WO2003107440A3 - Opteolectronic devices - Google Patents

Opteolectronic devices Download PDF

Info

Publication number
WO2003107440A3
WO2003107440A3 PCT/GB2003/002431 GB0302431W WO03107440A3 WO 2003107440 A3 WO2003107440 A3 WO 2003107440A3 GB 0302431 W GB0302431 W GB 0302431W WO 03107440 A3 WO03107440 A3 WO 03107440A3
Authority
WO
WIPO (PCT)
Prior art keywords
pipe
heat pipe
heat
transport
optical fibres
Prior art date
Application number
PCT/GB2003/002431
Other languages
French (fr)
Other versions
WO2003107440A2 (en
Inventor
Kenneth Board
Gareth Peter Evans
Gareth Jones
Original Assignee
Enfis Ltd
Kenneth Board
Gareth Peter Evans
Gareth Jones
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enfis Ltd, Kenneth Board, Gareth Peter Evans, Gareth Jones filed Critical Enfis Ltd
Priority to EP03730348A priority Critical patent/EP1516371A2/en
Priority to US10/517,907 priority patent/US20060196651A1/en
Priority to AU2003241030A priority patent/AU2003241030A1/en
Publication of WO2003107440A2 publication Critical patent/WO2003107440A2/en
Publication of WO2003107440A3 publication Critical patent/WO2003107440A3/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/648Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

A light emitting semiconductor device (10) mounted on a heat sink (16) and having a heat pipe (18) located on its upper surface (12). The heat pipe (18) comprises a sealed cylindrical member of transparent or translucent material having a wick (20) disposed down the side and along the bottom thereof. The heat (18) is partially filled with a liquid which is placed under a partial vacuum to reduce its boiling point. A bundle of optical fibres may be provided within the heat pipe (18), with the gaps created between the optical fibres providing an efficient capillary action within the heat pipe (18) for transport of vapour to the cool end of the pipe (18) and for transport of condensed coolant to the hot end of the pipe (18).
PCT/GB2003/002431 2002-06-13 2003-06-05 Opteolectronic devices WO2003107440A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03730348A EP1516371A2 (en) 2002-06-13 2003-06-05 Optoelectronic device comprising a heat pipe
US10/517,907 US20060196651A1 (en) 2002-06-13 2003-06-05 Opteolectronic devices
AU2003241030A AU2003241030A1 (en) 2002-06-13 2003-06-05 Opteolectronic devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0213504A GB2389706A (en) 2002-06-13 2002-06-13 Optoelectronic devices
GB0213504.4 2002-06-13

Publications (2)

Publication Number Publication Date
WO2003107440A2 WO2003107440A2 (en) 2003-12-24
WO2003107440A3 true WO2003107440A3 (en) 2004-08-05

Family

ID=9938450

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2003/002431 WO2003107440A2 (en) 2002-06-13 2003-06-05 Opteolectronic devices

Country Status (5)

Country Link
US (1) US20060196651A1 (en)
EP (1) EP1516371A2 (en)
AU (1) AU2003241030A1 (en)
GB (1) GB2389706A (en)
WO (1) WO2003107440A2 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004011848A2 (en) 2002-07-25 2004-02-05 Dahm Jonathan S Method and apparatus for using light emitting diodes for curing
JP5179875B2 (en) * 2004-09-15 2013-04-10 ソウル セミコンダクター カンパニー リミテッド LIGHT EMITTING ELEMENT HAVING HEAT PIPE AND METHOD FOR PRODUCING HEAT PIPE LEAD FOR LIGHT EMITTING ELEMENT
US8109981B2 (en) 2005-01-25 2012-02-07 Valam Corporation Optical therapies and devices
EP1952198A2 (en) 2005-11-08 2008-08-06 Garrett J Young Apparatus and method for generating light from milti-primary colors
ES2553167T3 (en) 2006-07-28 2015-12-04 Koninklijke Philips N.V. Lighting module with similar heat and light propagation directions
WO2009007905A2 (en) * 2007-07-11 2009-01-15 Koninklijke Philips Electronics N.V. Heat pipe
DE102007041852A1 (en) * 2007-09-03 2009-03-05 Osram Opto Semiconductors Gmbh High power LED module, has semicircular hollow portion extending into transparent carrier on side of LED and having evaporable cooling agent, and electrode structures provided in transparent carrier
US8827498B2 (en) * 2008-09-30 2014-09-09 Osram Sylvania Inc. LED light source having glass heat pipe with fiberglass wick
CN101813429B (en) * 2009-02-20 2013-01-23 富瑞精密组件(昆山)有限公司 Manufacturing method of heat pipe
EP2414875A1 (en) * 2009-03-31 2012-02-08 Koninklijke Philips Electronics N.V. Led collimation optics module providing an isolation fitting
US8378559B2 (en) * 2009-08-20 2013-02-19 Progressive Cooling Solutions, Inc. LED bulb for high intensity discharge bulb replacement
EP2480828A2 (en) 2009-09-25 2012-08-01 Cree, Inc. Lighting device having heat dissipation element
KR20110106169A (en) * 2010-03-22 2011-09-28 삼성전자주식회사 Light source module and display apparatus having the same
US8746975B2 (en) 2011-02-17 2014-06-10 Media Lario S.R.L. Thermal management systems, assemblies and methods for grazing incidence collectors for EUV lithography
US8731139B2 (en) 2011-05-04 2014-05-20 Media Lario S.R.L. Evaporative thermal management of grazing incidence collectors for EUV lithography
GB2514552A (en) 2013-05-28 2014-12-03 Ibm Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network
GB2514551A (en) * 2013-05-28 2014-12-03 Ibm Fluid-cooled electronic circuit device with cooling fluid conduits having optical transmission medium
FR3054292B1 (en) * 2016-07-22 2019-04-05 Valeo Vision LIGHT MODULE OF LAND VEHICLE
US10877217B2 (en) 2017-01-06 2020-12-29 Rockley Photonics Limited Copackaging of asic and silicon photonics
CN110799874A (en) 2017-08-01 2020-02-14 洛克利光子有限公司 Module with transmitting and receiving optical subassemblies
DE102020112591A1 (en) 2020-05-08 2021-11-11 Airbus S.A.S. COOLING DEVICE FOR USE IN MAGNETIC ALTERNATING FIELDS, COIL ARRANGEMENT, ELECTRIC MACHINE AND AIRPLANE

Citations (14)

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Publication number Priority date Publication date Assignee Title
FR1428845A (en) * 1965-03-22 1966-02-18 Thomson Houston Comp Francaise Improvements to systems to generate coherent radiation
GB1216090A (en) * 1966-12-28 1970-12-16 Philips Electronic Associated Semiconductor devices
GB1295775A (en) * 1969-04-01 1972-11-08
US3825741A (en) * 1973-03-05 1974-07-23 Tinsley Labor Inc Light source with high efficiency light collection means
US3860847A (en) * 1973-04-17 1975-01-14 Los Angeles Miniature Products Hermetically sealed solid state lamp
JPS5546589A (en) * 1978-09-29 1980-04-01 Fujitsu Ltd Cooled photoelectric converter
SU1035400A1 (en) * 1982-01-08 1983-08-15 Предприятие П/Я В-2572 Transphoton heat pipe and its operation method
JPS60153188A (en) * 1984-01-21 1985-08-12 Toshiaki Shinmura Semiconductor laser output device utilizing heat pipe
EP0435473A2 (en) * 1989-12-29 1991-07-03 Digital Equipment Corporation Evaporator having etched fiber nucleation sites and method of fabricating same
EP0658933A2 (en) * 1993-12-16 1995-06-21 Sharp Kabushiki Kaisha Semiconductor devices and method for manufacturing the same
EP0789405A2 (en) * 1996-02-07 1997-08-13 Toyota Jidosha Kabushiki Kaisha Method of cooling solar cells
WO1999016136A1 (en) * 1997-09-25 1999-04-01 University Of Bristol Optical irradiation device
JP2001036153A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source device
US20030052584A1 (en) * 2001-09-17 2003-03-20 Nobuyuki Matsui Lighting apparatus with enhanced capability of removing heat

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US3543841A (en) * 1967-10-19 1970-12-01 Rca Corp Heat exchanger for high voltage electronic devices
JPS57141986A (en) * 1981-02-25 1982-09-02 Fujitsu Ltd Cooling method for semiconductor laser
JPS57200003A (en) * 1981-06-03 1982-12-08 Sumitomo Electric Ind Ltd Optical fiber observing device
DE3480294D1 (en) * 1984-11-15 1989-11-30 Japan Traffic Manage Tech Ass Signal light unit having heat dissipating function
JPH05243441A (en) * 1992-03-03 1993-09-21 Ito Gijutsu Kenkiyuushitsu:Kk Heat dissipating device
US5852339A (en) * 1997-06-18 1998-12-22 Northrop Grumman Corporation Affordable electrodeless lighting
US6200134B1 (en) * 1998-01-20 2001-03-13 Kerr Corporation Apparatus and method for curing materials with radiation

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1428845A (en) * 1965-03-22 1966-02-18 Thomson Houston Comp Francaise Improvements to systems to generate coherent radiation
GB1216090A (en) * 1966-12-28 1970-12-16 Philips Electronic Associated Semiconductor devices
GB1295775A (en) * 1969-04-01 1972-11-08
US3825741A (en) * 1973-03-05 1974-07-23 Tinsley Labor Inc Light source with high efficiency light collection means
US3860847A (en) * 1973-04-17 1975-01-14 Los Angeles Miniature Products Hermetically sealed solid state lamp
JPS5546589A (en) * 1978-09-29 1980-04-01 Fujitsu Ltd Cooled photoelectric converter
SU1035400A1 (en) * 1982-01-08 1983-08-15 Предприятие П/Я В-2572 Transphoton heat pipe and its operation method
JPS60153188A (en) * 1984-01-21 1985-08-12 Toshiaki Shinmura Semiconductor laser output device utilizing heat pipe
EP0435473A2 (en) * 1989-12-29 1991-07-03 Digital Equipment Corporation Evaporator having etched fiber nucleation sites and method of fabricating same
EP0658933A2 (en) * 1993-12-16 1995-06-21 Sharp Kabushiki Kaisha Semiconductor devices and method for manufacturing the same
EP0789405A2 (en) * 1996-02-07 1997-08-13 Toyota Jidosha Kabushiki Kaisha Method of cooling solar cells
WO1999016136A1 (en) * 1997-09-25 1999-04-01 University Of Bristol Optical irradiation device
JP2001036153A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source device
US20030052584A1 (en) * 2001-09-17 2003-03-20 Nobuyuki Matsui Lighting apparatus with enhanced capability of removing heat

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 198420, Derwent World Patents Index; Class J08, AN 1984-125544, XP002279226 *
PATENT ABSTRACTS OF JAPAN vol. 004, no. 079 (E - 014) 7 June 1980 (1980-06-07) *
PATENT ABSTRACTS OF JAPAN vol. 009, no. 321 (E - 367) 17 December 1985 (1985-12-17) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 19 5 June 2001 (2001-06-05) *

Also Published As

Publication number Publication date
AU2003241030A8 (en) 2003-12-31
WO2003107440A2 (en) 2003-12-24
US20060196651A1 (en) 2006-09-07
AU2003241030A1 (en) 2003-12-31
GB2389706A (en) 2003-12-17
EP1516371A2 (en) 2005-03-23
GB0213504D0 (en) 2002-07-24

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