WO2003069016A3 - In-line deposition processes for circuit fabrication - Google Patents
In-line deposition processes for circuit fabrication Download PDFInfo
- Publication number
- WO2003069016A3 WO2003069016A3 PCT/US2003/001821 US0301821W WO03069016A3 WO 2003069016 A3 WO2003069016 A3 WO 2003069016A3 US 0301821 W US0301821 W US 0301821W WO 03069016 A3 WO03069016 A3 WO 03069016A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- deposition
- mask patterns
- web
- elongated
- aperture mask
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003568122A JP2005517810A (en) | 2002-02-14 | 2003-01-21 | In-line deposition for circuit manufacturing |
EP03739675A EP1474543A2 (en) | 2002-02-14 | 2003-01-21 | In-line deposition processes for circuit fabrication |
AU2003210596A AU2003210596A1 (en) | 2002-02-14 | 2003-01-21 | In-line deposition processes for circuit fabrication |
KR10-2004-7012559A KR20040085191A (en) | 2002-02-14 | 2003-01-21 | In-line deposition processes for circuit fabrication |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/076,005 US6821348B2 (en) | 2002-02-14 | 2002-02-14 | In-line deposition processes for circuit fabrication |
US10/076,005 | 2002-02-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003069016A2 WO2003069016A2 (en) | 2003-08-21 |
WO2003069016A3 true WO2003069016A3 (en) | 2004-01-29 |
Family
ID=27660172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/001821 WO2003069016A2 (en) | 2002-02-14 | 2003-01-21 | In-line deposition processes for circuit fabrication |
Country Status (7)
Country | Link |
---|---|
US (3) | US6821348B2 (en) |
EP (1) | EP1474543A2 (en) |
JP (1) | JP2005517810A (en) |
KR (1) | KR20040085191A (en) |
CN (1) | CN100351425C (en) |
AU (1) | AU2003210596A1 (en) |
WO (1) | WO2003069016A2 (en) |
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US6667215B2 (en) * | 2002-05-02 | 2003-12-23 | 3M Innovative Properties | Method of making transistors |
US20040087009A1 (en) * | 2002-10-31 | 2004-05-06 | Schembri Carol T. | Array substrates having protective layer |
US7294209B2 (en) * | 2003-01-02 | 2007-11-13 | Cymbet Corporation | Apparatus and method for depositing material onto a substrate using a roll-to-roll mask |
JP4280509B2 (en) * | 2003-01-31 | 2009-06-17 | キヤノン株式会社 | Projection exposure mask, projection exposure mask manufacturing method, projection exposure apparatus, and projection exposure method |
US7153180B2 (en) * | 2003-11-13 | 2006-12-26 | Eastman Kodak Company | Continuous manufacture of flat panel light emitting devices |
-
2002
- 2002-02-14 US US10/076,005 patent/US6821348B2/en not_active Expired - Fee Related
-
2003
- 2003-01-21 EP EP03739675A patent/EP1474543A2/en not_active Withdrawn
- 2003-01-21 CN CNB038040093A patent/CN100351425C/en not_active Expired - Fee Related
- 2003-01-21 JP JP2003568122A patent/JP2005517810A/en active Pending
- 2003-01-21 AU AU2003210596A patent/AU2003210596A1/en not_active Abandoned
- 2003-01-21 WO PCT/US2003/001821 patent/WO2003069016A2/en active Application Filing
- 2003-01-21 KR KR10-2004-7012559A patent/KR20040085191A/en not_active Application Discontinuation
-
2004
- 2004-09-14 US US10/940,448 patent/US7297361B2/en not_active Expired - Fee Related
-
2007
- 2007-10-23 US US11/877,159 patent/US20080044556A1/en not_active Abandoned
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US4676193A (en) * | 1984-02-27 | 1987-06-30 | Applied Magnetics Corporation | Stabilized mask assembly for direct deposition of a thin film pattern onto a substrate |
US5304274A (en) * | 1990-11-08 | 1994-04-19 | Bmc Technology Corporation | Method for manufacturing electrodes for multilayer ceramic capacitors |
JPH0578818A (en) * | 1991-09-19 | 1993-03-30 | Hitachi Cable Ltd | Formation of partial film |
US5626784A (en) * | 1995-03-31 | 1997-05-06 | Motorola, Inc. | In-situ sizing of photolithographic mask or the like, and frame therefore |
WO1999054786A1 (en) * | 1998-04-21 | 1999-10-28 | President And Fellows Of Harvard College | Elastomeric mask and use in fabrication of devices, inlcuding pixelated electroluminescent displays |
US20010002583A1 (en) * | 1999-01-14 | 2001-06-07 | Detlef Eller | Device for treating a band-shaped substrate with a gas |
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PATENT ABSTRACTS OF JAPAN vol. 017, no. 409 (C - 1091) 30 July 1993 (1993-07-30) * |
Also Published As
Publication number | Publication date |
---|---|
CN1633517A (en) | 2005-06-29 |
JP2005517810A (en) | 2005-06-16 |
US6821348B2 (en) | 2004-11-23 |
US7297361B2 (en) | 2007-11-20 |
EP1474543A2 (en) | 2004-11-10 |
KR20040085191A (en) | 2004-10-07 |
US20030152691A1 (en) | 2003-08-14 |
US20080044556A1 (en) | 2008-02-21 |
AU2003210596A1 (en) | 2003-09-04 |
US20050042365A1 (en) | 2005-02-24 |
AU2003210596A8 (en) | 2003-09-04 |
CN100351425C (en) | 2007-11-28 |
WO2003069016A2 (en) | 2003-08-21 |
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