WO2004073029A3 - Vacuum chuck utilizing sintered material and method of providing - Google Patents

Vacuum chuck utilizing sintered material and method of providing Download PDF

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Publication number
WO2004073029A3
WO2004073029A3 PCT/US2004/003401 US2004003401W WO2004073029A3 WO 2004073029 A3 WO2004073029 A3 WO 2004073029A3 US 2004003401 W US2004003401 W US 2004003401W WO 2004073029 A3 WO2004073029 A3 WO 2004073029A3
Authority
WO
WIPO (PCT)
Prior art keywords
vacuum
region
wafer
holding
sintered material
Prior art date
Application number
PCT/US2004/003401
Other languages
French (fr)
Other versions
WO2004073029A2 (en
Inventor
Alexei Sheydayi
Original Assignee
Supercritical Systems Inc
Alexei Sheydayi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Supercritical Systems Inc, Alexei Sheydayi filed Critical Supercritical Systems Inc
Publication of WO2004073029A2 publication Critical patent/WO2004073029A2/en
Publication of WO2004073029A3 publication Critical patent/WO2004073029A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum

Abstract

A vacuum chuck (100) for holding a semiconductor wafer during high pressure, preferably supercritical, processing comprising: a w holding region (102) for holding the wafer; a vacuum region (104) for applying vacuum to a surface of the wafer, the vacuum region within the wafer holding region; and a material(l 16), preferably sintered material, applied within the vacuum region (104), the mate configurable to provide a uniform surface between the surface of the wafer and the wafer holding region (102), wherein the material configured to allow vacuum to flow therethrough. The vacuum region preferably comprises at least one vacuum groove (104).
PCT/US2004/003401 2003-02-06 2004-02-06 Vacuum chuck utilizing sintered material and method of providing WO2004073029A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/359,923 US7021635B2 (en) 2003-02-06 2003-02-06 Vacuum chuck utilizing sintered material and method of providing thereof
US10/359,923 2003-02-06

Publications (2)

Publication Number Publication Date
WO2004073029A2 WO2004073029A2 (en) 2004-08-26
WO2004073029A3 true WO2004073029A3 (en) 2009-04-09

Family

ID=32823890

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/003401 WO2004073029A2 (en) 2003-02-06 2004-02-06 Vacuum chuck utilizing sintered material and method of providing

Country Status (3)

Country Link
US (1) US7021635B2 (en)
TW (1) TWI283889B (en)
WO (1) WO2004073029A2 (en)

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JP2006108273A (en) * 2004-10-04 2006-04-20 Disco Abrasive Syst Ltd Method and apparatus of dividing wafer
US7434590B2 (en) * 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
KR100829923B1 (en) * 2006-08-30 2008-05-16 세메스 주식회사 Spin head and method using the same for treating substrate
DE102007014917A1 (en) * 2007-03-26 2008-10-02 Platsch Gmbh & Co.Kg Dosing device for powder
JP5600943B2 (en) * 2010-01-20 2014-10-08 大日本印刷株式会社 Sheet chuck and microcontact printing method using the same
US9159595B2 (en) * 2010-02-09 2015-10-13 Suss Microtec Lithography Gmbh Thin wafer carrier
WO2011159390A1 (en) 2010-06-07 2011-12-22 Cascade Microtech, Inc. High voltage chuck for a probe station
TWI500482B (en) * 2011-03-24 2015-09-21 Nat Univ Tsing Hua Vacuum device by using centrifugal resources
SG2014009351A (en) * 2011-08-12 2014-10-30 Ev Group E Thallner Gmbh Holding device for holding a patterned wafer
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US10734270B2 (en) 2013-02-13 2020-08-04 Entegris, Inc. Vacuum chuck with polymeric embossments
US10300569B2 (en) * 2014-10-14 2019-05-28 Technical Tooling L.L.C. Method for fabricating vacuum fixturing using granular media
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US11199562B2 (en) 2019-08-08 2021-12-14 Western Digital Technologies, Inc. Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same

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Also Published As

Publication number Publication date
US7021635B2 (en) 2006-04-04
WO2004073029A2 (en) 2004-08-26
TW200511379A (en) 2005-03-16
US20040157420A1 (en) 2004-08-12
TWI283889B (en) 2007-07-11

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