WO2003085471A3 - Heat dissipation system for audio amplifier - Google Patents

Heat dissipation system for audio amplifier Download PDF

Info

Publication number
WO2003085471A3
WO2003085471A3 PCT/US2003/010062 US0310062W WO03085471A3 WO 2003085471 A3 WO2003085471 A3 WO 2003085471A3 US 0310062 W US0310062 W US 0310062W WO 03085471 A3 WO03085471 A3 WO 03085471A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
audio amplifier
housing
dissipation system
apertures
Prior art date
Application number
PCT/US2003/010062
Other languages
French (fr)
Other versions
WO2003085471A2 (en
Inventor
David W Seaton
Mark H Powell
Jason R Taylor
Eric Mendenhall
Original Assignee
Gibson Guitar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gibson Guitar Corp filed Critical Gibson Guitar Corp
Priority to AU2003226198A priority Critical patent/AU2003226198A1/en
Publication of WO2003085471A2 publication Critical patent/WO2003085471A2/en
Publication of WO2003085471A3 publication Critical patent/WO2003085471A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

A heat dissipation system for an audio amplifier (10) is presented, including a housing (12) having a plurality of apertures therein; at least one completely enclosed air tunnels (40), each air tunnel extendingbetween one of the apertures (42) in the housing and another of the apertures (44) in the housing, each air tunnel at least partially defined by a pair of opposed heat sinks (34A and 34B) mounted within the housing.
PCT/US2003/010062 2002-04-04 2003-04-02 Heat dissipation system for audio amplifier WO2003085471A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003226198A AU2003226198A1 (en) 2002-04-04 2003-04-02 Heat dissipation system for audio amplifier

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US36973302P 2002-04-04 2002-04-04
US60/369,733 2002-04-04
US10/405,983 2003-04-01
US10/405,983 US6853553B2 (en) 2002-04-04 2003-04-01 Heat dissipation system for audio amplifier

Publications (2)

Publication Number Publication Date
WO2003085471A2 WO2003085471A2 (en) 2003-10-16
WO2003085471A3 true WO2003085471A3 (en) 2003-12-11

Family

ID=28794374

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/010062 WO2003085471A2 (en) 2002-04-04 2003-04-02 Heat dissipation system for audio amplifier

Country Status (3)

Country Link
US (1) US6853553B2 (en)
AU (1) AU2003226198A1 (en)
WO (1) WO2003085471A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3983496B2 (en) * 2001-04-25 2007-09-26 富士通株式会社 Transmission amplification unit for wireless communication device
KR100669371B1 (en) * 2004-01-29 2007-01-15 삼성에스디아이 주식회사 Plasma display device
JP4579081B2 (en) * 2005-07-29 2010-11-10 本田技研工業株式会社 Audio device arrangement structure for motorcycles
US7463485B1 (en) * 2005-10-28 2008-12-09 Yamaichi Electronics U.S.A., Inc. Circuit board housing and circuit board assembly
ATE548892T1 (en) * 2007-01-11 2012-03-15 Harman Becker Automotive Sys COOLING SYSTEM FOR AN ELECTRONIC DEVICE
US8130495B2 (en) * 2009-09-30 2012-03-06 Kmc Music, Inc. Audio amplifier in compact case with peak voltage and current limiting circuit and thermal cooling tunnel
JP5730700B2 (en) * 2011-07-25 2015-06-10 新電元工業株式会社 Power conditioner device and photovoltaic power generation system
TWI456854B (en) * 2011-12-14 2014-10-11 Timotion Technology Co Ltd Power supply module of linear actuator and conversion module thereof
TWI486747B (en) * 2012-03-28 2015-06-01 Wistron Corp Computer system
US9385064B2 (en) 2014-04-28 2016-07-05 Freescale Semiconductor, Inc. Heat sink having a through-opening
CN112087893B (en) * 2019-06-14 2021-08-24 杭州海康威视数字技术股份有限公司 Interference unit
AU2022255065A1 (en) * 2021-04-08 2023-10-12 Kuori Oy Cross flow heat transfer apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5946188A (en) * 1998-07-29 1999-08-31 Epsilon Electronics, Inc. Car amplifier incorporating a peltier device for cooling
US6034871A (en) * 1999-04-27 2000-03-07 Auras Technology Ltd. Heat dissipation cassette for a notebook personal computer
US6244953B1 (en) * 1999-05-25 2001-06-12 3Com Corporation Electronic device fan mounting system

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778551A (en) * 1969-01-17 1973-12-11 Chicago Musical Instr Co Air cooled audio amplifier assembly
US3909679A (en) * 1974-11-07 1975-09-30 Rock Ola Mfg Corp Cabinet and heat sink for amplifier components
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
US4811403A (en) * 1987-06-10 1989-03-07 U.S. Sound, Inc. Ultralight loudspeaker enclosures
JPS6474798A (en) * 1987-09-16 1989-03-20 Nec Corp Integrated type power amplifier
US5132780A (en) 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
US5000079A (en) 1990-05-17 1991-03-19 Mardis Michael C Noise-attenuating ventilation pedestal for an electronic enclosure
EP0655881A1 (en) 1993-11-26 1995-05-31 Siemens Aktiengesellschaft Casing
US5482109A (en) 1994-03-15 1996-01-09 E-Systems, Inc. Modular heat exchanger
US5481433A (en) 1994-07-01 1996-01-02 Chrysler Corporation Heat dissipation from high power semiconductors in an electrical vehicle
US5514036A (en) 1994-08-09 1996-05-07 Macase Of Georgia, Inc. Disk drive within a cabinet, with a filter element structure
US5689403A (en) * 1994-12-27 1997-11-18 Motorola, Inc. Intercooled electronic device
US5533132A (en) * 1995-01-23 1996-07-02 Jbl Incorporated Loudspeaker thermal management structure
EP0893042A1 (en) 1996-04-10 1999-01-27 Intergraph Corporation Removable circuit board with ducted cooling
EP0810511B1 (en) 1996-05-14 2003-11-12 Hewlett-Packard Company, A Delaware Corporation Component cooling arrangement in electronic equipment with internal power supply
US5704212A (en) 1996-09-13 1998-01-06 Itronix Corporation Active cooling system for cradle of portable electronic devices
US5828549A (en) 1996-10-08 1998-10-27 Dell U.S.A., L.P. Combination heat sink and air duct for cooling processors with a series air flow
US6021042A (en) 1997-08-06 2000-02-01 Intel Corporation Cooling duct for a computer cooling system with redundant air moving units
US5871396A (en) 1997-08-12 1999-02-16 Shen; Tsan Jung Convection type heat dissipation device for computers that is adjustable with respect to a heat source
US6069792A (en) 1997-09-16 2000-05-30 Nelik; Jacob Computer component cooling assembly
JP2000012751A (en) 1998-06-24 2000-01-14 Nippon Densan Corp Cooling fan device
US6134107A (en) 1998-10-19 2000-10-17 International Business Machines Corporation Reverse convective airflow cooling of computer enclosure
US6075697A (en) 1998-10-19 2000-06-13 International Business Machines Corporation Use of pressurized enclosure for impingement cooling of electronic component
US6317319B1 (en) 2000-07-26 2001-11-13 Compaq Computer Corporation Low-profile cooling assembly for the CPU chip of a computer or the like
TW484721U (en) * 2000-11-06 2002-04-21 Giga Byte Tech Co Ltd Improved airflow guiding structure of server

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5946188A (en) * 1998-07-29 1999-08-31 Epsilon Electronics, Inc. Car amplifier incorporating a peltier device for cooling
US6034871A (en) * 1999-04-27 2000-03-07 Auras Technology Ltd. Heat dissipation cassette for a notebook personal computer
US6244953B1 (en) * 1999-05-25 2001-06-12 3Com Corporation Electronic device fan mounting system

Also Published As

Publication number Publication date
US6853553B2 (en) 2005-02-08
AU2003226198A1 (en) 2003-10-20
AU2003226198A8 (en) 2003-10-20
WO2003085471A2 (en) 2003-10-16
US20040036563A1 (en) 2004-02-26

Similar Documents

Publication Publication Date Title
WO2003085471A3 (en) Heat dissipation system for audio amplifier
WO2005060309A3 (en) Thermal management methods and apparatus for lighting devices
HK1021594A1 (en) High-frequency power amplifier circuit and high-frequency power amplifier module.
AU2002328419A1 (en) Semiconductor circuit device, packet processing method, management system, management method, and packet processing method
WO2003067383A3 (en) Services processor having a packet editing unit
DE60218781D1 (en) Operational amplifier circuit, driver circuit and method
DK1256188T3 (en) Access channel structure for wireless communication system
ATE333254T1 (en) UNIVERSAL TIBIAL BLOCK
AU2003260875A1 (en) Sound reproduction system, program and data carrier
ITBO980656A0 (en) FOOTWEAR WITH ACTIVE AIR CONDITIONING DEVICE.
AU2001244659A1 (en) Power amplifier module
EP1312091B8 (en) Memory device and method having data path with multiple prefetch i/o configurations
DE602004016339D1 (en)
DE69911545D1 (en) BASS-REFLEX SPEAKER SYSTEM
GB2408820A (en) Limit interface for performance management
WO2003096032A3 (en) Current source evaluation sense-amplifier
KR20040081807A (en) Method and apparatus for data transmission using variable packet lengths
WO2004057443A8 (en) Optimizing authentication service availability and responsiveness via client-side routing
DE60302631T8 (en) Encryption code setting system, access node, encryption code setting method and authentication code setting system
WO2005031986A3 (en) Audio accessory optimization system
WO2001057986A3 (en) Bulb cooling
EP1306971A4 (en) Base bias circuit, and power amplifier using the base bias circuit
ATE439734T1 (en) APARTMENT STATION FOR A DOOR COMMUNICATION SYSTEM
SE9902409D0 (en) Compact cabling mount
ATE333737T1 (en) ACCESS POINT WITH COMBINED RADIO STANDARDS

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP