WO2004048639A3 - Method and apparatus for controlling a deposition process - Google Patents
Method and apparatus for controlling a deposition process Download PDFInfo
- Publication number
- WO2004048639A3 WO2004048639A3 PCT/GB2003/005130 GB0305130W WO2004048639A3 WO 2004048639 A3 WO2004048639 A3 WO 2004048639A3 GB 0305130 W GB0305130 W GB 0305130W WO 2004048639 A3 WO2004048639 A3 WO 2004048639A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- same apparatus
- combinatorial
- controlling
- deposition process
- interdependencies
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003285518A AU2003285518A1 (en) | 2002-11-25 | 2003-11-25 | Method and apparatus for controlling a deposition process |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0227446A GB2395492A (en) | 2002-11-25 | 2002-11-25 | Improvements in deposition methods for the production of semiconductors |
GB0227446.2 | 2002-11-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004048639A2 WO2004048639A2 (en) | 2004-06-10 |
WO2004048639A3 true WO2004048639A3 (en) | 2004-11-18 |
Family
ID=9948456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2003/005130 WO2004048639A2 (en) | 2002-11-25 | 2003-11-25 | Method and apparatus for controlling a deposition process |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003285518A1 (en) |
GB (1) | GB2395492A (en) |
WO (1) | WO2004048639A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017040623A1 (en) | 2015-09-01 | 2017-03-09 | Silcotek Corp. | Thermal chemical vapor deposition coating |
US20170211180A1 (en) * | 2016-01-22 | 2017-07-27 | Silcotek Corp. | Diffusion-rate-limited thermal chemical vapor deposition coating |
WO2020252306A1 (en) | 2019-06-14 | 2020-12-17 | Silcotek Corp. | Nano-wire growth |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4607591A (en) * | 1985-08-06 | 1986-08-26 | Spectrum Cvd, Inc. | CVD heater control circuit |
JPH08218177A (en) * | 1995-02-08 | 1996-08-27 | Matsushita Electric Ind Co Ltd | Cvd simulation method |
US5624720A (en) * | 1989-03-31 | 1997-04-29 | Canon Kabushiki Kaisha | Process for forming a deposited film by reacting between a gaseous starting material and an oxidizing agent |
JPH11243061A (en) * | 1998-02-25 | 1999-09-07 | Sumitomo Metal Ind Ltd | Vapor-phase growing method and device thereof |
US6162488A (en) * | 1996-05-14 | 2000-12-19 | Boston University | Method for closed loop control of chemical vapor deposition process |
EP1083470A2 (en) * | 1999-09-10 | 2001-03-14 | Applied Materials, Inc. | Multi-computer chamber control system, method and medium |
US6217651B1 (en) * | 1998-07-23 | 2001-04-17 | Shin-Etsu Handotai, Co., Ltd. | Method for correction of thin film growth temperature |
US6335288B1 (en) * | 2000-08-24 | 2002-01-01 | Applied Materials, Inc. | Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD |
US6374194B1 (en) * | 1998-04-14 | 2002-04-16 | The Institute Of Physical And Chemical Research | System and method of diagnosing particle formation |
WO2002092876A1 (en) * | 2001-05-17 | 2002-11-21 | Aixtron Ag | Method and device for depositing layers |
-
2002
- 2002-11-25 GB GB0227446A patent/GB2395492A/en not_active Withdrawn
-
2003
- 2003-11-25 AU AU2003285518A patent/AU2003285518A1/en not_active Abandoned
- 2003-11-25 WO PCT/GB2003/005130 patent/WO2004048639A2/en not_active Application Discontinuation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4607591A (en) * | 1985-08-06 | 1986-08-26 | Spectrum Cvd, Inc. | CVD heater control circuit |
US5624720A (en) * | 1989-03-31 | 1997-04-29 | Canon Kabushiki Kaisha | Process for forming a deposited film by reacting between a gaseous starting material and an oxidizing agent |
JPH08218177A (en) * | 1995-02-08 | 1996-08-27 | Matsushita Electric Ind Co Ltd | Cvd simulation method |
US6162488A (en) * | 1996-05-14 | 2000-12-19 | Boston University | Method for closed loop control of chemical vapor deposition process |
JPH11243061A (en) * | 1998-02-25 | 1999-09-07 | Sumitomo Metal Ind Ltd | Vapor-phase growing method and device thereof |
US6374194B1 (en) * | 1998-04-14 | 2002-04-16 | The Institute Of Physical And Chemical Research | System and method of diagnosing particle formation |
US6217651B1 (en) * | 1998-07-23 | 2001-04-17 | Shin-Etsu Handotai, Co., Ltd. | Method for correction of thin film growth temperature |
EP1083470A2 (en) * | 1999-09-10 | 2001-03-14 | Applied Materials, Inc. | Multi-computer chamber control system, method and medium |
US6335288B1 (en) * | 2000-08-24 | 2002-01-01 | Applied Materials, Inc. | Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD |
WO2002092876A1 (en) * | 2001-05-17 | 2002-11-21 | Aixtron Ag | Method and device for depositing layers |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 12 26 December 1996 (1996-12-26) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 14 22 December 1999 (1999-12-22) * |
Also Published As
Publication number | Publication date |
---|---|
AU2003285518A1 (en) | 2004-06-18 |
WO2004048639A2 (en) | 2004-06-10 |
GB0227446D0 (en) | 2002-12-31 |
GB2395492A (en) | 2004-05-26 |
AU2003285518A8 (en) | 2004-06-18 |
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