WO2004063698A3 - System for detection of wafer defects - Google Patents

System for detection of wafer defects Download PDF

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Publication number
WO2004063698A3
WO2004063698A3 PCT/IL2004/000023 IL2004000023W WO2004063698A3 WO 2004063698 A3 WO2004063698 A3 WO 2004063698A3 IL 2004000023 W IL2004000023 W IL 2004000023W WO 2004063698 A3 WO2004063698 A3 WO 2004063698A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
detection
methods
focal plane
defects
Prior art date
Application number
PCT/IL2004/000023
Other languages
French (fr)
Other versions
WO2004063698A2 (en
Inventor
Dov Furman
Gad Neumann
Mark Wagner
Noam Dotan
Ram Segal
Shai Silberstein
Original Assignee
Negevtech Ltd
Dov Furman
Gad Neumann
Mark Wagner
Noam Dotan
Ram Segal
Shai Silberstein
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Negevtech Ltd, Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein filed Critical Negevtech Ltd
Priority to EP04701321A priority Critical patent/EP1606605A2/en
Priority to KR1020057013165A priority patent/KR101113602B1/en
Publication of WO2004063698A2 publication Critical patent/WO2004063698A2/en
Publication of WO2004063698A3 publication Critical patent/WO2004063698A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4788—Diffraction
    • G01N2021/479—Speckle
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/069—Supply of sources
    • G01N2201/0696—Pulsed
    • G01N2201/0697—Pulsed lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/08—Optical fibres; light guides
    • G01N2201/0826—Fibre array at source, distributing

Abstract

The invention concerns on-line electro-optical detection of wafer defects by illuminating a continuously moving wafer with a light pulse from a pulsed laser and imaging the moving wafer onto a focal plane assembly formed as a continuous surface of photo-detectors at the focal plane of the optical imaging system. The laser pulses are of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. A fiber optical illumination delivery system, which reduces the effects of source coherence, is described. Other aspects of the system include a system for compensating for variations in the pulse energy of a Q-switched laser output, methods for auto- focusing of the wafer imaging system, and methods for removal of repetitive features of the image by means of Fourier plane filtering, to enable easier detection of wafer defects.
PCT/IL2004/000023 2003-01-15 2004-01-11 System for detection of wafer defects WO2004063698A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04701321A EP1606605A2 (en) 2003-01-15 2004-01-11 System for detection of wafer defects
KR1020057013165A KR101113602B1 (en) 2003-01-15 2004-01-11 System for detection of wafer defects

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/345,097 2003-01-15
US10/345,097 US7525659B2 (en) 2003-01-15 2003-01-15 System for detection of water defects

Publications (2)

Publication Number Publication Date
WO2004063698A2 WO2004063698A2 (en) 2004-07-29
WO2004063698A3 true WO2004063698A3 (en) 2007-11-01

Family

ID=32711879

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2004/000023 WO2004063698A2 (en) 2003-01-15 2004-01-11 System for detection of wafer defects

Country Status (5)

Country Link
US (7) US7525659B2 (en)
EP (1) EP1606605A2 (en)
KR (1) KR101113602B1 (en)
TW (1) TWI310457B (en)
WO (1) WO2004063698A2 (en)

Families Citing this family (186)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
WO2002082271A1 (en) * 2001-04-05 2002-10-17 Audible Magic Corporation Copyright detection and protection system and method
US7486861B2 (en) * 2003-01-15 2009-02-03 Negevtech Ltd. Fiber optical illumination system
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
US20050067740A1 (en) * 2003-09-29 2005-03-31 Frederick Haubensak Wafer defect reduction by short pulse laser ablation
US7373023B2 (en) * 2003-11-12 2008-05-13 Northrop Grumman Guidance And Electronics Company, Inc. Method and system for generating an image
US20050112474A1 (en) * 2003-11-20 2005-05-26 Micronic Laser Systems Ab Method involving a mask or a reticle
KR100773665B1 (en) * 2003-11-20 2007-11-05 마이크로닉 레이저 시스템즈 에이비 Method and apparatus for printing patterns with improved cd uniformity
US20050112768A1 (en) * 2003-11-26 2005-05-26 Thomas Evans Method of authenticating tagged polymers
US7319229B2 (en) * 2003-12-29 2008-01-15 Kla-Tencor Technologies Corporation Illumination apparatus and methods
US7499166B2 (en) * 2004-05-20 2009-03-03 The Regents Of The University Of California Wide field imager for quantitative analysis of microarrays
US7375326B2 (en) * 2004-06-21 2008-05-20 Applied Materials, Israel, Ltd. Method and system for focusing a charged particle beam
EP1766363A2 (en) * 2004-07-12 2007-03-28 Negevtech Ltd. Multi mode inspection method and apparatus
US7841529B2 (en) * 2004-10-19 2010-11-30 Applied Materials Israel, Ltd. Multiple optical head inspection system and a method for imaging an article
US7499584B2 (en) 2004-10-21 2009-03-03 Mitutoyo Corporation Smear-limit based system and method for controlling vision systems for consistently accurate and high-speed inspection
US20060096964A1 (en) * 2004-11-08 2006-05-11 Fordahl Craig A Method and apparatus for breakthrough detection for laser workpiece processing operations
US7813541B2 (en) 2005-02-28 2010-10-12 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers
US7804993B2 (en) 2005-02-28 2010-09-28 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
JP4713185B2 (en) * 2005-03-11 2011-06-29 株式会社日立ハイテクノロジーズ Foreign object defect inspection method and apparatus
JP2006261162A (en) * 2005-03-15 2006-09-28 Hitachi High-Technologies Corp Review apparatus and inspection method in review apparatus
KR100675890B1 (en) 2005-04-26 2007-02-02 주식회사 하이닉스반도체 Method for inspecting the defects of semiconductor device
US7561813B2 (en) * 2005-06-09 2009-07-14 Northrop Grumman Corporation Wide field of view heterodyne receiver
DE102005027120A1 (en) * 2005-06-10 2006-12-14 Leica Microsystems Semiconductor Gmbh Method of Inspecting Semiconductor Wafers Considering the Saw Design
US7345752B1 (en) 2005-06-22 2008-03-18 Kla-Tencor Technologies Corp. Multi-spot illumination and collection optics for highly tilted wafer planes
US7385688B1 (en) * 2005-06-22 2008-06-10 Kla-Tencor Technologies Corp. Multi-spot illumination and collection optics for highly tilted wafer planes
US7414409B1 (en) * 2005-08-19 2008-08-19 Vladimir Faifer Non-contact method and apparatus for measurement of leakage current of p-n junctions in IC product wafers
JP2007096089A (en) * 2005-09-29 2007-04-12 Renesas Technology Corp Aligner
WO2007046037A1 (en) * 2005-10-17 2007-04-26 Koninklijke Philips Electronics N.V. Integrated puf
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
JP2007178144A (en) * 2005-12-27 2007-07-12 Advanced Mask Inspection Technology Kk Pattern inspection system, pattern inspection method, sample to be inspected, and method for managing sample to be inspected
US20070229833A1 (en) * 2006-02-22 2007-10-04 Allan Rosencwaig High-sensitivity surface detection system and method
JP4988224B2 (en) * 2006-03-01 2012-08-01 株式会社日立ハイテクノロジーズ Defect inspection method and apparatus
US8031931B2 (en) 2006-04-24 2011-10-04 Applied Materials South East Asia Pte. Ltd. Printed fourier filtering in optical inspection tools
US7567344B2 (en) * 2006-05-12 2009-07-28 Corning Incorporated Apparatus and method for characterizing defects in a transparent substrate
US7471381B2 (en) * 2006-05-23 2008-12-30 Agency For Science, Technology And Research Method and apparatus for bump inspection
US7659973B2 (en) 2006-05-26 2010-02-09 Applied Materials Southeast Asia, Pte Ltd. Wafer inspection using short-pulsed continuous broadband illumination
KR20080015363A (en) 2006-08-14 2008-02-19 야마하 가부시키가이샤 Method and apparatus for inspection of wafer and semiconductor device
JP4421589B2 (en) * 2006-10-10 2010-02-24 浜松ホトニクス株式会社 Photodetector
US8243127B2 (en) 2006-10-27 2012-08-14 Zecotek Display Systems Pte. Ltd. Switchable optical imaging system and related 3D/2D image switchable apparatus
US7544950B2 (en) * 2006-10-30 2009-06-09 Applied Materials, Israel, Ltd. Microscope with vacuum objective
US7369236B1 (en) 2006-10-31 2008-05-06 Negevtech, Ltd. Defect detection through image comparison using relative measures
US7719674B2 (en) * 2006-11-28 2010-05-18 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
US7714998B2 (en) * 2006-11-28 2010-05-11 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
US7869643B2 (en) 2007-01-31 2011-01-11 Applied Materials South East Asia Pte. Ltd. Advanced cell-to-cell inspection
KR100945918B1 (en) 2007-02-02 2010-03-05 주식회사 하이닉스반도체 Method and apparatus for inspecting defects on mask
US8038897B2 (en) * 2007-02-06 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for wafer inspection
JP2008218799A (en) * 2007-03-06 2008-09-18 Topcon Corp Surface inspection method and surface inspection device
WO2008124397A1 (en) * 2007-04-03 2008-10-16 David Fishbaine Inspection system and method
US7907770B2 (en) * 2007-06-15 2011-03-15 United Microelectronics Corp. Method for inspecting photomask and real-time online method for inspecting photomask
US20080316748A1 (en) * 2007-06-21 2008-12-25 Carl Zeiss Laser Optics Gmbh Illumination system
SG149763A1 (en) * 2007-07-12 2009-02-27 Applied Materials Israel Ltd Method and system for evaluating an object that has a repetitive pattern
KR101387071B1 (en) * 2007-07-12 2014-04-18 칼 자이스 에스엠에스 엘티디 Method and apparatus for duv transmission mapping
US8098372B2 (en) 2007-07-23 2012-01-17 Applied Materials South East Asia Pte. Ltd. Optical inspection tool featuring multiple speed modes
US7872745B2 (en) * 2007-08-08 2011-01-18 Nuflare Technology, Inc. Pattern inspection apparatus and pattern inspection method
KR100901925B1 (en) * 2007-09-17 2009-06-10 주식회사 실트론 Evaluation method for gettering ability of wafer
US7681166B2 (en) * 2007-09-28 2010-03-16 Synopsys, Inc. Method and apparatus for performing dummy-fill by using a set of dummy-fill cells
US9052494B2 (en) * 2007-10-02 2015-06-09 Kla-Tencor Technologies Corporation Optical imaging system with catoptric objective; broadband objective with mirror; and refractive lenses and broadband optical imaging system having two or more imaging paths
US7645621B2 (en) * 2007-10-16 2010-01-12 International Business Machines Corporation Optical inspection methods
DE102007055530A1 (en) * 2007-11-21 2009-05-28 Carl Zeiss Ag laser beam machining
US7826049B2 (en) * 2008-02-11 2010-11-02 Applied Materials South East Asia Pte. Ltd. Inspection tools supporting multiple operating states for multiple detector arrangements
JP5022959B2 (en) * 2008-03-24 2012-09-12 株式会社日立製作所 Defect inspection system using catadioptric objective lens
US8077307B2 (en) * 2008-04-09 2011-12-13 Orbotech Ltd. Illumination system for optical inspection
US8001495B2 (en) 2008-04-17 2011-08-16 International Business Machines Corporation System and method of predicting problematic areas for lithography in a circuit design
US7912658B2 (en) * 2008-05-28 2011-03-22 Kla-Tencor Corp. Systems and methods for determining two or more characteristics of a wafer
US8054553B2 (en) * 2008-06-12 2011-11-08 Orbotech Ltd. Illumination angle control using dichroic filters
US7973921B2 (en) * 2008-06-25 2011-07-05 Applied Materials South East Asia Pte Ltd. Dynamic illumination in optical inspection systems
US7843558B2 (en) * 2008-06-25 2010-11-30 Applied Materials South East Asia Pte. Ltd. Optical inspection tools featuring light shaping diffusers
US8135207B2 (en) * 2008-06-25 2012-03-13 Applied Materials South East Asia Pte. Ltd. Optical inspection tools featuring parallel post-inspection analysis
US9659670B2 (en) 2008-07-28 2017-05-23 Kla-Tencor Corp. Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US8406501B2 (en) * 2008-08-01 2013-03-26 Denso Corporation Method and system for inspection of tube width of heat exchanger
JP5287178B2 (en) * 2008-11-27 2013-09-11 富士通セミコンダクター株式会社 Defect review device
NL2003678A (en) * 2008-12-17 2010-06-21 Asml Holding Nv Euv mask inspection system.
JP5429869B2 (en) * 2008-12-22 2014-02-26 株式会社 Ｎｇｒ Pattern inspection apparatus and method
NL2003658A (en) * 2008-12-31 2010-07-01 Asml Holding Nv Euv mask inspection.
US8219351B2 (en) * 2008-12-31 2012-07-10 Texas Instruments Incorporated Methods and systems to align wafer signatures
SG163442A1 (en) * 2009-01-13 2010-08-30 Semiconductor Technologies & Instruments System and method for inspecting a wafer
SG164292A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
SG164293A1 (en) * 2009-01-13 2010-09-29 Semiconductor Technologies & Instruments Pte System and method for inspecting a wafer
US8054558B2 (en) * 2009-02-11 2011-11-08 Omniprobe, Inc. Multiple magnification optical system with single objective lens
US9768082B2 (en) * 2009-02-13 2017-09-19 Hermes Microvision Inc. Method and machine for examining wafers
US20100211202A1 (en) * 2009-02-13 2010-08-19 Hermes Microvision, Inc. Method and machine for examining wafers
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8170838B2 (en) * 2009-04-27 2012-05-01 Nanometrics Incorporated Simulating two-dimensional periodic patterns using compressed fourier space
TWI437509B (en) * 2009-08-18 2014-05-11 Ind Tech Res Inst Light information receiving method
US20110305256A1 (en) * 2010-03-05 2011-12-15 TeraDiode, Inc. Wavelength beam combining based laser pumps
US20130148113A1 (en) * 2010-03-31 2013-06-13 Hitachi High-Technologies Corporation Inspection apparatus and inspection method
SG177786A1 (en) * 2010-07-13 2012-02-28 Semiconductor Tech & Instr Inc System and method for capturing illumination reflected in multiple directions
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
JP5911865B2 (en) * 2010-08-05 2016-04-27 オーボテック リミテッド Lighting system
JP5091287B2 (en) * 2010-08-06 2012-12-05 ファナック株式会社 Processing information acquisition device in a processing machine that supplies energy or substance to a processing point
US8705050B2 (en) 2010-10-06 2014-04-22 International Business Machines Corporation Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer
JP2013539052A (en) * 2010-10-08 2013-10-17 ダーク フィールド テクノロジーズ、インコーポレーテッド Retro-reflective imaging
WO2012082501A2 (en) 2010-12-16 2012-06-21 Kla-Tencor Corporation Wafer inspection
WO2012096153A1 (en) * 2011-01-12 2012-07-19 株式会社ニコン Microscope system
US8526709B2 (en) * 2011-01-13 2013-09-03 Lam Research Corporation Methods and apparatus for detecting multiple objects
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
JP5765022B2 (en) * 2011-03-31 2015-08-19 ソニー株式会社 Fine particle analyzer and fine particle analysis method
US9012875B2 (en) * 2011-04-07 2015-04-21 Applied Materials Israel, Ltd. Inspection method and an inspection system exhibiting speckle reduction characteristics
US9279774B2 (en) 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US9250178B2 (en) * 2011-10-07 2016-02-02 Kla-Tencor Corporation Passivation of nonlinear optical crystals
US8831334B2 (en) * 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8855400B2 (en) * 2012-03-08 2014-10-07 Kla-Tencor Corporation Detection of thin lines for selective sensitivity during reticle inspection using processed images
CN103366176B (en) * 2012-03-31 2018-05-01 湖北山鹰光学有限公司 Optical element defect batch automatic identification equipment and method
US9939386B2 (en) * 2012-04-12 2018-04-10 KLA—Tencor Corporation Systems and methods for sample inspection and review
US10096478B2 (en) * 2012-04-12 2018-10-09 Kla-Tencor Corporation System and method for rejuvenating an imaging sensor degraded by exposure to extreme ultraviolet or deep ultraviolet light
US8817273B2 (en) * 2012-04-24 2014-08-26 Nanometrics Incorporated Dark field diffraction based overlay
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
EP3640691B1 (en) * 2012-05-30 2023-09-20 IPG Photonics Corporation High power spatial filter
JP6353831B2 (en) 2012-06-26 2018-07-04 ケーエルエー−テンカー コーポレイション Algorithmic removal from scanning and diffraction optical measurements in angle-resolved reflectometry
US10073045B2 (en) 2012-07-24 2018-09-11 Nova Measuring Instruments Ltd. Optical method and system for measuring isolated features of a structure
US9030660B2 (en) * 2012-09-19 2015-05-12 Raytheon Company Multi-band imaging spectrometer
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
WO2014149197A1 (en) 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
KR101403469B1 (en) * 2013-03-08 2014-06-03 (주)넥스틴 Apparatus for examining pattern image of semiconductor wafer using separated mirror type image devider
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US9110246B2 (en) 2013-05-29 2015-08-18 Ipg Photonics Corporation High power spatial filter
WO2014200648A2 (en) * 2013-06-14 2014-12-18 Kla-Tencor Corporation System and method for determining the position of defects on objects, coordinate measuring unit and computer program for coordinate measuring unit
JP6387416B2 (en) * 2013-11-29 2018-09-05 ネックスティン，インコーポレイテッド Wafer image inspection system
US10537965B2 (en) * 2013-12-13 2020-01-21 Applied Materials, Inc. Fiber array line generator
US9500599B2 (en) 2014-01-23 2016-11-22 Samsung Electronics Co., Ltd. Surface inspection apparatus for semiconductor chips
US9182606B2 (en) 2014-01-29 2015-11-10 Emine Goulanian Rear-projection autostereoscopic 3D display system
US9182605B2 (en) 2014-01-29 2015-11-10 Emine Goulanian Front-projection autostereoscopic 3D display system
US10041997B2 (en) * 2014-03-13 2018-08-07 Fei Efa, Inc. System and method for fault isolation by emission spectra analysis
US9752992B2 (en) * 2014-03-25 2017-09-05 Kla-Tencor Corporation Variable image field curvature for object inspection
US9599572B2 (en) 2014-04-07 2017-03-21 Orbotech Ltd. Optical inspection system and method
US9390884B2 (en) 2014-05-09 2016-07-12 Globalfoundries Inc. Method of inspecting a semiconductor substrate
JP6701177B2 (en) 2014-05-15 2020-05-27 イーメージ ヴィジョン ピーティーイー． エルティーディー．Ｅｍａｇｅ Ｖｉｓｉｏｎ Ｐｔｅ． Ｌｔｄ． System and method for inspecting an intraocular lens
JP6251647B2 (en) * 2014-07-15 2017-12-20 株式会社ニューフレアテクノロジー Mask inspection apparatus and mask inspection method
US9250194B1 (en) 2014-10-10 2016-02-02 Exnodes Inc. Wide field illumination for wafer inspection
US9523645B2 (en) 2014-10-20 2016-12-20 Exnodes Inc. Lenticular wafer inspection
US9250187B1 (en) * 2014-11-11 2016-02-02 Exnodes Inc. Labeled wafer inspection
US10408766B2 (en) * 2015-02-04 2019-09-10 Bosch Packaging Technology K.K. Inspection device and inspection system
WO2016136900A1 (en) * 2015-02-27 2016-09-01 日本電気株式会社 Comparison system, comparison device, comparison method, and program
KR102301536B1 (en) * 2015-03-10 2021-09-14 삼성전자주식회사 Grain Analyzing Method and System using HRTEM Image
KR20160115682A (en) * 2015-03-25 2016-10-06 삼성전자주식회사 Method of enabling spatially varying auto focusing of objects and an image capturing system thereof
KR101652355B1 (en) 2015-03-30 2016-08-31 (주)넥스틴 optical apparatus for examining pattern image of semiconductor wafer
KR101652356B1 (en) 2015-03-30 2016-08-31 (주)넥스틴 optical apparatus for examining pattern image of semiconductor device
ES2753539T3 (en) 2015-05-18 2020-04-13 Nerre Therapeutics Ltd NK-1 / NK-3 receptor antagonist for the treatment of hot flashes
US10495446B2 (en) 2015-06-29 2019-12-03 Kla-Tencor Corporation Methods and apparatus for measuring height on a semiconductor wafer
CN106772923B (en) * 2015-11-24 2021-01-01 睿励科学仪器（上海）有限公司 Automatic focusing method and system based on inclined slit
TWI581213B (en) * 2015-12-28 2017-05-01 力晶科技股份有限公司 Method, image processing system and computer-readable recording medium for item defect inspection
KR102543948B1 (en) * 2016-05-17 2023-06-15 삼성전자주식회사 Clock signal generator and substrate inspecting apparatus having the same
US10190991B2 (en) * 2016-11-03 2019-01-29 Applied Materials Israel Ltd. Method for adaptive sampling in examining an object and system thereof
CN109997285A (en) * 2016-12-02 2019-07-09 特拉迪欧德公司 Utilize the laser system of the fiber optic bundle for power conveying and light beam switching
JP7113613B2 (en) * 2016-12-21 2022-08-05 エフ イー アイ カンパニ defect analysis
US10366674B1 (en) * 2016-12-27 2019-07-30 Facebook Technologies, Llc Display calibration in electronic displays
US10887500B2 (en) 2017-01-24 2021-01-05 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Optical inspection system
WO2018163572A1 (en) * 2017-03-10 2018-09-13 富士フイルム株式会社 Image-processing system, image-processing device, image-processing method, and image-processing program
JP7079569B2 (en) * 2017-04-21 2022-06-02 株式会社ニューフレアテクノロジー Inspection methods
EP3649460A4 (en) * 2017-07-07 2021-03-24 Koh Young Technology Inc Apparatus for optimizing inspection of exterior of target object and method thereof
US10215714B1 (en) * 2017-08-16 2019-02-26 Siemens Energy, Inc. Method and system for detecting defects on surface of object
US10192301B1 (en) * 2017-08-16 2019-01-29 Siemens Energy, Inc. Method and system for detecting line defects on surface of object
KR102427648B1 (en) 2017-11-03 2022-08-01 삼성전자주식회사 Method of inspecting defects and defects inspecting apparatus
US11087451B2 (en) * 2017-12-19 2021-08-10 Texas Instruments Incorporated Generating multi-focal defect maps using optical tools
KR101999210B1 (en) 2018-01-02 2019-07-11 (주)넥스틴 method of testing 3D type multi layer semiconductor device in the process of stacking chip
US10338013B1 (en) * 2018-01-25 2019-07-02 Kla-Tencor Corporation Position feedback for multi-beam particle detector
EA202092131A1 (en) 2018-03-14 2020-11-27 Кэнди Терапьютикс Лимитед NEW PHARMACEUTICAL PREPARATION CONTAINING DUAL ANTAGONISTS OF THE NK-1 / NK-3 RECEPTOR
US11441893B2 (en) * 2018-04-27 2022-09-13 Kla Corporation Multi-spot analysis system with multiple optical probes
TWI681309B (en) * 2018-05-10 2020-01-01 瑞昱半導體股份有限公司 Electronic device test data base generating method
WO2020072512A1 (en) * 2018-10-01 2020-04-09 Lsp Technologies, Inc. Systems, methods and apparatuses for launching laser beams into multiple fibers and/or combining beams
JP2020094955A (en) * 2018-12-14 2020-06-18 セイコーエプソン株式会社 Defect detecting device, and defect detecting method
US11294162B2 (en) * 2019-02-07 2022-04-05 Nanotronics Imaging, Inc. Fluorescence microscopy inspection systems, apparatus and methods with darkfield channel
JP7265908B2 (en) * 2019-03-27 2023-04-27 ウシオ電機株式会社 Tablet inspection method and tablet inspection device
DE102019111557B4 (en) 2019-05-03 2023-02-23 Carl Zeiss Industrielle Messtechnik Gmbh Sensor and method for determining the geometric properties of a measurement object
CN110159941B (en) * 2019-05-29 2021-03-23 业成科技（成都）有限公司 Light source module with uniform projected light intensity
TWI691715B (en) * 2019-06-17 2020-04-21 華矽創新股份有限公司 Automatic optical detection mechanism for detecting silicon wafer defects and method thereof
CN110308182A (en) * 2019-07-17 2019-10-08 西安奕斯伟硅片技术有限公司 Wafer defect detection method and device
US11300525B2 (en) * 2019-07-31 2022-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer inspection apparatus and method
TWI709727B (en) * 2019-08-12 2020-11-11 京元電子股份有限公司 Ic chip appearance inspection module
WO2021087345A1 (en) * 2019-11-01 2021-05-06 Unm Rainforest Innovations In-line angular optical multi-point scatterometry for nanomanufacturing systems
JP7392582B2 (en) * 2020-06-12 2023-12-06 オムロン株式会社 Inspection system and method
CN111879791B (en) * 2020-07-30 2023-06-20 西湖大学 Machine vision system and method for enhancing raised features on pattern surface
JP2022026730A (en) * 2020-07-31 2022-02-10 ファスフォードテクノロジ株式会社 Manufacturing methods of die bonding device and semiconductor device
US20220139743A1 (en) * 2020-11-04 2022-05-05 Tokyo Electron Limited Optical Sensor for Inspecting Pattern Collapse Defects
CN112986160B (en) * 2021-01-16 2022-05-20 西安交通大学 Multispectral high-speed imaging device for realizing scanning deflection based on DKDP crystal
US20220236196A1 (en) * 2021-01-26 2022-07-28 Changxin Memory Technologies, Inc. Methods for determining focus spot window and judging whether wafer needs to be reworked
US11709352B2 (en) 2021-03-25 2023-07-25 Trustees Of Boston University Dark-field mid-infrared photothermal microscopy
US11728192B2 (en) * 2021-07-22 2023-08-15 Globalfoundries U.S. Inc. Refining defect detection using process window
CN113866179B (en) * 2021-12-02 2022-03-15 苏州长光华芯光电技术股份有限公司 Defect detection system and method for semiconductor laser chip
CN115388762A (en) * 2022-07-25 2022-11-25 魅杰光电科技(上海)有限公司 CD measuring equipment of wafer and corresponding CD measuring method
CN116343213B (en) * 2023-05-31 2023-08-25 成都数之联科技股份有限公司 Model training and chip character recognition method, device, equipment and medium

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806774A (en) * 1987-06-08 1989-02-21 Insystems, Inc. Inspection system for array of microcircuit dies having redundant circuit patterns
US5012081A (en) * 1989-06-22 1991-04-30 Northrop Corporation Strapdown stellar sensor and holographic lens therefor
US5432331A (en) * 1994-06-07 1995-07-11 Eastman Kodak Company Method and apparatus for detecting focus of moving images with tilted plane detector and time delay means
US5617203A (en) * 1993-10-01 1997-04-01 Hamamatsu Photonics K.K. Optical detector employing an optically-addressed spatial light modulator
US5699447A (en) * 1990-11-16 1997-12-16 Orbot Instruments Ltd. Two-phase optical inspection method and apparatus for defect detection
US5892579A (en) * 1996-07-16 1999-04-06 Orbot Instruments Ltd. Optical inspection method and apparatus
US5909276A (en) * 1997-03-31 1999-06-01 Microtherm, Llc Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
US6249630B1 (en) * 1996-12-13 2001-06-19 Imra America, Inc. Apparatus and method for delivery of dispersion-compensated ultrashort optical pulses with high peak power
US6292228B1 (en) * 1998-06-29 2001-09-18 Lg Electronics Inc. Device and method for auto-adjustment of image condition in display using data representing both brightness or contrast and color temperature
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6347173B1 (en) * 1998-05-15 2002-02-12 Sony Corporation Optical coherence reduction method and its device, illuminating method and its system and optical fiber bundle
US6366315B1 (en) * 1993-06-15 2002-04-02 Deutsches Zentrum für Luft- und Raumfahrt e.V. Arrangement for lengthening sensor lines in an optoelectronic camera
US6630996B2 (en) * 2000-11-15 2003-10-07 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects

Family Cites Families (176)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US67478A (en) * 1867-08-06 ashokoft
US5600734A (en) 1991-10-04 1997-02-04 Fujitsu Limited Electron beam tester
US3220331A (en) 1965-01-27 1965-11-30 Kulicke And Soffa Mfg Company Contact printing mask alignment apparatus for semiconductor wafer geometry
US3598467A (en) 1969-03-28 1971-08-10 Trw Inc Er optic diffuser for holography
US3790280A (en) 1972-05-03 1974-02-05 Western Electric Co Spatial filtering system utilizing compensating elements
US4011403A (en) 1976-03-30 1977-03-08 Northwestern University Fiber optic laser illuminators
US4247203A (en) 1978-04-03 1981-01-27 Kla Instrument Corporation Automatic photomask inspection system and apparatus
US4347001A (en) 1978-04-03 1982-08-31 Kla Instruments Corporation Automatic photomask inspection system and apparatus
US4246822A (en) * 1979-02-09 1981-01-27 Kawai Musical Instrument Mfg. Co. Ltd. Data transfer apparatus for digital polyphonic tone synthesizer
JPS5620428A (en) 1979-07-27 1981-02-26 Olympus Optical Co Lighting optical system for endoscope
GB2069482B (en) * 1980-02-14 1984-04-04 Gist Brocades Nv Process for the preparation of 3'-bromosubstituted deacetoxycephalosporanic acid sulphoxide derivatives
US4323925A (en) * 1980-07-07 1982-04-06 Avco Everett Research Laboratory, Inc. Method and apparatus for arraying image sensor modules
US4360372A (en) 1980-11-10 1982-11-23 Northern Telecom Limited Fiber optic element for reducing speckle noise
US4378159A (en) 1981-03-30 1983-03-29 Tencor Instruments Scanning contaminant and defect detector
US4462662A (en) 1981-06-15 1984-07-31 Xerox Corporation Imaging system utilizing a gradient index lens array compensated for non-uniform object illumination
JPS57211044A (en) * 1981-06-19 1982-12-24 Hajime Sangyo Kk Inspecting device
US4964692A (en) 1982-07-21 1990-10-23 Smith & Nephew Dyonics, Inc. Fiber bundle illumination system
US4579455A (en) 1983-05-09 1986-04-01 Kla Instruments Corporation Photomask inspection apparatus and method with improved defect detection
US4532650A (en) 1983-05-12 1985-07-30 Kla Instruments Corporation Photomask inspection apparatus and method using corner comparator defect detection algorithm
US4601576A (en) 1983-12-09 1986-07-22 Tencor Instruments Light collector for optical contaminant and flaw detector
US4588293A (en) 1983-12-12 1986-05-13 The Perkin-Elmer Corporation Method and apparatus for inspecting photomasks to detect defects
US4644172A (en) 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
US4618938A (en) 1984-02-22 1986-10-21 Kla Instruments Corporation Method and apparatus for automatic wafer inspection
US4639587A (en) 1984-02-22 1987-01-27 Kla Instruments Corporation Automatic focusing system for a microscope
US4556317A (en) 1984-02-22 1985-12-03 Kla Instruments Corporation X-Y Stage for a patterned wafer automatic inspection system
US4619508A (en) 1984-04-28 1986-10-28 Nippon Kogaku K. K. Illumination optical arrangement
US4589736A (en) 1984-11-23 1986-05-20 Xerox Corporation Two row reduction/enlargement gradient index lens array having square-ended fibers
JPH0610694B2 (en) 1985-04-12 1994-02-09 株式会社日立製作所 Automatic focusing method and device
JPS61262607A (en) 1985-05-17 1986-11-20 Hitachi Ltd Visual inspection instrument
US4760265A (en) 1986-01-18 1988-07-26 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Method and device for detecting defects of patterns in microelectronic devices
US4969198A (en) 1986-04-17 1990-11-06 International Business Machines Corporation System for automatic inspection of periodic patterns
US4734923A (en) 1986-05-19 1988-03-29 Hampshire Instruments, Inc Lithographic system mask inspection device
US4805123B1 (en) 1986-07-14 1998-10-13 Kla Instr Corp Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems
JPH0682102B2 (en) 1987-02-27 1994-10-19 三菱電機株式会社 Pattern defect inspection device and pattern defect inspection method
US4763975A (en) 1987-04-28 1988-08-16 Spectra Diode Laboratories, Inc. Optical system with bright light output
US4898471A (en) 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
US4766324A (en) 1987-08-07 1988-08-23 Tencor Instruments Particle detection method including comparison between sequential scans
US5046847A (en) 1987-10-30 1991-09-10 Hitachi Ltd. Method for detecting foreign matter and device for realizing same
US4845558A (en) 1987-12-03 1989-07-04 Kla Instruments Corporation Method and apparatus for detecting defects in repeated microminiature patterns
US4877326A (en) 1988-02-19 1989-10-31 Kla Instruments Corporation Method and apparatus for optical inspection of substrates
IL85862A (en) 1988-03-24 1993-01-14 Orbot Systems Ltd Telecentric imaging system
JPH02170279A (en) 1988-12-23 1990-07-02 Hitachi Ltd Method and device for detecting defect of pattern to be checked
IL90545A (en) 1989-06-06 1994-07-31 Orbot Systems Ltd Immobilizing device for printed-circuit boards
US5058982A (en) 1989-06-21 1991-10-22 Orbot Systems Ltd. Illumination system and inspection apparatus including same
US4967095A (en) 1989-06-28 1990-10-30 Tencor Instruments Method and apparatus for detecting and sizing particles on surfaces
US5194959A (en) * 1989-12-21 1993-03-16 Ricoh Company, Ltd. and Nippon Telegraph and Telephone Corporation Image forming apparatus for forming image corresponding to subject, by dividing optical image corresponding to the subject into plural adjacent optical image parts
US5029975A (en) 1990-01-24 1991-07-09 The Mitre Corporation Despeckling screen utilizing optical fibers and method of reducing interference using same
US5185812A (en) 1990-02-14 1993-02-09 Kabushiki Kaisha Toshiba Optical pattern inspection system
US5112129A (en) 1990-03-02 1992-05-12 Kla Instruments Corporation Method of image enhancement for the coherence probe microscope with applications to integrated circuit metrology
IL94368A (en) 1990-05-11 1993-07-08 Orbot Systems Ltd Optic inspection apparatus and illumination system particularly useful therein
US5076692A (en) 1990-05-31 1991-12-31 Tencor Instruments Particle detection on a patterned or bare wafer surface
JP2748678B2 (en) * 1990-10-09 1998-05-13 松下電器産業株式会社 Gradation correction method and gradation correction device
US5172000A (en) 1990-11-02 1992-12-15 Insystems, Inc. Spatial filter for optically based defect inspection system
DE4035145A1 (en) * 1990-11-06 1992-05-07 Bio Photonics Gmbh OPTICAL SYSTEM FOR DIVIDING A REAL IMAGE
US5586058A (en) 1990-12-04 1996-12-17 Orbot Instruments Ltd. Apparatus and method for inspection of a patterned object by comparison thereof to a reference
IL125217A (en) 1990-12-04 1999-10-28 Orbot Instr Ltd Apparatus and method for microscopic inspection of articles
US5233459A (en) 1991-03-06 1993-08-03 Massachusetts Institute Of Technology Electric display device
US5177559A (en) 1991-05-17 1993-01-05 International Business Machines Corporation Dark field imaging defect inspection system for repetitive pattern integrated circuits
DE69228629T2 (en) * 1991-06-20 1999-09-09 Canon Kk Arrangement of several image sensors in one video camera
US5287215A (en) 1991-07-17 1994-02-15 Optron Systems, Inc. Membrane light modulation systems
JPH0580083A (en) * 1991-09-20 1993-03-30 Nippon Telegr & Teleph Corp <Ntt> Method and apparatus for testing integrated circuit
JPH06188501A (en) * 1991-12-11 1994-07-08 Toshiba Corp Q switch laser unit
JP2908099B2 (en) 1992-01-17 1999-06-21 キヤノン株式会社 Substrate alignment method
US5233460A (en) 1992-01-31 1993-08-03 Regents Of The University Of California Method and means for reducing speckle in coherent laser pulses
DE4301716C2 (en) * 1992-02-04 1999-08-12 Hitachi Ltd Projection exposure device and method
US5264912A (en) 1992-02-07 1993-11-23 Tencor Instruments Speckle reduction track filter apparatus for optical inspection of patterned substrates
US5298963A (en) 1992-02-26 1994-03-29 Mitsui Mining & Smelting Co., Ltd. Apparatus for inspecting the surface of materials
JP2989364B2 (en) 1992-03-12 1999-12-13 シャープ株式会社 Image processing apparatus and image processing method
US5276498A (en) 1992-05-12 1994-01-04 Tencor Instruments Adaptive spatial filter for surface inspection
US5267017A (en) 1992-05-20 1993-11-30 Applied Materials, Inc. Method of particle analysis on a mirror wafer
US5422724A (en) 1992-05-20 1995-06-06 Applied Materials, Inc. Multiple-scan method for wafer particle analysis
IL102659A (en) 1992-07-27 1997-07-13 Orbot Instr Ltd Apparatus and method for comparing and aligning two digital representations of an image
CA2272165C (en) 1992-07-31 2003-10-14 Canon Kabushiki Kaisha Liquid storing container for recording apparatus
US5629768A (en) 1993-01-28 1997-05-13 Nikon Corporation Defect inspecting apparatus
US5461237A (en) 1993-03-26 1995-10-24 Nikon Corporation Surface-position setting apparatus
EP0622627A1 (en) 1993-04-30 1994-11-02 Applied Materials, Inc. Method and apparatus for detecting particles on a substrate
US5471066A (en) 1993-08-26 1995-11-28 Nikon Corporation Defect inspection apparatus of rotary type
US5381004A (en) 1993-08-31 1995-01-10 Applied Materials, Inc. Particle analysis of notched wafers
US5537669A (en) 1993-09-30 1996-07-16 Kla Instruments Corporation Inspection method and apparatus for the inspection of either random or repeating patterns
US5689592A (en) 1993-12-22 1997-11-18 Vivo Software, Inc. Parallel processing of digital signals in a single arithmetic/logic unit
US6271916B1 (en) 1994-03-24 2001-08-07 Kla-Tencor Corporation Process and assembly for non-destructive surface inspections
US5883710A (en) 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US5864394A (en) 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
JP3404134B2 (en) 1994-06-21 2003-05-06 株式会社ニュークリエイション Inspection device
JP3462272B2 (en) * 1994-09-07 2003-11-05 浜松ホトニクス株式会社 Array electrode substrate inspection equipment
US5506676A (en) 1994-10-25 1996-04-09 Pixel Systems, Inc. Defect detection using fourier optics and a spatial separator for simultaneous optical computing of separated fourier transform components
JPH08154210A (en) 1994-11-28 1996-06-11 Kubota Corp Image pickup device
US5948972A (en) 1994-12-22 1999-09-07 Kla-Tencor Corporation Dual stage instrument for scanning a specimen
US5659390A (en) 1995-02-09 1997-08-19 Inspex, Inc. Method and apparatus for detecting particles on a surface of a semiconductor wafer having repetitive patterns
US5604585A (en) 1995-03-31 1997-02-18 Tencor Instruments Particle detection system employing a subsystem for collecting scattered light from the particles
US5694481A (en) 1995-04-12 1997-12-02 Semiconductor Insights Inc. Automated design analysis system for generating circuit schematics from high magnification images of an integrated circuit
JPH08292361A (en) 1995-04-24 1996-11-05 Olympus Optical Co Ltd Prism fixing device
US5991699A (en) 1995-05-04 1999-11-23 Kla Instruments Corporation Detecting groups of defects in semiconductor feature space
US5995665A (en) 1995-05-31 1999-11-30 Canon Kabushiki Kaisha Image processing apparatus and method
WO1996039619A1 (en) 1995-06-06 1996-12-12 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen
US6288780B1 (en) 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
US20020054291A1 (en) 1997-06-27 2002-05-09 Tsai Bin-Ming Benjamin Inspection system simultaneously utilizing monochromatic darkfield and broadband brightfield illumination sources
US5659172A (en) 1995-06-21 1997-08-19 Opal Technologies Ltd. Reliable defect detection using multiple perspective scanning electron microscope images
US5825482A (en) 1995-09-29 1998-10-20 Kla-Tencor Corporation Surface inspection system with misregistration error correction and adaptive illumination
US5939647A (en) 1996-01-16 1999-08-17 Applied Materials, Inc. Surface particle sampling head having a rotatable probe
US5798829A (en) 1996-03-05 1998-08-25 Kla-Tencor Corporation Single laser bright field and dark field system for detecting anomalies of a sample
JP3277121B2 (en) * 1996-05-22 2002-04-22 インターナショナル・ビジネス・マシーンズ・コーポレーション Intermediate display drive method for liquid crystal display
JP4306800B2 (en) 1996-06-04 2009-08-05 ケーエルエー−テンカー テクノロジィース コーポレイション Optical scanning system for surface inspection
US6064517A (en) 1996-07-22 2000-05-16 Kla-Tencor Corporation High NA system for multiple mode imaging
CN1609593B (en) * 1996-08-16 2012-04-25 Ge保健尼亚加拉公司 Digital imaging system for assays in well plates, gels and blots
JP3701032B2 (en) * 1996-08-29 2005-09-28 昭和電工株式会社 Process for producing benzonitrile and benzyl alcohol
IL119213A (en) 1996-09-06 2000-08-31 Orbot Instr Ltd Universal chuck for holding plates of various sizes
JP2809215B2 (en) 1996-09-26 1998-10-08 日本電気株式会社 Solid-state imaging camera
US5917588A (en) 1996-11-04 1999-06-29 Kla-Tencor Corporation Automated specimen inspection system for and method of distinguishing features or anomalies under either bright field or dark field illumination
US5982790A (en) * 1997-01-16 1999-11-09 Lightwave Electronics Corporation System for reducing pulse-to-pulse energy variation in a pulsed laser
US6172349B1 (en) 1997-03-31 2001-01-09 Kla-Tencor Corporation Autofocusing apparatus and method for high resolution microscope system
US5859698A (en) 1997-05-07 1999-01-12 Nikon Corporation Method and apparatus for macro defect detection using scattered light
US6075375A (en) 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
JP3647608B2 (en) 1997-06-20 2005-05-18 株式会社ソキア Surveyor automatic tracking device
US6099596A (en) 1997-07-23 2000-08-08 Applied Materials, Inc. Wafer out-of-pocket detection tool
US5912735A (en) 1997-07-29 1999-06-15 Kla-Tencor Corporation Laser/white light viewing laser imaging system
US5970168A (en) 1997-08-05 1999-10-19 Kla-Tencor Corporation Fourier filtering mechanism for inspecting wafers
US6147664A (en) * 1997-08-29 2000-11-14 Candescent Technologies Corporation Controlling the brightness of an FED device using PWM on the row side and AM on the column side
US5943551A (en) 1997-09-04 1999-08-24 Texas Instruments Incorporated Apparatus and method for detecting defects on silicon dies on a silicon wafer
US6895109B1 (en) 1997-09-04 2005-05-17 Texas Instruments Incorporated Apparatus and method for automatically detecting defects on silicon dies on silicon wafers
US6201601B1 (en) 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
JP3397101B2 (en) 1997-10-29 2003-04-14 株式会社日立製作所 Defect inspection method and apparatus
US6170973B1 (en) * 1997-11-26 2001-01-09 Cognex Corporation Method and apparatus for wide-angle illumination in line-scanning machine vision devices
US6236454B1 (en) 1997-12-15 2001-05-22 Applied Materials, Inc. Multiple beam scanner for an inspection system
US6618093B1 (en) * 1998-01-15 2003-09-09 Chauncey F. Levy Distortion-free imaging device having curved photosensor
US6175645B1 (en) 1998-01-22 2001-01-16 Applied Materials, Inc. Optical inspection method and apparatus
US6020957A (en) 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
US6023056A (en) 1998-05-04 2000-02-08 Eastman Kodak Company Scene-based autofocus method
JPH11326827A (en) 1998-05-20 1999-11-26 Sony Corp Method and device for reducing coherence of light and method and device for illumination
US6282309B1 (en) 1998-05-29 2001-08-28 Kla-Tencor Corporation Enhanced sensitivity automated photomask inspection system
US6134365A (en) 1998-06-01 2000-10-17 Colvin; James Barry Coherent illumination system and method
US6256093B1 (en) 1998-06-25 2001-07-03 Applied Materials, Inc. On-the-fly automatic defect classification for substrates using signal attributes
US6208750B1 (en) 1998-07-07 2001-03-27 Applied Materials, Inc. Method for detecting particles using illumination with several wavelengths
JP3566589B2 (en) 1998-07-28 2004-09-15 株式会社日立製作所 Defect inspection apparatus and method
US6317514B1 (en) 1998-09-09 2001-11-13 Applied Materials, Inc. Method and apparatus for inspection of patterned semiconductor wafers
US6208411B1 (en) 1998-09-28 2001-03-27 Kla-Tencor Corporation Massively parallel inspection and imaging system
US6122046A (en) 1998-10-02 2000-09-19 Applied Materials, Inc. Dual resolution combined laser spot scanning and area imaging inspection
US6081381A (en) 1998-10-26 2000-06-27 Polametrics, Inc. Apparatus and method for reducing spatial coherence and for improving uniformity of a light beam emitted from a coherent light source
US6124924A (en) 1998-12-24 2000-09-26 Applied Materials, Inc. Focus error correction method and apparatus
JP2000199872A (en) 1998-12-29 2000-07-18 Sony Corp Illumination device and image display device
DE19903486C2 (en) * 1999-01-29 2003-03-06 Leica Microsystems Method and device for the optical examination of structured surfaces of objects
US6268916B1 (en) 1999-05-11 2001-07-31 Kla-Tencor Corporation System for non-destructive measurement of samples
US6246822B1 (en) 1999-05-18 2001-06-12 The Boeing Company Fiber-coupled receiver and associated method
WO2000070332A1 (en) 1999-05-18 2000-11-23 Applied Materials, Inc. Method of and apparatus for inspection of articles by comparison with a master
US6392747B1 (en) 1999-06-11 2002-05-21 Raytheon Company Method and device for identifying an object and determining its location
JP3869589B2 (en) 1999-09-02 2007-01-17 ペンタックス株式会社 Fiber bundle and endoscope apparatus
US6707544B1 (en) 1999-09-07 2004-03-16 Applied Materials, Inc. Particle detection and embedded vision system to enhance substrate yield and throughput
US6268093B1 (en) 1999-10-13 2001-07-31 Applied Materials, Inc. Method for reticle inspection using aerial imaging
US6369888B1 (en) 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
US6226116B1 (en) 1999-11-30 2001-05-01 Eastman Kodak Company Magnetic micro-shutters
US6577405B2 (en) 2000-01-07 2003-06-10 Cyberoptics Corporation Phase profilometry system with telecentric projector
US6361910B1 (en) 2000-02-03 2002-03-26 Applied Materials, Inc Straight line defect detection
US6895184B2 (en) 2000-05-22 2005-05-17 Opvista, Inc. Interconnected broadcast and select optical networks with shared wavelengths
US6456420B1 (en) 2000-07-27 2002-09-24 Mcnc Microelectromechanical elevating structures
JP4131899B2 (en) 2000-09-28 2008-08-13 株式会社東芝 Pattern inspection device
JP2002280324A (en) 2001-03-16 2002-09-27 Sony Corp Laser
JP2002300480A (en) * 2001-03-29 2002-10-11 Fuji Photo Optical Co Ltd Electronic camera
US6794625B2 (en) 2001-05-15 2004-09-21 Applied Materials Dynamic automatic focusing method and apparatus using interference patterns
US6627865B1 (en) * 2001-05-15 2003-09-30 Raytheon Company Nonplanar integrated optical device array structure and a method for its fabrication
US6842186B2 (en) 2001-05-30 2005-01-11 Polaroid Corporation High speed photo-printing apparatus
WO2003008940A1 (en) 2001-07-16 2003-01-30 August Technology Corporation Confocal 3d inspection system and process
US6657714B2 (en) 2001-09-24 2003-12-02 Applied Materials, Inc. Defect detection with enhanced dynamic range
US6902829B2 (en) * 2001-11-15 2005-06-07 Isg Technologies Inc. Coated steel alloy product
SE0104238D0 (en) 2001-12-14 2001-12-14 Micronic Laser Systems Ab Method and apparatus for patterning a workpiece
US20040032581A1 (en) 2002-01-15 2004-02-19 Mehrdad Nikoonahad Systems and methods for inspection of specimen surfaces
US7359045B2 (en) 2002-05-06 2008-04-15 Applied Materials, Israel, Ltd. High speed laser scanning inspection system
JP3729154B2 (en) * 2002-05-10 2005-12-21 株式会社日立製作所 Pattern defect inspection method and apparatus
US6895149B1 (en) 2002-05-13 2005-05-17 James Jeffery Jacob Apparatus for beam homogenization and speckle reduction
US6791072B1 (en) * 2002-05-22 2004-09-14 National Semiconductor Corporation Method and apparatus for forming curved image sensor module
JP3729156B2 (en) * 2002-06-07 2005-12-21 株式会社日立製作所 Pattern defect detection method and apparatus
US20040207836A1 (en) 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
US7265900B2 (en) 2002-09-30 2007-09-04 Applied Materials, Inc. Inspection system with oblique viewing angle
CN1685220B (en) 2002-09-30 2010-04-28 应用材料以色列股份有限公司 Dark field inspection system
US6892013B2 (en) 2003-01-15 2005-05-10 Negevtech Ltd. Fiber optical illumination system
US7525659B2 (en) 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
JP2004233163A (en) * 2003-01-29 2004-08-19 Hitachi High-Technologies Corp Method and device for inspecting pattern defect

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806774A (en) * 1987-06-08 1989-02-21 Insystems, Inc. Inspection system for array of microcircuit dies having redundant circuit patterns
US5012081A (en) * 1989-06-22 1991-04-30 Northrop Corporation Strapdown stellar sensor and holographic lens therefor
US5699447A (en) * 1990-11-16 1997-12-16 Orbot Instruments Ltd. Two-phase optical inspection method and apparatus for defect detection
US6366315B1 (en) * 1993-06-15 2002-04-02 Deutsches Zentrum für Luft- und Raumfahrt e.V. Arrangement for lengthening sensor lines in an optoelectronic camera
US5617203A (en) * 1993-10-01 1997-04-01 Hamamatsu Photonics K.K. Optical detector employing an optically-addressed spatial light modulator
US5432331A (en) * 1994-06-07 1995-07-11 Eastman Kodak Company Method and apparatus for detecting focus of moving images with tilted plane detector and time delay means
US5892579A (en) * 1996-07-16 1999-04-06 Orbot Instruments Ltd. Optical inspection method and apparatus
US6249630B1 (en) * 1996-12-13 2001-06-19 Imra America, Inc. Apparatus and method for delivery of dispersion-compensated ultrashort optical pulses with high peak power
US5909276A (en) * 1997-03-31 1999-06-01 Microtherm, Llc Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
US6347173B1 (en) * 1998-05-15 2002-02-12 Sony Corporation Optical coherence reduction method and its device, illuminating method and its system and optical fiber bundle
US6292228B1 (en) * 1998-06-29 2001-09-18 Lg Electronics Inc. Device and method for auto-adjustment of image condition in display using data representing both brightness or contrast and color temperature
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6630996B2 (en) * 2000-11-15 2003-10-07 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects

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