-05-15 Small-scale optoelectronic package

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US29134801P 2001-05-15 2001-05-15
US60/291,348 2001-05-15
US30012901P 2001-06-22 2001-06-22
US60/300,129 2001-06-22
US30369501P 2001-07-06 2001-07-06
US60/303,695 2001-07-06
US30438701P 2001-07-09 2001-07-09
US60/304,387 2001-07-09
US33502101P 2001-10-31 2001-10-31
US60/335,021 2001-10-31
US10/099,523 US6869229B2 (en) 2001-03-16 2002-03-15 Coupled optical and optoelectronic devices, and method of making the same
US10/099,523 2002-03-15
US36559902P 2002-03-18 2002-03-18
US60/365,599 2002-03-18

Publications (2)

Publication Number Publication Date
WO2002093696A2 WO2002093696A2 (en) 2002-11-21
WO2002093696A3 true WO2002093696A3 (en) 2003-05-01

Family

ID=27568593

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/015379 WO2002093696A2 (en) 2001-05-15 2002-05-15 Small-scale optoelectronic package

Country Status (4)

Country Link
EP (1) EP1396013A2 (en)
JP (1) JP2004533009A (en)
AU (1) AU2002318132A1 (en)
WO (1) WO2002093696A2 (en)

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JP3759494B2 (en) 2002-12-12 2006-03-22 セイコーエプソン株式会社 Optical communication device
US6908232B2 (en) 2003-03-21 2005-06-21 Agilent Technologies, Inc. Fiber optic connectors and methods of making the same
FR2876191B1 (en) * 2004-10-05 2007-05-25 Intexys Sa METHOD AND DEVICE FOR COUPLING OPTICAL COMPONENTS
US7251398B2 (en) 2004-08-26 2007-07-31 Interuniversitair Microelektronica Centrum (Imec) Method for providing an optical interface and devices according to such methods
EP1630578A3 (en) * 2004-08-26 2006-03-22 Interuniversitair Microelektronica Centrum Method for providing an optical interface with an optical coupling structure for a packaged optical device and devices according to such a method
KR101351882B1 (en) 2006-09-13 2014-01-17 주식회사 와이텔포토닉스 An optical connection component
JP2010177578A (en) * 2009-01-30 2010-08-12 Furukawa Electric Co Ltd:The Optical module of parallel optical transmission device
US20120082413A1 (en) * 2009-02-05 2012-04-05 Edith Cowan University An optical connection system
US20110091168A1 (en) * 2009-10-19 2011-04-21 Zarlink Semiconductor Ab Opto-electrical assemblies and associated apparatus and methods
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
US9160450B2 (en) * 2011-09-23 2015-10-13 Te Connectivity Nederland B.V. Multi-channel transceiver
KR101301949B1 (en) 2011-11-07 2013-09-02 가부시키가이샤 어드밴티스트 Device interface apparatus and test apparatus
US20160274318A1 (en) 2012-03-05 2016-09-22 Nanoprecision Products, Inc. Optical bench subassembly having integrated photonic device
JP6056186B2 (en) * 2012-05-08 2017-01-11 株式会社ニコン Image sensor
CA2978955A1 (en) * 2015-03-22 2016-09-29 Nanoprecision Products, Inc. Optical bench subassembly having integrated photonic device
EP3867948A1 (en) 2018-10-15 2021-08-25 Semtech Corporation Semiconductor package for providing mechanical isolation of assembled diodes
JP7353056B2 (en) * 2019-03-29 2023-09-29 日東電工株式会社 Optical/electrical hybrid board with optical element
US20230058904A1 (en) * 2019-12-19 2023-02-23 Ams Sensors Singapore Pte. Ltd. Optical component
KR20220139868A (en) * 2020-02-12 2022-10-17 닛토덴코 가부시키가이샤 Photoelectric hybrid substrate
CN112331644B (en) * 2020-11-09 2023-05-23 中国电子科技集团公司第四十四研究所 High-speed photoelectric coupler resistant to irradiation and manufacturing method thereof
US20230200119A1 (en) * 2021-12-20 2023-06-22 Intel Corporation Organic thin-films for data transmission

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US5159413A (en) * 1990-04-20 1992-10-27 Eaton Corporation Monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate
US5574814A (en) * 1995-01-31 1996-11-12 Microelectronics And Computer Technology Corporation Parallel optical transceiver link
US5781682A (en) * 1996-02-01 1998-07-14 International Business Machines Corporation Low-cost packaging for parallel optical computer link
US6075908A (en) * 1997-12-19 2000-06-13 Intel Corporation Method and apparatus for optically modulating light through the back side of an integrated circuit die
US6234687B1 (en) * 1999-08-27 2001-05-22 International Business Machines Corporation Self-aligning method and interlocking assembly for attaching an optoelectronic device to a coupler

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US5159413A (en) * 1990-04-20 1992-10-27 Eaton Corporation Monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate
US5574814A (en) * 1995-01-31 1996-11-12 Microelectronics And Computer Technology Corporation Parallel optical transceiver link
US5781682A (en) * 1996-02-01 1998-07-14 International Business Machines Corporation Low-cost packaging for parallel optical computer link
US6075908A (en) * 1997-12-19 2000-06-13 Intel Corporation Method and apparatus for optically modulating light through the back side of an integrated circuit die
US6234687B1 (en) * 1999-08-27 2001-05-22 International Business Machines Corporation Self-aligning method and interlocking assembly for attaching an optoelectronic device to a coupler

Non-Patent Citations (2)

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Title
WOLF ET AL.: "Silicon processing for the VLSI Era, Vol. 1: Process technology", LATTICE PRESS, 1986, SUNSET BEACH, CA, pages 473 - 476, XP002959400 *
WOLF: "Silicon processing for the VLSI Era, Vol. 2: Process integration", LATTICE PRESS, 1990, SUNSET BEACH, CA, pages 376 - 380, XP002959399 *

Also Published As

Publication number Publication date
AU2002318132A1 (en) 2002-11-25
EP1396013A2 (en) 2004-03-10
WO2002093696A2 (en) 2002-11-21
JP2004533009A (en) 2004-10-28

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