WO2004075292A1 - Cooling assembly comprising micro-jets - Google Patents
Cooling assembly comprising micro-jets Download PDFInfo
- Publication number
- WO2004075292A1 WO2004075292A1 PCT/IB2004/050090 IB2004050090W WO2004075292A1 WO 2004075292 A1 WO2004075292 A1 WO 2004075292A1 IB 2004050090 W IB2004050090 W IB 2004050090W WO 2004075292 A1 WO2004075292 A1 WO 2004075292A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coolant
- micro
- jets
- cooling assembly
- cooling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- Cooling assembly comprising micro-jets
- the present invention relates to a cooling assembly for cooling a heat source, in particular electronic components, with a coolant. Further, the present invention relates to a semiconductor device, a circuit board and a cooling method.
- the new generation handheld devices such as cellular phones, handheld computers, but also high quality electronic products like beamers, set-top boxes, flat televisions, DVD and BD recorders, etc., require new sophisticated cooling technologies that have low power consumption, are silent and have the capability of cooling high heat fluxes. Another requirement may be the degree of integration. Critical components with integrated cooling solutions can easily be integrated in devices without requiring a redesign of the device layout such that an optimum thermal performance is achieved.
- EP 0 560 478 Al discloses a cooling structure which is used for forced cooling of an electronic circuit package such as an integrated circuit.
- a cooling structure comprises a tubular fin member having many through-holes of small diameter, a flat plate member which is joined to and seals one end of the tubular fin member, a lid member attached to the other end of the tubular fin member and a pipe member used as a nozzle from which the coolant is jetted towards the plate member.
- a spiral groove is formed on the inner surface of the nozzle so that a whirling movement is imparted to the coolant when it passes through the nozzle.
- a number of such cooling structures may be arranged in line forming a cooling assembly.
- a cooling assembly as claimed in claim 1, comprising: a plurality of micro-jets adapted to eject the coolant onto the heat source in response to a control signal, and - a controller adapted to control the ejection of the coolant from the micro-jets in a sweep mode in which the micro-jets eject the coolant subsequently.
- the invention is based on the idea to use a plurality of micro-jets, which do not eject the coolant to the heat source simultaneously but are operated in a sweep mode, i.e. are activated subsequently one after another or in groups after another.
- a macroscopic transport of coolant is obtained through a cooling channel above the heat source to be cooled and the occurrence of re-circulation areas in the cooling channel can be diminished which occur when all micro-jets are controlled to eject the coolant simultaneously.
- a coolant flow into a preferred direction can be induced in the cooling channel so that an effective removal of hot coolant can be provided thus ensuring a high heat transfer coefficient.
- the macroscopic flow by subsequently addressing the micro-jets can be forced into a priticular area of high temperature of heat flux.
- micro-jets comprise: an inlet for inflow of the coolant, an outlet for ejection of the coolant, a micro-channel for flow of the coolant from the inlet to the outlet, and a forcing means for inducing velocity perturbations on the coolant in the micro-channel, wherein the micro-jets are arranged substantially perpendicular to the surface of the heat source.
- micro-jets are thus forced by an external field to induce velocity perturbations into the coolant in the axial or normal direction.
- the resulting high turbulence levels will lead to an enhanced convective heat transfer from the heat source to be cooled.
- Preferred forcing means comprise piezoelectric crystals, piezoelectric ceramics or woofers and a controller for controlling the forcing.
- the coolant can be a gas, such as air or nitrogen, but also a liquid, such as water, which, however, requires a closed cooling system.
- a gas such as air or nitrogen
- a liquid such as water
- a boundary condition with respect to the focussing frequency is that it should be very low, preferably below 200 Hz, or rather high, preferably above 10 kHz.
- the optimum frequency range depends on the aerodynamic properties of the entire system and needs to be experimentally determined.
- the sweeping rate i.e. the frequency at which the micro-jets are activated and switched off, is also dependent on the system properties, like flow resistance, pressure drops, etc.
- micro-jets are substantially not perpendicular, but are placed at an inclined angle with respect to the surface of the heat source, in particular at an inclined angle in the range from 0° to 45°.
- the plurality of micro-jets is preferably arranged as a two-dimensional array of micro-jets.
- the micro-jets can be arranged in-line, as a staggered matrix or on other geometries, such as being oriented in a circular or triangular shape.
- Different preferred sweeping modes are defined in claims 10 to 12. Possible sweep schemes are:
- the coolant can be either ejected continuously from all micro-jets according to a bias flow rate while only during predetermined time periods each micro-jet ejects an additional high amount of coolant.
- each micro-jet ejects an additional high amount of coolant.
- no coolant is ejected, but only during predetermined time periods in order to activate the micro-jets.
- the present invention also relates to a semiconductor device comprising a semiconductor element and a cooling assembly integrated with the semiconductor element for cooling it. Further,- the present invention relates to a circuit board, comprising a semiconductor device and a cooling assembly arranged to cool the semiconductor device.
- the invention is not limited to cooling semiconductor devices, but can also be adapted to cool any other heat sources, which require a high cooling capacity.
- Fig. 1 shows an embodiment of a single forced micro-jet according to the present invention
- Fig. 2 shows an array of forced micro-jets operated in continuous mode
- Fig. 3 shows an array of forced micro-jets operated in sweep mode according to the present invention
- Fig. 4 shows the flow-rates of micro-jets shown in Fig. 3
- Fig. 5 shows different pulse shapes
- Fig. 6 shows an array of forced micro-jets according to the present invention
- Fig. 7 illustrates a first embodiment of a sweep mode
- Fig. 8 illustrates a second embodiment of a sweep mode
- Fig. 9 illustrates a third embodiment of a sweep mode
- Fig. 10 illustrates a forth embodiment of a sweep mode
- Fig. 11 shows an embodiment of a cooling assembly integrated with a semiconductor device
- Fig. 12 shows an embodiment of a circuit board with a cooling device and a semiconductor device mounted on top.
- the micro -jet 1 comprises an inlet 10 for an inflow of a coolant C, an outlet 11 for ejection of the coolant, a micro-channel 12 for flow of the coolant from the inlet 10 to the outlet 11 and forcing means 13 for inducing velocity perturbations on the coolant C in the micro-channel 12, said forcing means 13 being controlled by a controller 14.
- the micro-jet is preferably arranged such that the micro-channel 12, which can be an isolated ordinary channel, tube or minichannel (e.g. submicron channel of nanometer size), is substantially perpendicular to the surface of the heat source 2 to be cooled as shown.
- the micro- channel 12 may also be arranged at an angle different from 90° to the surface of the heat source 2. Such an inclined arrangement may either enhance or diminish the occurrence of a macroscopic flow induced by the sweeping micro-jets.
- the resulting flow pattern of the ejected coolant C after impinging on the surface of the heat source 2 is indicated by 3. It is well known that such flow has a high heat transfer coefficient in the vicinity of the point 31 where the flow impinges on the surface of the heat source 2, which point 31 is called a stagnation point. However, the re-circulative nature of such flow causes poor heat transfer performance at the separation points 32, located away from the stagnation point 31.
- Forcing of the flow by an external field E is used to induce velocity perturbations into the undistorted inflow of the coolant and to increase the turbulence intensity.
- the axial channel flow 3 may be distorted in the axial, longitudinal or normal direction to increase the velocity perturbations, i.e. to enhance the turbulence intensity of the flow.
- a woofer for instance for a forced laminar wall flow
- piecoelectric ceramics or a piezoelectric crystal can be used as forcing means 13.
- Such piezoelectric crystals or ceramics are, for instance, used in inkjet print heads to dose the flow through the channel such that only small droplets of ink are deposited on the to be printed substrate. Forcing of the flow can also be controlled by a sinusoidal, saw-tooth like, or short pulse modulation.
- an array of forced micro-jets la, lb, lc, Id forming a cooling assembly 100 is used as shown in Fig. 2a to enlarge the area to be cooled.
- a drawback of an array of multiple micro-jets la- Id located in staggered or in in-line arrangement is the occurrence of separation points 32 in the outflow 3 of the coolant when the micro-jets are operated simultaneously.
- the resulting flow pattern 3 consists of multiple stagnation points 31 and separation points 32.
- Separation points 32 are characterized by a dramatic reduction of the heat transfer coefficient as can be seen from the heat transfer coefficient distribution 4 shown in Fig. 2b.
- the maxima of the distribution 4 correspond to the stagnation points 31, the minima correspond to the separation points 32.
- the location of the separation points 32 and the strength of the heat transfer coefficient drop is determined by the in-line and off-axis spacing of the micro-jets la-Id.
- Garimella et al. have performed a theoretical study of the heat transfer characteristics of micro-jet arrays (Garimella et al., "Local heat transfer distributions in confined multiple air jet impingement", Journal of Elec. Pack., 2001, v. 123, p. 165). Some of the parameters that have been varied are the nozzle diameter and the distance to the heat source. Arrays with multiple micro-nozzles are considered for cooling applications in devices where space and noise is a constraint.
- the cooling assembly further comprises a controller 15 for control of the ejection of coolant from the individual micro-jets.
- the micro-jets are operated such that the coolant is not ejected simultaneously from all micro-jets but a single micro-jet or groups of several micro-jets are activated one after another.
- This sweeping operation is controlled by the controller 15.
- the corresponding heat transfer coefficient 6 of the sweep mode operation is shown in Fig. 3b. As can be seen there are no maxima or minima as in the distribution 4 for the continuous mode operation.
- the decay in the heat transfer coefficient 6 in the stream- wise direction is caused by heating up of the coolant in this direction.
- Fig. 4 shows the flow-rates ⁇ of the four micro-jets la- Id (also called nozzles) over time.
- the nozzles are subsequently activated by a rectangular pulse, e.g. nozzle la is activated by pulse ⁇ a , pu ise, having a time duration of t ⁇ a , off - t ⁇ a ,on.
- the pulses of nozzles la and lb as well as the pulses of nozzles lc and Id slightly overlap in time.
- the nozzles are either in an active (open) or passive (closed) state.
- this may lead to a lower effective flow-rate through the cooling assembly.
- An even more improved heat transfer can be achieved by providing a continuous bias flow-rate at all nozzles on which the additional flow-rate during activation of the individual nozzle is superimposed.
- Fig. 4 where at times where the nozzles are not activated by the activation pulse the flow-rate ⁇ is for each level at a particular bias flow-rate ⁇ bias-
- the ratio between the additional flow-rate and the bias flow-rate can be determined, and mainly depends on different system parameters. Ratios between 0.1 and 100 seem to be feasible. It should be noted that the bias flow-rate can also be different for each nozzle.
- the flow rate of each nozzle is time-dependent, and the maximum flow rate depends on the position of the nozzle in the cooling assembly. For instance, the maximum flow-rate through central nozzles in an array of nozzles can be controlled to be higher than that through the nozzles at the edges of an array.
- the present invention thus allows the use of different flow rate strategies, i.e. the use of a constant bias level with a- time-dependent additional pulse-shaped flow rate. This additional flow rate will cause the macroscopic flow and can be considered as the sweeping factor.
- Different possible pulse shapes are shown in Fig. 5.
- Fig. 5a shows a rectangular pulse
- Fig. 5b a trapezium shaped pulse
- Fig. 5c a third shape of a pulse.
- Further possible pulse shapes are, for instance, triangles, staircase-like etc.
- FIG. 6 An array of a plurality of micro-jets located on a cartesian grid having N columns and M rows is schematically shown in Fig. 6.
- the spacing L m (m) and L n (n) depend on the location in the matrix.
- the location for single micro-jet 1 is indicated with n and m.
- Such an arrangement shall be used in Figures 7 to 10 to illustrate different sweep modes used according to the present invention. In these figures the sweep modes are illustrated by showing three subsequent steps wherein a filled circle 1 ' indicates a passive (or closed) micro-jet, i.e. which is controlled not to eject coolant, while an empty circle 1" indicates an active (or open) micro-jet, i.e. which is controlled to eject coolant. It shall be noted that a bias level may be present in both the active and passive state of the micro-jet.
- the individual micro-jets are controlled to eject coolant subsequently from the centre towards the edge of the array in a sort of expansion mode.
- the ejected coolant is thus forced to flow from the centre towards the edge.
- the micro -jets are addressed column-wise from left to right.
- the micro-jets could also be addressed row- wise, or in one cycle the micro-jets can be addressed column by column, while in the next cycle the micro -jets are addressed row by row.
- micro-jets of the central column (or row) are addressed first, while subsequently micro-jets in columns (or rows) towards the edges.
- flow of coolant in the central part of the array can be accelerated.
- FIG. 10 Still a further embodiment is shown in Fig. 10 according to which micro-jets in the lower left corner are addressed first, while subsequently micro -jets towards the upper left corner are addressed.
- a flow of coolant into a predefined direction can be obtained, here into the direction of the upper left corner.
- An embodiment of a semiconductor device 7 comprising a semiconductor element 20, the surface of which shall be cooled, and an array of micro-jets 1 integrated therewith is shown in Fig. 11.
- a coolant supply 8 is provided on the upper part.
- the micro-jets are spread over the whole surface of the semiconductor element 2 to provide efficient cooling.
- FIG. 12 An embodiment of a circuit board 9 onto which a semiconductor device 7' and a cooling assembly 100 according to the present invention are mounted are shown in Fig. 12.
- the cooling assembly 100 is not integrated within the semiconductor device 7' but is located, as a separate element, above the semiconductor device 7'.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/545,987 US7483770B2 (en) | 2003-02-20 | 2004-02-09 | Cooling assembly comprising micro-jets |
EP04709306A EP1597763A1 (en) | 2003-02-20 | 2004-02-09 | Cooling assembly comprising micro-jets |
JP2006502574A JP4298746B2 (en) | 2003-02-20 | 2004-02-09 | Cooling assembly with micro jet |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03100392 | 2003-02-20 | ||
EP03100392.4 | 2003-02-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004075292A1 true WO2004075292A1 (en) | 2004-09-02 |
Family
ID=32892956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2004/050090 WO2004075292A1 (en) | 2003-02-20 | 2004-02-09 | Cooling assembly comprising micro-jets |
Country Status (5)
Country | Link |
---|---|
US (1) | US7483770B2 (en) |
EP (1) | EP1597763A1 (en) |
JP (1) | JP4298746B2 (en) |
CN (1) | CN100399556C (en) |
WO (1) | WO2004075292A1 (en) |
Cited By (4)
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EP2395549A1 (en) * | 2010-06-10 | 2011-12-14 | Imec | Device for cooling integrated circuits |
WO2012168890A1 (en) | 2011-06-10 | 2012-12-13 | Koninklijke Philips Electronics N.V. | Fragrance delivery device and method |
US8584735B2 (en) | 2009-07-28 | 2013-11-19 | Aerojet Rocketdyne Of De, Inc. | Cooling device and method with synthetic jet actuator |
RU2755608C1 (en) * | 2020-12-18 | 2021-09-17 | Федеральное государственное автономное образовательное учреждение высшего образования "Новосибирский национальный исследовательский государственный университет" (Новосибирский государственный университет, НГУ) | Method for cooling electronic equipment |
Families Citing this family (25)
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US7483770B2 (en) * | 2003-02-20 | 2009-01-27 | Koninklijke Philips Electronics N.V. | Cooling assembly comprising micro-jets |
US7607470B2 (en) * | 2005-11-14 | 2009-10-27 | Nuventix, Inc. | Synthetic jet heat pipe thermal management system |
US8030886B2 (en) | 2005-12-21 | 2011-10-04 | Nuventix, Inc. | Thermal management of batteries using synthetic jets |
EP1999381B1 (en) * | 2006-03-21 | 2017-11-22 | Philips Lighting Holding B.V. | Cooling device and electronic device comprising such a cooling device |
US8051905B2 (en) * | 2006-08-15 | 2011-11-08 | General Electric Company | Cooling systems employing fluidic jets, methods for their use and methods for cooling |
JP5320298B2 (en) * | 2006-12-15 | 2013-10-23 | コーニンクレッカ フィリップス エヌ ヴェ | Pulsating fluid cooling with frequency control |
FR2911247B1 (en) * | 2007-01-08 | 2009-02-27 | Sames Technologies Soc Par Act | ELECTRONIC CARD AND COLD PLATE FOR THIS CARD. |
US20110036538A1 (en) * | 2007-09-07 | 2011-02-17 | International Business Machines Corporation | Method and device for cooling a heat generating component |
US8418934B2 (en) * | 2008-08-26 | 2013-04-16 | General Electric Company | System and method for miniaturization of synthetic jets |
US7821787B2 (en) * | 2008-08-29 | 2010-10-26 | Freescale Semiconductor, Inc. | System and method for cooling using impinging jet control |
US7760499B1 (en) * | 2009-05-14 | 2010-07-20 | Nuventix, Inc. | Thermal management system for card cages |
US7778030B1 (en) * | 2009-05-23 | 2010-08-17 | Freescale Semiconductor, Inc. | Method for cooling using impinging jet control |
US9252069B2 (en) * | 2010-08-31 | 2016-02-02 | Teledyne Scientific & Imaging, Llc | High power module cooling system |
US20120073788A1 (en) * | 2010-09-24 | 2012-03-29 | John Jay Streyle | Method and system for synthetic jet cooling |
US8602607B2 (en) | 2010-10-21 | 2013-12-10 | General Electric Company | Lighting system with thermal management system having point contact synthetic jets |
US8529097B2 (en) | 2010-10-21 | 2013-09-10 | General Electric Company | Lighting system with heat distribution face plate |
US20120285667A1 (en) * | 2011-05-13 | 2012-11-15 | Lighting Science Group Corporation | Sound baffling cooling system for led thermal management and associated methods |
US8912643B2 (en) | 2012-12-10 | 2014-12-16 | General Electric Company | Electronic device cooling with microjet impingement and method of assembly |
US11022383B2 (en) | 2016-06-16 | 2021-06-01 | Teledyne Scientific & Imaging, Llc | Interface-free thermal management system for high power devices co-fabricated with electronic circuit |
US11464140B2 (en) | 2019-12-06 | 2022-10-04 | Frore Systems Inc. | Centrally anchored MEMS-based active cooling systems |
US11710678B2 (en) | 2018-08-10 | 2023-07-25 | Frore Systems Inc. | Combined architecture for cooling devices |
KR20220082053A (en) | 2019-10-30 | 2022-06-16 | 프로리 시스템스 인코포레이티드 | MEMS based airflow system |
US11510341B2 (en) | 2019-12-06 | 2022-11-22 | Frore Systems Inc. | Engineered actuators usable in MEMs active cooling devices |
US11796262B2 (en) | 2019-12-06 | 2023-10-24 | Frore Systems Inc. | Top chamber cavities for center-pinned actuators |
JP2023544160A (en) | 2020-10-02 | 2023-10-20 | フロー・システムズ・インコーポレーテッド | active heat sink |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5310440A (en) * | 1990-04-27 | 1994-05-10 | International Business Machines Corporation | Convection transfer system |
US20020152761A1 (en) | 2001-02-22 | 2002-10-24 | Patel Chandrakant D. | Spray cooling with local control of nozzles |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1140969A (en) * | 1997-07-18 | 1999-02-12 | Nec Gumma Ltd | Cooling structure for electronic device |
JP2000252669A (en) * | 1999-02-26 | 2000-09-14 | Sony Corp | Cooling arrangement and electronic equipment |
US6205799B1 (en) * | 1999-09-13 | 2001-03-27 | Hewlett-Packard Company | Spray cooling system |
US6550263B2 (en) * | 2001-02-22 | 2003-04-22 | Hp Development Company L.L.P. | Spray cooling system for a device |
US6644058B2 (en) * | 2001-02-22 | 2003-11-11 | Hewlett-Packard Development Company, L.P. | Modular sprayjet cooling system |
US7483770B2 (en) * | 2003-02-20 | 2009-01-27 | Koninklijke Philips Electronics N.V. | Cooling assembly comprising micro-jets |
JP4677744B2 (en) * | 2003-11-04 | 2011-04-27 | ソニー株式会社 | Jet generating device, electronic device and jet generating method |
US6952346B2 (en) * | 2004-02-24 | 2005-10-04 | Isothermal Systems Research, Inc | Etched open microchannel spray cooling |
-
2004
- 2004-02-09 US US10/545,987 patent/US7483770B2/en not_active Expired - Fee Related
- 2004-02-09 WO PCT/IB2004/050090 patent/WO2004075292A1/en active Application Filing
- 2004-02-09 EP EP04709306A patent/EP1597763A1/en not_active Withdrawn
- 2004-02-09 JP JP2006502574A patent/JP4298746B2/en not_active Expired - Fee Related
- 2004-02-09 CN CNB2004800046071A patent/CN100399556C/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5310440A (en) * | 1990-04-27 | 1994-05-10 | International Business Machines Corporation | Convection transfer system |
US20020152761A1 (en) | 2001-02-22 | 2002-10-24 | Patel Chandrakant D. | Spray cooling with local control of nozzles |
Non-Patent Citations (1)
Title |
---|
KERCHER D M ET AL: "HEAT TRANSFER BY A SQUARE ARRAY OF ROUNDE AIR JETS IMPINGING PERPENDICULAR TO A FLAT SURFACE INCLUDING THE EFFECT OF SPENT AIR", GAS TURBINE CONFERENCE AND PRODUCTS SHOW, XX, XX, 9 March 1969 (1969-03-09), pages 1 - 13, XP000651051 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8584735B2 (en) | 2009-07-28 | 2013-11-19 | Aerojet Rocketdyne Of De, Inc. | Cooling device and method with synthetic jet actuator |
EP2395549A1 (en) * | 2010-06-10 | 2011-12-14 | Imec | Device for cooling integrated circuits |
US8493736B2 (en) | 2010-06-10 | 2013-07-23 | Imec | Device for cooling integrated circuits |
WO2012168890A1 (en) | 2011-06-10 | 2012-12-13 | Koninklijke Philips Electronics N.V. | Fragrance delivery device and method |
RU2755608C1 (en) * | 2020-12-18 | 2021-09-17 | Федеральное государственное автономное образовательное учреждение высшего образования "Новосибирский национальный исследовательский государственный университет" (Новосибирский государственный университет, НГУ) | Method for cooling electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
EP1597763A1 (en) | 2005-11-23 |
CN100399556C (en) | 2008-07-02 |
JP2006520094A (en) | 2006-08-31 |
JP4298746B2 (en) | 2009-07-22 |
US7483770B2 (en) | 2009-01-27 |
CN1751389A (en) | 2006-03-22 |
US20060164805A1 (en) | 2006-07-27 |
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