WO2004038759A3 - Method and apparatus for using light emitting diodes - Google Patents

Method and apparatus for using light emitting diodes Download PDF

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Publication number
WO2004038759A3
WO2004038759A3 PCT/US2003/026553 US0326553W WO2004038759A3 WO 2004038759 A3 WO2004038759 A3 WO 2004038759A3 US 0326553 W US0326553 W US 0326553W WO 2004038759 A3 WO2004038759 A3 WO 2004038759A3
Authority
WO
WIPO (PCT)
Prior art keywords
emitting diodes
light emitting
light
heat pipe
same
Prior art date
Application number
PCT/US2003/026553
Other languages
French (fr)
Other versions
WO2004038759A2 (en
Inventor
Jonathan S Dahm
Original Assignee
Jonathan S Dahm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jonathan S Dahm filed Critical Jonathan S Dahm
Priority to AU2003298561A priority Critical patent/AU2003298561A1/en
Publication of WO2004038759A2 publication Critical patent/WO2004038759A2/en
Publication of WO2004038759A3 publication Critical patent/WO2004038759A3/en
Priority to US10/979,903 priority patent/US7345320B2/en
Priority to US11/974,432 priority patent/US7863641B2/en
Priority to US12/715,163 priority patent/US7989839B2/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C19/00—Dental auxiliary appliances
    • A61C19/003—Apparatus for curing resins by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C19/00—Dental auxiliary appliances
    • A61C19/003—Apparatus for curing resins by radiation
    • A61C19/004—Hand-held apparatus, e.g. guns
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C19/00—Dental auxiliary appliances
    • A61C19/06—Implements for therapeutic treatment
    • A61C19/063—Medicament applicators for teeth or gums, e.g. treatment with fluorides
    • A61C19/066—Bleaching devices; Whitening agent applicators for teeth, e.g. trays or strips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

A method and apparatus for using light emitting diodes (10) for curing and various solid state lighting applications. The method includes cooling the light emitting diodes (10) and mounting the same on a heat pipe (64) in a manner which delivers ultra high power light in UV, visible and IR regions. The LED packaging technology utilizes heat pipes (64) that perform very efficiently in very compact space. Much more closely spaced LEDs (10) operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe (64) and away from the light-emitting direction rather than a radial direction in nearly the same plane as the 'p-n' junction.
PCT/US2003/026553 2002-08-23 2003-08-25 Method and apparatus for using light emitting diodes WO2004038759A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2003298561A AU2003298561A1 (en) 2002-08-23 2003-08-25 Method and apparatus for using light emitting diodes
US10/979,903 US7345320B2 (en) 2002-08-23 2004-11-02 Light emitting apparatus
US11/974,432 US7863641B2 (en) 2002-08-23 2007-10-12 Method and apparatus for using light emitting diodes for the treatment of biological tissue
US12/715,163 US7989839B2 (en) 2002-08-23 2010-03-01 Method and apparatus for using light emitting diodes

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US40543202P 2002-08-23 2002-08-23
US60/405,432 2002-08-23
US41072002P 2002-09-13 2002-09-13
US60/410,720 2002-09-13
US41694802P 2002-10-08 2002-10-08
US60/416,948 2002-10-08
US42047902P 2002-10-21 2002-10-21
US60/420,479 2002-10-21
US46770203P 2003-05-03 2003-05-03
US60/467,702 2003-05-03
US47600403P 2003-06-04 2003-06-04
US60/476,004 2003-06-04

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US10979903 A-371-Of-International 2003-08-25
US10/979,903 Continuation US7345320B2 (en) 2002-08-23 2004-11-02 Light emitting apparatus
US11/974,432 Continuation US7863641B2 (en) 2002-08-23 2007-10-12 Method and apparatus for using light emitting diodes for the treatment of biological tissue

Publications (2)

Publication Number Publication Date
WO2004038759A2 WO2004038759A2 (en) 2004-05-06
WO2004038759A3 true WO2004038759A3 (en) 2004-10-14

Family

ID=32180836

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/026553 WO2004038759A2 (en) 2002-08-23 2003-08-25 Method and apparatus for using light emitting diodes

Country Status (3)

Country Link
US (3) US7345320B2 (en)
AU (1) AU2003298561A1 (en)
WO (1) WO2004038759A2 (en)

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US9281001B2 (en) 2004-11-08 2016-03-08 Phoseon Technology, Inc. Methods and systems relating to light sources for use in industrial processes

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US7863641B2 (en) 2011-01-04
US20100219736A1 (en) 2010-09-02
WO2004038759A2 (en) 2004-05-06
US7989839B2 (en) 2011-08-02
US20080094841A1 (en) 2008-04-24
AU2003298561A8 (en) 2004-05-13
AU2003298561A1 (en) 2004-05-13
US20050231983A1 (en) 2005-10-20
US7345320B2 (en) 2008-03-18

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