WO2004030083A3 - User interface for quantifying wafer non-uniformities and graphically explore significance - Google Patents

User interface for quantifying wafer non-uniformities and graphically explore significance Download PDF

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Publication number
WO2004030083A3
WO2004030083A3 PCT/US2003/030456 US0330456W WO2004030083A3 WO 2004030083 A3 WO2004030083 A3 WO 2004030083A3 US 0330456 W US0330456 W US 0330456W WO 2004030083 A3 WO2004030083 A3 WO 2004030083A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
user interface
uniformities
wafer non
analysis
Prior art date
Application number
PCT/US2003/030456
Other languages
French (fr)
Other versions
WO2004030083A2 (en
Inventor
Jorge Luque
Iii Andrew D Bailey
Mark Wilcoxson
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/331,194 external-priority patent/US7239737B2/en
Priority claimed from US10/452,248 external-priority patent/US7738693B2/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Priority to KR1020057005323A priority Critical patent/KR101127779B1/en
Priority to JP2005501992A priority patent/JP2006515468A/en
Priority to AU2003299056A priority patent/AU2003299056A1/en
Priority to EP03756878A priority patent/EP1543550A2/en
Publication of WO2004030083A2 publication Critical patent/WO2004030083A2/en
Publication of WO2004030083A3 publication Critical patent/WO2004030083A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

A wafer viewer system is provided for graphical presentation and analysis of a wafer and a wafer series. More specifically, the wafer viewer system includes a graphical user interface for displaying a wafer, graphically selecting regions of the wafer for analysis, performing analysis on the selected regions of the wafer, and displaying results of the analysis.
PCT/US2003/030456 2002-09-26 2003-09-24 User interface for quantifying wafer non-uniformities and graphically explore significance WO2004030083A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020057005323A KR101127779B1 (en) 2002-09-26 2003-09-24 User interface for quantifying wafer non-uniformities and graphically explore significance
JP2005501992A JP2006515468A (en) 2002-09-26 2003-09-24 User interface for non-uniformity quantification and significance illustration for wafers
AU2003299056A AU2003299056A1 (en) 2002-09-26 2003-09-24 User interface for quantifying wafer non-uniformities and graphically explore significance
EP03756878A EP1543550A2 (en) 2002-09-26 2003-09-24 User interface for quantifying wafer non-uniformities and graphically explore significance

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US41402102P 2002-09-26 2002-09-26
US60/414,021 2002-09-26
US10/331,194 US7239737B2 (en) 2002-09-26 2002-12-24 User interface for quantifying wafer non-uniformities and graphically explore significance
US10/331,194 2002-12-24
US10/452,248 2003-05-30
US10/452,248 US7738693B2 (en) 2002-12-24 2003-05-30 User interface for wafer data analysis and visualization

Publications (2)

Publication Number Publication Date
WO2004030083A2 WO2004030083A2 (en) 2004-04-08
WO2004030083A3 true WO2004030083A3 (en) 2004-07-15

Family

ID=32045857

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/030456 WO2004030083A2 (en) 2002-09-26 2003-09-24 User interface for quantifying wafer non-uniformities and graphically explore significance

Country Status (6)

Country Link
EP (1) EP1543550A2 (en)
JP (1) JP2006515468A (en)
KR (1) KR101127779B1 (en)
AU (1) AU2003299056A1 (en)
TW (1) TWI229914B (en)
WO (1) WO2004030083A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4290204B2 (en) * 2007-02-13 2009-07-01 東京エレクトロン株式会社 Substrate processing apparatus setting operation support apparatus, setting operation support method, and storage medium for storing program
JP5597056B2 (en) * 2010-08-02 2014-10-01 株式会社キーエンス Image measuring apparatus, image measuring method, and program for image measuring apparatus

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0398781A2 (en) * 1989-05-19 1990-11-22 Eastman Kodak Company Method and apparatus for low angle, high resolution surface inspection
US5761064A (en) * 1995-10-06 1998-06-02 Advanced Micro Devices, Inc. Defect management system for productivity and yield improvement
US5939719A (en) * 1992-03-13 1999-08-17 Thermomicroscopes Corporation Scanning probe microscope with scan correction
US20010000460A1 (en) * 1989-07-12 2001-04-26 Kazuko Ishihara Semiconductor failure analysis system
US20010001015A1 (en) * 1989-07-12 2001-05-10 Seiji Ishikawa Inspection data analyzing system
US20020051565A1 (en) * 2000-10-26 2002-05-02 Takashi Hiroi Circuit pattern inspection method and apparatus
US20020102747A1 (en) * 2000-09-18 2002-08-01 David Muradian Correction of overlay offset between inspection layers in integrated circuits
US6477685B1 (en) * 1999-09-22 2002-11-05 Texas Instruments Incorporated Method and apparatus for yield and failure analysis in the manufacturing of semiconductors

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1145919A (en) * 1997-07-24 1999-02-16 Hitachi Ltd Manufacture of semiconductor substrate
JP4206192B2 (en) * 2000-11-09 2009-01-07 株式会社日立製作所 Pattern inspection method and apparatus
JP4006119B2 (en) * 1998-11-30 2007-11-14 株式会社日立製作所 Circuit pattern inspection apparatus and circuit pattern inspection method
JP4041630B2 (en) 1998-11-30 2008-01-30 株式会社日立製作所 Circuit pattern inspection apparatus and inspection method
JP3996728B2 (en) * 2000-03-08 2007-10-24 株式会社日立製作所 Surface inspection apparatus and method
JP4526661B2 (en) * 2000-06-28 2010-08-18 株式会社日立製作所 Inspection apparatus and inspection method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0398781A2 (en) * 1989-05-19 1990-11-22 Eastman Kodak Company Method and apparatus for low angle, high resolution surface inspection
US20010000460A1 (en) * 1989-07-12 2001-04-26 Kazuko Ishihara Semiconductor failure analysis system
US20010001015A1 (en) * 1989-07-12 2001-05-10 Seiji Ishikawa Inspection data analyzing system
US5939719A (en) * 1992-03-13 1999-08-17 Thermomicroscopes Corporation Scanning probe microscope with scan correction
US5761064A (en) * 1995-10-06 1998-06-02 Advanced Micro Devices, Inc. Defect management system for productivity and yield improvement
US6477685B1 (en) * 1999-09-22 2002-11-05 Texas Instruments Incorporated Method and apparatus for yield and failure analysis in the manufacturing of semiconductors
US20020102747A1 (en) * 2000-09-18 2002-08-01 David Muradian Correction of overlay offset between inspection layers in integrated circuits
US20020051565A1 (en) * 2000-10-26 2002-05-02 Takashi Hiroi Circuit pattern inspection method and apparatus

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE INSPEC [online] INSTITUTE OF ELECTRICAL ENGINEERS, STEVENAGE, GB; RODGERS M R ET AL: "Application of the atomic force microscope to integrated circuit failure analysis", XP002277053, Database accession no. 4506485 *
MICROELECTRONICS AND RELIABILITY, SEPT. 1993, UK, vol. 33, no. 11-12, pages 1947 - 1956, ISSN: 0026-2714 *

Also Published As

Publication number Publication date
TWI229914B (en) 2005-03-21
KR101127779B1 (en) 2012-03-27
WO2004030083A2 (en) 2004-04-08
KR20050084603A (en) 2005-08-26
EP1543550A2 (en) 2005-06-22
AU2003299056A1 (en) 2004-04-19
JP2006515468A (en) 2006-05-25
TW200414395A (en) 2004-08-01

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