WO2004049247A1 - A transponder and a method for manufacturing it - Google Patents

A transponder and a method for manufacturing it Download PDF

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Publication number
WO2004049247A1
WO2004049247A1 PCT/FI2003/000855 FI0300855W WO2004049247A1 WO 2004049247 A1 WO2004049247 A1 WO 2004049247A1 FI 0300855 W FI0300855 W FI 0300855W WO 2004049247 A1 WO2004049247 A1 WO 2004049247A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
transponder
hole
substrate
ink
Prior art date
Application number
PCT/FI2003/000855
Other languages
French (fr)
Inventor
Mikko Tirkkonen
Original Assignee
Rafsec Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rafsec Oy filed Critical Rafsec Oy
Priority to AU2003276321A priority Critical patent/AU2003276321A1/en
Publication of WO2004049247A1 publication Critical patent/WO2004049247A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Definitions

  • the present invention relates to a transponder comprising a substrate, which includes a circuitry pattern and an integrated circuit on a chip having a location on the substrate, and a cover layer attached to the substrate in such a manner that at the location of the chip there is a hole in the cover layer in which the chip is arranged to be located, and there is a free space outside the chip in the hole.
  • the present invention also relates to a method for manufacturing such a card.
  • transponders refer to cards, tags, labels, and the like comprising an RF-ID circuit (identification) or an RF-EAS circuit (electronic article surveillance).
  • the transponder comprises a so-called radio frequency identification (RFID) circuit, which is typically used at a distance of some tens of centimetres from a reader antenna.
  • RFID radio frequency identification
  • a reader device and the card are coupled inductively.
  • Such a transponder can be used for example as an electrical purse, as a ticket in public service vehicles, or for personal identification.
  • the card may be for single use only.
  • transponders having the inductive coupling to the reader device also transponders having an antenna based on the dipole antenna technique and an electric coupling belong in the scope of the invention.
  • a problem related to transponders is that the chip is brittle and vulnerable to damages. Therefore the chip must be protected against impacts.
  • a web stock device comprises a sheet-like material, which has a cavity.
  • a signalling device is at least partly contained in the cavity.
  • the web stock material includes means for retaining the signalling device at least partly in the cavity.
  • the transponder of the invention is characterized in that the free space has been filled with ink.
  • the manufacturing method of the invention is characterized in that the free space is filled at least partially with ink.
  • the invention has advantageous features. Excess layers are avoided in the product, and it is made simple and easy to manufacture.
  • the process step comprising printing with ink can be integrated into the same production line in which other process steps to manufacture the card are made.
  • the transponder can be manufactured individually, as sheets comprising more than one transponder, or as a continuous web.
  • the continuous web is a preferred choice.
  • the transponder substrate in a web form comprises successive and/or adjacent circuitry patterns to which the chips are attached.
  • the different layers of the transponder may include paper or plastic materials.
  • the layers are attached to each other by a suitable adhesive, or by heat sealing.
  • the adhesive is preferably a film, which can be laminated to another surface by transfer lamination.
  • the circuitry pattern of the transponder can be manufactured by printing a circuitry pattern with an electroconductive printing ink on a film, by etching the circuitry pattern on a metal film, by electroplating, by punching the circuitry pattern from a metal film, or by winding the circuitry pattern of for example a copper wire.
  • the preferred manufacturing method is etching.
  • the electrically operating radio frequency identification (RFID) circuit of the transponder is a simple electric oscillating circuit (RCL circuit) operating at a defined frequency.
  • the circuit consists of a coil, a capacitor and an integrated circuit on a chip.
  • the integrated circuit comprises an escort memory and an RF part, which is arranged to communicate with a reader device. Also the capacitor of the RCL circuit can be integrated on the chip.
  • the integrated circuit on the chip is attached to the circuitry pattern for example by using the principle of the flip-chip technique, which is known as such but also other techniques for the attachment are possible.
  • the chip can be attached to a separate structural part as well, and thereafter attach the structural part to the substrate comprising the circuitry pattern.
  • the transponder substrate may be provided with a thermoplastic anisotropically conductive film, which is attached to the surface on the transponder substrate to cover the surface including the circuitry pattern.
  • the anisotropically conductive film may cover the transponder substrate completely or partly. Since the anisotropically conductive film is thermoplastic it endures repetitive heating, which is necessary for making the film tacky.
  • thermoplastic films for adhering the chip are for example anisotropic conductive films 8773 and 8783 (Z-Axis Adhesive Films 8773 and 8783, 3M, USA).
  • anisotropically conductive films In addition to anisotropically conductive films, also other suitable techniques for attaching the chip may be used. For example, isotropically conductive films, or crimping techniques can be used.
  • the transponder substrate comprising the circuitry pattern and the chip is attached to the cover layer, which includes a hole.
  • the hole is intended for receiving the chip from underneath when the transponder substrate and the cover layer are attached together.
  • the shape of the hole can be any, for example a square or a circle.
  • the dimensions of the hole are larger than the dimensions of the chip, and hence there is a free space around the chip except the underside of the chip, which is firmly attached to the transponder substrate.
  • the hole is at least partially filled with ink.
  • the ink may be printed by conventional printing methods over the hole when the ink transfers into the hole.
  • the ink may fill the hole as such, or it may comprise expandable components, which are expanded after printing.
  • Inks which are capable for filling the hole as such are for example inks intended for printing Braille alphabets.
  • the ink When the ink is expanded by using for example heat, substantially the rest of the hole volume not filled with the chip is filled with the expanded ink.
  • a level of the ink may be even with the upper level of the cover layer, or slightly lower. It is also possible that the expandable substance is other than the ink, and it is brought into the hole by using technique other than the printing. Some coating compositions and coating or injecting methods may be usable, too.
  • the transponder is manufactured as a continuous web, and all the layers of the transponder are attached to each other on the same production line. It is possible that the ink is also filled in the hole and possibly expanded on the same production line as the layers are attached to each other.
  • Fig. 1 shows a substrate of a transponder in a top view
  • Fig. 2 shows a transponder of the invention in a cross-sectional view.
  • FIG. 1 shows a transponder substrate 1 , such as a smart card substrate, in a top view, including a circuitry pattern 3 and an integrated circuit on a chip 2 therein.
  • the transponder substrate is separated from a continuous web.
  • the transponder substrate 1 can be manufactured by printing the circuitry pattern on a film with an electroconductive printing ink, by etching the circuitry pattern on a metal film, by punching the circuitry pattern off a metal film, or by winding the circuitry pattern of e.g. a copper wire.
  • the circuitry pattern is provided with an identification circuit, such as a radio frequency identification (RFID) circuit.
  • RFID radio frequency identification
  • the identification circuit is a simple electric oscillating circuit (RCL circuit) tuned to operate at a defined frequency.
  • the circuit consists of a coil, a capacitor and a circuit integrated on a chip, consisting of an escort memory and an RF part for communication with a reader device.
  • the capacitor of the RCL circuit can also be
  • FIG. 2 shows a transponder of the invention in a cross-sectional view.
  • a transponder substrate 1 carries a chip 2 and a circuitry pattern (not shown in Fig. 2.).
  • a cover layer 4 is attached t ⁇ ⁇ the transponder substrate 1.
  • the cover layer 4 has a hole at a location of the chip 2, and dimensions of the hole are larger than those of the chip 2.
  • the vertical walls of the hole form a protective arrangement for the chip 2 but excess protection is needed against perpendicular impacts.
  • the hole is at least partially filled with ink 5, which fills the rest of the hole volume not filled with the chip 2 when the ink 5 has been cured, for example by heat or ultraviolet radiation.
  • Such inks include inks capable for forming Braille alphabets.
  • ink is YK20- 9599 (Sun Chemical, USA).
  • the ink shall be such that its volume does not decrease essentially during drying.
  • On the reverse side of the transponder substrate 1 may be an excess material layer 6 to bring some rigidity to the transponder.
  • the ink may comprise for example expandable microspheres, such as Expancel® microspheres (Expancel Inc., USA).

Abstract

The present invention relates to a transponder comprising a substrate (1), which includes a circuitry pattern (3) and an integrated circuit on a chip (2) having a location on the substrate (1), and a cover layer (4) attached to the substrate (1). At the location of the chip (2) there is a hole in the cover layer (4) in which the chip (2) is arranged to be located, and there is a free space outside the chip (2) in the hole. The free space has been filled with ink (5). The present invention also relates to a method for manufacturing such a transponder.

Description

A transponder and a method for manufacturing it
The present invention relates to a transponder comprising a substrate, which includes a circuitry pattern and an integrated circuit on a chip having a location on the substrate, and a cover layer attached to the substrate in such a manner that at the location of the chip there is a hole in the cover layer in which the chip is arranged to be located, and there is a free space outside the chip in the hole. The present invention also relates to a method for manufacturing such a card.
In the present application, transponders refer to cards, tags, labels, and the like comprising an RF-ID circuit (identification) or an RF-EAS circuit (electronic article surveillance). The transponder comprises a so-called radio frequency identification (RFID) circuit, which is typically used at a distance of some tens of centimetres from a reader antenna. A reader device and the card are coupled inductively. Such a transponder can be used for example as an electrical purse, as a ticket in public service vehicles, or for personal identification. The card may be for single use only.
In addition to the transponders having the inductive coupling to the reader device, also transponders having an antenna based on the dipole antenna technique and an electric coupling belong in the scope of the invention.
A problem related to transponders is that the chip is brittle and vulnerable to damages. Therefore the chip must be protected against impacts. One such arrangement is described in WO 99/41721. A web stock device comprises a sheet-like material, which has a cavity. A signalling device is at least partly contained in the cavity. The web stock material includes means for retaining the signalling device at least partly in the cavity.
The transponder of the invention is characterized in that the free space has been filled with ink. The manufacturing method of the invention is characterized in that the free space is filled at least partially with ink. The invention has advantageous features. Excess layers are avoided in the product, and it is made simple and easy to manufacture. The process step comprising printing with ink can be integrated into the same production line in which other process steps to manufacture the card are made.
The transponder can be manufactured individually, as sheets comprising more than one transponder, or as a continuous web. The continuous web is a preferred choice. The transponder substrate in a web form comprises successive and/or adjacent circuitry patterns to which the chips are attached. The different layers of the transponder may include paper or plastic materials. The layers are attached to each other by a suitable adhesive, or by heat sealing. The adhesive is preferably a film, which can be laminated to another surface by transfer lamination.
The circuitry pattern of the transponder can be manufactured by printing a circuitry pattern with an electroconductive printing ink on a film, by etching the circuitry pattern on a metal film, by electroplating, by punching the circuitry pattern from a metal film, or by winding the circuitry pattern of for example a copper wire. The preferred manufacturing method is etching. The electrically operating radio frequency identification (RFID) circuit of the transponder is a simple electric oscillating circuit (RCL circuit) operating at a defined frequency. The circuit consists of a coil, a capacitor and an integrated circuit on a chip. The integrated circuit comprises an escort memory and an RF part, which is arranged to communicate with a reader device. Also the capacitor of the RCL circuit can be integrated on the chip.
The integrated circuit on the chip is attached to the circuitry pattern for example by using the principle of the flip-chip technique, which is known as such but also other techniques for the attachment are possible. The chip can be attached to a separate structural part as well, and thereafter attach the structural part to the substrate comprising the circuitry pattern. The transponder substrate may be provided with a thermoplastic anisotropically conductive film, which is attached to the surface on the transponder substrate to cover the surface including the circuitry pattern. The anisotropically conductive film may cover the transponder substrate completely or partly. Since the anisotropically conductive film is thermoplastic it endures repetitive heating, which is necessary for making the film tacky. The attachment of the chip is made so that a suitable place in the transponder substrate is heated on the reverse side and the chip adheres slightly to the substrate. After that the chip is fixed firmly to the substrate. Suitable thermoplastic films for adhering the chip are for example anisotropic conductive films 8773 and 8783 (Z-Axis Adhesive Films 8773 and 8783, 3M, USA).
In addition to anisotropically conductive films, also other suitable techniques for attaching the chip may be used. For example, isotropically conductive films, or crimping techniques can be used.
The transponder substrate comprising the circuitry pattern and the chip is attached to the cover layer, which includes a hole. The hole is intended for receiving the chip from underneath when the transponder substrate and the cover layer are attached together. The shape of the hole can be any, for example a square or a circle. The dimensions of the hole are larger than the dimensions of the chip, and hence there is a free space around the chip except the underside of the chip, which is firmly attached to the transponder substrate. The hole is at least partially filled with ink. The ink may be printed by conventional printing methods over the hole when the ink transfers into the hole. The ink may fill the hole as such, or it may comprise expandable components, which are expanded after printing. Inks, which are capable for filling the hole as such are for example inks intended for printing Braille alphabets. When the ink is expanded by using for example heat, substantially the rest of the hole volume not filled with the chip is filled with the expanded ink. A level of the ink may be even with the upper level of the cover layer, or slightly lower. It is also possible that the expandable substance is other than the ink, and it is brought into the hole by using technique other than the printing. Some coating compositions and coating or injecting methods may be usable, too.
In a preferred embodiment, the transponder is manufactured as a continuous web, and all the layers of the transponder are attached to each other on the same production line. It is possible that the ink is also filled in the hole and possibly expanded on the same production line as the layers are attached to each other.
In the following, the invention will be described with reference to the appended drawings, in which
Fig. 1 shows a substrate of a transponder in a top view, and
Fig. 2 shows a transponder of the invention in a cross-sectional view.
Figure 1 shows a transponder substrate 1 , such as a smart card substrate, in a top view, including a circuitry pattern 3 and an integrated circuit on a chip 2 therein. In Fig. 1 , the transponder substrate is separated from a continuous web. The transponder substrate 1 can be manufactured by printing the circuitry pattern on a film with an electroconductive printing ink, by etching the circuitry pattern on a metal film, by punching the circuitry pattern off a metal film, or by winding the circuitry pattern of e.g. a copper wire. The circuitry pattern is provided with an identification circuit, such as a radio frequency identification (RFID) circuit. The identification circuit is a simple electric oscillating circuit (RCL circuit) tuned to operate at a defined frequency. The circuit consists of a coil, a capacitor and a circuit integrated on a chip, consisting of an escort memory and an RF part for communication with a reader device. The capacitor of the RCL circuit can also be integrated on the chip.
Figure 2 shows a transponder of the invention in a cross-sectional view. A transponder substrate 1 carries a chip 2 and a circuitry pattern (not shown in Fig. 2.). A cover layer 4 is attached tσ~the transponder substrate 1. The cover layer 4 has a hole at a location of the chip 2, and dimensions of the hole are larger than those of the chip 2. The vertical walls of the hole form a protective arrangement for the chip 2 but excess protection is needed against perpendicular impacts. Thus, the hole is at least partially filled with ink 5, which fills the rest of the hole volume not filled with the chip 2 when the ink 5 has been cured, for example by heat or ultraviolet radiation. Such inks include inks capable for forming Braille alphabets. An example of such ink is YK20- 9599 (Sun Chemical, USA). In general, the ink shall be such that its volume does not decrease essentially during drying. On the reverse side of the transponder substrate 1 may be an excess material layer 6 to bring some rigidity to the transponder.
Another possibility is to fill the hole by an expandable ink, and expand it by heat. The ink may comprise for example expandable microspheres, such as Expancel® microspheres (Expancel Inc., USA).
The invention is not restricted to the description above, but it may vary within the scope of the claims.

Claims

Claims:
1. A transponder comprising a substrate (1 ), which includes a circuitry pattern (3) and an integrated circuit on a chip (2) having a location on the substrate (1), and a cover layer (4) attached to the substrate (1) in such a manner that at the location of the chip (2) there is a hole in the cover layer (4) in which the chip (2) is arranged to be located, and there is a free space outside the chip (2) in the hole, characterized in that the free space has been filled with ink (5).
2. A method for manufacturing a transponder in which method a substrate (1 ) comprising a circuitry pattern (3) and an integrated circuit on a chip (2), and a cover layer (4) including a hole being larger than the chip (2) are attached in such a manner that the chip (2) is focused in the hole and a free space remains outside the chip in the hole, characterized in that the free space is filled at least partially with ink.
3. The method according to claim 2, characterized in that the free space is filled with an expandable ink, and the ink is expanded.
4. The method according to claim 2 or 3, characterized in that the hole is filled by printing.
5. The method according to any preceding claim 2 - 4, characterized in that the ink is expanded by heat or ultraviolet radiation.
PCT/FI2003/000855 2002-11-25 2003-11-12 A transponder and a method for manufacturing it WO2004049247A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003276321A AU2003276321A1 (en) 2002-11-25 2003-11-12 A transponder and a method for manufacturing it

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20022094 2002-11-25
FI20022094A FI20022094A0 (en) 2002-11-25 2002-11-25 Transponder and method for its manufacture

Publications (1)

Publication Number Publication Date
WO2004049247A1 true WO2004049247A1 (en) 2004-06-10

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AU (1) AU2003276321A1 (en)
FI (1) FI20022094A0 (en)
WO (1) WO2004049247A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2877462A1 (en) * 2004-10-29 2006-05-05 Arjowiggins Security Soc Par A STRUCTURE COMPRISING AN ELECTRONIC DEVICE FOR THE MANUFACTURE OF A SAFETY DOCUMENT.
EP1667058A1 (en) * 2004-11-15 2006-06-07 Solid State System Co., Ltd. Package structure of memory card and packaging method for the structure
EP1677232A1 (en) * 2004-12-22 2006-07-05 Trüb AG Data carrier and method for manufacturing such a data carrier
US7102520B2 (en) 2002-12-31 2006-09-05 Avery Dennison Corporation RFID device and method of forming
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US7872579B2 (en) 2004-04-14 2011-01-18 Arjowiggins Security Structure including an electronic device, in particular for fabricating a security document or a document of value

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998009252A1 (en) * 1996-08-26 1998-03-05 Tomas Meinen Process for manufacturing chip cards
WO1999041721A1 (en) * 1998-02-11 1999-08-19 Avery Dennison Corporation Label/tag with embedded signaling device and method and apparatus for making and using
EP1050845A1 (en) * 1999-05-06 2000-11-08 Oberthur Card Systems Sa Method for mounting a microchip in a recess of a card
US6390375B2 (en) * 1999-11-29 2002-05-21 Ask S.A. Contactless or hybrid contact-contactless smart card designed to limit the risks of fraud

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998009252A1 (en) * 1996-08-26 1998-03-05 Tomas Meinen Process for manufacturing chip cards
WO1999041721A1 (en) * 1998-02-11 1999-08-19 Avery Dennison Corporation Label/tag with embedded signaling device and method and apparatus for making and using
EP1050845A1 (en) * 1999-05-06 2000-11-08 Oberthur Card Systems Sa Method for mounting a microchip in a recess of a card
US6390375B2 (en) * 1999-11-29 2002-05-21 Ask S.A. Contactless or hybrid contact-contactless smart card designed to limit the risks of fraud

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7102520B2 (en) 2002-12-31 2006-09-05 Avery Dennison Corporation RFID device and method of forming
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US8072333B2 (en) 2002-12-31 2011-12-06 Avery Dennison Corporation RFID device and method of forming
US7872579B2 (en) 2004-04-14 2011-01-18 Arjowiggins Security Structure including an electronic device, in particular for fabricating a security document or a document of value
US8144016B2 (en) 2004-04-14 2012-03-27 Arjowiggins Security Structure including an electronic device, in particular for fabricating a security document or a document of value
FR2877462A1 (en) * 2004-10-29 2006-05-05 Arjowiggins Security Soc Par A STRUCTURE COMPRISING AN ELECTRONIC DEVICE FOR THE MANUFACTURE OF A SAFETY DOCUMENT.
WO2006048577A1 (en) * 2004-10-29 2006-05-11 Arjowiggins Security Structure comprising an electronic device for producing a security document
US8079519B2 (en) 2004-10-29 2011-12-20 Arjowiggins Security Structure including an electronic device for making a security document
EP1667058A1 (en) * 2004-11-15 2006-06-07 Solid State System Co., Ltd. Package structure of memory card and packaging method for the structure
EP1677232A1 (en) * 2004-12-22 2006-07-05 Trüb AG Data carrier and method for manufacturing such a data carrier

Also Published As

Publication number Publication date
FI20022094A0 (en) 2002-11-25
AU2003276321A1 (en) 2004-06-18

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