WO2003073554A1 - A radio transceiver module - Google Patents

A radio transceiver module Download PDF

Info

Publication number
WO2003073554A1
WO2003073554A1 PCT/SE2003/000293 SE0300293W WO03073554A1 WO 2003073554 A1 WO2003073554 A1 WO 2003073554A1 SE 0300293 W SE0300293 W SE 0300293W WO 03073554 A1 WO03073554 A1 WO 03073554A1
Authority
WO
WIPO (PCT)
Prior art keywords
ground plane
substrate
antenna
transmitter
receiver devices
Prior art date
Application number
PCT/SE2003/000293
Other languages
French (fr)
Inventor
Richard Wallace
James D. Macdonald
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Priority to AU2003206574A priority Critical patent/AU2003206574A1/en
Publication of WO2003073554A1 publication Critical patent/WO2003073554A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna

Definitions

  • the invention relates generally to radio transceiver modules and more specifically to miniaturization of antennas for such modules.
  • MCM Multi-Chip Module
  • Another effect of placing an antenna directly on the module surface is the loss of efficiency due to the organic encapsulant used to protect the active components of the module, e.g. the transmitter/receiver devices.
  • Organic encapsulants used in electronic packages commonly have a dielectric constant > 3.0. Such a high dielectric constant reduces the efficiency of preferred antenna types used in low profile applications, i.e. building heights of 2.0 mm or less above the surface of the substrate of the module.
  • Preferred antenna types are e.g. a PIFA (Planar Inverted F Antenna) or a patch antenna that both work most efficiently with a dielectric constant approaching a value of 1.0.
  • the object of the invention is to overcome the difficulties encountered with conventional solutions yet stay within the size constraints of standard packaging heights.
  • the antenna comprises a dielectric core in the form of an epoxy layer encapsulating the transmitter/receiver devices, and planar radiating elements on a plastic film fixed on top of the epoxy layer, while the ground plane of the antenna is formed by the ground plane of the substrate.
  • Fig. 1 is a schematic cross-sectional view of a first embodiment of a transceiver module according to the invention
  • Fig. 2 is a schematic cross-sectional view of a second embodiment of the transceiver module according to the invention
  • Fig. 3 is a schematic cross-sectional view of a third embodiment of the transceiver module according to the invention.
  • Fig. 1 is a schematic cross-sectional view of a first embodiment of a transceiver module 1 according to the invention.
  • the transceiver module 1 comprises a substrate 2 with a ground plane 3 located in the substrate 2.
  • active devices i.e. transmitter/receiver devices 4 are mounted on the substrate 2 and are connected to the ground plane 3 by means of conductors 5 extending through the substrate 2 down to the ground plane 3.
  • the transmitter/receiver devices 4 are encapsulated in an epoxy layer 6 onto which an antenna element 7 is fixed by means of a layer 8 of an adhesive.
  • the antenna element 7 comprises planar radiating elements 9 of copper on a plastic film 10 fixed with the adhesive layer 8 on top of the epoxy layer 6.
  • Preferred types of antennas are either a PIFA (Planar Inverted F Antenna) or a patch antenna, e.g. a DCL- FSS (DC Inductive Frequency Selective Surface) shorted patch antenna from e-tenna Corporation, San Diego, CA, U.S.A.
  • the epoxy layer 6 that preferably is formed of a syntactic foam epoxy forms a rigid dielectric core for the antenna element 7.
  • a syntactic foam epoxy is comprised of miniature air filled glass spheres and only 3 - 6 % epoxy. This type of material has a dielectric constant of 1.22.
  • a dielectric constant ⁇ 1.25 is critical to antenna efficiency.
  • the antenna element 7, i.e. the plastic film 10 with the radiating elements 9 is preferably bonded to the epoxy layer 6 with an acrylic PSA (Pressure Sensitive Adhesive).
  • PSA Pressure Sensitive Adhesive
  • Other types of adhesives in liquid form may be used but acrylic is preferred for ease of assembly, high temperature resistance, and its ability to bond to low energy surfaces such as the glass sphere filled syntactic foam epoxy.
  • the ground plane of the antenna element 7 is formed by the ground plane 3 of the substrate 2.
  • an electrical interconnection between the antenna element 7, i.e. the radiating elements 9, and the ground plane 3 is made directly by means of a conductor 11 that extends from the radiating elements 9 through the adhesive layer 8, the epoxy layer 6 and part of the substrate 2 down to the ground plane 3.
  • Fig. 2 is a schematic cross-sectional view of a second embodiment of a transceiver module 1 ' according to the invention. It is to be understood that the dimensions of the module 1 ' are not to scale.
  • the transceiver module 1 ' in Fig. 2 comprises a substrate 2 with a ground plane 3 located in the substrate 2.
  • Transmitter/receiver devices 4 are mounted on the substrate 2 and are connected to the ground plane 3 by means of conductors 5 extending through the substrate 2 down to the ground plane 3. Also, the transmitter/receiver devices 4 are encapsulated in an epoxy layer 6.
  • an antenna element 7' i.e. a plastic film 10' with radiating elements 9, is fixed by means of a layer 8' of an adhesive to the top of the epoxy layer 6 in the same manner as in Fig. 1.
  • the electrical interconnection between the radiating elements 9 and the ground plane 3 and the transmitter/receiver devices 4 is not made directly through the adhesive layer 8', the epoxy layer 6 and part of the substrate 2 down to the ground plane 3 as in Fig. 1.
  • the plastic film 10' is extended and the extension 13 is provided with conductors 14 for electrical interconnection between the radiating elements 9 and the ground plane 3 and the transmitter/receiver devices 4.
  • the plastic film extension 13 is double sided i.e. the conductors 14 are embedded in the plastic film.
  • the adhesive layer 8' is also extended to fix the extension 13 of the plastic film with the conductors 14 also to one edge of the epoxy layer 6 and the substrate 2 as well as to the underside of the substrate 2.
  • the conductors 14 are interconnected with the ground plane 3 and the transmitter/receiver devices 4 via conductors 15 and 16, respectively, through the substrate 2.
  • the conductors 16 pass through the ground plane 3.
  • the plastic film extension 13 on the underside of the substrate 2 has to be provided with holes.
  • Fig. 3 is a schematic cross-sectional view of a third embodiment of a transceiver module 1 ' ' according to the invention.
  • the transceiver module 1 " in Fig. 3 is mounted on a multi-layer PCB (Printed Circuit Board) 17 having surface pads 18, 19, 20 and 21.
  • the PCB 17 has inner conductors 22 and 23 that interconnect the surface pads 18, 21 and 19, 20, respectively.
  • the plastic film extension 13 with the conductors 14 for electrical interconnection between the radiating elements 9 and the ground plane 3 and the transmitter/receiver devices 4, respectively, does not extend on the whole underside of the substrate 2 but is shortened.
  • the conductor for electrical interconnection between the radiating elements 9 and the ground plane 3 is interconnected with the ground plane 3 via surface pad 18, inner conductor 22, surface pad 21 and conductor 15".
  • the conductor for electrical interconnection between the radiating elements 9 and the transmitter/receiver devices 4 is interconnected with the transmitter/receiver devices 4 via surface pad 19, inner conductor 23, surface pad 20 and conductor 16" that passes through the substrate 2 and the ground plane 3.
  • the plastic film 10' in Fig. 3 can be single sided, i.e. the conductors 14 are not embedded in the plastic film but are exposed on the plastic film.

Abstract

A radio transceiver module comprises on a substrate (2) having a ground plane (3), an antenna connected to transmitter/receiver devices (4) on the substrate (2) and to the ground plane (3). The antenna (7, 7') comprises a dielectric core in the form of an epoxy layer (6) encapsulating the transmitter/receiver devices (4), and planar radiating elements (9) on a plastic film (10, 10') that is fixed on top of the epoxy layer (6). The ground plane of the antenna (7, 7') is formed by the ground plane (3) of the substrate (2)

Description

A RADIO TRANSCEIVER MODULE
TECHNICAL FIELD
The invention relates generally to radio transceiver modules and more specifically to miniaturization of antennas for such modules.
BACKGROUND OF THE INVENTION
Attempts to integrate antennas directly on top of transceiver modules have been made.
However, placing an antenna at a distance of 2 - 3 mm above the ground plane of a module, e.g. a Multi-Chip Module (MCM), typically results in an efficiency of less than 10 %. At such low efficiency, the reflected power ratio will be so high that bandwidth will be limited and required impedance matching circuits to the antenna result in increased circuit complexity and transmission losses.
Another effect of placing an antenna directly on the module surface is the loss of efficiency due to the organic encapsulant used to protect the active components of the module, e.g. the transmitter/receiver devices. Organic encapsulants used in electronic packages commonly have a dielectric constant > 3.0. Such a high dielectric constant reduces the efficiency of preferred antenna types used in low profile applications, i.e. building heights of 2.0 mm or less above the surface of the substrate of the module. Preferred antenna types are e.g. a PIFA (Planar Inverted F Antenna) or a patch antenna that both work most efficiently with a dielectric constant approaching a value of 1.0.
SUMMARY OF THE INVENTION
The object of the invention is to overcome the difficulties encountered with conventional solutions yet stay within the size constraints of standard packaging heights.
This is attained in that, in a radio transceiver module that comprises on a substrate having a ground plane, an antenna connected to transmitter/receiver devices on the substrate and to the ground plane, in accordance with the invention the antenna comprises a dielectric core in the form of an epoxy layer encapsulating the transmitter/receiver devices, and planar radiating elements on a plastic film fixed on top of the epoxy layer, while the ground plane of the antenna is formed by the ground plane of the substrate.
BRIEF DESCRIPTION OF THE DRAWING
The invention will be described more in detail below with reference to the appended drawing on which Fig. 1 is a schematic cross-sectional view of a first embodiment of a transceiver module according to the invention, Fig. 2 is a schematic cross-sectional view of a second embodiment of the transceiver module according to the invention, and Fig. 3 is a schematic cross-sectional view of a third embodiment of the transceiver module according to the invention.
DESCRIPTION OF THE INVENTION
Fig. 1 is a schematic cross-sectional view of a first embodiment of a transceiver module 1 according to the invention.
It is to be understood that the dimensions of the module 1 are not to scale.
In the embodiment shown in Fig. 1, the transceiver module 1 comprises a substrate 2 with a ground plane 3 located in the substrate 2.
In a manner known per se, active devices, i.e. transmitter/receiver devices 4 are mounted on the substrate 2 and are connected to the ground plane 3 by means of conductors 5 extending through the substrate 2 down to the ground plane 3.
In accordance with the invention, the transmitter/receiver devices 4 are encapsulated in an epoxy layer 6 onto which an antenna element 7 is fixed by means of a layer 8 of an adhesive.
The antenna element 7 comprises planar radiating elements 9 of copper on a plastic film 10 fixed with the adhesive layer 8 on top of the epoxy layer 6. Preferred types of antennas are either a PIFA (Planar Inverted F Antenna) or a patch antenna, e.g. a DCL- FSS (DC Inductive Frequency Selective Surface) shorted patch antenna from e-tenna Corporation, San Diego, CA, U.S.A.
The epoxy layer 6 that preferably is formed of a syntactic foam epoxy forms a rigid dielectric core for the antenna element 7. A syntactic foam epoxy is comprised of miniature air filled glass spheres and only 3 - 6 % epoxy. This type of material has a dielectric constant of 1.22. A dielectric constant < 1.25 is critical to antenna efficiency.
The antenna element 7, i.e. the plastic film 10 with the radiating elements 9 is preferably bonded to the epoxy layer 6 with an acrylic PSA (Pressure Sensitive Adhesive). Other types of adhesives in liquid form may be used but acrylic is preferred for ease of assembly, high temperature resistance, and its ability to bond to low energy surfaces such as the glass sphere filled syntactic foam epoxy.
In accordance with the invention, the ground plane of the antenna element 7 is formed by the ground plane 3 of the substrate 2.
In the embodiment shown in Fig. 1, an electrical interconnection between the antenna element 7, i.e. the radiating elements 9, and the ground plane 3 is made directly by means of a conductor 11 that extends from the radiating elements 9 through the adhesive layer 8, the epoxy layer 6 and part of the substrate 2 down to the ground plane 3.
Electrical interconnections between the radiating elements 9 and the transmitter/receiver devices 4 are also made directly by means of conductors 12 that extend from the radiating elements 9 through the adhesive layer 8 and the epoxy layer 6 to the transmitter/receiver devices 4.
Fig. 2 is a schematic cross-sectional view of a second embodiment of a transceiver module 1 ' according to the invention. It is to be understood that the dimensions of the module 1 ' are not to scale.
Elements in Fig. 2 that are identical to elements in Fig. 1 have been provided with identical reference numerals.
As in Fig. 1, the transceiver module 1 ' in Fig. 2 comprises a substrate 2 with a ground plane 3 located in the substrate 2. Transmitter/receiver devices 4 are mounted on the substrate 2 and are connected to the ground plane 3 by means of conductors 5 extending through the substrate 2 down to the ground plane 3. Also, the transmitter/receiver devices 4 are encapsulated in an epoxy layer 6.
In the embodiment in Fig. 2, an antenna element 7', i.e. a plastic film 10' with radiating elements 9, is fixed by means of a layer 8' of an adhesive to the top of the epoxy layer 6 in the same manner as in Fig. 1.
However, in the embodiment in Fig. 2, the electrical interconnection between the radiating elements 9 and the ground plane 3 and the transmitter/receiver devices 4 is not made directly through the adhesive layer 8', the epoxy layer 6 and part of the substrate 2 down to the ground plane 3 as in Fig. 1.
Instead, the plastic film 10' is extended and the extension 13 is provided with conductors 14 for electrical interconnection between the radiating elements 9 and the ground plane 3 and the transmitter/receiver devices 4.
In the embodiment in Fig. 2, the plastic film extension 13 is double sided i.e. the conductors 14 are embedded in the plastic film.
The adhesive layer 8' is also extended to fix the extension 13 of the plastic film with the conductors 14 also to one edge of the epoxy layer 6 and the substrate 2 as well as to the underside of the substrate 2. There, the conductors 14 are interconnected with the ground plane 3 and the transmitter/receiver devices 4 via conductors 15 and 16, respectively, through the substrate 2. The conductors 16 pass through the ground plane 3.
For interconnection of the module 1 ' to e.g. a printed circuit board, the plastic film extension 13 on the underside of the substrate 2 has to be provided with holes.
Fig. 3 is a schematic cross-sectional view of a third embodiment of a transceiver module 1 ' ' according to the invention.
It is to be understood that the dimensions of the module 1 " are not to scale.
Elements in Fig. 3 that are identical to elements in Figs. 1 and 2 have been provided with identical reference numerals.
The transceiver module 1 " in Fig. 3 is mounted on a multi-layer PCB (Printed Circuit Board) 17 having surface pads 18, 19, 20 and 21. The PCB 17 has inner conductors 22 and 23 that interconnect the surface pads 18, 21 and 19, 20, respectively.
In the embodiment in Fig. 3, the plastic film extension 13 with the conductors 14 for electrical interconnection between the radiating elements 9 and the ground plane 3 and the transmitter/receiver devices 4, respectively, does not extend on the whole underside of the substrate 2 but is shortened. The conductor for electrical interconnection between the radiating elements 9 and the ground plane 3 is interconnected with the ground plane 3 via surface pad 18, inner conductor 22, surface pad 21 and conductor 15". The conductor for electrical interconnection between the radiating elements 9 and the transmitter/receiver devices 4 is interconnected with the transmitter/receiver devices 4 via surface pad 19, inner conductor 23, surface pad 20 and conductor 16" that passes through the substrate 2 and the ground plane 3. In an alternative embodiment (not shown), the plastic film 10' in Fig. 3 can be single sided, i.e. the conductors 14 are not embedded in the plastic film but are exposed on the plastic film.

Claims

1. A radio transceiver module comprising on a substrate (2) having a ground plane (3), an antenna connected to transmitter/receiver devices (4) on the substrate (2) and to the ground plane (3), characterized in that the antenna (7, 7') comprises a dielectric core in the form of an epoxy layer (6) encapsulating the transmitter/receiver devices (4), and planar radiating elements (9) on a plastic film (10, 10') fixed on top of the epoxy layer (6), the ground plane of the antenna (7, 7') being formed by the ground plane (3) of the substrate (2).
2. The module according to claim 1, characterized in that the epoxy layer (6) has a dielectric constant < 1.25.
3. The module according to claim 1 or 2, characterized in that the epoxy is syntactic foam epoxy.
4. The module according to claim 1, 2 or 3, characterized in that the plastic film (10, 10') with the planar radiating elements (9) is fixed to the epoxy layer (6) by a layer (8) of pressure sensitive acrylic adhesive.
PCT/SE2003/000293 2002-02-27 2003-02-24 A radio transceiver module WO2003073554A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003206574A AU2003206574A1 (en) 2002-02-27 2003-02-24 A radio transceiver module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0200604A SE522052C2 (en) 2002-02-27 2002-02-27 Radio transceiver module including an antenna
SE0200604-7 2002-02-27

Publications (1)

Publication Number Publication Date
WO2003073554A1 true WO2003073554A1 (en) 2003-09-04

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ID=20287115

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PCT/SE2003/000293 WO2003073554A1 (en) 2002-02-27 2003-02-24 A radio transceiver module

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AU (1) AU2003206574A1 (en)
SE (1) SE522052C2 (en)
WO (1) WO2003073554A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1035663C2 (en) * 2008-07-04 2010-01-05 Thales Nederland Bv A method for manufacturing a three-dimensional multi-layered (multi-layer) interconnection facility.

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6147604A (en) * 1998-10-15 2000-11-14 Intermec Ip Corporation Wireless memory device
EP1055943A2 (en) * 1999-05-24 2000-11-29 Hitachi, Ltd. A wireless tag, its manufacturing and its layout
US6239752B1 (en) * 1995-02-28 2001-05-29 Stmicroelectronics, Inc. Semiconductor chip package that is also an antenna
US6288679B1 (en) * 2000-05-31 2001-09-11 Lucent Technologies Inc. Single element antenna structure with high isolation
US6326927B1 (en) * 1999-07-21 2001-12-04 Range Star Wireless, Inc. Capacitively-tuned broadband antenna structure
WO2002027862A1 (en) * 2000-09-27 2002-04-04 Rangestar Wireless, Inc. Omni directional antenna with multiple polarizations

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239752B1 (en) * 1995-02-28 2001-05-29 Stmicroelectronics, Inc. Semiconductor chip package that is also an antenna
US6147604A (en) * 1998-10-15 2000-11-14 Intermec Ip Corporation Wireless memory device
EP1055943A2 (en) * 1999-05-24 2000-11-29 Hitachi, Ltd. A wireless tag, its manufacturing and its layout
US6326927B1 (en) * 1999-07-21 2001-12-04 Range Star Wireless, Inc. Capacitively-tuned broadband antenna structure
US6288679B1 (en) * 2000-05-31 2001-09-11 Lucent Technologies Inc. Single element antenna structure with high isolation
WO2002027862A1 (en) * 2000-09-27 2002-04-04 Rangestar Wireless, Inc. Omni directional antenna with multiple polarizations

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1035663C2 (en) * 2008-07-04 2010-01-05 Thales Nederland Bv A method for manufacturing a three-dimensional multi-layered (multi-layer) interconnection facility.

Also Published As

Publication number Publication date
AU2003206574A1 (en) 2003-09-09
SE522052C2 (en) 2004-01-07
SE0200604D0 (en) 2002-02-27
SE0200604L (en) 2003-08-28

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