WO2003041158A3 - Semiconductor package device and method of formation and testing - Google Patents
Semiconductor package device and method of formation and testing Download PDFInfo
- Publication number
- WO2003041158A3 WO2003041158A3 PCT/US2002/033083 US0233083W WO03041158A3 WO 2003041158 A3 WO2003041158 A3 WO 2003041158A3 US 0233083 W US0233083 W US 0233083W WO 03041158 A3 WO03041158 A3 WO 03041158A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- testing
- package device
- formation
- semiconductor package
- Prior art date
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003543094A JP2005535103A (en) | 2001-11-08 | 2002-10-16 | Semiconductor package device and manufacturing and testing method |
AU2002337875A AU2002337875A1 (en) | 2001-11-08 | 2002-10-16 | Semiconductor package device and method of formation and testing |
EP02773779A EP1481421A2 (en) | 2001-11-08 | 2002-10-16 | Semiconductor package device and method of formation and testing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/008,800 US6916682B2 (en) | 2001-11-08 | 2001-11-08 | Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing |
US10/008,800 | 2001-11-08 |
Publications (2)
Publication Number | Publication Date |
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WO2003041158A2 WO2003041158A2 (en) | 2003-05-15 |
WO2003041158A3 true WO2003041158A3 (en) | 2003-10-23 |
Family
ID=21733752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/033083 WO2003041158A2 (en) | 2001-11-08 | 2002-10-16 | Semiconductor package device and method of formation and testing |
Country Status (8)
Country | Link |
---|---|
US (1) | US6916682B2 (en) |
EP (1) | EP1481421A2 (en) |
JP (1) | JP2005535103A (en) |
KR (1) | KR100926002B1 (en) |
CN (1) | CN100477141C (en) |
AU (1) | AU2002337875A1 (en) |
TW (1) | TWI260076B (en) |
WO (1) | WO2003041158A2 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG108245A1 (en) | 2001-03-30 | 2005-01-28 | Micron Technology Inc | Ball grid array interposer, packages and methods |
JP2003243604A (en) * | 2002-02-13 | 2003-08-29 | Sony Corp | Electronic component and manufacturing method of electronic component |
US6906415B2 (en) * | 2002-06-27 | 2005-06-14 | Micron Technology, Inc. | Semiconductor device assemblies and packages including multiple semiconductor devices and methods |
US7573136B2 (en) * | 2002-06-27 | 2009-08-11 | Micron Technology, Inc. | Semiconductor device assemblies and packages including multiple semiconductor device components |
US7071545B1 (en) * | 2002-12-20 | 2006-07-04 | Asat Ltd. | Shielded integrated circuit package |
JP3867796B2 (en) * | 2003-10-09 | 2007-01-10 | セイコーエプソン株式会社 | Semiconductor device and manufacturing method thereof, circuit board, and electronic apparatus |
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Also Published As
Publication number | Publication date |
---|---|
CN1602548A (en) | 2005-03-30 |
US6916682B2 (en) | 2005-07-12 |
WO2003041158A2 (en) | 2003-05-15 |
TWI260076B (en) | 2006-08-11 |
US20030085463A1 (en) | 2003-05-08 |
KR100926002B1 (en) | 2009-11-09 |
CN100477141C (en) | 2009-04-08 |
JP2005535103A (en) | 2005-11-17 |
EP1481421A2 (en) | 2004-12-01 |
AU2002337875A1 (en) | 2003-05-19 |
KR20050037430A (en) | 2005-04-21 |
TW200300283A (en) | 2003-05-16 |
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