WO2004016056A1 - Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board - Google Patents

Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board Download PDF

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Publication number
WO2004016056A1
WO2004016056A1 PCT/PL2003/000071 PL0300071W WO2004016056A1 WO 2004016056 A1 WO2004016056 A1 WO 2004016056A1 PL 0300071 W PL0300071 W PL 0300071W WO 2004016056 A1 WO2004016056 A1 WO 2004016056A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
board
electronic elements
electronic
Prior art date
Application number
PCT/PL2003/000071
Other languages
French (fr)
Inventor
Ryszard HORBOWSKI
Original Assignee
Advanced Digital Broadcast Polska Sp. Z O.O
Advanced Digital Broadcast Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Digital Broadcast Polska Sp. Z O.O, Advanced Digital Broadcast Ltd. filed Critical Advanced Digital Broadcast Polska Sp. Z O.O
Priority to AU2003263695A priority Critical patent/AU2003263695A1/en
Publication of WO2004016056A1 publication Critical patent/WO2004016056A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a printed circuit board and electronic elements to be mounted in a printed circuit board as well as a method for mounting electronic elements in a printed circuit board, used in electrical and electronic circuits.
  • the invention seeks to provide a printed circuit board with electronic components to be mounted in a limited space.
  • the object of the invention is a printed circuit board and electronic elements for mounting in that printed circuit board.
  • the electronic elements have surfaces allowing electrical connection with conducting layers of the printed circuit of the board.
  • the printed circuit board has at least one hole, which is in principle perpendicular to the surface of the printed circuit board, and which ends at the conducting layers of the printed circuit of the board.
  • In the hole of the board at least one electronic element is mounted, having, at its terminals, surfaces allowing electrical connection with the conducting layers of the printed circuit of the board through a joining substance, which creates an electrical connection of the . electronic element and the printed circuit of the board.
  • the printed circuit board can comprise several isolating layers and each layer has its own printed circuit.
  • the printed circuit board can comprise several isolating layers between which conducting layers are situated.
  • the hole of the printed circuit board can extend through several isolating layers.
  • the cross section of the hole can have the shape of an arbitrary plain figure.
  • the cross section of the electronic element can have the shape of an arbitrary plain figure.
  • At least one end of the hole can be at least partially covered by a conducting layer of the board.
  • At least one end of the hole can be at least partially covered by a conducting layer situated between isolating layers of the board.
  • the conducting surfaces of the electronic element can be situated at its terminals.
  • the electronic element can be mounted in an isolating casing placed in the hole.
  • the isolating casing can be made of a gel substance or can be an isolating sleeve.
  • the electronic element can have a part whose diameter is larger than the diameter of the hole in which the electronic element is mounted.
  • the object of the invention is also a method for mounting electronic elements in a printed circuit board, in which a hole is made.
  • the hole extends in principle perpendicularly to the surface of the board, in which at least one electronic element is mounted that has surfaces at its terminals that allow electrical connection and which is connected through a substance conducting electrical current with the printed circuit of the board.
  • Fig. 1 shows a printed circuit board along with cylindrical electronic components
  • Fig. 2 shows a cross section of a printed circuit board with an electronic element inside
  • Fig. 3 shows a cross section of a multi-layered printed circuit board with an electronic component placed inside the isolating layer
  • Figs. 4, 5, and 6 show various methods for mounting electronic components
  • Figs. 7, 8, and 9 show various shapes of electronic components.
  • Fig. 1 shows a printed circuit board and electronic elements or components that are mounted therein.
  • a bottom conducting layer 2 of this board there is a bottom conducting layer 2, which consists of conducting paths, and a top conducting layer 3.
  • Both the conducting layers 2 and 3 can be made by sputtering, by etching the conducting material or by using conducting foils, attached by arbitrary method, for instance by gluing.
  • an electronic component 4 - connected electrically with both conducting layers 2 and 3 - is placed in the hole or the opening 5, made in the conducting layers 2, 3, and in the isolating layer 1, an electronic component 4 - connected electrically with both conducting layers 2 and 3 - is placed.
  • the electronic component 4 can be connected with conducting layers 2 and 3 by soldering, welding or by the use of an elastic conducting joining substance.
  • connection can be direct or through intermediate elements, for instance metal connector terminals attached or otherwise placed on the electronic component terminals.
  • Another electronic component 8 is placed in a partial opening 9, made only in the isolating layer 1_.
  • the electronic component 8 is connected with the top conducting layer 3 through a binding material 10 and with the path 6 of the bottom conducting layer 2 through a binding material 7.
  • the electronic element 8 is placed in the opening 9. After their application, it is soldered to them, for instance by point heating.
  • Electronic components 4 and 8 are cylindrically shaped, as are the openings where they are placed. Diameters of the openings are matched to the diameters of electronic components.
  • Fig. 2 shows a lateral cross section of the printed circuit board with an electronic component 14 connected, by its terminals, through intermediate elements 15 and 16, to a top conducting path 13 through a binding material 18, and to the bottom conducting path 12 through a binding material 19.
  • the top conducting path 13 and the bottom conducting path 12 are separated by an isolating layer 11.
  • the opening made in the top conducting layer 13 has bevel edges 17 which allow easier placement of the electronic component 14 in the opening, and its easier soldering.
  • the height of the electronic component 14, including the intermediate elements 15 and 16 is slightly greater than the sum of the thickness of the isolating layer 1_1, the top conducting path 13, and the bottom conducting path 12.
  • Fig. 3 shows a cross section of a multi-layered board with printed circuits. It is made up of several isolating layers 21., 32, and 33 as well as conducting layers 22, 23, and 3J_, placed between the isolating layers 21., 32, and 33, and on the outside of the isolating layers 21, and 32.
  • An electronic component 24 is placed inside an opening made in the first bottom layer 32 and in the second bottom layer 33 of the board.
  • the electronic component 24 has a bottom intermediate element 27 on one of its terminals, which improves the contact between the electronic component 24, a binding material 26, and the bottom conducting layer 22.
  • the electronic component 24 has at its other terminal a top intermediate element 28, which improves the contact between the electronic component 24, a binding material 25, and the top conducting layer 23.
  • the electronic component 24 can also be connected directly, without the use of intermediate elements.
  • the height of the electronic component 24,. including the intermediate elements 27, 28 - as shown in Fig.3 - is smaller than the sum of the thickness of the bottom layers 32 and 33 of the board.
  • the binding material 25 replaces the missing part of the electronic component 24, filling the opening 20 up to the top surface of the conducting layer 23.
  • the electronic element 24 is placed in an isolating casing 29, which can be either an isolating tube or can be made of gel. Apart from isolating the electronic component 24 from other conducting layers, the isolating casing 29 also facilitates its placement in the opening 20 during mounting.
  • the opening 30, made in the top layer 2 of the board, along with the conducting layer 31, allows heating up the binding material 25 in a case when the electronic element is mounted after the conducting layers have been applied.
  • Fig. 4 shows a board with an isolating layer 71, a bottom conducting layer 72, and a top conducting layer 73.
  • An electronic component 74 is placed inside an opening made only in the isolating layer 7 _.
  • the electronic element 74 is connected with the bottom conducting layer 72 through a binding material or another conducting contact material 76 and with the top conducting layer 73 through a binding material or another conducting contact material 75, for instance a conducting paste.
  • the opening is first made in the isolating layer 71, into which the electronic component 74 is placed, together with the binding or conducting contact material 76 and the binding or conducting contact material 75-
  • the bottom conducting layer 72 and the top conducting layer 73 are applied onto the isolating layer 71
  • the connection of the electronic element 74 with the bottom conducting layer 72 and the top conducting layer 73 is self- created when a conducting contact material is used.
  • the connection may be also created by point heating of the conducting layers in the place of their contact with the binding material.
  • Fig. 5 shows a board with an opening made in an isolating layer 8 . and a top conducting layer 83.
  • An electronic component 84 is connected, by its bottom terminal, with a bottom conducting layer 82 via a binding material 86.
  • the top conducting layer 83 is first applied onto the isolating layer 81 Next, the opening is made.
  • the electronic component 84 is placed in the opening and connected to the bottom conducting layer 82 through the binding material 86, and to the top conducting layer 83 through a binding material 85.
  • the electronic component can also be connected through intermediate elements.
  • Fig. 6 shows a mushroom-shaped electronic component 94.
  • a top part 95 of the electronic component 94 has a diameter greater than an opening 97 made in an isolating layer 9_1, a bottom conducting layer 92, and a top conducting layer 93.
  • the top part 95 of the electronic element 94 rests on the top conducting layer 93, in this way facilitating its connection with the conducting layers using binding agents 98 and 9J
  • Figs. 7, 8, and 9 show various shapes of openings and of electronic components that are placed therein.
  • Fig. 7 shows an electronic component 34 of a shape of a right prism with intermediate elements 37, 38, placed in a cylindrical opening 35, which is shown as an outline.
  • Fig. 9, in turn, shows a cylindrical electronic component 44 with intermediate elements 47 and 48, placed in an opening 45 of a shape of a right prism, which is shown as an outline.
  • Fig. 8 shows an electronic component 54 of a shape of a right prism with intermediate elements 57 and 58, placed in an opening 50 ⁇ which is shaped as a right prism with a triangular base.
  • the electronic components and openings can be of any shape, not necessarily those shown in Fig. 7, 8, and 9.

Abstract

In a printed circuit board (1) and electronic elements (4, 8) for mounting in that printed circuit board, the electronic elements (4, 8) have surfaces allowing electrical connection with conducting layers of the printed circuit of the board. The printed circuit board (1) has at least one hole (5, 9), which is in principle perpendicular to the surface of the printed circuit board (1), and which ends at the conducting layers (2, 3) of the printed circuit of the board (1). In the hole (5, 9) of the board (1) at least one electronic element (4, 8) is mounted, having, at its terminals, surfaces allowing electrical connection with the conducting layers (2, 3) of the printed circuit of the board (1) through a joining substance, which creates an electrical connection of the electronic element and the printed circuit of the board (1).

Description

PRINTED CIRCUIT BOARD AND ELECTRONIC ELEMENTS FOR MOUNTING
IN PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC
ELEMENTS IN PRINTED CIRCUIT BOARD
TECHNICAL FIELD
The invention relates to a printed circuit board and electronic elements to be mounted in a printed circuit board as well as a method for mounting electronic elements in a printed circuit board, used in electrical and electronic circuits.
BACKGROUND ART
Electrical and electronic circuit specialists are required more and more often to design circuits that are as small and compact as possible. This is caused by the limitations in space where a given circuit is to be installed, by constant increase in circuit complexity and by the fact that components in compact circuits are connected by short paths, which results in decreased size of parasitic components.
One of the methods for decreasing the dimensions of electronic circuits is the use of integrated circuits. When a need for discrete elements arises, small Surface Mounted Devices (SMD) can be used. In many cases, however, the space allotted to an electronic circuit requires further decrease in that circuit size.
AIM OF THE INVENTION The invention seeks to provide a printed circuit board with electronic components to be mounted in a limited space.
DISCLOSURE OF THE INVENTION
The object of the invention is a printed circuit board and electronic elements for mounting in that printed circuit board. The electronic elements have surfaces allowing electrical connection with conducting layers of the printed circuit of the board. The printed circuit board has at least one hole, which is in principle perpendicular to the surface of the printed circuit board, and which ends at the conducting layers of the printed circuit of the board. In the hole of the board at least one electronic element is mounted, having, at its terminals, surfaces allowing electrical connection with the conducting layers of the printed circuit of the board through a joining substance, which creates an electrical connection of the . electronic element and the printed circuit of the board.
The printed circuit board can comprise several isolating layers and each layer has its own printed circuit.
The printed circuit board can comprise several isolating layers between which conducting layers are situated.
The hole of the printed circuit board can extend through several isolating layers.
The cross section of the hole can have the shape of an arbitrary plain figure.
The cross section of the electronic element can have the shape of an arbitrary plain figure.
At least one end of the hole can be at least partially covered by a conducting layer of the board.
At least one end of the hole can be at least partially covered by a conducting layer situated between isolating layers of the board.
The conducting surfaces of the electronic element can be situated at its terminals.
The electronic element can be mounted in an isolating casing placed in the hole.
The isolating casing can be made of a gel substance or can be an isolating sleeve.
The electronic element can have a part whose diameter is larger than the diameter of the hole in which the electronic element is mounted.
The object of the invention is also a method for mounting electronic elements in a printed circuit board, in which a hole is made. The hole extends in principle perpendicularly to the surface of the board, in which at least one electronic element is mounted that has surfaces at its terminals that allow electrical connection and which is connected through a substance conducting electrical current with the printed circuit of the board.
BRIEF DESCRIPTION OF DRAWINGS
The object of this invention is shown in implementation examples in the enclosed drawings, in which:
Fig. 1 shows a printed circuit board along with cylindrical electronic components;
Fig. 2 shows a cross section of a printed circuit board with an electronic element inside;
Fig. 3 shows a cross section of a multi-layered printed circuit board with an electronic component placed inside the isolating layer;
Figs. 4, 5, and 6 show various methods for mounting electronic components; and
Figs. 7, 8, and 9 show various shapes of electronic components.
BEST MODE FOR CARRYING OUT THE INVENTION Fig. 1 shows a printed circuit board and electronic elements or components that are mounted therein. On an isolating layer 1 of this board there is a bottom conducting layer 2, which consists of conducting paths, and a top conducting layer 3. Both the conducting layers 2 and 3 can be made by sputtering, by etching the conducting material or by using conducting foils, attached by arbitrary method, for instance by gluing. In the hole or the opening 5, made in the conducting layers 2, 3, and in the isolating layer 1, an electronic component 4 - connected electrically with both conducting layers 2 and 3 - is placed. The electronic component 4 can be connected with conducting layers 2 and 3 by soldering, welding or by the use of an elastic conducting joining substance. The connection can be direct or through intermediate elements, for instance metal connector terminals attached or otherwise placed on the electronic component terminals. Another electronic component 8 is placed in a partial opening 9, made only in the isolating layer 1_. The electronic component 8 is connected with the top conducting layer 3 through a binding material 10 and with the path 6 of the bottom conducting layer 2 through a binding material 7. Before the conducting layers 2 and 3 are applied, the electronic element 8 is placed in the opening 9. After their application, it is soldered to them, for instance by point heating. Electronic components 4 and 8 are cylindrically shaped, as are the openings where they are placed. Diameters of the openings are matched to the diameters of electronic components.
Fig. 2 shows a lateral cross section of the printed circuit board with an electronic component 14 connected, by its terminals, through intermediate elements 15 and 16, to a top conducting path 13 through a binding material 18, and to the bottom conducting path 12 through a binding material 19. The top conducting path 13 and the bottom conducting path 12 are separated by an isolating layer 11.. The opening made in the top conducting layer 13 has bevel edges 17 which allow easier placement of the electronic component 14 in the opening, and its easier soldering. The height of the electronic component 14, including the intermediate elements 15 and 16, is slightly greater than the sum of the thickness of the isolating layer 1_1, the top conducting path 13, and the bottom conducting path 12.
Fig. 3 shows a cross section of a multi-layered board with printed circuits. It is made up of several isolating layers 21., 32, and 33 as well as conducting layers 22, 23, and 3J_, placed between the isolating layers 21., 32, and 33, and on the outside of the isolating layers 21, and 32. An electronic component 24 is placed inside an opening made in the first bottom layer 32 and in the second bottom layer 33 of the board. The electronic component 24 has a bottom intermediate element 27 on one of its terminals, which improves the contact between the electronic component 24, a binding material 26, and the bottom conducting layer 22. The electronic component 24 has at its other terminal a top intermediate element 28, which improves the contact between the electronic component 24, a binding material 25, and the top conducting layer 23. The electronic component 24 can also be connected directly, without the use of intermediate elements. The height of the electronic component 24,. including the intermediate elements 27, 28 - as shown in Fig.3 - is smaller than the sum of the thickness of the bottom layers 32 and 33 of the board. The binding material 25 replaces the missing part of the electronic component 24, filling the opening 20 up to the top surface of the conducting layer 23. The electronic element 24 is placed in an isolating casing 29, which can be either an isolating tube or can be made of gel. Apart from isolating the electronic component 24 from other conducting layers, the isolating casing 29 also facilitates its placement in the opening 20 during mounting.
The opening 30, made in the top layer 2 of the board, along with the conducting layer 31, allows heating up the binding material 25 in a case when the electronic element is mounted after the conducting layers have been applied.
Fig. 4 shows a board with an isolating layer 71, a bottom conducting layer 72, and a top conducting layer 73. An electronic component 74 is placed inside an opening made only in the isolating layer 7 _. The electronic element 74 is connected with the bottom conducting layer 72 through a binding material or another conducting contact material 76 and with the top conducting layer 73 through a binding material or another conducting contact material 75, for instance a conducting paste. When mounting the electronic element 74 in the board, the opening is first made in the isolating layer 71, into which the electronic component 74 is placed, together with the binding or conducting contact material 76 and the binding or conducting contact material 75- In the end, the bottom conducting layer 72 and the top conducting layer 73 are applied onto the isolating layer 71 The connection of the electronic element 74 with the bottom conducting layer 72 and the top conducting layer 73 is self- created when a conducting contact material is used. The connection may be also created by point heating of the conducting layers in the place of their contact with the binding material.
Fig. 5 shows a board with an opening made in an isolating layer 8 . and a top conducting layer 83. An electronic component 84 is connected, by its bottom terminal, with a bottom conducting layer 82 via a binding material 86. When mounting, the top conducting layer 83 is first applied onto the isolating layer 81 Next, the opening is made. After applying the bottom conducting layer 82, the electronic component 84 is placed in the opening and connected to the bottom conducting layer 82 through the binding material 86, and to the top conducting layer 83 through a binding material 85. The electronic component can also be connected through intermediate elements.
Fig. 6 shows a mushroom-shaped electronic component 94. A top part 95 of the electronic component 94 has a diameter greater than an opening 97 made in an isolating layer 9_1, a bottom conducting layer 92, and a top conducting layer 93. When mounting, the top part 95 of the electronic element 94 rests on the top conducting layer 93, in this way facilitating its connection with the conducting layers using binding agents 98 and 9J
Figs. 7, 8, and 9 show various shapes of openings and of electronic components that are placed therein. Fig. 7 shows an electronic component 34 of a shape of a right prism with intermediate elements 37, 38, placed in a cylindrical opening 35, which is shown as an outline. Fig. 9, in turn, shows a cylindrical electronic component 44 with intermediate elements 47 and 48, placed in an opening 45 of a shape of a right prism, which is shown as an outline. Fig. 8 shows an electronic component 54 of a shape of a right prism with intermediate elements 57 and 58, placed in an opening 50^ which is shaped as a right prism with a triangular base. The electronic components and openings can be of any shape, not necessarily those shown in Fig. 7, 8, and 9.

Claims

1. A printed circuit board and electronic elements having surfaces allowing electrical connection with conducting layers of the printed circuit of the board, characterized in that the printed circuit board (1) has at least one hole (5, 9), which is in principle perpendicular to the surface of the printed circuit board (1), and which ends at the conducting layers (2, 3) of the printed circuit of the board (1), and in the hole (5, 9) of the board (1) at least one electronic element (4, 8) is mounted, having, at its terminals, surfaces allowing electrical connection with the conducting layers (2, 3) of the printed circuit of the board (1) through a joining substance, which creates an electrical connection of the electronic element and the printed circuit of the board (1).
2. The printed circuit board with electronic elements according to claim 1 , characterized in that the printed circuit board comprises several isolating layers (21 32, 33) and each layer has its own printed circuit.
3. The printed circuit board with electronic elements according to claim 1 , characterized in that the printed circuit board comprises several isolating layers (21 33) between which conducting layers are situated.
4. The printed circuit board with electronic elements according to claim 2, characterized in that the hole of the printed circuit board extends through several isolating layers (21, 32, 33).
5. The printed circuit board with electronic elements according to claim 1 , characterized in that the cross section of the hole (35, 45, 50) has the shape of an arbitrary plain figure.
6. The printed circuit board with electronic elements according to claim 1 , characterized in that the cross section of the electronic element (34, 44, 54) has the shape of an arbitrary plain figure.
7. The printed circuit board with electronic elements according to claim 1 , characterized in that at least one end of the hole is at least partially covered by a conducting layer (82) of the board.
8. The printed circuit board with electronic elements according to claim 3, characterized in that at least one end of the hole is at least partially covered by a conducting layer situated between isolating layers of the board.
9. The printed circuit board with electronic elements according to claim 1 , characterized in that the conducting surfaces of the electronic element (34, 44, 54) are situated at its terminals.
10. The printed circuit board with electronic elements according to claim 1 , characterized in that the electronic element (24) is mounted in an isolating casing (29) placed in the hole (20).
11. The printed circuit board with electronic elements according to claim 10, characterized in that the isolating casing (29) is made of a gel substance.
12. The printed circuit board with electronic elements according to claim 10, characterized in that the isolating casing (29) is an isolating sleeve.
13. The printed circuit board with electronic elements according to claim 1 , characterized in that the electronic element has a part (95) whose diameter is larger than the diameter of the hole in which the electronic element (94) is mounted.
14. A method for mounting electronic elements in a printed circuit board, characterized in that a hole (5, 9) is made in the board (1), the hole extending in principle perpendicularly to the surface of the board (1), in which at least one electronic element (4, 8) is mounted that has surfaces at its terminals that allow electrical connection and which is connected through a substance conducting electrical current with the printed circuit of the board (1).
15. The method for mounting electronic elements in a printed circuit board according to claim 14, characterized in that the electronic element (24) is mounted in an isolating casing (29) placed in the hole (20).
PCT/PL2003/000071 2002-08-08 2003-07-29 Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board WO2004016056A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003263695A AU2003263695A1 (en) 2002-08-08 2003-07-29 Printed circuit board and electronic elements for mounting in printed circuit board and method for mounting electronic elements in printed circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PL02355404A PL355404A1 (en) 2002-08-08 2002-08-08 Pronted circuit board with electronic components to be fitted on a pronted circuit board and method of fitting electronic components on printed circuit board
PLP-355404 2002-08-08

Publications (1)

Publication Number Publication Date
WO2004016056A1 true WO2004016056A1 (en) 2004-02-19

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AU (1) AU2003263695A1 (en)
PL (1) PL355404A1 (en)
WO (1) WO2004016056A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3108228A1 (en) * 2020-03-12 2021-09-17 Stmicroelectronics (Grenoble 2) Sas Electronic device comprising component type surface mounted dipoles, and corresponding assembly method.

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1449653A (en) * 1965-04-15 1966-05-06 Radiotechnique Improvements to insulating boards carrying printed circuits
DE3115303A1 (en) * 1981-04-15 1982-11-04 Becker Autoradiowerk Gmbh, 7516 Karlsbad Method for populating printed-circuit boards with miniature components having no wires, and a printed-circuit board populated with such miniature components
USH416H (en) * 1981-08-31 1988-01-05 Rogers Corporation High capacitance flexible circuit
US4878155A (en) * 1987-09-25 1989-10-31 Conley Larry R High speed discrete wire pin panel assembly with embedded capacitors
JPH0212889A (en) * 1988-06-30 1990-01-17 Mini Pairo Denki:Kk Circuit connecting method and circuit board
JPH0391907A (en) * 1989-09-04 1991-04-17 Matsushita Electric Ind Co Ltd Chip part
US5074799A (en) * 1991-03-27 1991-12-24 Amp Incorporated Gel connector of laminar construction
DE4033199A1 (en) * 1990-10-19 1992-04-23 Kawe Electronic Gmbh & Co Kg PCB mfr. using miniature through-pins - achieves high component density using vertical solder dipping process
US5420755A (en) * 1990-08-18 1995-05-30 Hiller; Peter Circuit board with electrical components, in particular surface-mounted devices
US5809641A (en) * 1996-04-25 1998-09-22 International Business Machines Corporation Method for printed circuit board repair
EP1098368A1 (en) * 1999-04-16 2001-05-09 Matsushita Electric Industrial Co., Ltd. Module component and method of manufacturing the same
US20020100611A1 (en) * 2001-02-01 2002-08-01 International Business Machines Corporation Insertion of electrical component within a via of a printed circuit board

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1449653A (en) * 1965-04-15 1966-05-06 Radiotechnique Improvements to insulating boards carrying printed circuits
DE3115303A1 (en) * 1981-04-15 1982-11-04 Becker Autoradiowerk Gmbh, 7516 Karlsbad Method for populating printed-circuit boards with miniature components having no wires, and a printed-circuit board populated with such miniature components
USH416H (en) * 1981-08-31 1988-01-05 Rogers Corporation High capacitance flexible circuit
US4878155A (en) * 1987-09-25 1989-10-31 Conley Larry R High speed discrete wire pin panel assembly with embedded capacitors
JPH0212889A (en) * 1988-06-30 1990-01-17 Mini Pairo Denki:Kk Circuit connecting method and circuit board
JPH0391907A (en) * 1989-09-04 1991-04-17 Matsushita Electric Ind Co Ltd Chip part
US5420755A (en) * 1990-08-18 1995-05-30 Hiller; Peter Circuit board with electrical components, in particular surface-mounted devices
DE4033199A1 (en) * 1990-10-19 1992-04-23 Kawe Electronic Gmbh & Co Kg PCB mfr. using miniature through-pins - achieves high component density using vertical solder dipping process
US5074799A (en) * 1991-03-27 1991-12-24 Amp Incorporated Gel connector of laminar construction
US5809641A (en) * 1996-04-25 1998-09-22 International Business Machines Corporation Method for printed circuit board repair
EP1098368A1 (en) * 1999-04-16 2001-05-09 Matsushita Electric Industrial Co., Ltd. Module component and method of manufacturing the same
US20020100611A1 (en) * 2001-02-01 2002-08-01 International Business Machines Corporation Insertion of electrical component within a via of a printed circuit board

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 154 (E - 0907) 23 March 1990 (1990-03-23) *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 273 (E - 1088) 11 July 1991 (1991-07-11) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3108228A1 (en) * 2020-03-12 2021-09-17 Stmicroelectronics (Grenoble 2) Sas Electronic device comprising component type surface mounted dipoles, and corresponding assembly method.

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