WO2003061006A3 - Stacked die in die bga package - Google Patents

Stacked die in die bga package Download PDF

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Publication number
WO2003061006A3
WO2003061006A3 PCT/US2003/000569 US0300569W WO03061006A3 WO 2003061006 A3 WO2003061006 A3 WO 2003061006A3 US 0300569 W US0300569 W US 0300569W WO 03061006 A3 WO03061006 A3 WO 03061006A3
Authority
WO
WIPO (PCT)
Prior art keywords
die
bga package
stacked
stacked die
devices
Prior art date
Application number
PCT/US2003/000569
Other languages
French (fr)
Other versions
WO2003061006A2 (en
WO2003061006B1 (en
Inventor
Hock Chuan Tan
Thiam Chye Lim
Victor Cher Khng Tan
Chee Peng Neo
Michael Kian Shing Tan
Beng Chye Chew
Cheng Poh Pour
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SG200200134A external-priority patent/SG121702A1/en
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to AU2003207484A priority Critical patent/AU2003207484A1/en
Publication of WO2003061006A2 publication Critical patent/WO2003061006A2/en
Publication of WO2003061006A3 publication Critical patent/WO2003061006A3/en
Publication of WO2003061006B1 publication Critical patent/WO2003061006B1/en

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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
PCT/US2003/000569 2002-01-09 2003-01-09 Stacked die in die bga package WO2003061006A2 (en)

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AU2003207484A AU2003207484A1 (en) 2002-01-09 2003-01-09 Stacked die in die bga package

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SG200200134-5 2002-01-09
SG200200134A SG121702A1 (en) 2002-01-09 2002-01-09 Stacked die in die bga package
US10/068,159 US7332819B2 (en) 2002-01-09 2002-02-05 Stacked die in die BGA package
US10/068,159 2002-02-05

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WO2003061006A2 WO2003061006A2 (en) 2003-07-24
WO2003061006A3 true WO2003061006A3 (en) 2004-06-17
WO2003061006B1 WO2003061006B1 (en) 2004-08-26

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