WO2004003916A1 - Memory buffer arrangement - Google Patents
Memory buffer arrangement Download PDFInfo
- Publication number
- WO2004003916A1 WO2004003916A1 PCT/US2003/017618 US0317618W WO2004003916A1 WO 2004003916 A1 WO2004003916 A1 WO 2004003916A1 US 0317618 W US0317618 W US 0317618W WO 2004003916 A1 WO2004003916 A1 WO 2004003916A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- memory
- memory devices
- buffer device
- leads
- buffer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
Landscapes
- Memory System (AREA)
- Dram (AREA)
- Read Only Memory (AREA)
- Vehicle Body Suspensions (AREA)
- Non-Volatile Memory (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Memory System Of A Hierarchy Structure (AREA)
- Information Transfer Systems (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN038202107A CN1679108B (en) | 2002-06-27 | 2003-05-22 | Memory buffer arrangement |
EP03731546A EP1516339B1 (en) | 2002-06-27 | 2003-05-22 | Memory buffer arrangement |
AU2003240534A AU2003240534A1 (en) | 2002-06-27 | 2003-05-22 | Memory buffer arrangement |
KR1020047021085A KR100647162B1 (en) | 2002-06-27 | 2003-05-22 | Memory buffer arrangement |
DE60308183T DE60308183T2 (en) | 2002-06-27 | 2003-05-22 | BUFFER ARRANGEMENT FOR MEMORY |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/186,357 US6639820B1 (en) | 2002-06-27 | 2002-06-27 | Memory buffer arrangement |
US10/186,357 | 2002-06-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004003916A1 true WO2004003916A1 (en) | 2004-01-08 |
Family
ID=29250181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/017618 WO2004003916A1 (en) | 2002-06-27 | 2003-05-22 | Memory buffer arrangement |
Country Status (9)
Country | Link |
---|---|
US (1) | US6639820B1 (en) |
EP (1) | EP1516339B1 (en) |
KR (1) | KR100647162B1 (en) |
CN (1) | CN1679108B (en) |
AT (1) | ATE339006T1 (en) |
AU (1) | AU2003240534A1 (en) |
DE (1) | DE60308183T2 (en) |
TW (1) | TWI290322B (en) |
WO (1) | WO2004003916A1 (en) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
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US20050010737A1 (en) * | 2000-01-05 | 2005-01-13 | Fred Ware | Configurable width buffered module having splitter elements |
US7363422B2 (en) * | 2000-01-05 | 2008-04-22 | Rambus Inc. | Configurable width buffered module |
US7356639B2 (en) * | 2000-01-05 | 2008-04-08 | Rambus Inc. | Configurable width buffered module having a bypass circuit |
US7120765B2 (en) * | 2002-10-30 | 2006-10-10 | Intel Corporation | Memory transaction ordering |
US8250295B2 (en) | 2004-01-05 | 2012-08-21 | Smart Modular Technologies, Inc. | Multi-rank memory module that emulates a memory module having a different number of ranks |
DE102004004026A1 (en) * | 2004-01-27 | 2005-08-18 | Infineon Technologies Ag | Circuitry for data storage, especially dynamic random access memory (DRAM) with flexibly arranged circuit chips for memory cell units and data transmission units, without faults in units causing total breakdown of entire circuitry |
US20060129712A1 (en) * | 2004-12-10 | 2006-06-15 | Siva Raghuram | Buffer chip for a multi-rank dual inline memory module (DIMM) |
US8386722B1 (en) | 2008-06-23 | 2013-02-26 | Google Inc. | Stacked DIMM memory interface |
US8089795B2 (en) | 2006-02-09 | 2012-01-03 | Google Inc. | Memory module with memory stack and interface with enhanced capabilities |
US8619452B2 (en) | 2005-09-02 | 2013-12-31 | Google Inc. | Methods and apparatus of stacking DRAMs |
US7472220B2 (en) | 2006-07-31 | 2008-12-30 | Metaram, Inc. | Interface circuit system and method for performing power management operations utilizing power management signals |
US8796830B1 (en) | 2006-09-01 | 2014-08-05 | Google Inc. | Stackable low-profile lead frame package |
US8327104B2 (en) | 2006-07-31 | 2012-12-04 | Google Inc. | Adjusting the timing of signals associated with a memory system |
US20060294295A1 (en) * | 2005-06-24 | 2006-12-28 | Yukio Fukuzo | DRAM chip device well-communicated with flash memory chip and multi-chip package comprising such a device |
US8335894B1 (en) | 2008-07-25 | 2012-12-18 | Google Inc. | Configurable memory system with interface circuit |
US8397013B1 (en) | 2006-10-05 | 2013-03-12 | Google Inc. | Hybrid memory module |
US8111566B1 (en) | 2007-11-16 | 2012-02-07 | Google, Inc. | Optimal channel design for memory devices for providing a high-speed memory interface |
US7386656B2 (en) | 2006-07-31 | 2008-06-10 | Metaram, Inc. | Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit |
US8055833B2 (en) | 2006-10-05 | 2011-11-08 | Google Inc. | System and method for increasing capacity, performance, and flexibility of flash storage |
US8359187B2 (en) | 2005-06-24 | 2013-01-22 | Google Inc. | Simulating a different number of memory circuit devices |
US8041881B2 (en) | 2006-07-31 | 2011-10-18 | Google Inc. | Memory device with emulated characteristics |
US9507739B2 (en) | 2005-06-24 | 2016-11-29 | Google Inc. | Configurable memory circuit system and method |
US8130560B1 (en) | 2006-11-13 | 2012-03-06 | Google Inc. | Multi-rank partial width memory modules |
US8090897B2 (en) | 2006-07-31 | 2012-01-03 | Google Inc. | System and method for simulating an aspect of a memory circuit |
US9542352B2 (en) | 2006-02-09 | 2017-01-10 | Google Inc. | System and method for reducing command scheduling constraints of memory circuits |
US8438328B2 (en) | 2008-02-21 | 2013-05-07 | Google Inc. | Emulation of abstracted DIMMs using abstracted DRAMs |
US20080082763A1 (en) | 2006-10-02 | 2008-04-03 | Metaram, Inc. | Apparatus and method for power management of memory circuits by a system or component thereof |
US8244971B2 (en) | 2006-07-31 | 2012-08-14 | Google Inc. | Memory circuit system and method |
US8081474B1 (en) | 2007-12-18 | 2011-12-20 | Google Inc. | Embossed heat spreader |
US8077535B2 (en) | 2006-07-31 | 2011-12-13 | Google Inc. | Memory refresh apparatus and method |
US10013371B2 (en) | 2005-06-24 | 2018-07-03 | Google Llc | Configurable memory circuit system and method |
US7590796B2 (en) * | 2006-07-31 | 2009-09-15 | Metaram, Inc. | System and method for power management in memory systems |
US7392338B2 (en) | 2006-07-31 | 2008-06-24 | Metaram, Inc. | Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits |
US8060774B2 (en) | 2005-06-24 | 2011-11-15 | Google Inc. | Memory systems and memory modules |
US20080028136A1 (en) | 2006-07-31 | 2008-01-31 | Schakel Keith R | Method and apparatus for refresh management of memory modules |
US9171585B2 (en) | 2005-06-24 | 2015-10-27 | Google Inc. | Configurable memory circuit system and method |
US7966446B2 (en) * | 2005-09-12 | 2011-06-21 | Samsung Electronics Co., Ltd. | Memory system and method having point-to-point link |
US7930492B2 (en) * | 2005-09-12 | 2011-04-19 | Samsung Electronics Co., Ltd. | Memory system having low power consumption |
KR100871835B1 (en) * | 2007-01-05 | 2008-12-03 | 삼성전자주식회사 | Memory system and method of signaling of the same |
US7562271B2 (en) | 2005-09-26 | 2009-07-14 | Rambus Inc. | Memory system topologies including a buffer device and an integrated circuit memory device |
US7464225B2 (en) | 2005-09-26 | 2008-12-09 | Rambus Inc. | Memory module including a plurality of integrated circuit memory devices and a plurality of buffer devices in a matrix topology |
US11328764B2 (en) | 2005-09-26 | 2022-05-10 | Rambus Inc. | Memory system topologies including a memory die stack |
US9632929B2 (en) | 2006-02-09 | 2017-04-25 | Google Inc. | Translating an address associated with a command communicated between a system and memory circuits |
US20070290333A1 (en) * | 2006-06-16 | 2007-12-20 | Intel Corporation | Chip stack with a higher power chip on the outside of the stack |
US7724589B2 (en) | 2006-07-31 | 2010-05-25 | Google Inc. | System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits |
KR100810613B1 (en) * | 2006-08-04 | 2008-03-07 | 삼성전자주식회사 | Memory module having improved discrete devices architecture |
US7761624B2 (en) * | 2006-09-28 | 2010-07-20 | Virident Systems, Inc. | Systems and apparatus for main memory with non-volatile type memory modules, and related technologies |
DE102006051514B4 (en) * | 2006-10-31 | 2010-01-21 | Qimonda Ag | Memory module and method for operating a memory module |
US20080123305A1 (en) * | 2006-11-28 | 2008-05-29 | Smart Modular Technologies, Inc. | Multi-channel memory modules for computing devices |
US8209479B2 (en) | 2007-07-18 | 2012-06-26 | Google Inc. | Memory circuit system and method |
US8080874B1 (en) | 2007-09-14 | 2011-12-20 | Google Inc. | Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween |
US8001434B1 (en) | 2008-04-14 | 2011-08-16 | Netlist, Inc. | Memory board with self-testing capability |
EP2441007A1 (en) | 2009-06-09 | 2012-04-18 | Google, Inc. | Programming of dimm termination resistance values |
KR102094393B1 (en) | 2013-11-18 | 2020-03-27 | 삼성전자주식회사 | Nonvolatile memory system and operation method thereof |
EP3837611A4 (en) * | 2018-08-14 | 2022-05-11 | Rambus Inc. | Packaged integrated device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0220460A2 (en) * | 1985-10-30 | 1987-05-06 | International Business Machines Corporation | Stacked module using standard integrated circuit chips |
EP0398188A2 (en) * | 1989-05-19 | 1990-11-22 | Compaq Computer Corporation | Modular computer memory circuit board |
US5272664A (en) * | 1993-04-21 | 1993-12-21 | Silicon Graphics, Inc. | High memory capacity DRAM SIMM |
US5434745A (en) * | 1994-07-26 | 1995-07-18 | White Microelectronics Div. Of Bowmar Instrument Corp. | Stacked silicon die carrier assembly |
WO1999030240A1 (en) * | 1997-12-05 | 1999-06-17 | Intel Corporation | Memory system including a memory module having a memory module controller |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6487102B1 (en) * | 2000-09-18 | 2002-11-26 | Intel Corporation | Memory module having buffer for isolating stacked memory devices |
US6317352B1 (en) * | 2000-09-18 | 2001-11-13 | Intel Corporation | Apparatus for implementing a buffered daisy chain connection between a memory controller and memory modules |
US6493250B2 (en) | 2000-12-28 | 2002-12-10 | Intel Corporation | Multi-tier point-to-point buffered memory interface |
US6542393B1 (en) * | 2002-04-24 | 2003-04-01 | Ma Laboratories, Inc. | Dual-bank memory module with stacked DRAM chips having a concave-shaped re-route PCB in-between |
-
2002
- 2002-06-27 US US10/186,357 patent/US6639820B1/en not_active Expired - Lifetime
-
2003
- 2003-05-22 WO PCT/US2003/017618 patent/WO2004003916A1/en active IP Right Grant
- 2003-05-22 EP EP03731546A patent/EP1516339B1/en not_active Expired - Lifetime
- 2003-05-22 AU AU2003240534A patent/AU2003240534A1/en not_active Abandoned
- 2003-05-22 CN CN038202107A patent/CN1679108B/en not_active Expired - Fee Related
- 2003-05-22 DE DE60308183T patent/DE60308183T2/en not_active Expired - Lifetime
- 2003-05-22 KR KR1020047021085A patent/KR100647162B1/en not_active IP Right Cessation
- 2003-05-22 AT AT03731546T patent/ATE339006T1/en not_active IP Right Cessation
- 2003-06-26 TW TW092117439A patent/TWI290322B/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0220460A2 (en) * | 1985-10-30 | 1987-05-06 | International Business Machines Corporation | Stacked module using standard integrated circuit chips |
EP0398188A2 (en) * | 1989-05-19 | 1990-11-22 | Compaq Computer Corporation | Modular computer memory circuit board |
US5272664A (en) * | 1993-04-21 | 1993-12-21 | Silicon Graphics, Inc. | High memory capacity DRAM SIMM |
US5434745A (en) * | 1994-07-26 | 1995-07-18 | White Microelectronics Div. Of Bowmar Instrument Corp. | Stacked silicon die carrier assembly |
WO1999030240A1 (en) * | 1997-12-05 | 1999-06-17 | Intel Corporation | Memory system including a memory module having a memory module controller |
Also Published As
Publication number | Publication date |
---|---|
TWI290322B (en) | 2007-11-21 |
CN1679108B (en) | 2011-08-17 |
ATE339006T1 (en) | 2006-09-15 |
KR20050012832A (en) | 2005-02-02 |
AU2003240534A1 (en) | 2004-01-19 |
TW200407904A (en) | 2004-05-16 |
US6639820B1 (en) | 2003-10-28 |
EP1516339B1 (en) | 2006-09-06 |
CN1679108A (en) | 2005-10-05 |
DE60308183D1 (en) | 2006-10-19 |
DE60308183T2 (en) | 2007-08-23 |
EP1516339A1 (en) | 2005-03-23 |
KR100647162B1 (en) | 2006-11-23 |
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